CN202292310U - 用于半导体单晶硅加工的外圆磨床 - Google Patents
用于半导体单晶硅加工的外圆磨床 Download PDFInfo
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- CN202292310U CN202292310U CN2011204398537U CN201120439853U CN202292310U CN 202292310 U CN202292310 U CN 202292310U CN 2011204398537 U CN2011204398537 U CN 2011204398537U CN 201120439853 U CN201120439853 U CN 201120439853U CN 202292310 U CN202292310 U CN 202292310U
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- China
- Prior art keywords
- emery wheel
- skive
- grinding machine
- monocrystalline silicon
- cylindrical
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 229910001651 emery Inorganic materials 0.000 claims description 24
- 238000007514 turning Methods 0.000 claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000004576 sand Substances 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 239000004575 stone Substances 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound 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[Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 14
- 229910052710 silicon Inorganic materials 0.000 abstract description 14
- 239000010703 silicon Substances 0.000 abstract description 14
- 229910003460 diamond Inorganic materials 0.000 abstract description 5
- 239000010432 diamond Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000005096 rolling process Methods 0.000 abstract 1
- 238000003754 machining Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
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Abstract
本实用新型公开了一种用于半导体单晶硅加工的外圆磨床，包括电机、皮带、砂轮、转动轴和工作台，所述电机的转轴与转动轴通过所述皮带连接，所述砂轮设于所述转动轴上，所述砂轮与所述工作台的台面垂直。所述砂轮为金刚石砂轮。本实用新型具有能满足硅棒外圆滚磨的要求，硅棒表面的粗糙度达到0.4左右，大大提高了单晶硅棒的成品率和后工序生产效率和合格率。同时，本实用新型还具有结构简单、加工精度高和加工效率高等优点。
Description
用于半导体单晶硅加工的外圆磨床
技术领域
[0001] 本实用新型涉及一种外圆磨床，特别是涉及一种用于半导体单晶硅加工的外圆磨床。
背景技术
[0002] 随着高精度、高硬度机械零件的增多，以及精密铸造和精密锻造工艺的发展，磨床的性能、品种和产量都在不断的提高和增长。磨床是各类金属切削机床中最多的一类，主要有外圆磨床、内圆磨床、平面磨床、无心磨床和工具磨床。外圆磨床是一种圆柱形、圆锥形或其他形状素线展成的外表面和轴肩端面的磨床。工件支撑在头架和尾座的两顶尖之间，由头架的拨盘带动旋转作圆周进给运动，可作纵向往复的进给运动，装有高度旋转砂轮的砂轮架，则作横向进给运动。
[0003] 单晶硅具有金刚石晶格，晶体硬而脆，很难用常规的外圆磨床磨削单晶硅。因为传统外圆磨床的结构设计存在缺陷（如图1所示），砂轮方向确定其所通用砂轮硬度与单晶硅棒硬度几乎相当（莫氏硬度8左右），无法加工单晶硅棒。
