CN201845996U - Air cooling system - Google Patents
Air cooling system Download PDFInfo
- Publication number
- CN201845996U CN201845996U CN2010205859235U CN201020585923U CN201845996U CN 201845996 U CN201845996 U CN 201845996U CN 2010205859235 U CN2010205859235 U CN 2010205859235U CN 201020585923 U CN201020585923 U CN 201020585923U CN 201845996 U CN201845996 U CN 201845996U
- Authority
- CN
- China
- Prior art keywords
- wind
- radiator
- control cabinet
- air
- cooling system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005086 pumping Methods 0.000 abstract 4
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides an air cooling system which is used for cooling a laser pumping diode and a built-in heat resource in a control cabinet, and comprises the laser pumping diode, a radiator, semiconductor refrigerating sheets, a first wind inlet, a second wind inlet, a third wind inlet, a first wind outlet, a second wind outlet and a first fan, wherein the laser pumping diode and the radiator are positioned in the control cabinet, the semiconductor refrigerating sheets are positioned between the laser pumping diode and the radiator, the first wind inlet, the second wind inlet and the third wind inlet are positioned at the two sides of the control cabinet, the first wind outlet and the second wind outlet are positioned at the rear side of the control cabinet, and the first fan corresponds to the first wind outlet. The system also comprises a second fan for supplying high-pressure wind, a third wind outlet, a first wind guide cover and a second wind guide cover, wherein the second fan is positioned between the first wind inlet and the radiator, the third wind outlet is positioned in the control cabinet, the first wind guide cover is communicated with the second wind outlet, the second wind guide cover is communicated with the third wind outlet, and the first wind guide cover and the second wind guide cover are connected with the two sides of the radiator. The utility model has the beneficial effects that as the radiator and the high-pressure fans are combined, through the guide flow of the second wind guide cover, the belt pressure wind port is formed in the control cabinet, the air in the cabinet can be quickened to flow, and the radiating effect of the cabinet body is improved.
Description
[technical field]
The utility model relates to the equipment cooling field, especially cabinet inside heat radiation field.
[background technology]
The air cooling system characteristics of existing product are: the one, and the radiator that is connected with laser pump diode is to adopt the common process processes to form, whole heat-transfer effect is poor; The 2nd, the blower fan of its heat transmission is common low blast blower fan, fan pressure low promptly under the big situation of windage air quantity little, air quantity is little to cause that promptly radiating effect is poor; The 3rd, the position that its blower fan is laid is an air intake in electric control box, in a casing that seals relatively, the constantly heating of other electric vigour part is arranged, because the inside wind is mobile relatively poor, the accumulation heat is on the increase, the temperature inside the box is generally outer high a lot of than case, and radiating effect is poor under the higher situation of temperature of blower fan air intake wind like this.Therefore the whole cooling effect of existing system is not ideal enough, and inefficiency particularly is difficult to meet the demands under the situation of installing with the laser pump diode of high power golf calorific value especially.
[utility model content]
The utility model purpose is for a kind of laser pump diode place environment provides a kind of air cooling system efficiently, to realize in the casing quick heat radiating fast.
A kind of air cooling system, be positioned at control cabinet, it comprises laser pump diode and radiator, the semiconductor chilling plate between described laser pump diode and radiator in this control cabinet, is positioned at first, second and third air inlet of described control cabinet both sides, be positioned at first and second air outlet of described control cabinet rear side, and corresponding to first blower fan of this first air outlet; It is characterized in that: also comprise second blower fan between described first air inlet and described radiator, be positioned at described control cabinet the 3rd air outlet, connect both sides and first wind scooper that be communicated with described second air outlet of described radiator and be communicated with second wind scooper of described the 3rd air outlet;
Wherein, described second blower fan is a high pressure positive blower.
Wherein, described semiconductor chilling plate cold junction is adjacent to described laser pump diode, and the hot junction is adjacent to described radiator.
Wherein, described radiator adopts Aluminium Radiator.
Wherein, also be provided with the power supply and the controlling parts of built-in thermal source in the described control cabinet.
The beneficial effects of the utility model are: by second blower fan and the radiator of combined high pressure air-out, and feed the second interior wind scooper guide functions of control cabinet, make the interior formation band of control cabinet press the air port, the interior gas flow of quickening case, the heat sinking function of raising casing.
[description of drawings]
The utility model will be further described in conjunction with execution mode with reference to the accompanying drawings.
Fig. 1 is the overall distribution figure of the utility model air cooling system;
Fig. 2 is the case shell left side schematic diagram of the utility model air cooling system;
Fig. 3 is the case shell right side schematic diagram of the utility model air cooling system;
Fig. 4 is the case shell rear side schematic diagram of the utility model air cooling system;
Fig. 5 is the fundamental diagram of radiator among the embodiment;
Fig. 6 is the fin schematic diagram of radiator among the embodiment.
Sequence number explanation among the figure:
1, semiconductor chilling plate; 2, radiator; 3, first blower fan; 4, first air inlet;
5, first wind scooper; 6, second wind scooper; 7, first air outlet;
8, second air outlet; 9, the 3rd air outlet; 10, second air inlet;
11, the 3rd air inlet; 12, second blower fan; 13, laser pump diode;
14, power supply; 15, controlling parts; 16, control cabinet; 21, heat radiator fin.
