CN202310280U - Two-layer printed circuit board and mobile communication terminal - Google Patents
Two-layer printed circuit board and mobile communication terminal Download PDFInfo
- Publication number
- CN202310280U CN202310280U CN 201120399252 CN201120399252U CN202310280U CN 202310280 U CN202310280 U CN 202310280U CN 201120399252 CN201120399252 CN 201120399252 CN 201120399252 U CN201120399252 U CN 201120399252U CN 202310280 U CN202310280 U CN 202310280U
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- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- layer printed
- sensitive
- cabling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
Abstract
The utility model discloses a two-layer printed circuit board and a mobile communication terminal, which can overcome the defects that the prior low end mobile communication terminal employs a six-layer or four-layer printed circuit board, thereby being high in cost, wherein in the two-layer printed circuit board, at the intersection of the route of a sensitive signal line and the route of a non-sensitive signal line on the other side of the printed circuit board, there is provided an avoidant element connected in series with the non-sensitive signal line without influencing the performance of the non-sensitive signal line in order to avoid the route of the sensitive signal line, and between two pads of the avoidant element there is provided a ground layer. The embodiment of the utility model enables the avoidant element with low impedance to be added to a common signal line, thereby realizing the intersection of radio frequency lines and the common signal line in different layers, and also ensuring the integrity of the radio frequency performance of the mobile communication terminal.
Description
Technical field
The utility model relates to printed circuit board, relates in particular to a kind of two-layer printed circuit board and comprises the mobile communication terminal of this circuit board.
Background technology
Printed circuit is exactly according to designed circuit in advance, utilizes print process at the surface of insulated substrate or the conductive pattern that is used for connecting between the components and parts of its inner formation.Printed circuit board occupies very consequence in electronic product.
One of main application of printed circuit board is exactly a mobile communication terminal.The competition of the mobile communication terminal of low side mainly concentrates on stable and price cheap of performance.At present, employed printed circuit board in the mobile communication terminal of low side mainly is six layers of printed circuit board (being called for short six laminates) and four layers of printed circuit board (being called for short four laminates).
On the whole; The cost of two-layer printed circuit board approximately has only the half the of four layers of printed circuit board; Have only 1/3rd of six layers of printed circuit board, therefore two-layer printed circuit board is applied on the mobile communication terminal of low side, will obviously reduce the cost of mobile communication terminal.
The utility model content
The utility model technical problem to be solved is to overcome present low side mobile communication terminal to use six layers or four layers of deficiency that the printed circuit board cost is higher.
In order to solve the problems of the technologies described above; The utility model provides a kind of two-layer printed circuit board; In this two-layer printed circuit board; The cabling of sensitive signal wire and printed circuit board (PCB) be the cabling intersection of the non-sensitive holding wire of one side in addition, on this non-sensitive holding wire, be in series with do not influence this non-sensitive holding wire performance evade element avoiding the cabling of this sensitive signal wire, this is evaded between element two pads and is covered with the stratum.
Preferably, power amplifier module on this two-layer printed circuit board and master chip are according to the adjacent setting of cabling of this sensitive signal wire.
Preferably, the said series impedance of element on this non-sensitive holding wire of evading is less than 1 ohm.
Preferably, the said element of evading comprises inductance, magnetic bead, electric capacity, resistance or cable.
Preferably, this gap of evading between element two pads is wideer than the live width of this non-sensitive holding wire.
Preferably, all sensitive signal wires are complete ground level from the position and the regional back side of cabling that baseband chip is drawn on this two-layer printed circuit board.
Preferably, pass through the space of the radio-frequency receiving tube pin of the power amplifier module of the non-sensitive holding wire of part from this two-layer printed circuit board and the ground pad between the radio frequency output pin.
Preferably, this sensitive signal wire comprises radio frequency line and/or clock cable.
Preferably, the radio frequency between from the master chip to the power amplifier module receives line and the shortest and cabling smooth mode setting according to distance of radio-frequency transmissions line.
The utility model also provides a kind of mobile communication terminal, comprises foregoing this two-layer printed circuit board.