实用新型内容
[0004] 本实用新型的目的是为了解决上述问题而提供一种结构简单、加工精度高、加工效率高的用于半导体单晶硅加工的外圆磨床。
[0005] 本实用新型是通过以下技术方案实现的：
[0006] 一种用于半导体单晶硅加工的外圆磨床，包括电机、皮带、砂轮、转动轴和工作台， 所述电机的转轴与转动轴通过所述皮带连接，所述砂轮设于所述转动轴上，所述砂轮与所述工作台的台面垂直。改进后的外圆磨床加工工件时，工件4的需要切削面与砂轮的圆周面接触，工件由头架的拨盘带动旋转作圆周进给运动，可作纵向往复的进给运动，砂轮在电机带动下则作横向进给运动。通过改变砂轮的安装方向，能满足硅棒外圆滚磨的要求，硅棒表面的粗糙度达到0.4左右。
[0007] 作为一种优选方式，所述砂轮为金刚石砂轮。由于单晶硅具有金刚石晶格，晶体硬而脆，一些普通的砂轮的硬度较低不能加工单晶硅，然而金刚石砂轮因其优良的磨削性能， 能够对高硬度材料进行磨削。所述金刚石砂轮是由金刚石或立方氮化硼磨料制作的超硬磨料砂轮，金刚石砂轮的莫氏硬度约为9. 5-10，硬度强于单晶硅棒，所以采用金刚石砂轮能够对单晶硅进行磨削加工。
[0008] 进一步地，所述金刚石砂轮为烧结型金刚石砂轮、电镀金钢石砂轮或单层钎焊金刚石砂轮。随着半导体单晶硅的精度的要求越来越高，金属结合剂砂轮因其结合强度高、成型性好、使用寿命长等优点得到越来越广泛的应用，为了满足单晶硅的加工硬度和精度要求，采用烧结型金刚石砂轮、电镀金钢石砂轮或单层钎焊金刚石砂轮作为加工单晶硅的砂轮。
[0009] 本实用新型的有益效果是：[0010] 通过改变砂轮的安装方向和选用金刚石砂轮，能满足硅棒外圆滚磨的要求，硅棒表面的粗糙度达到0.4左右，大大提高了单晶硅棒的成品率和后工序生产效率和合格率。 同时，本实用新型还具有结构简单、加工精度高和加工效率高等优点。附图说明[0011] 图1是改进前的外圆磨床的结构示意图；[0012] 图2是本实用新型用于半导体单晶硅加工的外圆磨床的结构示意图；[0013] 图中：1-电机，2-砂轮，3-皮带，4-工件，5-工作台，6-转动轴。具体实施方式[0014] 下面结合附图及具体实施例对本实用新型作进一步的详细说明：[0015] 本实用新型用于半导体单晶硅加工的外圆磨床，一种用于半导体单晶硅加工的外圆磨床，包括电机1、砂轮2、皮带3、转动轴6和工作台5，电机1的转轴与转动轴6通过皮带3连接，砂轮2设于转动轴6上，砂轮2与工作台5的台面垂直。[0016] 砂轮2为金刚石砂轮，所述金刚石砂轮是由金刚石或立方氮化硼磨料制作的超硬磨料砂轮，金刚石砂轮的莫氏硬度约为9. 5-10 ；所述金刚石砂轮为电镀金钢石砂轮。[0017] 改进后的外圆磨床加工工件时，工件4的需要切削面与砂轮的圆周面接触，工件4 由头架的拨盘带动旋转作圆周进给运动，可作纵向往复的进给运动，砂轮在电机带动下则作横向进给运动。通过改变砂轮的安装方向，能满足硅棒外圆滚磨的要求，硅棒表面的粗糙度达到0.4左右。[0018] 最后需要说明的是，如熟悉此技术的人员所了解的，以上所述仅为本实用新型的较佳实施例，而不是对本实用新型技术方案的限定，任何对本实用新型技术特征所做的等同替换或相应改进，仍在本实用新型的保护范围之内。
Claims (3)
1. 一种用于半导体单晶硅加工的外圆磨床，包括电机、皮带、砂轮、转动轴和工作台，所述电机的转轴与转动轴通过所述皮带连接，所述砂轮设于所述转动轴上，其特征在于：所述砂轮与所述工作台的台面垂直。
2.根据权利要求1所述的用于半导体单晶硅加工的外圆磨床，其特征在于：所述砂轮为金刚石砂轮。
3.根据权利要求2所述的用于半导体单晶硅加工的外圆磨床，其特征在于：所述金刚石砂轮为烧结型金刚石砂轮、电镀金钢石砂轮或单层钎焊金刚石砂轮。
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102773777A (zh) * | 2012-08-03 | 2012-11-14 | 刘双红 | 车床内外径研磨机 |
| CN105799072A (zh) * | 2016-05-12 | 2016-07-27 | 大工（青岛）新能源材料技术研究院有限公司 | 一种多晶硅管靶的加工方法 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102773777A (zh) * | 2012-08-03 | 2012-11-14 | 刘双红 | 车床内外径研磨机 |
| CN105799072A (zh) * | 2016-05-12 | 2016-07-27 | 大工（青岛）新能源材料技术研究院有限公司 | 一种多晶硅管靶的加工方法 |
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