CN201772311U - 一种led灯珠结构 - Google Patents

一种led灯珠结构 Download PDF

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CN201772311U
CN201772311U CN2010202937020U CN201020293702U CN201772311U CN 201772311 U CN201772311 U CN 201772311U CN 2010202937020 U CN2010202937020 U CN 2010202937020U CN 201020293702 U CN201020293702 U CN 201020293702U CN 201772311 U CN201772311 U CN 201772311U
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pin
led lamp
housing
chip
tank
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郭云涛
潘静
杜涛
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Xiamen Xindeco Optoelectronics Co Ltd
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Xiamen Xindeco Optoelectronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

本实用新型公开了一种LED灯珠结构，其壳体内嵌固有正负两个PIN脚，壳体上方设有容槽，容槽内固定有一芯片，该芯片通过导线与两个PIN脚电连接，容槽内灌注有封胶将芯片封装于容槽内；所述的两个PIN脚均为开口朝下的U形体，两者U形体的底侧边位于壳体的容槽底部，两者U形体的两侧边位于壳体的侧面，其中第一侧边的开放端弯折有一底折边，该底折边位于壳体的底部，第二侧边的一侧弯折有一后折边。这种结构使LED灯珠的底面及侧面均具有焊锡点，因此可以实现正、侧面照明，使用更灵活。而且，每个面的焊锡点均仅有两个，不存在因厚度不一而导致虚焊的问题，也不会造成芯片不平整而影响光照方向。

Description

一种LED灯珠结构
技术领域
本实用新型涉及一种发光装置，尤指一种LED灯球结构。
背景技术
LED是一种常见的发光装置，如图1、2所示，为一种典型的LED灯珠结构示意图，其在壳体1内嵌固有正负两个PIN脚，即第一PIN脚2及第二PIN脚3，该壳体1的上方设有容槽11，两个PIN脚的内端位于容槽11的底部，两个PIN脚的外端位于壳体1的底面，所述的容槽11内固定有一芯片4，该芯片4通过导线5与两个PIN脚电连接，该容槽11内灌注有封胶6将芯片4封装于容槽11内。该LED灯珠在使用时，将其底部的两个PIN脚2、3的外端焊接在一电路板上，即可形式电连接而令芯片4发光。该结构的LED灯珠，其两个PIN脚2、3(如图3所示)为开口朝向一侧的U形，U形的一个侧边位于壳体1的容槽11底部，另一个侧边则位于壳体1的底部，这种结构的PIN脚，由于与电路板焊接部分位于芯片4的背面，在与电路板电连接后，只能向电路板的上方发光，实现正面照明，而无法实现侧面照明，使用灵活性较差。
如图4、5所示，为另一种LED灯珠结构示意图，该LED灯珠同样包括壳体1、第一PIN脚2、第二PIN脚3、芯片4、导线5及封胶6。该LED灯珠的两个PIN脚2、3为开口朝下的U形，U形的底边位于壳体1的容槽11底部，U形的两个侧边位于壳体1的两侧面，且两侧边开放端向内弯折形成折边位于壳体1的底部。该结构的LED灯珠在焊接于电路板上时，可以以其折边焊接于电路板上，也可以以其两侧边焊接于电路板上，因此可实现正、侧面照明，出光形式多样。但是，这种结构的LED灯珠，由于壳体1底部的每个PIN脚2、3都有两个折边，将其焊接在电路板上时，将有四边与电路板接触，而四个边在制作时厚薄不易调节，若厚度不一致，焊锡时易形成虚焊，且易造成芯片不平整，影响光明方向。
实用新型内容
本实用新型所要解决的技术问题在于提供一种可实现多面照明的LED灯球结构，且其焊锡时不会出现焊脚厚度不一而影响照明方向的问题。
为解决上述技术问题，本实用新型的技术解决方案是：
一种LED灯珠结构，其壳体内嵌固有正负两个PIN脚，壳体上方设有容槽，容槽内固定有一芯片，该芯片通过导线与两个PIN脚电连接，容槽内灌注有封胶将芯片封装于容槽内；所述的两个PIN脚均为开口朝下的U形体，两者U形体的底侧边位于壳体的容槽底部，两者U形体的两侧边位于壳体的侧面，其中第一侧边的开放端弯折有一底折边，该底折边位于壳体的底部，第二侧边的一侧弯折有一后折边。
所述两个PIN脚的其中一个PIN脚的底侧边异于所述后折边的一端设有延伸段，所述芯片置于该延伸段上。
采用上述方案后，由于本实用新型所述LED灯珠的壳体在成型后，其两个PIN脚具有底折边位于壳体的底部，两PIN脚还具有两侧边位于壳体的两侧，使LED灯珠的底面及侧面均具有焊锡点，这样在使用时，可以将壳体的底部正对电路板，以两PIN脚的底折边焊接在一电路板上，形式正面照明状态；也可以将壳体的任何一个侧边正对电路板，以两个PIN脚的其中一侧的侧边焊接在电路板上，形成侧面照明状态，因此照明角度多样使用灵活。而且，无论是将LED灯珠的哪一面与电路板电连接，其两PIN脚的焊锡点均仅有两个，不存在因厚度不一而导致虚焊的问题，也不会造成芯片不平整而影响光照方向。
附图说明
图1是现有一种LED灯珠的立体示意图；
图2是现有一种LED灯珠的剖视图；
图3是现有一种LED灯珠壳体与两PIN脚的立体分解图；
图4是现有另一种LED灯珠的立体示意图；
图5是现有另一种LED灯珠壳体与两PIN脚的立体分解图；
图6是本实用新型的立体示意图；
图7是本实用新型壳体与两PIN脚的立体分解图；
图8是本实用新型的俯视图；
图9是图8的A-A剖视图；
图10是图8的B-B剖视图。
具体实施方式
下面结合附图和具体实施例对本实用新型作进一步详述。
本实用新型所揭示的是一种LED灯珠结构，参阅图6至图10所示，为本实用新型的较佳实施例。所述LED灯珠包括一壳体1，在该壳体1内嵌固有正负两个PIN脚，即第一PIN脚2A及第二PIN脚3A，该壳体1的上方设有容槽11，该容槽11内固定有一芯片4，该芯片4通过导线5与两个PIN脚电连接，该容槽11内灌注有封胶6将芯片4封装于容槽11内。
所述的第一PIN脚2A为开口朝下的U形体，该U形体的底侧边21A位于壳体1的容槽11底部，其两侧边位于壳体1的侧面，其中第一侧边22A的开放端弯折有一底折边23A，该底折边23A位于壳体1的底部，另一侧边即第二侧边24A的一侧弯折有一后折边25A。
所述的第二PIN脚3A也为开口朝下的U形体，该U形体的底侧边31A位于壳体1的容槽11底部，其两侧边位于壳体1的侧面，其中第一侧边32A的开放端弯折有一底折边33A，该底折边33A位于壳体1的底部，另一侧边即第二侧边34A的一侧弯折有一后折边35A。此外，该第二PIN脚3A的底侧边31A异于所述后折边35A的一端还设有延伸段36A，用以将芯片4置于其上。
该LED灯珠的壳体1在成型时，是先将两PIN脚2A、3A置于模具中，然后注塑成型，成型后，两个PIN脚2A、3A的底侧边21A及31A位于壳体1的容槽11底部，第一侧边22A、32A及第二侧边24A、34A位于壳体1的两侧，两者的底折边23A、33A位于壳体1的底部。这种结构的LED灯珠在使用时，可以将壳体1的底部正对电路板，以两PIN脚2A、3A的底折边23A、33A焊接在一电路板上，形式正面照明状态；也可以将壳体1的任何一个侧边正对电路板，以两个PIN脚2A、3A的其中一侧边22A、32A或24A、34A焊接在电路板上，形成侧面照明状态，因此照明角度多样使用灵活。
而且，无论是将LED灯珠的哪一面与电路板电连接，其两PIN脚的焊锡点均仅有两个，不存在因厚度不一而导致虚焊的问题，也不会造成芯片不平整而影响光照方向。