Compared with prior art, the embodiment of the utility model has realized promptly intersecting between different layers radio frequency line and the normal signal line integrality that has guaranteed the mobile communication terminal radio-frequency performance again through on common holding wire, increasing the low-impedance element of evading.Two layers of printed circuit board of the utility model embodiment are when being applied to mobile communication terminal; Can guarantee that mobile communication terminal function is normal; Compare the existing mobile communication terminal that adopts four layers of printed circuit board or six layers of printed circuit board; Under the prerequisite of not losing function, obviously reduce cost, improved the product competition advantage.
Description of drawings
Fig. 1 be among the utility model embodiment one deck cabling through evading the stagger structural representation of radio frequency line of element.
Fig. 2 is the sketch map that the part cabling passes through the power amplifier module corner among the utility model embodiment.
Fig. 3 is master chip and a power amplifier module placement location sketch map among the utility model embodiment.
Fig. 4 be among the utility model embodiment from master chip to power amplifier module radio frequency cabling sketch map.
Fig. 5 is the schematic flow sheet that the utility model embodiment prints two layers of printed circuit board.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model is clearer, hereinafter will combine accompanying drawing that the embodiment of the utility model is elaborated.Need to prove that under the situation of not conflicting, embodiment among the application and the characteristic among the embodiment be combination in any each other.
The two-layer printed circuit board of the utility model embodiment; In this two-layer printed circuit board; The cabling of the sensitive signal wire that is subject to disturb and printed circuit board (PCB) be the cabling intersection of the non-sensitive holding wire of one side in addition; On this non-sensitive holding wire series connection low-impedance do not influence non-sensitive holding wire performance evade the cabling of element with the sensitive signal wire avoiding being subject to disturb, this evades gap between element two pads, and the live width of this non-sensitive holding wire is wide, is covered with the stratum between two pads.So handle, for the sensitive signal wire that is subject to disturb, can set up the excellent protection environment.
Among the embodiment of the utility model, the above-mentioned low-impedance element of evading be such as being resistance less than 1 ohm resistance, also can be series impedance less than cable of 1 ohm or the like.
Among the embodiment of the utility model; The above-mentioned element of evading that does not influence non-sensitive holding wire performance can be the device of selecting according to the characteristic of this non-sensitive line; As then select direct current equivalent resistance (Direct Current Resistance for the non-sensitive holding wire of low frequency signal; DCR) lower inductance or magnetic bead, and, then can select the electric capacity of Da Rong value for the non-sensitive holding wire of high-frequency signal.
Among some embodiment of the utility model, this low frequency signal usually can be thought the signal of frequency less than 2 megahertzes (MHz), and high-frequency signal usually can be thought the signal greater than 10MHz.Certainly, in the other embodiment of the utility model, this low frequency signal and high-frequency signal also can be to exceed with other numerical value.
Among the embodiment of the utility model, the impedance of this electric capacity is satisfied 1/ (2*pi*f*C) less than 1 ohm, and wherein pi is a circumference ratio, and f is signalman's working frequency, and unit is Hz, and C is the appearance value of electric capacity, is unit farad (f).
Among the embodiment of the utility model, all sensitive signal wires are complete ground level from the position and the regional back side of cabling that baseband chip is drawn on two-layer printed circuit board.
Among the embodiment of the utility model, this sensitive signal wire also can be a clock cable such as being radio frequency line.
In the two-layer printed circuit board that embodiment realized of the utility model,, therefore significantly reduced the needed zone of cabling because two-layer printed circuit board can cabling.And the radio frequency line in the present embodiment needs some signal reference layers in ground, so that one deck of the back side of radio frequency line is not allow cabling.If fully according to this rule, then will inevitably cause segment signal line to connect.
As shown in Figure 1; The embodiment of the utility model evades element through series connection on non-sensitive holding wire; And evade between element two pads at this and to spread the stratum, the sensitive signal wire of one deck is just in time vertical in addition evades element with this and walks corresponding zone in the middle of this evades element two pads, has realized that so promptly non-sensitive holding wire passes sensitive signal wire at another layer; Guarantee the integrality of sensitive signal wire again, can satisfy the functional requirement of mobile communication terminal.So convenient processing the cabling of two-layer printed circuit board, do not influence sensitive signal wire such as the cabling of radio frequency line with and the cabling of non-sensitive holding wire.
In the position of ellipse shown in Figure 1 sign, adopted the utility model embodiment above-mentioned element is evaded in the non-sensitive holding wire series connection of one deck and in addition one deck sensitive signal wire pass the laying mode that this evades element.
