CN202210918U - Heat pipe and pedestal combined structure - Google Patents

Heat pipe and pedestal combined structure Download PDF

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Publication number
CN202210918U
CN202210918U CN2011203052635U CN201120305263U CN202210918U CN 202210918 U CN202210918 U CN 202210918U CN 2011203052635 U CN2011203052635 U CN 2011203052635U CN 201120305263 U CN201120305263 U CN 201120305263U CN 202210918 U CN202210918 U CN 202210918U
Authority
CN
China
Prior art keywords
heat
heat pipe
conducting base
groove
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011203052635U
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Chinese (zh)
Inventor
陈世明
Original Assignee
陈世明
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 陈世明 filed Critical 陈世明
Priority to CN2011203052635U priority Critical patent/CN202210918U/en
Application granted granted Critical
Publication of CN202210918U publication Critical patent/CN202210918U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The present utility model provides a heat pipe and pedestal combined structure. The combined structure comprises a heat conduction pedestal and a heat pipe, a groove is arranged on the surface of the heat conduction pedestal, the heat pipe is arranged inside the groove, the heat pipe is pushed and extruded by pushing and extruding the lateral side of the groove of the heat conduction pedestal, thus a part of the heat conduction pedestal is pressed on the surface of the heat pipe, the heat pipe and the heat conduction pedestal can be well combined, the heat pipe is directly contacted with a heating assembly, and the heat conduction efficiency is increased.

