CN202443384U - Heat radiation chassis for computer - Google Patents

Abstract

The utility model discloses a heat radiation chassis for a computer. The heat radiation chassis comprises a chassis body and a temperature collecting controller, wherein a heat radiation window is arranged on the side wall of the chassis body; a semiconductor refrigerator and a heat radiation fan are nested on the heat radiation window; the temperature collecting controller comprises a temperature collecting module, a master control module and a power supply converting module; and the semiconductor refrigerator, the heat radiation fan, the power supply converting module and the temperature collecting module are electrically connected with the master control module. The heat radiation chassis provided by the utility model has the advantages of simple structure and novel design. The temperature collecting module can collect internal temperatures and external temperatures of the chassis, and the master control module precisely controls the semiconductor refrigerator and the heat radiation fan to work, thereby realizing a function of controlling the heat radiation of the chassis body.

Description

computer cooling case

technical field

The utility model relates to a computer case, in particular to a computer cooling case.

Background technique

In the prior art, the computer case is made of metal steel plates and plastic panels, providing installation space for storage devices such as power supplies, motherboards, various expansion boards, floppy disk drives, CD-ROM drives, hard drives, etc. Various screws or clips, clips and other connectors firmly fix these components inside the chassis to form a host. The heat dissipation performance of the existing chassis is low, and it cannot be automatically adjusted relative to the change of the ambient temperature.

Contents of the invention

Aiming at the above-mentioned problems in the prior art, the utility model provides a computer cooling case.

In order to achieve the above purpose, the technical solution adopted by the utility model is: a computer heat dissipation chassis, including a box body, the side wall of the box body is provided with a heat dissipation window, and also includes a temperature acquisition controller, and a semiconductor refrigerator is embedded on the heat dissipation window and a cooling fan, the temperature acquisition controller includes a temperature acquisition module, a main control module and a power conversion module, and the semiconductor cooler, cooling fan, power conversion module and temperature acquisition module are all electrically connected to the main control module.

Preferably, the temperature acquisition module includes a first temperature sensor and a second temperature sensor, and the first temperature sensor and the second temperature sensor are respectively located inside and outside the box.

Compared with the prior art, the utility model has the advantages of simple structure and novel design, the temperature collection module can collect the temperature inside and outside the case, and then the main control module can precisely control the work of the semiconductor refrigerator and the heat dissipation fan, so as to control the heat dissipation of the case Function.

Description of drawings

Fig. 1 is the three-dimensional structure schematic diagram of the present utility model;

Fig. 2 is a block diagram of the circuit structure of the utility model.

In the figure: 1. Box body; 2. Heat dissipation window; 3. Semiconductor refrigerator; 4. Heat dissipation fan.

Detailed ways

The utility model will be further described below in conjunction with accompanying drawing.

As an embodiment of the present utility model, referring to Fig. 1 and Fig. 2, the present utility model comprises a box body 1, and the side wall of the box body 1 is provided with a heat dissipation window 2, and also includes a temperature acquisition controller, on which the heat dissipation window 2 is embedded There is a semiconductor cooler 3 and a cooling fan 4, and the temperature acquisition controller includes a temperature acquisition module, a main control module and a power conversion module, and the semiconductor cooler 3, the cooling fan 4, the power conversion module and the temperature acquisition module are all electrically connected to the main control module . The temperature acquisition module includes a first temperature sensor and a second temperature sensor, and the first temperature sensor and the second temperature sensor are respectively located inside and outside the box 1 .

When people use it, the first temperature sensor and the second temperature sensor located inside and outside the cabinet 1 can collect the temperature inside and outside the cabinet, and then the main control module precisely controls the operation of the semiconductor refrigerator 3 and the cooling fan 4 to achieve the control of the cabinet. 1 heat dissipation function.

The above description of the disclosed embodiments enables those skilled in the art to realize or use the utility model. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model . Therefore, the present invention will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims (2)

1. computer to dissipate heat cabinet; Comprise casing; The sidewall of said casing is provided with the heat radiation window, it is characterized in that: also comprise the temperature acquisition controller, be embedded with semiconductor cooler and radiator fan on the heat radiation window; Said temperature acquisition controller comprises temperature collect module, main control module and power transfer module, and said semiconductor cooler, radiator fan, power transfer module and temperature collect module all are electrically connected with main control module.

2. computer to dissipate heat cabinet according to claim 1 is characterized in that: said temperature collect module comprises first temperature sensor and second temperature sensor, and said first temperature sensor and second temperature sensor lay respectively at the inside and outside of casing.

Images