In the two-layer printed circuit board of the utility model embodiment; Because the space of a ground pad is arranged between the radio-frequency receiving tube pin of power amplifier module and the radio frequency output pin; Therefore the cabling of the non-sensitive holding wire of part can be walked through here; Avoid intersecting the zone in oval circle the as shown in Figure 2 with radio frequency line.So can under the prerequisite that guarantees the radio frequency line cabling, increase the cabling zone of non-sensitive holding wire.
As shown in Figure 3, in the embodiment of the utility model, power amplifier module on this two-layer printed circuit board 10 and the move towards adjacent setting of master chip (such as the MT6251 chip) according to this radio frequency line, and the shortest and alternately be not as the criterion with cabling.So be provided with and reduced from the master chip to the power amplifier module cable run distance of radio frequency line between 10, and then increase the cabling space of non-sensitive holding wire.
As shown in Figure 4; Among the embodiment of the utility model; Radio frequency from the master chip to the power amplifier module between 10 receives line and radio-frequency transmissions line, and the shortest and cabling smooth mode is provided with according to distance, guarantees that from the master chip to the power amplifier module radio frequency line between 10 only occurs and can not walk at the second layer at ground floor, has guaranteed that further two radio frequency lines are non-intersect; So processing also can increase the cabling space of non-sensitive holding wire, has also increased the reliability of radiofrequency signal simultaneously.
As shown in Figure 5, the utility model embodiment prints the flow process of two layers of printed circuit board, and present embodiment is that example describes with the cabling of this sensitive signal wire of radio frequency line.As shown in Figure 5, this flow process has mainly comprised following steps:
Step S510, power amplifier module and master chip (such as the MT6251 chip) move towards adjacent and the shortest and setting that alternately is not as the criterion with cabling according to this radio frequency line, to reduce the cable run distance of radio frequency line.
Step S520, the cabling of radio frequency line and printed circuit board (PCB) be the cabling intersection of the non-sensitive holding wire of one side in addition, and the stagger cabling of this radio frequency line of element is evaded in one of series connection on this non-sensitive holding wire.
Step S530 evades floor file layer between element two pads at this.
Step S540 utilizes in the power amplifier module to receive the space that a ground pad is arranged between pin and the output pin, and several groups of non-sensitive holding wires of other one deck are passed from this space, avoids these several groups non-sensitive holding wires and radio frequency line crossing.
The embodiment of the utility model also comprises aforesaid two layers of printed circuit board is applied in the mobile communication terminal.Details are not done here and are given unnecessary details referring to the description of two layers of printed circuit board in the previous embodiment.
The embodiment of the utility model evades element through on non-sensitive holding wire, increasing by one, the promptly crossing integrality that has guaranteed performances such as mobile communication terminal radio frequency again between the sensitive signal wire of having realized different layers and the non-sensitive holding wire.The embodiment of the utility model receives the cabling zone between pin and the output pin through increasing power amplifier module, has increased the space of two-ply at the non-sensitive holding wire cabling in radio frequency zone.The embodiment of the utility model is through reducing the distance and the position of adjusting power amplifier module between master chip and the power amplifier module; Improved the mode of master chip to radio frequency cabling between the power amplifier module; Avoid intersecting of this part radio frequency line and non-sensitive holding wire, improved the stability of system.
Though the execution mode that the utility model disclosed as above, the execution mode that described content just adopts for the ease of understanding the utility model is not in order to limit the utility model.Technical staff under any the utility model in the technical field; Under the prerequisite of spirit that does not break away from the utility model and disclosed and scope; Can do any modification and variation what implement in form and on the details; But the scope of patent protection of the utility model still must be as the criterion with the scope that appending claims was defined.
Claims (10)
1. two-layer printed circuit board; It is characterized in that; In this two-layer printed circuit board; The cabling of sensitive signal wire and printed circuit board (PCB) be the cabling intersection of the non-sensitive holding wire of one side in addition, on this non-sensitive holding wire, be in series with do not influence this non-sensitive holding wire performance evade element avoiding the cabling of this sensitive signal wire, this is evaded between element two pads and is covered with the stratum.
2. two-layer printed circuit board according to claim 1 is characterized in that,
Power amplifier module on this two-layer printed circuit board and master chip are according to the adjacent setting of cabling of this sensitive signal wire.
