CN202076245U - Semiconductor block with substrate having lead clamping groove - Google Patents
Semiconductor block with substrate having lead clamping groove Download PDFInfo
- Publication number
- CN202076245U CN202076245U CN2011202081626U CN201120208162U CN202076245U CN 202076245 U CN202076245 U CN 202076245U CN 2011202081626 U CN2011202081626 U CN 2011202081626U CN 201120208162 U CN201120208162 U CN 201120208162U CN 202076245 U CN202076245 U CN 202076245U
- Authority
- CN
- China
- Prior art keywords
- substrate
- lead
- semiconductor block
- clamping groove
- lead clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000013078 crystal Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
Images
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a semiconductor block. The semiconductor block with a substrate having a lead clamping groove comprises a substrate and a lead, and is characterized in that a plurality of openings are disposed on the periphery of the substrate, and one segment of the lead penetrates the openings to and fro. The semiconductor block is durable and simple in structure, and the lead on the block is not liable to separate.
Description
Technical field
The utility model relates to semiconductor piece.
Background technology
A plurality of semiconductor crystal blocks that semiconductor piece has substrate and welds above, also have the lead that the semiconductor crystal block is connecting, in the prior art, do not have the structure that connects between lead and the substrate, just separate easily between such semiconductor piece and the lead, influence the normal use of semiconductor piece.
The utility model content
Order of the present utility model is exactly at above-mentioned shortcoming, provide a kind of durable in use, the not segregative in the above semiconductor piece of lead---substrate has lead and adds the semiconductor piece of holding groove.
Technical solution adopted in the utility model is such: substrate has lead and adds the semiconductor piece of holding groove, comprises substrate and lead, it is characterized in that: have a plurality of openings around the described substrate, described lead wherein has one section interspersed back and forth opening.
The beneficial effects of the utility model are: such semiconductor piece have durable in use, lead is not easily separated in the above, advantage of simple structure.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Wherein: 1, substrate 2, lead 3, opening
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
As shown in Figure 1, substrate has lead and adds the semiconductor piece of holding groove, comprises substrate 1 and lead 2, it is characterized in that: have a plurality of openings 3 around the described substrate 1, described lead 2 wherein has one section interspersed back and forth opening 3.
Claims (1)
1. substrate has lead and adds the semiconductor piece of holding groove, comprises substrate and lead, it is characterized in that: have a plurality of openings around the described substrate, described lead wherein has one section to intert opening back and forth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202081626U CN202076245U (en) | 2011-06-07 | 2011-06-07 | Semiconductor block with substrate having lead clamping groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202081626U CN202076245U (en) | 2011-06-07 | 2011-06-07 | Semiconductor block with substrate having lead clamping groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202076245U true CN202076245U (en) | 2011-12-14 |
Family
ID=45114334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202081626U Expired - Fee Related CN202076245U (en) | 2011-06-07 | 2011-06-07 | Semiconductor block with substrate having lead clamping groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202076245U (en) |
-
2011
- 2011-06-07 CN CN2011202081626U patent/CN202076245U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111214 Termination date: 20120607 |