CN201765685U - Sensing node circuit applicable to various types of sensors - Google Patents

Sensing node circuit applicable to various types of sensors Download PDF

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Publication number
CN201765685U
CN201765685U CN2010202986050U CN201020298605U CN201765685U CN 201765685 U CN201765685 U CN 201765685U CN 2010202986050 U CN2010202986050 U CN 2010202986050U CN 201020298605 U CN201020298605 U CN 201020298605U CN 201765685 U CN201765685 U CN 201765685U
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China
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sensor
chip
sensing node
central processing
unit
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CN2010202986050U
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Chinese (zh)
Inventor
李士宁
李志刚
马峻岩
蒙海军
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西北工业大学
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Priority to CN2010202986050U priority Critical patent/CN201765685U/en
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Abstract

The utility model discloses a sensing node circuit applicable to various types of sensors. An environment parameter detection unit comprises various types of sensors, real-time detection is carried out on environment parameters, detection signals are collected and processed by a central processing unit, and are stored in a data memory connected with the central processing unit, the processed data is sent out through a wireless radio frequency receiving and sending unit, a shape memory alloy (SMA) antenna matched with the wireless radio frequency receiving and sending unit to be used, and a resistance matching circuit connected between the wireless radio frequency receiving and sending unit and the SMA antenna, and power supply modules are used for supplying electricity for each electricity consumption unit. The utility model is reasonable in design, simple in wiring and convenient in installation, in addition, the circuit board has small size and light weight, the use effect is good, and in addition, the practical value is high. The total number of node equipment required in the network can be reduced, and the adopted power supply modules have reasonable design and reliable performance.

