CN202373589U - Diode capable of preventing stress from acting on chip - Google Patents
Diode capable of preventing stress from acting on chip Download PDFInfo
- Publication number
- CN202373589U CN202373589U CN 201120546911 CN201120546911U CN202373589U CN 202373589 U CN202373589 U CN 202373589U CN 201120546911 CN201120546911 CN 201120546911 CN 201120546911 U CN201120546911 U CN 201120546911U CN 202373589 U CN202373589 U CN 202373589U
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- Prior art keywords
- diode
- chip
- stress
- cylinder
- base
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses a diode capable of preventing stress from acting on a chip. The diode comprises a base, wherein a pier lead and a diode chip are arranged on the base; the base has a convex structure which is formed by a large-diameter cylinder and a small-diameter cylinder; a concave hole is formed in the large-diameter cylinder; a circular welding platform is arranged in the middle of a bottom surface of the concave hole; an annular groove is formed around the welding platform; the diode chip which is connected with the pier lead is welded on the welding platform; and silicon rubber which completely covers the diode chip is filled in the concave hole. The diode has the advantages of simple structure and reliable performance, and the chip of the diode cannot be destroyed by assembly external force during assembly.
Description
Technical field
the utility model relates to a kind of stress diode on chip and preparation method thereof that prevents; Particularly a kind of stress diode on chip that prevents to produce because of assembling pressure and preparation method thereof belongs to the diode fabrication technical field.
Background technology
The silicon rectifier diode of 25～50A on motor vehicle, is used usually in
, is mainly used in the alternating current that motor generator is sent and changes into other electrical equipment uses on the direct current steam supply car.At present, the main popular BOSCH type press-fit diode in market is owing to its structural reason; With heat radiation pole plate combine and assemble the time, if mismate, under the effect of assembling pressure; Cause the damage to diode chip for backlight unit of the stress that produces because of assembling pressure easily, make diode on electrical quantity, not reach standard-required, reverse leakage current increases; When serious even can cause diode fails, lose the function of " forward conduction, reverse by ".Therefore existing diode structure is still reasonable inadequately.
Summary of the invention
The purpose of
the utility model is; Provide a kind of simple in structure and can make diode when assembling diode chip for backlight unit can not receive a kind of diode of stress on chip that prevent of the stress rupture that external force produces, to overcome the deficiency of prior art.
The technical scheme of
the utility model is to constitute like this: a kind of diode of stress on chip that prevent of the utility model is: this diode comprises base; Pier nose lead-in wire and diode chip for backlight unit are installed on base; Base is made up of the planform of convex shape cylinder with large diameter and small diameter cylinders; On cylinder with large diameter, be provided with shrinkage pool; Be provided with the jig of a circle at middle part, shrinkage pool bottom surface and be provided with a ring annular groove around jig, the diode chip for backlight unit that is connected with the pier nose lead-in wire is welded on the jig, and embedding has the silicon rubber that diode chip for backlight unit is all covered in shrinkage pool.
The bottom surface cross sectional shape of
above-mentioned annular groove is a circular shape.
The outside diameter of
above-mentioned cylinder with large diameter is greater than the outside diameter of small diameter cylinders.
The outside diameter of
above-mentioned small diameter cylinders is less than the aperture of cylinder with large diameter upper concave hole.
are provided with on the external cylindrical surface of small diameter cylinders and can guarantee and be assembled the close-fitting straight burr of parts.
are owing to adopted technique scheme; The utility model becomes the convex shape planform of being made up of cylinder with large diameter and small diameter cylinders with the base shape fabricating of diode; And with small diameter cylinders as the assembling connecting portion of assembling during diode; Cylinder with large diameter is born the position of assembling pressure effect during diode as assembling; Around jig, be provided with a ring annular groove simultaneously; When pressing solidly the assembling of the diode of the utility model on the product of being produced, its assembling pressure will act on the large diameter cylinder like this, and the stress that its assembling pressure is produced base inside is owing to there is the buffer action of annular groove can discharge the stress to jig; So the chip that is welded on the jig can not receive the stress influence that assembling pressure produces, and more can not be assembled the stress rupture that pressure produces.In addition; Because the base of the utility model has adopted the structure of convex shape, when assembling, its small diameter cylinders can be assembled under less pressure and put in place; So reduced the interior assembling compression that is produced of base greatly, made the product function and the stability of being produced better.So, the utility model compared with prior art, the utility model not only has the chip that can guarantee diode can not receive the advantage of assembling outside destroy when assembling, but also has advantage simple in structure, dependable performance.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Fig. 2 is the annular groove bottom surface cross sectional shape structure for amplifying sketch map of the utility model base.
Being labeled as in
accompanying drawing: 1-base, 1.1-cylinder with large diameter, 1.2-small diameter cylinders, 1.3-shrinkage pool, 1.4-annular groove, 1.5-jig, 1.6-straight burr, 2-pier nose lead-in wire, 3-diode chip for backlight unit, 4-silicon rubber.
Embodiment
are further described the utility model below in conjunction with accompanying drawing and embodiment, but not as the foundation to the utility model restriction.