Description

The integrated structure of heat pipe and pedestal
Technical field
The relevant a kind of heat abstractor of the utility model is especially about the integrated structure of a kind of heat pipe and pedestal.
Background technology
The heat abstractor that is used for electronic heating component now; Heat pipe has been the heat-conductive assembly of widespread usage, and the occupation mode of heat pipe is to be combined on the heat conducting base, amplexiforms each other with the heating electronic building brick again; With the heat energy of conduction heating electronics and give loss; Wherein, whether good the structural design that heat pipe combines with pedestal is, directly influences heat conduction benefit and property easy to assembly.
As shown in Figure 1, be the integrated structure of a kind of existing heat pipe and thermal transfer base, include thermal transfer base 1, heat pipe 2 and heat-conducting block 3.Wherein, Thermal transfer base 1 is provided with groove 4; Heat pipe 2 is for flat tube and be flat in this groove 4 and be formed with end face 5, and this end face 5 contacts with heat-conducting block 3 lower, planar, is respectively equipped with aduncate sidewall 6 above groove 4 left and right sides of thermal transfer base 1; So that heat pipe 2 and heat-conducting block 3 are coated in the groove 4, suppress on heat pipe 2 and make heat pipe 2 and thermal transfer base 1 do contacting of face and face by heat-conducting block 3.
Though above-mentioned combination can be guaranteed good contact the between heat pipe and the thermal transfer base; But; Owing to press the heat-conducting block of heat pipe and coat the surface that the sidewall of heat pipe can protrude thermal transfer base, cause directly contact heating assembly of heat pipe, ten minutes influences heat transfer efficiency.
The utility model content
In view of this, the main purpose of the utility model is to provide the integrated structure of a kind of heat pipe and pedestal, can guarantee the good combination between heat pipe and the heat conducting base, makes the direct contact heating assembly of heat pipe, increases heat transfer efficiency.
In order to achieve the above object; The utility model provides the integrated structure of a kind of heat pipe and pedestal, comprises heat conducting base and heat pipe, and the surface of heat conducting base offers groove; Heat pipe is placed in the groove; Wherein, the groove side of this heat conducting base supports crowded this heat pipe through squeezing the mode that pushes away, and the part of this heat conducting base covers the heat pipe surface.
Further, said heat conducting base produces the distortion groove through squeezing to push away.
Further, said heat conducting base is provided with location notch at the side of said groove, and this location notch receives crowded pushing away and produces distortion.
Further, the bottom surface of said groove is the plane.
Further, said heat pipe is that relative two sides are flat flat heat pipe.
Further, said heat pipe is that a side is flat, relative another side is circular-arc heat pipe.
Further, said heat pipe has flat horizontal surface, and this heat pipe is incorporated in the said groove flush of this flat horizontal surface and said heat conducting base.
Further, said heat pipe has flat horizontal surface, and this heat pipe is incorporated in the said groove, and this flat horizontal surface is lower than the surface of said heat conducting base, and the part of this heat conducting base covers this flat horizontal surface.
Further, said heat pipe has flat horizontal surface, and this heat pipe is incorporated in the said groove, and this flat horizontal surface is higher than the surface of said heat conducting base.
Further, the groove side compartment of terrain of said heat conducting base receives squeezing and pushes away, and this heat conducting base compartment of terrain covers said heat pipe surface.
Further, said heat conducting base is interval with to receive at the side of said groove and squeezes two above location notchs that push away.
Further, the part of said heat conducting base pushes away and sidesway through squeezing, and heat conducting base is supported squeeze said heat pipe.
Compared to prior art, the heat pipe of the utility model and the integrated structure of pedestal are offered the groove of settling heat pipe at heat conducting base, and receive crowded pushing away at the groove side; When heat conducting base receive to squeeze push away and support squeeze heat pipe after, the part of heat conducting base can cover on the heat pipe surface, and this heat pipe is mounted in the groove; Guarantee the good combination between heat pipe and the heat conducting base whereby; Also can form the surface that flushes heat conducting base, make directly contact heating assembly of heat pipe, increase heat transfer efficiency.
Description of drawings
Fig. 1 is the solid combination sketch map of existing heat pipe and thermal transfer base;
Fig. 2 is the perspective exploded view of the heat pipe and the heat conducting base of the utility model;
Fig. 3 is the heat pipe of the utility model and the combination sketch map of heat conducting base;
Fig. 4 is the cross-sectional schematic of the heat pipe and the heat conducting base of the utility model;
Fig. 5 is the heat pipe of the utility model and the crowded effect sketch map that pushes away of heat conducting base;
Fig. 6 receives to squeeze the sketch map that combines that postpones for the heat pipe of the utility model with heat conducting base;
Fig. 7 is that the heat pipe of the utility model amplifies schematic perspective view with the part after heat conducting base combines;
Fig. 8 is heat pipe and the cross-sectional schematic of heat conducting base of second embodiment of the utility model;
Fig. 9 is the heat pipe of second embodiment of the utility model and the crowded effect sketch map that pushes away of heat conducting base;