Description

A kind of sensing node circuit that adapts to the polytype sensor
Technical field
The invention belongs to the wireless sensor network technology field, especially relate to a kind of sensing node (NPUmote) circuit that adapts to the polytype sensor.
Background technology
Wireless sensor network is that a large amount of microminiaturized sensing nodes is arranged in the monitored area, a kind of network that constitutes by the wireless telecommunications self-organization between node.Microminiaturized sensing node generally includes parts such as environmental parameter detecting unit, data processing, radio communication as the basic composition element of sensor network, and wherein, sensor is the core of environmental parameter detecting unit.The sensor that existing miniature sensing node adopted all is digital signal output mostly, its digital signal output end is directly connected to the respective pin of processor usually by serial asynchronous communication mode (for example TWI, I2C), and the existing common function singleness of miniature sensing node, each node is that particular sensor designs.
In sum, hardware and software (for example single transceiver, the single-sensor) design function of existing sensing node is single, all is the sensor of one type on a node band basically, does not realize the integrated of multiple sensors and merges.
Summary of the invention
In order to overcome the deficiency of prior art function singleness, the invention provides a kind of sensing node circuit that adapts to the polytype sensor, can effectively solve existing sensing node and can only and can not realize the practical problems that multiple sensors is integrated and merge with a kind of type sensor.
The technical solution adopted for the present invention to solve the technical problems is: comprise environmental parameter detecting unit, central processing unit, radio transceiver unit, data-carrier store and power module.The environmental parameter detecting unit comprises the polytype sensor, environmental parameter is detected in real time, institute's detection signal is gathered and is handled by central processing unit, and be stored in the data-carrier store that joins with central processing unit, match by the radio transceiver unit and with the radio transceiver unit SMA antenna that uses, the impedance matching circuit that is connected between radio transceiver unit and SMA antenna of data after the processing sends, and power module is powered for each power unit.
Polytype sensor in the described environmental parameter detecting unit comprises digital sensors and analog sensor, and described digital sensors comprises CO 2Sensor, Temperature Humidity Sensor and optical sensor, described analog sensor comprise the sensor of 4~20MA and the output of 0~5V analog quantity.
Described central processing unit is 8 high-performance AVR Chip Microcomputer A tmega1281V.
Described radio transceiver unit is chip AT86RF230.
Described data-carrier store is chip AT45DB041.
Described CO 2Sensor is 6004 infrared CO 2Module is connected to central processing unit by USART.
Described Temperature Humidity Sensor is a SHTxx series single-chip sensor, and the serial line interface by two-wire system is connected to central processing unit.
Described optical sensor is light digital sensor ISL29001, is connected to central processing unit by the I2C bus.
Described power module is made up of supply module and the low pressure difference linear voltage regulator and the DC/DC converter that join with supply module respectively, is used for the power supply of modules such as central processing unit, radio transceiver unit, data-carrier store, CO2 sensor.
But described DC/DC converter is independent power cutoff chip MIC2288.
The invention has the beneficial effects as follows:
1, circuit design is reasonable, and wiring is simple, easy for installation and the circuit board volume is little, in light weight.
2, result of use is good and practical value is high, not only supports multiple digital signal sensors, has also increased the support to analog signal sensors.In actual use, the data-signal sensor such as integrated CO2, humiture, illumination and the soil moisture, soil moisture analog sensor, and be laid on the circuit board multiple sensors is integrated, realized the integrated of multiple sensors and merged.
3, used radio transceiver unit is that chip AT86RF230 is the radio transceiver chip with the ZigBee/IEEE802.15.4 compatibility, it is operated in the 2.4GHz ISM band, have the 104dB link budget ,-receiving sensitivity of 101dB and the through-put power of 3dB, thereby can reduce the sum of required node device in the network, thereby greatly reduce the networking cost of IEEE 802.15.4 system.
4, the used reasonable in design and dependable performance of power module, adopt Switching Power Supply to power, because the inner key components of Switching Power Supply is operated in the HF switch state, the energy that itself consumes is very low, switch power efficiency can reach 80%~90%, improves nearly one times than common linear stabilized power supply; And adopt battery and adapter power supply mode, safe and reliable and result of use good; In addition, but there is independent power cutoff chip to power, to satisfy the bigger user demand of sensor power consumption at CO2 sensor special configuration.
In sum, circuit design of the present invention is reasonable, wiring is simple, volume is little, in light weight, easy for installation and each component capabilities is good, result of use good, practical value is high, can effectively solve existing sensing node can only with a kind of type sensor and can not realize multiple sensors integrated with the practical problems that merges.
1, NPUmote not only supports multiple digital signal sensors, has also increased the support to analog signal sensors, after the particular modulus conversion module that the simulating signal of sensor output is introduced into single chip computer AT MEL128 carries out analog to digital conversion, carries out respective handling again.2, NPUmote adopts that multiple sensors is integrated to be laid in a Design Mode on the circuit board.
