CN201868407U - Modified silicon chip carrier - Google Patents
Modified silicon chip carrier Download PDFInfo
- Publication number
- CN201868407U CN201868407U CN2010206244581U CN201020624458U CN201868407U CN 201868407 U CN201868407 U CN 201868407U CN 2010206244581 U CN2010206244581 U CN 2010206244581U CN 201020624458 U CN201020624458 U CN 201020624458U CN 201868407 U CN201868407 U CN 201868407U
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- plate body
- carrying plate
- silicon
- bogey
- air supply
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- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a modified silicon chip carrier, which comprises a carrying board and air supply units. The carrying board is provided with at least one drilled hole and at least one guide groove, and the carrying board and carried silicon chips are subjected to be in a vacuum adsorption state. Additionally, the air supply units are disposed on the periphery of the carrying board and provide air flows passing through the drilled holes of the carrying board so as to release vacuum adsorption of the carrying board with the silicon chips. Therefore, after vacuum absorption force between the carrying board and the silicon chips is released, the silicon chips can be quickly adsorbed by the sucker units.
Description
Technical field
The utility model relates to a kind of silicon bogey, particularly relate to a kind of like this Improvement type silicon bogey, carrying plate body in this bogey has boring, and the air communication mistake that air supply unit is provided is to abolish the vacuum suction state between silicon and the carrying plate body.
Background technology
In solar energy industry, the transport process of silicon is all being played the part of very important role on the lifting of production capacity or product percent of pass and defective.In other words, cooperate necessary efficient activity and optimization between the carrying plate body of carrying silicon and the sucker of drawing silicon.Yet known cypress is made great efforts sucker and often needs 10 to 15 seconds consuming time at the silicon of drawing on the carrying plate body.Thus, not only production capacity there is very big influence, easier of this known carrying plate body has the design of location hole, and make silicon seriously return plating (back-plating).In view of this, the present inventor has proposed a kind of Improvement type silicon bogey, to improve the problems referred to above.
The utility model content
Problem at known technology, the purpose of this utility model just provides a kind of Improvement type silicon bogey, in this bogey, the carrying plate body has at least one boring and at least one guide groove, and provide air-flow with by boring, thereby abolish silicon and the vacuum suction state that carries between the plate body by air supply unit.
With reference to the purpose of this utility model, a kind of Improvement type silicon bogey is proposed, it comprises carrying plate body and air supply unit.Specifically, the carrying plate body has at least one boring, and the carrying plate body is the vacuum suction state with the silicon that is carried.Air supply unit be arranged on the carrying plate body around, and provide air-flow with by above-mentioned boring, thereby abolish the vacuum suction state that carries between plate body and the silicon.
Specifically, the quantity of boring and form do not have limitation, and though be the mode of tiltedly boring with straight brill or any form can, this oblique angle is in the scope of 0 to 90 degree, and the multiple material plate that the carrying plate body is made up of graphite and the fine polymeric material of carbon is made.Moreover the position of air supply unit setting can be adjusted, as long as the air-flow that air supply unit provided can waltz through the boring of carrying plate body.Equally, the size of the air-flow of air supply unit and direction cooperate with boring, thereby can adjust.At last, after the vacuum adsorption force between carrying plate body and the silicon is disengaged, can utilize absorbing unit to draw silicon fast.
By above-mentioned explanation, can have following advantage according to Improvement type silicon bogey of the present utility model:
(1) according to Improvement type silicon bogey of the present utility model, when the vacuum suction state between carrying plate body and the silicon was abolished, absorbing unit can be drawn silicon fast.So-called absorption fast was defined as about 0.2 second the utility model.
(2) according to Improvement type silicon bogey of the present utility model, the carrying plate body is not provided with location hole, thereby can improve the problem that silicon seriously returns plating.
Description of drawings
Fig. 1 is the schematic diagram of the carrying plate body of Improvement type silicon bogey of the present utility model.
Fig. 2 is the schematic diagram of Improvement type silicon bogey of the present utility model.
Fig. 3 is the air supply unit of Improvement type silicon bogey of the present utility model and the schematic diagram of absorbing unit.
The primary clustering symbol description:
100: the carrying plate body;
110: boring;
120: guide groove;
200: silicon;
300: air supply unit;
310: air-flow;
400: absorbing unit.