Figure 10 receives to squeeze the sketch map that combines that postpones for the heat pipe of second embodiment of the utility model with heat conducting base;
Figure 11 is the heat pipe of the utility model and the sketch map of another form after heat conducting base combines;
Figure 12 is the heat pipe of the utility model and the sketch map of a form again after heat conducting base combines.
Description of reference numerals
1 thermal transfer base, 2 heat pipes
3 heat-conducting blocks, 4 grooves
5 end faces, 6 sidewalls
10 heat conducting bases, 11 grooves
12 location notchs, 12 ' distortion location notch
20 heat pipes, 21 flat horizontal surfaces
30 tools
10a heat conducting base 11a groove
12a distortion groove 20a heat pipe
Embodiment
Detailed description of relevant the utility model and technology contents, with the conjunction with figs. explanation as follows, yet appended accompanying drawing is not to be used to limit to the utility model only as illustrative purposes.
Please, be respectively the heat pipe of the utility model and the perspective exploded view and the combination sketch map of heat conducting base with reference to Fig. 2 and Fig. 3.The heat pipe of the utility model and the integrated structure of pedestal comprise heat conducting base 10 and heat pipe 20.
The surface of this heat conducting base 10 offers groove 11; In the present embodiment, this heat conducting base 10 is provided with location notch 12 at the side of this groove 11, and this location notch 12 can be made as V-type groove or other form; This groove 11 is U type groove (but not as limit), and the bottom surface of this groove 11 is the plane.
This heat pipe 20 is placed in this groove 11, and in addition, this heat pipe 20 can also have flat horizontal surface 21, and in the present embodiment, this heat pipe 20 is flat flat heat pipe for relative two sides.
Please, be respectively the heat pipe of the utility model and act on sketch map and receive to squeeze the sketch map that combines that postpones with the cross-sectional schematic of heat conducting base, crowded pushing away with reference to Fig. 4 to Fig. 6.This groove 11 of these heat conducting base 10 sides supports crowded this heat pipe 20 and makes the part of this heat conducting base 10 cover the surface of this heat pipe 20 through squeezing the mode that pushes away.In the present embodiment; The part of this heat conducting base 10 covers on the flat horizontal surface 21 of this heat pipe 20; The flat horizontal surface 21 of this heat pipe 20 and the flush of this heat conducting base 10, but not as limit, also can be during actual enforcement a little more than the surface of this heat conducting base 10 the contact heating source.In addition; This location notch 12 receives squeezing to push away and is to use terminal pointed tool 30, this tool 30 is pressed down and the part of this heat conducting base 10 is pushed away and sidesway through squeezing, and squeezes this heat pipe 20 so as to supporting; This heat pipe 20 is mounted in this groove 11; At this moment, former location notch 12 can receive crowded pushing away and produce distortion (enlarging slightly), forms distortion location notch 12 '.
Please with reference to Fig. 7, for the heat pipe of the utility model amplifies schematic perspective view with the part after heat conducting base combines.The groove 11 side compartment of terrains of this heat conducting base 10 receive squeezing and push away, so that these heat conducting base 10 compartment of terrains cover this heat pipe 20 surfaces.In the present embodiment; This heat conducting base 10 is interval with two above location notchs 12 at the side of this groove 11; These location notch 12 compartment of terrains receive squeezing and push away, and make these heat conducting base 10 compartment of terrains cover said heat pipe 20 surfaces, firmly this heat pipe 20 is incorporated into this heat conducting base 10.
Then, please with reference to Fig. 8 to Figure 10, the heat pipe that is respectively second embodiment of the utility model acts on sketch map and receives to squeeze the sketch map that combines that postpones with the cross-sectional schematic of heat conducting base, crowded pushing away.The present embodiment and first embodiment are roughly the same, comprise heat conducting base 10a and heat pipe 20a, and the surface of this heat conducting base 10a offers groove 11a.The place different with first embodiment is that this groove 11a is the arc shaped groove of semicircular in shape, and this heat pipe 20a is that a side is flat, relative another side is circular-arc heat pipe.In addition, another difference is that this heat conducting base 10a is not provided with location notch at the side of this groove 11a, and therefore, this heat conducting base 10a (being positioned at this groove 11a side) directly receives crowded pushing away and produces distortion groove 12a.
Please with reference to Figure 11 and Figure 12, be other two kinds of forms of the integrated structure of the heat pipe of the utility model and heat conducting base.The present embodiment place different with first embodiment is that heat pipe is combined in the form in the heat conducting base.Among Figure 11, in the time of in this heat pipe 20 is combined in this groove 11, this flat horizontal surface 21 is lower than the surface of this heat conducting base 10, and this heat conducting base 10 receives squeezing and push away and to support when squeezing this heat pipe 20, and the part of this heat conducting base 10 covers the flat horizontal surface 21 of this heat pipe 20.In addition, in Figure 12, the flat horizontal surface 21 of this heat pipe 20 is a little more than the surface of this heat conducting base 10.
The above is merely the specifying of preferred embodiment of the utility model, is not the protection range in order to limitation the utility model, and other any equivalent transformation all should belong to the application's claim scope.

