CN202485267U - Refrigerating device - Google Patents
Refrigerating device Download PDFInfo
- Publication number
- CN202485267U CN202485267U CN 201220009363 CN201220009363U CN202485267U CN 202485267 U CN202485267 U CN 202485267U CN 201220009363 CN201220009363 CN 201220009363 CN 201220009363 U CN201220009363 U CN 201220009363U CN 202485267 U CN202485267 U CN 202485267U
- Authority
- CN
- China
- Prior art keywords
- radiator
- compressor
- condenser
- refrigerating plant
- evaporimeter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003507 refrigerant Substances 0.000 claims abstract description 29
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 9
- 239000004065 semiconductor Substances 0.000 abstract description 8
- 239000007788 liquid Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 235000019615 sensations Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B1/00—Compression machines, plants or systems with non-reversible cycle
- F25B1/005—Compression machines, plants or systems with non-reversible cycle of the single unit type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Other Air-Conditioning Systems (AREA)
Abstract
The utility model relates to a refrigerating device which comprises an evaporator, a condenser, a compressor and a refrigerant delivery pipe. The evaporator comprises a first radiator, the condenser comprises a second radiator, and the refrigerant delivery pipe is sequentially connected with the evaporator, the compressor and the condenser. A refrigerant is arranged in the refrigerant delivery pipe. By means of the structure, the refrigerating device does not require a semiconductor chip for refrigeration, the compressor is long in service life, and the energy efficiency ratio can achieve over 200%.
Description
Technical field
The utility model belongs to the heat radiation field, relates in particular to a kind of refrigerating plant.
Background technology
Because the semiconductor chip refrigeration has advantages such as volume is little, super-silent, semiconductor refrigerating is widely used in the heat radiation of big electronic component of some caloric values or equipment box at present.But because the radiating effect of semiconductor chip itself is not good; Cause its heating power to be far longer than refrigeration work consumption; Even because its cold and hot temperature difference is big, chip is expanded with heat and contract with cold easily and is shortened service life, and the Energy Efficiency Ratio of semiconductor chip refrigerating plant generally can only reach about 50-60%.
The utility model content
The utility model technical problem to be solved is, provides a kind of Energy Efficiency Ratio higher, and service life is than long refrigerating plant.
For solving the problems of the technologies described above; The utility model provides a kind of refrigerating plant; Comprise evaporimeter, condenser, compressor and refrigerant transfer tube, said evaporimeter comprises first radiator, and said condenser comprises second radiator; Said refrigerant transfer tube connects said evaporimeter, compressor and condenser successively, in said refrigerant transfer tube, has refrigerant.
Further, said first radiator or second radiator are spaced fin, are provided with through hole in said fin, and said refrigerant transfer tube is arranged in the said through hole.
Further, said fin is processed by copper material.
Further, said first radiator or second radiator comprise pedestal and are positioned at the fin on the said pedestal in said pedestal, to have the said passage of passage and be connected with said refrigerant transfer tube.
Further, said first radiator is processed by aluminium.
Further, said compressor is a micro-compressor, and its diameter is 30-80mm.
Further, said evaporimeter also comprises first fan, and said first fan is positioned on said first radiator; Said condenser also comprises second fan, and said second fan is positioned on said second radiator.
Further, said evaporimeter is positioned at a side of a substrate, and said condenser and compressor are positioned at the opposite side of said substrate.
Further, said first radiator cowl is provided with first shell, and the position of corresponding said first radiator of said first shell has through hole, is provided with first fan in the through hole outside of said first shell; Said second radiator cowl is provided with second shell, and the position of corresponding said second radiator of said second shell has through hole, is provided with second fan in the through hole outside of said second shell.
Further, said condenser comprises two described second radiators, and said compressor is between described two second radiators.
Compared with prior art, the refrigerating plant of the utility model adopts evaporimeter, condenser and compressor to realize refrigeration, need not to use the semiconductor chip refrigeration, and the life-span of compressor is longer, and its Energy Efficiency Ratio can reach more than 200%.