[embodiment]
Below in conjunction with description of drawings and embodiment the utility model is further specified.
With reference to figure 1-Fig. 4.The utility model provides a kind of air cooling system, places in the control cabinet 16.This air cooling system comprises power supply 14, controlling parts 15, laser pump diode 13, radiator 2, the semiconductor chilling plate 1 between described laser pump diode 13 and radiator 2 in control cabinet 16, is positioned at first, second and third air inlet 4,10,11 of control cabinet 16 both sides, be positioned at first and second air outlet 7,8 of control cabinet 16 rear sides, and corresponding to first blower fan 3 of first air outlet 7.
This air cooling system also comprises second blower fan 12 between first air inlet 4 and radiator 2, is positioned at the 3rd air outlet 9 of control cabinet 16, connects radiator 2 both sides and is communicated with first wind scooper 5 of described second air outlet 8 and be communicated with second wind scooper 6 of the 3rd air outlet 9; Wherein, second blower fan 12 is a high pressure positive blower, and second blower fan 12 can keep big wind flow under the situation that windage increases.
Wherein, the cold junction of radiator 2 is adjacent to laser pump diode 13, and the hot junction then is adjacent to radiator 2, the heat of the laser pump diode 13 of drawing, loose.
Simultaneously, the outer cold wind of case enters in the control cabinet 16 through second air inlet 10 and the 3rd air inlet 11, cooler bin internal heat generation source, and first air outlet 7 of first blower fan, 3 correspondences is control cabinet 16 inner body air drafts.
In the present embodiment, radiator 2 is an aluminum fin formula radiator, and heat radiator fin 21 is thick to be h=1mm, adjacent spacing is b=2.5mm, fin 21 clearance cure are infiltrated by heat-conducting glue in the bottom of fin 21, to have strengthened conductivity, make radiator 2 good heat dissipation effect generally.
Heat transfer process of the present utility model is as follows:
When this air cooling system work, semiconductor chilling plate 1 cold junction is adjacent to laser pump diode 13, and its hot junction is adjacent to radiator 2, and its heat reaches radiator 2.
Wherein, described power supply 14 and controlling parts 15 also are the built-in thermal source in the control cabinet 16.
The utility model mainly by radiator 2, be second blower fan 12 of high pressure positive blower, to second wind scooper 6 of control cabinet 16 introducing high velocity airs, form band at the 3rd air outlet 9 then and compress into the air port, quickened air velocity in the control cabinet 16, overcome that windage is big in the former control cabinet, air quantity is little, thereby caused the problem of control cabinet radiating effect difference.
The conduction of this air cooling system heat is fast, and the heat radiation air pressure air flow is big, and the flow velocity of wind is fast, and the integral heat sink effect of electric control box is splendid.
Although with reference to the accompanying drawings; air cooling system of the present utility model is illustrated; but above-mentioned disclosed content only is in order to understand the utility model better; rather than limit the scope of claim by any way; so all according to the described structure of the utility model patent claim, feature and principle do etc. change or modify, be included in the protection range of the present utility model.
Claims (4)
1. air cooling system, be positioned at control cabinet, it comprises laser pump diode and radiator, the semiconductor chilling plate between described laser pump diode and radiator in this control cabinet, is positioned at first, second and third air inlet of described control cabinet both sides, be positioned at first and second air outlet of described control cabinet rear side, and corresponding to first blower fan of this first air outlet; It is characterized in that: also comprise second blower fan between described first air inlet and described radiator, be positioned at described control cabinet the 3rd air outlet, connect both sides and first wind scooper that be communicated with described second air outlet of described radiator and be communicated with second wind scooper of described the 3rd air outlet;
Wherein, described second blower fan is a high pressure positive blower.
2. air cooling system according to claim 1 is characterized in that: described semiconductor chilling plate cold junction is adjacent to described laser pump diode, and the hot junction is adjacent to described radiator.
3. air cooling system according to claim 1 is characterized in that: described radiator adopts Aluminium Radiator.
4. air cooling system according to claim 1 is characterized in that: the power supply and the controlling parts that also are provided with built-in thermal source in the described control cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205859235U CN201845996U (en) | 2010-10-29 | 2010-10-29 | Air cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205859235U CN201845996U (en) | 2010-10-29 | 2010-10-29 | Air cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201845996U true CN201845996U (en) | 2011-05-25 |
Family
ID=44040872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205859235U Expired - Lifetime CN201845996U (en) | 2010-10-29 | 2010-10-29 | Air cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201845996U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103921000A (en) * | 2014-03-13 | 2014-07-16 | 合肥亚澳激光科技有限公司 | Laser marking machine |
| CN115070218A (en) * | 2022-06-27 | 2022-09-20 | 武汉中谷联创光电科技股份有限公司 | Laser marking equipment |
-
2010
- 2010-10-29 CN CN2010205859235U patent/CN201845996U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103921000A (en) * | 2014-03-13 | 2014-07-16 | 合肥亚澳激光科技有限公司 | Laser marking machine |
| CN115070218A (en) * | 2022-06-27 | 2022-09-20 | 武汉中谷联创光电科技股份有限公司 | Laser marking equipment |
| CN115070218B (en) * | 2022-06-27 | 2025-07-04 | 武汉中谷联创光电科技股份有限公司 | Laser marking equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110525 |