CN201878424U - 用于电子产品波峰焊的印制电路板 - Google Patents
用于电子产品波峰焊的印制电路板 Download PDFInfo
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- CN201878424U CN201878424U CN2010206121469U CN201020612146U CN201878424U CN 201878424 U CN201878424 U CN 201878424U CN 2010206121469 U CN2010206121469 U CN 2010206121469U CN 201020612146 U CN201020612146 U CN 201020612146U CN 201878424 U CN201878424 U CN 201878424U
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CN2010206121469U CN201878424U (zh) | 2010-11-15 | 2010-11-15 | 用于电子产品波峰焊的印制电路板 |
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CN2010206121469U CN201878424U (zh) | 2010-11-15 | 2010-11-15 | 用于电子产品波峰焊的印制电路板 |
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CN201878424U true CN201878424U (zh) | 2011-06-22 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104093268A (zh) * | 2014-06-11 | 2014-10-08 | 深圳市磊科实业有限公司 | 一种可防止相邻焊盘连锡的pcb板结构 |
CN109068502A (zh) * | 2018-10-31 | 2018-12-21 | 中新科技集团股份有限公司 | 一种pcb |
WO2019028913A1 (zh) * | 2017-08-11 | 2019-02-14 | 华为技术有限公司 | 一种印制电路板和终端 |
-
2010
- 2010-11-15 CN CN2010206121469U patent/CN201878424U/zh not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104093268A (zh) * | 2014-06-11 | 2014-10-08 | 深圳市磊科实业有限公司 | 一种可防止相邻焊盘连锡的pcb板结构 |
WO2019028913A1 (zh) * | 2017-08-11 | 2019-02-14 | 华为技术有限公司 | 一种印制电路板和终端 |
CN110199578A (zh) * | 2017-08-11 | 2019-09-03 | 华为技术有限公司 | 一种印制电路板和终端 |
CN109068502A (zh) * | 2018-10-31 | 2018-12-21 | 中新科技集团股份有限公司 | 一种pcb |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171107 Address after: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop Patentee after: HUAWEI terminal (Dongguan) Co., Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: Huawei Device Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: Huawei Device Co., Ltd. Address before: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: HUAWEI terminal (Dongguan) Co., Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20110622 |