Claims (2)

1.一种LED灯珠结构，其壳体内嵌固有正负两个PIN脚，壳体上方设有容槽，容槽内固定有一芯片，该芯片通过导线与两个PIN脚电连接，容槽内灌注有封胶将芯片封装于容槽内；其特征在于：所述的两个PIN脚均为开口朝下的U形体，两者U形体的底侧边位于壳体的容槽底部，两者U形体的两侧边位于壳体的侧面，其中第一侧边的开放端弯折有一底折边，该底折边位于壳体的底部，第二侧边的一侧弯折有一后折边。
2.根据权利要求1所述的一种LED灯珠结构，其特征在于：所述两个PIN脚的其中一个PIN脚的底侧边异于所述后折边的一端设有延伸段，所述芯片置于该延伸段上。
CN2010202937020U 2010-08-12 2010-08-12 一种led灯珠结构 Expired - Fee Related CN201772311U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105185888A (zh) * 2014-05-23 2015-12-23 亿光电子工业股份有限公司 承载支架、发光装置及其制造方法
CN105870298A (zh) * 2016-05-27 2016-08-17 福建鸿博光电科技有限公司 一种led光源的封装方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105185888A (zh) * 2014-05-23 2015-12-23 亿光电子工业股份有限公司 承载支架、发光装置及其制造方法
CN108963049A (zh) * 2014-05-23 2018-12-07 亿光电子(中国)有限公司 发光装置
CN105185888B (zh) * 2014-05-23 2019-11-05 亿光电子(中国)有限公司 承载支架、发光装置及其制造方法
CN108963049B (zh) * 2014-05-23 2021-04-20 亿光电子(中国)有限公司 发光装置
CN105870298A (zh) * 2016-05-27 2016-08-17 福建鸿博光电科技有限公司 一种led光源的封装方法

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