Embodiment
According to technical characterictic of the present utility model, hereinafter with reference to the embodiment of relevant drawings figure explanation according to Improvement type silicon bogey of the present utility model, for ease of understanding, the same components among the following embodiment illustrates with identical symbology.
At first, see also Fig. 1, this figure is the schematic diagram of the carrying plate body of Improvement type silicon bogey of the present utility model.As shown in Figure 1, the carrying plate body 100 of Improvement type silicon bogey of the present utility model has at least one boring 110 and at least one guide groove 120, the oblique angle of described boring 110 is in the scope of 0 to 90 degree, and described oblique angle is the angle of the plane normal of boring 110 and carrying plate body 100.In other words, boring 110 on the carrying plate body 100 of the present utility model can have only one, can certainly be covered with whole carrying plate body 100, no matter and 110 employings of holing are directly bored or the oblique modes of boring of any form, be all the sample attitude of the technical scope of the utility model institute desire opinion.
Therefore, Fig. 1 pass the imperial examinations at the provincial level example illustrate the carrying plate body 100 have 4 boring 110 and 4 guide grooves 120 examples, and hole 110 and guide groove 120 common geometric center is arranged, boring 110 and guide groove 120 all be radial arrangement outward by this geometric center.Wherein, the function of guide groove 120 is from air-flow homogenizing that the outside imported and can be used for discharging unnecessary air-flow, so that the air-flows that distribute in the carrying plate body 100 are steady.Certainly, be that the quantity of boring 110 or guide groove 120 or the position of arrangement all only are that tool is not restricted for example.It should be noted that the multiple material plate that carrying plate body 100 of the present utility model is made up of the fine polymeric material of graphite and carbon makes, and carrying plate body 100 is not provided with location hole.
Please consult Fig. 2 and Fig. 3 simultaneously, Fig. 2 and Fig. 3 are respectively schematic diagram and the air supply unit of Improvement type silicon bogey of the present utility model and the schematic diagram of absorbing unit of Improvement type silicon bogey of the present utility model.As shown in Figures 2 and 3, carrying plate body 100 is used to carry at least one silicon 200, and is the vacuum suction state between carrying plate body 100 and the quilt silicon 200 that carries.That is to say that in the process that carrying plate body 100 is transmitting, each sheet silicon 200 all fits tightly by vacuum suction each other with carrying plate body 100.Emphasize that at this above-mentioned carrying plate body 100 is positioned at silicon 200 places of being carried and all comprises at least one boring 110 and at least one guide groove 120, certain carrying plate body 100 of the present utility model also can carry a plurality of silicons 200.In a word, carrying plate body 100 of the present utility model all comprises at least one boring 110 and at least one guide groove 120 at corresponding each silicon 200 place, is beneficial to abolish the vacuum suction state between silicon 200 and the carrying plate body 100.In addition, the utility model also comprises air supply unit 300, its be arranged at the carrying plate body 100 around, this air supply unit 300 can provide air-flow 310 with by above-mentioned boring 110, and abolish silicon 200 and the vacuum suction state of carrying between the plate body 100 with this, make that carrying plate body 100 is separated with silicon 200.Thus, scrutable is that major technique of the present utility model is characterised in that and can provides air-flow 310 by external air supply unit 300, and air-flow 310 blowed to the boring 110 of carrying plate body 100, thereby the vacuum adsorption force between carrying plate body 100 and the silicon 200 is disengaged.Thereby the position that air supply unit 300 is provided with can be adjusted, if air supply unit be positioned at carrying plate body 100 around so that the air-flow 310 that air supply unit 300 is provided can waltz through the boring 110 of carrying plate body 100.Though Fig. 3 shows air supply unit 300 and is arranged at carrying plate body 100 belows, it should be noted that this only is the signal of illustrative, but not is restricted expression.
That is to say that the size of the air-flow 310 of air supply unit 300 and direction cooperate with boring 110.For instance, air supply unit 300 can be arranged at the below of the boring 110 of carrying plate body 100, so the air-flow 310 of air supply unit 300 can up blow easily to the boring 110 of the carrying plate body 100 of top, and remove carrying plate body 100 and the vacuum suction state of quilt between the silicon 200 that carries with this; Yet this is only for for example, is not to have restrictedly, as long as the position that air supply unit 300 is provided with can make air-flow 310 by the boring 110 on the carrying plate body 100, and removes carrying plate body 100 with this and gets final product with vacuum suction state between the quilt silicon 200 that carries.If air supply unit 300 can be adjusted the flow that amplifies this air-flow 310 when bogey 100 is far away.Otherwise air supply unit 300 can be adjusted the flow that lowers this air-flow 310 when bogey 100 is nearer.In a word, the size and the direction of the air-flow 310 of air supply unit 300 can be adjusted, and have very much convenience in the online use of production.
