CN201849801U - High-performance protective liner for memory module of server - Google Patents
High-performance protective liner for memory module of server Download PDFInfo
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- CN201849801U CN201849801U CN2010206037628U CN201020603762U CN201849801U CN 201849801 U CN201849801 U CN 201849801U CN 2010206037628 U CN2010206037628 U CN 2010206037628U CN 201020603762 U CN201020603762 U CN 201020603762U CN 201849801 U CN201849801 U CN 201849801U
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Abstract
本实用新型提供一种高性能服务器内存模组防护衬垫,属于计算机部件的包装存放技术领域,其结构包括上盖、内衬、底托,内衬设置在底托内,内衬上面设置有上盖,内衬上层均匀的开设有横向的模组槽,内衬下层均匀的开设有纵向的托槽,模组槽和托槽上下层相交集的部位上下贯通,上盖底面设置有与模组槽相吻合的衬盖。本实用新型采用横纵栈桥式结构的内衬可以使模组板卡放置在模组槽内,模组槽之间形成的隔栅起到隔离和防护的作用,模组板卡底部座落在通过托槽之间形成的托栅上,模组板卡顶部通过上盖底部的衬盖防护,形成全方位的防护,很好地解决了模组板卡的放置、存储和运输的安全性问题。
The utility model provides a high-performance server memory module protection liner, which belongs to the technical field of packaging and storage of computer components. On the upper cover, the upper layer of the lining is uniformly provided with horizontal module grooves, and the lower layer of the inner lining is evenly provided with longitudinal brackets. Lining covers that match the set grooves. The utility model adopts the inner liner of the horizontal and vertical trestle structure, so that the module board can be placed in the module groove, and the barrier formed between the module grooves plays the role of isolation and protection, and the bottom of the module board is located on the Through the brackets formed between the brackets, the top of the module board is protected by the lining cover at the bottom of the upper cover, forming an all-round protection, which solves the safety problems of the placement, storage and transportation of the module board. .
Description
技术领域technical field
本实用新型涉及计算机部件的包装存放技术领域,具体地说是一种高性能服务器内存模组防护衬垫。The utility model relates to the technical field of packaging and storage of computer parts, in particular to a high-performance server memory module protective liner.
背景技术Background technique
一般的,板卡类的包装防护在计算机部件的包装领域十分关键,在搬运或是运输过程中经常出现板卡上面的内存等电器元件倾斜损坏,有时板卡在受到挤压、震动碰撞时变形现象的发生,这给生产和运输都带来巨大的挑战,计算机部件的包装运输问题亟待解决。Generally, the packaging protection of boards is very critical in the field of packaging of computer components. During handling or transportation, electrical components such as memory on boards are often tilted and damaged, and sometimes boards are deformed when they are squeezed or shaken. The occurrence of this phenomenon has brought huge challenges to both production and transportation, and the packaging and transportation of computer components needs to be solved urgently.
发明内容Contents of the invention
本实用新型的技术任务是解决现有技术的不足,提供一种高性能服务器内存模组防护衬垫。The technical task of the utility model is to solve the deficiencies of the prior art, and provide a high-performance server memory module protection liner.
本实用新型的技术方案是按以下方式实现的,该高性能服务器内存模组防护衬垫,其结构包括上盖、内衬、底托,内衬设置在底托内,内衬上面设置有上盖,内衬上层均匀的开设有横向的模组槽,内衬下层均匀的开设有纵向的托槽,模组槽和托槽上下层相交集的部位上下贯通,上盖底面设置有与模组槽相吻合的衬盖。The technical scheme of the utility model is realized in the following manner. The high-performance server memory module protective liner has a structure including an upper cover, an inner liner, and a bottom bracket. The inner liner is arranged in the bottom bracket, and an upper Cover, the upper layer of the inner lining is evenly opened with horizontal module grooves, the lower layer of the inner lining is evenly opened with longitudinal brackets, the intersection of the module grooves and the upper and lower layers of the brackets is connected up and down, and the bottom surface of the upper cover is provided with modules. Groove matching liner.
模组槽的边缘上开设有易损防护豁口。Vulnerable protection gaps are provided on the edge of the module slot.
上盖采用硬纸板上盖,衬盖采用EPE衬盖,内衬采用EPE内衬,底托采用硬纸板底托。The upper cover is made of cardboard, the lining is made of EPE, the inner lining is made of EPE, and the bottom is made of cardboard.