The embodiment of
the utility model: a kind of diode of stress on chip that prevent of the utility model makes up according to following manufacture method; This method is on the manufacture method of existing diode, to improve to form; When making the base of diode; Base 1 shape fabricating of diode is become the convex shape planform of being made up of cylinder with large diameter 1.1 and small diameter cylinders 1.2; And with small diameter cylinders 1.2 as the assembling connecting portion of assembling during diode; Cylinder with large diameter 1.1 is born the position of assembling pressure effect during diode as assembling, on cylinder with large diameter 1.1, produce a shrinkage pool 1.3, and in the shrinkage pool 1.3 of cylinder with large diameter 1.1, produce a ring annular groove 1.4 and jig 1.5; Adopt traditional welding procedure to be welded on the jig 1.5 the existing diode chip for backlight unit 3 that is connected with pier nose lead-in wire 2; Advance in the shrinkage pool 1.3 with traditional silicon rubber embedding then, diode chip for backlight unit 3 is all covered in, can produce and prevent the diode of stress on chip.
prevent that according to a kind of of the utility model that said method makes up the structure of the diode of stress on chip is as depicted in figs. 1 and 2; This diode comprises base 1 and the existing diode chip for backlight unit 3 that is connected with pier nose lead-in wire 2; Its base 1 is made up of the planform of convex shape cylinder with large diameter 1.1 and small diameter cylinders 1.2; On cylinder with large diameter 1.1, be manufactured with the shrinkage pool 1.3 of blind hole shape; Produce jig 1.5 and a annular groove 1.4 of a circle around jig 1.5 at middle part, shrinkage pool 1.3 bottom surfaces; During making, the outside diameter of cylinder with large diameter 1.1 is made into the outside diameter greater than small diameter cylinders 1.2, preferably the outside diameter of small diameter cylinders 1.2 is made into less than the aperture of the shrinkage pool on the cylinder with large diameter 1.1 1.3 and more than or equal to the diameter of jig 1.5; Cross sectional shape with annular groove 1.4 bottom surfaces is made into circular shape (as shown in Figure 2) simultaneously; For when assembling is used, connect more reliably, can on the external cylindrical surface of small diameter cylinders 1.2, produce and can guarantee and be assembled the close-fitting straight burr 1.6 of parts; The diode chip for backlight unit 3 that adopts traditional mode will be connected with pier nose lead-in wire 2 then is welded on the jig 1.5, and the silicon rubber 4 that embedding completely can all cover in diode chip for backlight unit 3 in shrinkage pool 1.3.
Claims (5)
1. one kind prevents the diode of stress on chip; Comprise base (1); Pier nose lead-in wire (2) and diode chip for backlight unit (3) are installed on base (1); It is characterized in that: base (1) is made up of the planform of convex shape cylinder with large diameter (1.1) and small diameter cylinders (1.2); On cylinder with large diameter (1.1), be provided with shrinkage pool (1.3); Be provided with the jig (1.5) of a circle at middle part, shrinkage pool (1.3) bottom surface and be provided with the stress of a ring annular groove (1.4) when closely cooperating with alleviation around jig (1.5), the diode chip for backlight unit (3) that is connected with pier nose lead-in wire (2) is welded on the jig (1.5), and embedding has the silicon rubber (4) that diode chip for backlight unit (3) is all covered in shrinkage pool (1.3).
2. the diode of stress on chip that prevent according to claim 1 is characterized in that: the cross sectional shape of annular groove (1.4) bottom surface is a circular shape.
3. the diode of stress on chip that prevent according to claim 1, it is characterized in that: the outside diameter of cylinder with large diameter (1.1) is greater than the outside diameter of small diameter cylinders (1.2).
4. the diode of stress on chip that prevent according to claim 1, it is characterized in that: the outside diameter of small diameter cylinders (1.2) is less than the aperture of cylinder with large diameter (1.1) upper concave hole (1.3).
5. the diode of stress on chip that prevent according to claim 1 is characterized in that: on the external cylindrical surface of small diameter cylinders (1.2), be provided with straight burr (1.6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120546911 CN202373589U (en) | 2011-12-23 | 2011-12-23 | Diode capable of preventing stress from acting on chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120546911 CN202373589U (en) | 2011-12-23 | 2011-12-23 | Diode capable of preventing stress from acting on chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202373589U true CN202373589U (en) | 2012-08-08 |
Family
ID=46597283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120546911 Expired - Fee Related CN202373589U (en) | 2011-12-23 | 2011-12-23 | Diode capable of preventing stress from acting on chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202373589U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103177959A (en) * | 2011-12-23 | 2013-06-26 | 贵州雅光电子科技股份有限公司 | Diode for preventing stress from being acted on chip and manufacture method thereof |
| CN103258799A (en) * | 2013-04-24 | 2013-08-21 | 哈尔滨飞机工业集团有限责任公司 | Diode mounting bracket used for helicopter |
-
2011
- 2011-12-23 CN CN 201120546911 patent/CN202373589U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103177959A (en) * | 2011-12-23 | 2013-06-26 | 贵州雅光电子科技股份有限公司 | Diode for preventing stress from being acted on chip and manufacture method thereof |
| CN103258799A (en) * | 2013-04-24 | 2013-08-21 | 哈尔滨飞机工业集团有限责任公司 | Diode mounting bracket used for helicopter |
| CN103258799B (en) * | 2013-04-24 | 2016-02-24 | 哈尔滨飞机工业集团有限责任公司 | A kind of helicopter diode mounting bracket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120808 Termination date: 20171223 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |