CN201956393U - 0.5瓦照明用贴片led - Google Patents

0.5瓦照明用贴片led Download PDF

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Publication number
CN201956393U
CN201956393U CN2011200054802U CN201120005480U CN201956393U CN 201956393 U CN201956393 U CN 201956393U CN 2011200054802 U CN2011200054802 U CN 2011200054802U CN 201120005480 U CN201120005480 U CN 201120005480U CN 201956393 U CN201956393 U CN 201956393U
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China
Prior art keywords
led
electrically connected
led wafer
lead
watt
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Expired - Fee Related
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CN2011200054802U
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English (en)
Inventor
杨光勇
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DONGGUAN JUNHONG OPTICAL Co Ltd
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DONGGUAN JUNHONG OPTICAL Co Ltd
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Priority to CN2011200054802U priority Critical patent/CN201956393U/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本实用新型公开了一种0.5瓦照明用贴片LED,其包括高导热的散热铜座,所述散热铜座中部设置有灯杯,所述灯杯上收容有LED晶片,所述LED晶片涂有一层硅胶质荧光粉,所述LED晶片的一端电连接有第一导线,所述第一导线的另一端电连接有第一电极;所述LED晶片的另一端电连接有第二导线,所述第二导线的另一端电连接有第二电极,所述LED晶片通过硅胶进行密封。本实用新型可实现散热性能好,使用寿命长,比传统的灯泡节能60%,寿命是普通灯泡的10倍。

Description

0.5瓦照明用贴片LED
技术领域
本实用新型涉及一种LED,尤其是涉及一种0.5瓦照明用贴片LED。
背景技术
随着电子产品向轻、薄、小及高密度多功能化发展,印制板上的元件组装密度和集成度越来越高,功率消耗越来越大,对PCB基板的散热性要求越来越迫切,如果基板的散热性不好,会导致印制板上的元器件过热,从而降低使用寿命,甚至损坏。LED作为一种新型的光源越来越受到人们的关注,其应用也越来越广泛,现有的LED主要有以下几类:大功率LED、直插式LED、灌胶式LED和贴片LED,其中贴片LED因体积小而得到广泛的应用。然而,现有的贴片LED散热性能差,使用寿命短。
发明内容
本实用新型是针对上述背景技术存在的缺陷提供一种散热性能好及使用寿命长的0.5瓦照明用贴片LED。
为实现上述目的,本实用新型公开了一种0.5瓦照明用贴片LED,其包括高导热的散热铜座,所述散热铜座中部设置有灯杯,所述灯杯上收容有LED晶片,所述LED晶片涂有一层硅胶质荧光粉,所述LED晶片的一端电连接有第一导线,所述第一导线的另一端电连接有第一电极;所述LED晶片的另一端电连接有第二导线,所述第二导线的另一端电连接有第二电极,所述LED晶片通过硅胶进行密封。
进一步地,所述第一导线为金线或银线。
进一步地,所述第二导线为金线或银线。
综上所述,本实用新型0.5瓦照明用贴片LED通过设置有高导热的所述散热铜座,因而可将所述LED晶片的热量快速导出,因而可实现散热性能好,使用寿命长,比传统的灯泡节能60%,寿命是普通灯泡的10倍。
附图说明
图1为本实用新型一种实施例的立体图。
图2为图1所示本实用新型另一视角的立体图。
图3为图1所示本实用新型的结构示意图。
具体实施方式
为能进一步了解本实用新型的特征、技术手段以及所达到的具体目的、功能,下面结合附图与具体实施方式对本实用新型作进一步详细描述。
请参阅图1至图3,本实用新型0.5瓦照明用贴片LED包括高导热的散热铜座1,所述散热铜座1中部设置有灯杯。所述灯杯上收容有LED晶片2,所述LED晶片2涂有一层硅胶质荧光粉,通电时本实用新型可发出白光。所述LED晶片2的一端电连接有第一导线3,所述第一导线3的另一端电连接有第一电极4。所述LED晶片2的另一端电连接有第二导线5,所述第二导线5的另一端电连接有第二电极6,所述LED晶片2通过硅胶7进行密封。
所述第一导线3及所述所述第二导线5可为金线或银线,在本实施例中,所述第一导线3及所述第二导线5均银线,因而与现有技术相比,本实用新型可节约成本。此外,当所述LED晶片2发出的光线射到所述银线表面后,通过所述银线表面反射出,因而可提高出光效率。
综上所述,本实用新型0.5瓦照明用贴片LED通过设置有高导热的所述散热铜座1,因而可将所述LED晶片2的热量快速导出,因而可实现散热性能好,使用寿命长,比传统的灯泡节能60%,寿命是普通灯泡的10倍。
以上所述实施例仅表达了本实用新型的一种实施方式,其描述较为具体和详细,但并不能因此而理解为对本实用新型范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本实用新型构思的前提下,还可以做出若干变形和改进,这些都属于本实用新型的保护范围。因此,本实用新型的保护范围应以所附权利要求为准。

Claims (3)

1.一种0.5瓦照明用贴片LED,其特征在于:包括高导热的散热铜座(1),所述散热铜座(1)中部设置有灯杯,所述灯杯上收容有LED晶片(2),所述LED晶片(2)涂有一层硅胶质荧光粉,所述LED晶片(2)的一端电连接有第一导线(3),所述第一导线(3)的另一端电连接有第一电极(4);所述LED晶片(2)的另一端电连接有第二导线(5),所述第二导线(5)的另一端电连接有第二电极(6),所述LED晶片(2)通过硅胶(7)进行密封。
2.根据权利要求1所述的0.5瓦照明用贴片LED,其特征在于:所述第一导线(3)为金线或银线。
3.根据权利要求1或2所述的0.5瓦照明用贴片LED,其特征在于:所述第二导线(5)为金线或银线。
CN2011200054802U 2011-01-10 2011-01-10 0.5瓦照明用贴片led Expired - Fee Related CN201956393U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102610727A (zh) * 2012-01-31 2012-07-25 安徽格锐特光电科技有限公司 高效白光led贴片发光二极管

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102610727A (zh) * 2012-01-31 2012-07-25 安徽格锐特光电科技有限公司 高效白光led贴片发光二极管

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Granted publication date: 20110831

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