本实用新型与现有技术相比所产生的有益效果是:Compared with the prior art, the utility model has the following beneficial effects:
该高性能服务器内存模组防护衬垫其上盖采用硬纸板+EPE,下面采用横纵栈桥式结构的内衬可以使模组板卡放置在模组槽内,模组槽之间形成的隔栅起到隔离和防护的作用,模组板卡底部座落在通过托槽之间形成的托栅上,模组板卡顶部通过上盖底部的衬盖防护,如此形成全方位的防护,很好地解决了模组板卡的放置、存储和运输的安全性问题,使模组板卡的电器元件不倾斜损坏,使板卡在受到挤压、震动碰撞时变形在可控范围内。该高性能服务器内存模组防护衬垫应用在包装结构上,极大增加了安全性同也降低了制造和维护成本,使用和实用性强。The upper cover of the high-performance server memory module protection liner is made of cardboard + EPE, and the lower layer is made of horizontal and vertical trestle structure lining, so that the module board can be placed in the module slot, and the partition formed between the module slots The grid plays the role of isolation and protection. The bottom of the module board is seated on the bracket formed between the brackets, and the top of the module board is protected by the lining cover at the bottom of the upper cover, thus forming an all-round protection. It solves the safety problems of the placement, storage and transportation of the modular board, prevents the electrical components of the modular board from being tilted and damaged, and makes the deformation of the board within a controllable range when it is squeezed, shakes and collides. The high-performance server memory module protective liner is applied to the packaging structure, which greatly increases the safety and reduces the manufacturing and maintenance costs, and has strong usability and practicability.
该高性能服务器内存模组防护衬垫所采用的EPE又称珍珠棉,是聚乙烯发泡棉是非交联闭孔结构,是一种新型环保的包装材料。它由低密度聚乙烯脂经物理发泡产生无数的独立气泡构成。克服了普通发泡胶易碎、变形、回复性差的缺点。具有隔水防潮、防震、隔音、保温、可塑性能佳、韧性强、循环再造、环保、抗撞力强等诸多优点,亦具有很好的抗化学性能,广泛应用于包装领域。The EPE used in the high-performance server memory module protective liner, also known as pearl cotton, is polyethylene foamed cotton with a non-cross-linked closed-cell structure, and is a new type of environmentally friendly packaging material. It is composed of low-density polyethylene fat through physical foaming to produce countless independent bubbles. It overcomes the shortcomings of ordinary styrofoam that are fragile, deformed, and poor in recovery. It has many advantages such as water and moisture resistance, shock resistance, sound insulation, heat preservation, good plasticity, strong toughness, recycling, environmental protection, and strong impact resistance. It also has good chemical resistance and is widely used in the packaging field.
附图说明Description of drawings
附图1是本实用新型的结构示意图;Accompanying
附图2是本实用新型的内衬的结构示意图;Accompanying
附图3是本实用新型的内衬的俯视结构示意图;Accompanying
附图4是本实用新型的上盖和衬盖的连接结构示意图;Accompanying
附图5是附图2中A-A的结构示意图;Accompanying
附图6是附图2中B-B的结构示意图。Accompanying
附图中的标记分别表示:The marks in the accompanying drawings indicate respectively:
1、上盖,2、内衬,3、底托,4、模组槽,5、托槽,6、衬盖,7、易损防护豁口,8、隔栅,9、托栅。1. Upper cover, 2. Lining, 3. Bottom bracket, 4. Module groove, 5. Bracket, 6. Lining cover, 7. Fragile protection gap, 8. Grille, 9. Bracket.
具体实施方式Detailed ways
下面结合附图对本实用新型的高性能服务器内存模组防护衬垫作以下详细说明。The high-performance server memory module protection liner of the present invention is described in detail below in conjunction with the accompanying drawings.
如附图1所示,本实用新型的高性能服务器内存模组防护衬垫,其结构包括上盖1、内衬2、底托3,内衬2设置在底托3内,内衬2上面设置有上盖1,内衬2上层均匀的开设有横向的模组槽4,内衬下层均匀的开设有纵向的托槽5,模组槽4和托槽5上下层相交集的部位上下贯通,上盖1底面设置有与模组槽相吻合的衬盖6。模组槽4的边缘上开设有易损防护豁口7。上盖1采用硬纸板上盖,衬盖6采用EPE衬盖,内衬2采用EPE内衬,底托3采用硬纸板底托。As shown in accompanying drawing 1, the high-performance server memory module protective liner of the present utility model, its structure comprises
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206037628U CN201849801U (en) | 2010-11-12 | 2010-11-12 | High-performance protective liner for memory module of server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206037628U CN201849801U (en) | 2010-11-12 | 2010-11-12 | High-performance protective liner for memory module of server |
Publications (1)
| Publication Number | Publication Date |
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| CN201849801U true CN201849801U (en) | 2011-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206037628U Expired - Fee Related CN201849801U (en) | 2010-11-12 | 2010-11-12 | High-performance protective liner for memory module of server |
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| CN (1) | CN201849801U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105819117A (en) * | 2016-05-17 | 2016-08-03 | 浪潮电子信息产业股份有限公司 | A kind of product packaging method of memory board |
| CN108341148A (en) * | 2017-11-28 | 2018-07-31 | 中久物流有限公司 | Ke Xunhuanliyong packing container |
-
2010
- 2010-11-12 CN CN2010206037628U patent/CN201849801U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105819117A (en) * | 2016-05-17 | 2016-08-03 | 浪潮电子信息产业股份有限公司 | A kind of product packaging method of memory board |
| CN108341148A (en) * | 2017-11-28 | 2018-07-31 | 中久物流有限公司 | Ke Xunhuanliyong packing container |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110601 Termination date: 20131112 |