CN202474019U - Packaging structure for which chip is separated from fluorescent powder - Google Patents
Packaging structure for which chip is separated from fluorescent powder Download PDFInfo
- Publication number
- CN202474019U CN202474019U CN2011205629990U CN201120562999U CN202474019U CN 202474019 U CN202474019 U CN 202474019U CN 2011205629990 U CN2011205629990 U CN 2011205629990U CN 201120562999 U CN201120562999 U CN 201120562999U CN 202474019 U CN202474019 U CN 202474019U
- Authority
- CN
- China
- Prior art keywords
- chip
- diffuser
- fluorescent powder
- fluorescent material
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000843 powder Substances 0.000 title abstract 7
- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 27
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000012536 packaging technology Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 230000005619 thermoelectricity Effects 0.000 abstract 1
- 238000010792 warming Methods 0.000 abstract 1
- 239000010453 quartz Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000007787 solid Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005676 thermoelectric effect Effects 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
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- Led Device Packages (AREA)
Abstract
The utility model relates to a packaging technology of a chip, specifically relating to a packaging structure for which an LED chip is separated from the fluorescent powder. The packaging structure for which the chip is separated from the fluorescent powder comprises a support and a substrate which is fixedly arranged on the support, wherein a chip, a launcher and a diffuser are arranged on the substrate; the diffuser is packaged on the chip; and the diffuser is provided with the fluorescent powder for forming a diaphanous film. Therefore, the packaging structure for which the chip is separated from the fluorescent powder has the advantages of getting the effect of thermoelectricity separation, reducing color drifting, avoiding the situation that the luminous efficiency of the fluorescent powder is reduced the rate of decay of the fluorescent powder is accelerated so as to quickening the LED lumens depreciation because of warming up rapidly, and prolonging the service life.
Description
Technical field
The present invention relates to a kind of packaging technology of chip, relate in particular to the encapsulating structure that a kind of led chip separates with fluorescent material.
Background technology
The mode that existing LED encapsulation technology is a led chip through solid gold solder line is fixed on led chip on the support, spreads upon the surface of led chip then with the fluorescent material of pasty state, because led chip has a large amount of heat energy generations luminous the time;, chip and fluorescent material causes problems such as LED goes out phototropic, and light decay is fast, and the life-span is brief easily when chemically reacting; Mode of the present invention has solved the above problem that occurs easily; Because of fluorescent material and chip isolation, the heat energy of chip can not pass on the fluorescent material, therefore is difficult to guarantee that the light emission rate of LED is pure; Light decay is slow, and the life-span is long etc.
For example: on December 14th, 2011, disclosed notification number was that the Chinese utility model patent of CN102280556A discloses a kind of LED encapsulating structure, comprised support and lens, and wafer is fixed on the solid brilliant position of support; Said lens are the stuffed quartz lens, and said stuffed quartz lens fixedly are covered on the said support, because lens are the stuffed quartz lens; It is solid transparent; Therefore need not filling gel, saved the processing procedure of traditional filling gel, not only improved generation efficient; And be prone to produce the problem of bubble when having avoided conventional package structure filling gel, improved process rate; Because the material advantage of stuffed quartz lens, can be because of ultraviolet ray aging yellowing, make product be fit to outdoor use; Because lens are the stuffed quartz lens, can completely cut off steam, and fluorescent material is not had injury, have improved the useful life of product.This kind LED encapsulation mainly be to have changed other a kind of material, though light emission rate increases, and prolonged the useful life of product, this material is comparatively expensive, so the expense that brings up can be higher.
Summary of the invention
For overcoming above defective, the present invention provides a kind of thermoelectric effect of separating, and reduces the look drift, but the encapsulating structure that the chip of life-saving separates with fluorescent material.
The present invention realizes through following technical scheme:
The encapsulating structure that a kind of chip separates with fluorescent material; Comprise: wafer, be provided with bearing wafer support, be fixedly installed on the substrate on the support; Said substrate is provided with chip, emitting substance, and diffuser, wherein; Said diffuser is encapsulated on the said chip, and said diffuser is provided with the fluorescent material that is used to form light-transmissive film.
