CN201998266U - Bamboo engineering material - Google Patents
Bamboo engineering material Download PDFInfo
- Publication number
- CN201998266U CN201998266U CN201120026179XU CN201120026179U CN201998266U CN 201998266 U CN201998266 U CN 201998266U CN 201120026179X U CN201120026179X U CN 201120026179XU CN 201120026179 U CN201120026179 U CN 201120026179U CN 201998266 U CN201998266 U CN 201998266U
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- CN
- China
- Prior art keywords
- bamboo
- engineering material
- bamboo chip
- container
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a bamboo engineering material. The upper and lower surfaces of a plywood (3) for container flooring are respectively adhered with a bamboo chip through an adhesive layer, wherein the adhesive layer is an epoxy resin adhesive layer; the thickness of the bamboo chip is 7.0-1.0mm; and the thickness of the plywood (3) for container flooring is 28-35mm. The bamboo engineering material has the advantages of low manufacturing cost, noble appearance material, simple structure and reliable performance.
Description
Technical field
The utility model relates to a kind of bamboo matter engineering material.
Background technology
Along with people's growth in the living standard, people more and more pay attention to the moulding and the outward appearance of decorating, and are particularly more and more higher to the material requirement of decorating, and decorate as bamboo matter and more are subjected to people's welcome.But it is higher that bamboo matter is decorated cost, and general public can't use bamboo matter and decorate.
The utility model content
Technical problem to be solved in the utility model provides the bamboo matter engineering material of a kind of low cost, outward appearance material noble quality.
In order to solve the problems of the technologies described above, the bamboo matter engineering material that the utility model provides is stained with a bamboo chip by glue-line respectively at the upper surface and the lower surface of composite board for bottom board of container.
Described glue-line is an epoxy glue layer.
The thickness of described bamboo chip is 7.0～1.0mm, and the thickness of described composite board for bottom board of container is 28～35mm.
Adopt the bamboo matter engineering material of technique scheme, because upper surface and lower surface at composite board for bottom board of container are stained with a bamboo chip by glue-line, composite board for bottom board of container has replaced part wooden, reduced wooden volume, increased the intensity of veneer simultaneously, reduced cost, bamboo chip is towards outside user's one side during use, being convenient to the user views and admires, like this, adopt the utility model both to satisfy the view and admire requirement of user, reduced manufacturing cost again, bamboo matter is decorated to come in the more user family bamboo matter decoration.
In sum, the utility model is that a kind of low cost, outward appearance material are noble and simple in structure, the bamboo matter engineering material of dependable performance.
Description of drawings
Fig. 1 is the utility model structural representation.
The specific embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
Referring to Fig. 1, upper surface at composite board for bottom board of container 3 is stained with bamboo chip 1 on by first epoxy glue layer 2, lower surface is stained with a following bamboo chip 5 by second epoxy glue layer 4, the thickness of last bamboo chip 1 and following bamboo chip 5 is 7.0～1.0mm, and the thickness of composite board for bottom board of container 3 is 28～35mm.
Referring to Fig. 1, because upper surface and lower surface at composite board for bottom board of container 3 are stained with bamboo chip 1 and following bamboo chip 5 on one by first epoxy glue layer 2 and second epoxy glue layer 4 respectively, composite board for bottom board of container 3 has replaced part wooden, reduced wooden volume, last bamboo chip 1 and following bamboo chip 5 have satisfied the view and admire requirement of user to bamboo matter decoration, composite board for bottom board of container 3 has increased the intensity of veneer, reduced cost, go up bamboo chip 1 and following bamboo chip 5 one side during use towards outside user, being convenient to the user views and admires, like this, adopt the utility model both to satisfy the view and admire requirement of user to bamboo matter decoration, reduced manufacturing cost again, bamboo matter has been decorated to come in the more user family.
Claims (3)
1. bamboo matter engineering material, it is characterized in that: upper surface and lower surface at composite board for bottom board of container (3) are stained with a bamboo chip by glue-line respectively.
2. bamboo matter engineering material according to claim 1, it is characterized in that: described glue-line is an epoxy glue layer.
3. bamboo matter engineering material according to claim 1 and 2, it is characterized in that: the thickness of described bamboo chip is 7.0～1.0mm, the thickness of described composite board for bottom board of container (3) is 28～35mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120026179XU CN201998266U (en) | 2011-01-26 | 2011-01-26 | Bamboo engineering material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120026179XU CN201998266U (en) | 2011-01-26 | 2011-01-26 | Bamboo engineering material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201998266U true CN201998266U (en) | 2011-10-05 |
Family
ID=44701038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120026179XU Expired - Fee Related CN201998266U (en) | 2011-01-26 | 2011-01-26 | Bamboo engineering material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201998266U (en) |
-
2011
- 2011-01-26 CN CN201120026179XU patent/CN201998266U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111005 Termination date: 20120126 |