CN202656333U - Separated solar silicon wafer cutting tool - Google Patents
Separated solar silicon wafer cutting tool Download PDFInfo
- Publication number
- CN202656333U CN202656333U CN 201220176702 CN201220176702U CN202656333U CN 202656333 U CN202656333 U CN 202656333U CN 201220176702 CN201220176702 CN 201220176702 CN 201220176702 U CN201220176702 U CN 201220176702U CN 202656333 U CN202656333 U CN 202656333U
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- CN
- China
- Prior art keywords
- cutting tool
- cutting
- sleeve
- solar silicon
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a separated solar silicon wafer cutting tool which is divided into a plurality of sections axially. The cutting tool is in a sleeve structure. The sections of the sleeve cutting tool are respectively sleeved on a main roller. Cutting pieces are arranged on the outer surface of the sleeve cutting tool. The sleeve cutting tool is connected with the main roller through a key. As the sleeve cutting tools are installed on the main roller of the solar silicon wafer cutting tool and each sleeve is further provided with one or more cutting pieces, the cutting pieces in different numbers can be installed on the main roller of the solar silicon wafer cutting tool according to the length of a silicon rod to be processed and the number of silicon wafers to be cut when used. A main cutting roller is installed axially, and the length of the cutting pieces to be installed is increased by 100mm above compared with that of current cutting pieces, thus, more silicon wafers can be cut in clamping at one time.
Description
Technical field
The utility model relates to solar silicon wafers cutting technique field, is specifically related to a kind of separated type solar silicon chip cutting tool.
Background technology
At present, the solar level cell silicon chip is square silicon single crystal rod to be thinly sliced form, because domestic silicon wafer material is rare, expensive, along with the extensive use of regenerative resource, the market demand of solar energy-level silicon wafer is increasing.So how to enhance productivity, namely the yield rate of silicon materials gets a promotion in the unit interval, shortens the time of cutting, raises the efficiency, and reduces the replacement frequency of blade, has become the pattern that each enterprise is pursued.
As shown in Figure 1, wafer cutter sweep commonly used is to use high speed qigong rotating shaft to drive the cutting mode of diamond blade.But because the silicon chip that pneumatic rotating shaft drives cutting home roll, the axial length degree is limited, can only cut out a small amount of solar silicon wafers at every turn, can't satisfy the demand to solar silicon wafers.In this case, just need to improve the structure of home roll and cutting tool, so that the efficient of silicon chip cutting is improved greatly.
The utility model content
The purpose of this utility model is to overcome the defective that exists in the prior art, and a kind of separated type solar silicon chip cutting tool is provided, and this cutter can improve the efficient of silicon chip cutting, is convenient to simultaneously change cutting tip.
For achieving the above object, the technical solution of the utility model is a kind of separated type solar silicon chip cutting tool of design, it is characterized in that, described cutting tool is divided into some sections vertically, described cutting tool is sleeve-like configuration, described some sections sleeve-shaped cutting tools are set on the home roll, are provided with cutting blade at the outer surface of described sleeve-shaped cutting tool, are connected by key between described sleeve-shaped cutting tool and the described home roll.
Wherein preferred technical scheme is that the axial installation length sum of described some sections sleeve-shaped cutting tools is 400mm～600mm.
The position that described cutting blade is used for the cutting solar silicon wafers is zigzag.
Described key is connected to the flat key connection or is spline joint.
Advantage of the present utility model and beneficial effect are: because the utility model is equipped with the cutting tool of several sleeve-shapeds at the home roll of solar power silicon sheet cutting equipment, on each sleeve, can be provided with again one to multiple cutting blade, in use can be according to the length and the sheet number of wanting cutting silicon wafer of processed silicon rod, the cutting blade of different sheet numbers is housed at the home roll of solar power silicon sheet cutting equipment, and main cutting roller in the axial direction, the length that blade can be installed has also increased more than the 100mm than existing, so also can cut out more silicon chip in once being installed.Most importantly can be different according to the length of silicon rod, install the sleeve-shaped cutting tool of varying number at the home roll that cutting tool is housed, if during the situation that has in addition cutting tool wearing and tearing to occur or damage, only need wearing and tearing or the cutting tool that damages are replaced just passable, and do not need the cutting tool on the whole home roll is all changed.Both time saving and energy saving in actual production like this, can reduce again the waste of cutting blade.