Further, said wafer and support are electrically connected with gold thread.
Further, said substrate also is provided with fin.
Further, said diffuser is semi-circular diffuser.
Further, said diffuser is the plastics diffuser.
Further, said chip is a led chip.
Beneficial effect of the present invention and advantage:
The encapsulating structure that a kind of led chip provided by the invention separates with fluorescent material, the present invention is after led chip is fixed on support, does a diffuser in addition, covers on the chip top, and sprays the fluorescent material of different-colour at the plastic jacket inwall.Play thermoelectric effect of separating, reduce the look drift, avoided fluorescent material to cause the phenomenon that luminous efficiency descends, the rate of decay is accelerated the LED light decay, the characteristics of life-saving owing to heating up rapidly.
Description of drawings
The encapsulating structure structural representation that accompanying drawing 1. chips provided by the invention separate with fluorescent material;
The encapsulating structure overall structure sketch map that accompanying drawing 2. chips provided by the invention separate with fluorescent material.
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is carried out specifying in the present embodiment below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Like Fig. 1, as shown in Figure 2; The encapsulating structure that a kind of chip separates with fluorescent material comprises: wafer (not shown), be provided with bearing wafer support 1, be fixedly installed on the substrate 2 on the support, said substrate is provided with chip 4, emitting substance 3; And diffuser 6; Wherein, said diffuser 6 is encapsulated on the said chip, and said diffuser 6 is provided with the fluorescent material that is used to form light-transmissive film.
In the present embodiment, said wafer (not shown) is electrically connected with gold thread with support 1.
In the present embodiment, said substrate 2 also is provided with fin 5.
In the present embodiment, said diffuser 6 is semi-circular diffuser.
In the present embodiment, said diffuser 6 is the plastics diffuser.
In the present embodiment, said chip is a led chip.
The above is merely preferred embodiment of the present invention, in order to restriction invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. encapsulating structure that chip separates with fluorescent material; Comprise: wafer, be provided with bearing wafer support, be fixedly installed on the substrate on the support; Said substrate is provided with chip, emitting substance, and diffuser, it is characterized in that; Said diffuser is encapsulated on the said chip, and said diffuser is provided with the fluorescent material that is used to form light-transmissive film.
2. the encapsulating structure that chip according to claim 1 separates with fluorescent material is characterized in that: said wafer and support are electrically connected with gold thread.
3. the encapsulating structure that chip according to claim 1 separates with fluorescent material is characterized in that: said substrate also is provided with fin.
4. the encapsulating structure that chip according to claim 1 separates with fluorescent material is characterized in that: said diffuser is semi-circular diffuser.
5. the encapsulating structure that chip according to claim 1 separates with fluorescent material is characterized in that: said diffuser is the plastics diffuser.
6. the encapsulating structure that chip according to claim 1 separates with fluorescent material is characterized in that: said chip is a led chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205629990U CN202474019U (en) | 2011-12-29 | 2011-12-29 | Packaging structure for which chip is separated from fluorescent powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205629990U CN202474019U (en) | 2011-12-29 | 2011-12-29 | Packaging structure for which chip is separated from fluorescent powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202474019U true CN202474019U (en) | 2012-10-03 |
Family
ID=46922161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205629990U Expired - Fee Related CN202474019U (en) | 2011-12-29 | 2011-12-29 | Packaging structure for which chip is separated from fluorescent powder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202474019U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103107276A (en) * | 2012-12-07 | 2013-05-15 | 孙雪刚 | Light-emitting diode (LED) packaging structure |
-
2011
- 2011-12-29 CN CN2011205629990U patent/CN202474019U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103107276A (en) * | 2012-12-07 | 2013-05-15 | 孙雪刚 | Light-emitting diode (LED) packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121003 Termination date: 20151229 |
|
| EXPY | Termination of patent right or utility model |