Generally speaking, after the vacuum adsorption force between carrying plate body 100 of the present utility model and the silicon 200 is disengaged, can utilize absorbing unit 400 to draw silicon 200 fast.For the utility model, the so-called absorption fast is defined as about 0.2 second.That is to say that air supply unit 300 removes that this vacuum adsorption forces institute is consuming time quite short, absorbing unit 400 does not need to stop the time too of a specified duration on silicon 200, thereby can increase the production capacity of production line and improve the qualification rate of silicon 200.In addition, described absorbing unit 400 after air supply unit 300 is forced to abolish vacuum, is drawn silicon 200 in quick efficient mode for meeting the sucker of Bai Nuli law, can reduce simultaneously and destroy the probability that silicon chip takes place.
Foregoing description only is an illustrative, but not is restricted.Anyly do not break away from spirit of the present utility model and category, and, all should fall into the application's claim its equivalent modifications of carrying out or change.
Claims (8)
1. Improvement type silicon bogey is characterized in that this device comprises:
The carrying plate body has at least one boring; And
Air supply unit, be arranged at described carrying plate body around, this air supply unit provides air-flow, this air communication cross described at least one boring, with the vacuum suction state that is presented between the silicon of abolishing described carrying plate body and being carried.
2. Improvement type silicon bogey as claimed in claim 1 is characterized in that this device also comprises absorbing unit, and when the vacuum suction state between described carrying plate body and the described silicon was abolished, this absorbing unit was used to draw described silicon.
3. Improvement type silicon bogey as claimed in claim 1 is characterized in that described air supply unit is set at the below of described carrying plate body.
4. Improvement type silicon bogey as claimed in claim 1 is characterized in that the position that described air supply unit is set can be adjusted.
5. Improvement type silicon bogey as claimed in claim 1 is characterized in that the direction of the air-flow of described air supply unit cooperates with described at least one boring.
6. Improvement type silicon bogey as claimed in claim 1 is characterized in that the multiple material plate that described carrying plate body is made up of the fine polymeric material of graphite and carbon makes.
7. Improvement type silicon bogey as claimed in claim 1 is characterized in that described carrying plate body also has at least one guide groove.
8. Improvement type silicon bogey as claimed in claim 1, the oblique angle that it is characterized in that described at least one boring is in the scope of 0 to 90 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206244581U CN201868407U (en) | 2010-11-23 | 2010-11-23 | Modified silicon chip carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206244581U CN201868407U (en) | 2010-11-23 | 2010-11-23 | Modified silicon chip carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201868407U true CN201868407U (en) | 2011-06-15 |
Family
ID=44139554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206244581U Expired - Fee Related CN201868407U (en) | 2010-11-23 | 2010-11-23 | Modified silicon chip carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201868407U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637649A (en) * | 2012-04-28 | 2012-08-15 | 日月光半导体制造股份有限公司 | Manufacturing method of semiconductor structure |
| CN106505022A (en) * | 2017-01-03 | 2017-03-15 | 江西比太科技有限公司 | Support plate and the manufacture of solar cells equipment using the support plate |
| CN107034513A (en) * | 2015-11-03 | 2017-08-11 | 三星显示有限公司 | Laser crystallization apparatus |
-
2010
- 2010-11-23 CN CN2010206244581U patent/CN201868407U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637649A (en) * | 2012-04-28 | 2012-08-15 | 日月光半导体制造股份有限公司 | Manufacturing method of semiconductor structure |
| CN107034513A (en) * | 2015-11-03 | 2017-08-11 | 三星显示有限公司 | Laser crystallization apparatus |
| US10898972B2 (en) | 2015-11-03 | 2021-01-26 | Samsung Display Co., Ltd. | Laser crystallizing apparatus |
| CN107034513B (en) * | 2015-11-03 | 2021-04-20 | 三星显示有限公司 | Laser crystallization device |
| CN106505022A (en) * | 2017-01-03 | 2017-03-15 | 江西比太科技有限公司 | Support plate and the manufacture of solar cells equipment using the support plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110615 Termination date: 20151123 |