3. two-layer printed circuit board according to claim 1 is characterized in that,
The said series impedance of element on this non-sensitive holding wire of evading is less than 1 ohm.
4. two-layer printed circuit board according to claim 1 is characterized in that,
The said element of evading comprises inductance, magnetic bead, electric capacity, resistance or cable.
5. two-layer printed circuit board according to claim 1 is characterized in that,
This gap of evading between element two pads is wideer than the live width of this non-sensitive holding wire.
6. two-layer printed circuit board according to claim 1, wherein:
All sensitive signal wires are complete ground level from the position and the regional back side of cabling that baseband chip is drawn on this two-layer printed circuit board.
7. two-layer printed circuit board according to claim 1 is characterized in that,
Pass through the radio-frequency receiving tube pin of the power amplifier module of the non-sensitive holding wire of part from this two-layer printed circuit board and the space of the ground pad between the radio frequency output pin.
8. according to the described two-layer printed circuit board of each claim in the claim 1 to 7, it is characterized in that,
This sensitive signal wire comprises radio frequency line and/or clock cable.
9. two-layer printed circuit board according to claim 8 is characterized in that,
Radio frequency between from the master chip to the power amplifier module receives line and the shortest and cabling smooth mode setting according to distance of radio-frequency transmissions line.
10. a mobile communication terminal is characterized in that, comprises like described this two-layer printed circuit board of each claim in the claim 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120399252 CN202310280U (en) | 2011-10-19 | 2011-10-19 | Two-layer printed circuit board and mobile communication terminal |
| PCT/CN2012/077130 WO2013056561A1 (en) | 2011-10-19 | 2012-06-19 | Two-layered printed circuit board and mobile communication terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120399252 CN202310280U (en) | 2011-10-19 | 2011-10-19 | Two-layer printed circuit board and mobile communication terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202310280U true CN202310280U (en) | 2012-07-04 |
Family
ID=46379086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120399252 Expired - Lifetime CN202310280U (en) | 2011-10-19 | 2011-10-19 | Two-layer printed circuit board and mobile communication terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202310280U (en) |
| WO (1) | WO2013056561A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013056561A1 (en) * | 2011-10-19 | 2013-04-25 | 中兴通讯股份有限公司 | Two-layered printed circuit board and mobile communication terminal |
| CN111295043A (en) * | 2019-06-18 | 2020-06-16 | 展讯通信（上海）有限公司 | Radio frequency circuit board |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100583458B1 (en) * | 2004-01-28 | 2006-05-26 | 삼성전자주식회사 | Printed Circuit Board |
| CN2731907Y (en) * | 2004-08-24 | 2005-10-05 | 华为技术有限公司 | Multilayer printed circuit board |
| KR100762395B1 (en) * | 2006-04-10 | 2007-10-02 | 엘지전자 주식회사 | Printed circuit board for high impedance matching and process for production thereof |
| US8338940B2 (en) * | 2008-03-28 | 2012-12-25 | Nec Corporation | Semiconductor device |
| KR20100084379A (en) * | 2009-01-16 | 2010-07-26 | 삼성전자주식회사 | Printed circuit board |
| CN101674704A (en) * | 2009-10-23 | 2010-03-17 | 中兴通讯股份有限公司 | Signal transmission method of printed circuit board (PCB) and printed circuit board |
| CN201830545U (en) * | 2010-09-29 | 2011-05-11 | 扬智科技股份有限公司 | PCB (printed circuit board) |
| CN202310280U (en) * | 2011-10-19 | 2012-07-04 | 中兴通讯股份有限公司 | Two-layer printed circuit board and mobile communication terminal |
-
2011
- 2011-10-19 CN CN 201120399252 patent/CN202310280U/en not_active Expired - Lifetime
-
2012
- 2012-06-19 WO PCT/CN2012/077130 patent/WO2013056561A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013056561A1 (en) * | 2011-10-19 | 2013-04-25 | 中兴通讯股份有限公司 | Two-layered printed circuit board and mobile communication terminal |
| CN111295043A (en) * | 2019-06-18 | 2020-06-16 | 展讯通信（上海）有限公司 | Radio frequency circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013056561A1 (en) | 2013-04-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120704 |
|
| CX01 | Expiry of patent term |