Description of drawings
Fig. 1 is the structural representation of existing solar silicon wafers cutting tool home roll;
Fig. 2 is the structural representation of the utility model separated type solar silicon chip cutting tool home roll;
Fig. 3 is the A-A cross-sectional schematic of Fig. 1.
The specific embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present utility model is further described.Following examples only are used for the technical solution of the utility model more clearly is described, and can not limit protection domain of the present utility model with this.
Shown in Fig. 2,3, the utility model is a kind of cutting tool 1 of separated type solar silicon chip, this cutting tool 1 is divided into some sections vertically, described cutting tool 1 is sleeve-like configuration, described some sections sleeve-shaped cutting tools 1 are set on the home roll 2, outer surface at described sleeve-shaped cutting tool 1 is provided with cutting blade 3, is connected by key 4 between described sleeve-shaped cutting tool 1 and the described home roll 2.
Preferred technical scheme is that the axial length sum of described some sections sleeve-shaped cutting tools 1 is 400mm～600mm in the utility model.
Preferred technical scheme also has in the utility model, and the position that described cutting blade 3 is used for the cutting solar silicon wafers is zigzag.
Preferred technical scheme also has in the utility model, and described key 4 is connected to the flat key connection or is spline joint.
Because the utility model is equipped with the cutting tool of several sleeve-shapeds at the home roll of solar power silicon sheet cutting equipment, on each sleeve, can be provided with again one to multiple cutting blade, in use can be according to the length and the sheet number of wanting cutting silicon wafer of processed silicon rod, the cutting blade of different sheet numbers is housed at the home roll of solar power silicon sheet cutting equipment, and main cutting roller in the axial direction, the length that blade can be installed has also increased more than the 100mm than existing, so also can cut out more silicon chip in once being installed.Most importantly can be different according to the length of silicon rod, install the sleeve-shaped cutting tool of varying number at the home roll that cutting tool is housed, if during the situation that has in addition cutting tool wearing and tearing to occur or damage, only need wearing and tearing or the cutting tool that damages are replaced just passable, and do not need the cutting tool on the whole home roll is all changed.Both time saving and energy saving in actual production like this, can reduce again the waste of cutting blade.
The above only is preferred embodiment of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (4)
1. separated type solar silicon chip cutting tool, it is characterized in that, described cutting tool is divided into some sections vertically, described cutting tool is sleeve-like configuration, described some sections sleeve-shaped cutting tools are set on the home roll, outer surface at described sleeve-shaped cutting tool is provided with cutting blade, is connected by key between described sleeve-shaped cutting tool and the described home roll.
2. separated type solar silicon chip cutting tool according to claim 1 is characterized in that, the axial installation length sum of described some sections sleeve-shaped cutting tools is 400mm～600mm.
3. separated type solar silicon chip cutting tool according to claim 1 is characterized in that, the position that described cutting blade is used for the cutting solar silicon wafers is zigzag.
4. separated type solar silicon chip cutting tool according to claim 1 is characterized in that, described key is connected to the flat key connection or is spline joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220176702 CN202656333U (en) | 2012-04-23 | 2012-04-23 | Separated solar silicon wafer cutting tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220176702 CN202656333U (en) | 2012-04-23 | 2012-04-23 | Separated solar silicon wafer cutting tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202656333U true CN202656333U (en) | 2013-01-09 |
Family
ID=47451264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220176702 Expired - Fee Related CN202656333U (en) | 2012-04-23 | 2012-04-23 | Separated solar silicon wafer cutting tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202656333U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106695013A (en) * | 2015-07-30 | 2017-05-24 | 南京春睿精密机械有限公司 | Saw tooth machining cutter |
-
2012
- 2012-04-23 CN CN 201220176702 patent/CN202656333U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106695013A (en) * | 2015-07-30 | 2017-05-24 | 南京春睿精密机械有限公司 | Saw tooth machining cutter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130109 Termination date: 20140423 |