Claims (12)

1. the integrated structure of heat pipe and pedestal is characterized in that this integrated structure comprises:
Heat conducting base, the surface offers groove;
Heat pipe is placed in this groove; And
Wherein, the groove side of this heat conducting base supports crowded this heat pipe through squeezing the mode that pushes away, and the part of this heat conducting base covers this heat pipe surface.
2. the integrated structure of heat pipe as claimed in claim 1 and pedestal is characterized in that, said heat conducting base produces the distortion groove through squeezing to push away.
3. the integrated structure of heat pipe as claimed in claim 1 and pedestal is characterized in that said heat conducting base is provided with location notch at the side of said groove, and this location notch receives crowded pushing away and produces distortion.
4. like the integrated structure of claim 1 or 3 described heat pipes and pedestal, it is characterized in that the bottom surface of said groove is the plane.
5. the integrated structure of heat pipe as claimed in claim 1 and pedestal is characterized in that, said heat pipe is that relative two sides are flat flat heat pipe.
6. the integrated structure of heat pipe as claimed in claim 1 and pedestal is characterized in that, said heat pipe is that a side is flat, relative another side is circular-arc heat pipe.
7. like the integrated structure of claim 1,5 or 6 described heat pipes and pedestal, it is characterized in that said heat pipe has flat horizontal surface, and this heat pipe is incorporated in the said groove flush of this flat horizontal surface and said heat conducting base.
8. like the integrated structure of claim 1,5 or 6 described heat pipes and pedestal; It is characterized in that said heat pipe has flat horizontal surface, and this heat pipe is incorporated in the said groove; This flat horizontal surface is lower than the surface of said heat conducting base, and the part of this heat conducting base covers this flat horizontal surface.
9. like the integrated structure of claim 1,5 or 6 described heat pipes and pedestal, it is characterized in that said heat pipe has flat horizontal surface, and this heat pipe is incorporated in the said groove, this flat horizontal surface is higher than the surface of said heat conducting base.
10. the integrated structure of heat pipe as claimed in claim 1 and pedestal is characterized in that, the groove side compartment of terrain of said heat conducting base receives squeezing and pushes away, and this heat conducting base compartment of terrain covers said heat pipe surface.
11. the integrated structure of heat pipe as claimed in claim 3 and pedestal is characterized in that, said heat conducting base is interval with to receive at the side of said groove and squeezes two above location notchs that push away.
12. the integrated structure like claim 1,2,3,10 or 11 described heat pipes and pedestal is characterized in that, the part of said heat conducting base pushes away and sidesway through squeezing, and heat conducting base is supported squeeze said heat pipe.
CN2011203052635U 2011-08-19 2011-08-19 Heat pipe and pedestal combined structure Expired - Fee Related CN202210918U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011203052635U CN202210918U (en) 2011-08-19 2011-08-19 Heat pipe and pedestal combined structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011203052635U CN202210918U (en) 2011-08-19 2011-08-19 Heat pipe and pedestal combined structure

Publications (1)

Publication Number Publication Date
CN202210918U true CN202210918U (en) 2012-05-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011203052635U Expired - Fee Related CN202210918U (en) 2011-08-19 2011-08-19 Heat pipe and pedestal combined structure

Country Status (1)

Country Link
CN (1) CN202210918U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103488263A (en) * 2012-06-08 2014-01-01 苹果公司 Fasteners and dual-thickness thermal stages in electronic devices
CN104869783A (en) * 2014-02-20 2015-08-26 奇鋐科技股份有限公司 Radiating module combined structure and radiating module manufacture method
TWI595210B (en) * 2016-01-29 2017-08-11 Asia Vital Components Co Ltd Heat dissipation module combined structure and manufacturing method thereof
JP2019102642A (en) * 2017-12-01 2019-06-24 株式会社フジクラ Heat dissipation module and manufacturing method of heat dissipation module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103488263A (en) * 2012-06-08 2014-01-01 苹果公司 Fasteners and dual-thickness thermal stages in electronic devices
CN103488263B (en) * 2012-06-08 2017-03-01 苹果公司 Securing member in electronic equipment and double thickness thermal levels
CN104869783A (en) * 2014-02-20 2015-08-26 奇鋐科技股份有限公司 Radiating module combined structure and radiating module manufacture method
CN104869783B (en) * 2014-02-20 2020-02-21 奇鋐科技股份有限公司 Heat dissipation module assembly structure and manufacturing method thereof
TWI595210B (en) * 2016-01-29 2017-08-11 Asia Vital Components Co Ltd Heat dissipation module combined structure and manufacturing method thereof
JP2019102642A (en) * 2017-12-01 2019-06-24 株式会社フジクラ Heat dissipation module and manufacturing method of heat dissipation module

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Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120502

Termination date: 20180819

CF01 Termination of patent right due to non-payment of annual fee