Description of drawings
Fig. 1 is the schematic perspective view of the utility model refrigerating plant one preferred embodiment.
Fig. 2 is the schematic perspective view that removes in embodiment illustrated in fig. 1 behind the shell.
The specific embodiment
In order to make the utility model technical problem to be solved, technical scheme and beneficial effect clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Seeing also Fig. 1 and Fig. 2, is a preferred embodiment of the utility model, and this refrigerating plant comprises evaporimeter 1, condenser 2, compressor 3 and refrigerant transfer tube 4.Evaporimeter 1 is positioned at a side of a substrate 5, and condenser 2 and compressor 3 are positioned at the opposite side of substrate 5.Refrigerant transfer tube 4 connects evaporimeter 1, compressor 3 and condenser 2 successively, in refrigerant transfer tube 4, has refrigerant.
Evaporimeter 1 comprises that first radiator 11 and first fan, 12, the first fans 12 are positioned on first radiator 11.First radiator 11 is the fin that some parallel interval are arranged, and it can be processed by copper material, to improve radiating efficiency.Be provided with some through holes in fin, refrigerant transfer tube 4 is arranged in the through hole, and refrigerant transfer tube 4 can be copper pipe.
In addition, first radiator, the 11 outer positions that are covered with first shell, 13, the first shells, 13 corresponding first radiators 11 in the present embodiment have the through hole (not shown), and first fan 12 is positioned at the through hole outside of first shell 13; Second radiator 21 and the compressor 3 outer positions that are covered with second shell, 23, the second shells, 23 corresponding two second radiators 21 have through hole respectively, and two second fans 22 lay respectively at the through hole outside of second shell 23.Like this, the contour structures of the refrigerating plant in the present embodiment is similar with traditional semiconductor movement to people's sensation.
As other embodiment, first radiator and second radiator also can be processed by aluminium, can comprise pedestal and be positioned at the fin on the pedestal, and in pedestal, have passage, passage can be connected with the refrigerant transfer tube.The structural form that is appreciated that first radiator and second radiator can be same or similar, also can be different fully, and for example first radiator adopts above-mentioned some forms that is spaced fin, and second radiator adopts above-mentioned form with pedestal.
When using above-mentioned refrigerating plant, near refrigeration object (not shown), process of refrigerastion is following: liquid refrigerants has absorbed the heat of refrigeration object in evaporimeter 1, flash to the steam state refrigerant with a side of evaporimeter 1; The steam state refrigerant is comprising the heat that absorbs and is being compressed machine 3 and pumps to condenser 2, and is compressed into the gas of high temperature, high pressure; The gas of high temperature, high pressure is condensed into liquid refrigerants after condenser 2 coolings; Liquid refrigerants is inflow evaporator 1 again, and evaporimeter 1 can be worked continuously.
Compared with prior art, the refrigerating plant of the utility model adopts evaporimeter 1, condenser 2 and compressor 3 to realize refrigeration, need not to use the semiconductor chip refrigeration, and the life-span of compressor 3 is longer, and its Energy Efficiency Ratio can reach more than 200%.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection domain of the utility model.
Claims (10)
1. refrigerating plant; It is characterized in that; Comprise evaporimeter, condenser, compressor and refrigerant transfer tube, said evaporimeter comprises first radiator, and said condenser comprises second radiator; Said refrigerant transfer tube connects said evaporimeter, compressor and condenser successively, in said refrigerant transfer tube, has refrigerant.
2. refrigerating plant as claimed in claim 1 is characterized in that, said first radiator or second radiator are spaced fin, are provided with through hole in said fin, and said refrigerant transfer tube is arranged in the said through hole.
3. refrigerating plant as claimed in claim 2 is characterized in that said fin is processed by copper material.
4. refrigerating plant as claimed in claim 1 is characterized in that, said first radiator or second radiator comprise pedestal and be positioned at the fin on the said pedestal in said pedestal, to have the said passage of passage and be connected with said refrigerant transfer tube.
5. refrigerating plant as claimed in claim 3 is characterized in that, said first radiator is processed by aluminium.
6. refrigerating plant as claimed in claim 1 is characterized in that, said compressor is a micro-compressor, and its diameter is 30-80mm.
7. refrigerating plant as claimed in claim 1 is characterized in that said evaporimeter also comprises first fan, and said first fan is positioned on said first radiator; Said condenser also comprises second fan, and said second fan is positioned on said second radiator.
8. refrigerating plant as claimed in claim 1 is characterized in that, said evaporimeter is positioned at a side of a substrate, and said condenser and compressor are positioned at the opposite side of said substrate.
9. refrigerating plant as claimed in claim 1 is characterized in that, said first radiator cowl is provided with first shell, and the position of corresponding said first radiator of said first shell has through hole, is provided with first fan in the through hole outside of said first shell; Said second radiator and compressor are covered with second shell outward, and the position of corresponding said second radiator of said second shell has through hole, are provided with second fan in the through hole outside of said second shell.
10. refrigerating plant as claimed in claim 1 is characterized in that, said condenser comprises two described second radiators, and said compressor is between described two second radiators.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220009363 CN202485267U (en) | 2012-01-09 | 2012-01-09 | Refrigerating device |
| PCT/CN2012/071718 WO2013104140A1 (en) | 2012-01-09 | 2012-02-28 | Refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220009363 CN202485267U (en) | 2012-01-09 | 2012-01-09 | Refrigerating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202485267U true CN202485267U (en) | 2012-10-10 |
Family
ID=46959685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220009363 Expired - Lifetime CN202485267U (en) | 2012-01-09 | 2012-01-09 | Refrigerating device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202485267U (en) |
| WO (1) | WO2013104140A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111457655A (en) * | 2020-06-01 | 2020-07-28 | 上海沃爱智能科技有限公司 | Novel refrigerating system |
| CN111457651A (en) * | 2020-06-01 | 2020-07-28 | 上海沃爱智能科技有限公司 | A mobile high-endurance refrigerator |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115209673A (en) * | 2021-04-08 | 2022-10-18 | 宏碁股份有限公司 | Heat dissipation module and electronic equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3998319B2 (en) * | 1998-03-24 | 2007-10-24 | 三洋電機株式会社 | Refrigeration equipment |
| US6116040A (en) * | 1999-03-15 | 2000-09-12 | Carrier Corporation | Apparatus for cooling the power electronics of a refrigeration compressor drive |
| CN1308632C (en) * | 2001-09-14 | 2007-04-04 | 左明立 | Compound refrigeration cycle device and method thereof |
| CN1302544C (en) * | 2003-06-18 | 2007-02-28 | 中国科学院理化技术研究所 | Miniature refrigerating system for radiating computer chip |
| US7963118B2 (en) * | 2007-09-25 | 2011-06-21 | International Business Machines Corporation | Vapor-compression heat exchange system with evaporator coil mounted to outlet door of an electronics rack |
| CN102026527A (en) * | 2010-11-16 | 2011-04-20 | 深圳市航宇德升科技有限公司 | Miniature refrigerator for cooling electronic equipment |
-
2012
- 2012-01-09 CN CN 201220009363 patent/CN202485267U/en not_active Expired - Lifetime
- 2012-02-28 WO PCT/CN2012/071718 patent/WO2013104140A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111457655A (en) * | 2020-06-01 | 2020-07-28 | 上海沃爱智能科技有限公司 | Novel refrigerating system |
| CN111457651A (en) * | 2020-06-01 | 2020-07-28 | 上海沃爱智能科技有限公司 | A mobile high-endurance refrigerator |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013104140A1 (en) | 2013-07-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121010 |
|
| CX01 | Expiry of patent term |