The present invention is further described below in conjunction with drawings and Examples.
Description of drawings
Fig. 1 is a circuit block diagram of the present invention.
Fig. 2 is the circuit block diagram of power module of the present invention.
Among the figure:
1-environmental parameter detecting unit; The 2-central processing unit; 3-radio transceiver unit;
The 4-SMA antenna; The 5-impedance matching circuit; The 6-data-carrier store;
The 7-power module; The 7-1-supply module; The 7-2-low pressure difference linear voltage regulator;
The 7-3-DC/DC converter.
Embodiment
As shown in Figure 1, the present invention includes the environmental parameter detecting unit of forming by the polytype sensor that various environmental parameters is detected in real time 1, the central processing unit 2 that 1 detection signal of environmental parameter detecting unit is gathered and handled, data-carrier store 6 and the radio transceiver unit 3 that joins with central processing unit 2 respectively, the SMA antenna 4 that matches and use with radio transceiver unit 3, be connected on the impedance matching circuit 5 of 4 on radio transceiver unit 3 and SMA antenna and be the power module 7 of each power unit power supply, the polytype sensor in the described environmental parameter detecting unit 1 all connects central processing unit 2.Described central processing unit 2 is 8 high-performance AVR Chip Microcomputer A tmega1281V.Described polytype sensor comprises digital sensors and analog sensor, and described digital sensors comprises CO 2Sensor, Temperature Humidity Sensor and optical sensor.In the present embodiment, described CO 2Sensor is 6004 infrared CO 2Module is chip U104A, and Temperature Humidity Sensor is a SHTxx series single-chip sensor, and optical sensor is that light digital sensor ISL29001 is chip U103.
The power supply of described 8 high-performance AVR Chip Microcomputer A tmega1281V (hereinafter to be referred as Chip Microcomputer A tmega1281V) all connects+the 3.3V power end for+3.3V power supply and its VCC pin, the AVCC pin of Chip Microcomputer A tmega1281V connects after inductance L 101+3.3V power end and its AREF pin directly connect+the 3.3V power end, the AVCC pin of described Chip Microcomputer A tmega1281V through after the inductance L 101 with and the equal ground connection after capacitor C 108 of VCC and AREF pin.Modes such as external crystal-controlled oscillation, outside RC oscillator, inner RC oscillator, external clock reference can be chosen in the work clock source of described Chip Microcomputer A tmega1281V, the selection in work clock source specifically designs by its internal fuse position, modes such as fuse bit can be programmed by JTAG, ISP programming are provided with, and Chip Microcomputer A tmega1281V goes up correspondence and is provided with ISP application programming interface and JTAG debugging interface.
In the present embodiment, Chip Microcomputer A tmega1281V adopts two external crystal-controlled oscillation: the 7.3728MHz crystal oscillator is the work clock of crystal oscillator X101 as Chip Microcomputer A tmega1281V; 32.768kHz crystal oscillator is that crystal oscillator X100 is as the realtime clock source sensor, wherein, two pins of crystal oscillator X100 are respectively with the TOSC2/PG3 of Chip Microcomputer A tmega1281V with the TOSC1/PG4 pin joins and two pin ground connection behind capacitor C 100 and C101 respectively, and two pins of crystal oscillator X101 are respectively with the XTAL2 of Chip Microcomputer A tmega1281V with the XTAL1 pin joins and two pin ground connection behind capacitor C 107 and C109 respectively.Described Chip Microcomputer A tmega1281V's Pin connects after resistance R 113+the 3.3V power end, and this pin ground connection after capacitor C 112.
Wherein, described 6004 infrared CO 2Adopt the UART mode to carry out communication between module and the Chip Microcomputer A tmega1281V, promptly the road Transistor-Transistor Logic level UART interface of Chip Microcomputer A tmega1281V meets 6004 infrared CO 2Module, described 6004 infrared CO 2The RXD pin of module meets PE1 (TXD0/PDO) pin of single-chip microcomputer Atmega1281V, described 6004 infrared CO after resistance R 123 2The TXD pin of module meets PE0 (RXD0/PCINT0/PDI) pin of single-chip microcomputer Atmega1281V, described 6004 infrared CO behind resistance R 111 and R123 2The GND pin of module meets PE0 (RXD0/PCINT0/PDI) pin of single-chip microcomputer Atmega1281V, described 6004 infrared CO behind resistance R 110 and R123 2The SER_CLK of module, GND and the equal ground connection of SER_IN pin and its+5V pin connects+the 5V power end.In addition, because 6004 infrared CO 2Module needs preheating when work, be generally 2 minutes, and maximum time is 10 minutes.Thereby must be at 6004 infrared CO 2Sample during the module working stability, and according to 6004 infrared CO 2The node physical construction of module is selected diffused for use when it is laid.Because 6004 infrared CO 2Module is the 5V power-supply system, thereby when carrying out communication with power supply for the Chip Microcomputer A tmega1281V of+3.3V, consider the level conversion problem.In the present embodiment, adopt 5V voltage signal dividing potential drop, the mode of connection that the 3.3V voltage signal directly links to each other.
The supply voltage of described SHTxx series single-chip sensor is 2.4~5.5V.After sensor powers on, wait for 11ms to cross " dormancy " state, need not central processing unit 1 during this period and send any instruction.In addition, can increase an electric capacity between the power pins VCC of SHTxx series single-chip sensor and the GND, in order to decoupling filtering.The serial line interface of SHTxx (two lines are two-way), sensor signal read and the loss of power aspect, all done optimization process; But incompatible with the I2C interface, need to use the GPIO mouth to come Simulation with I 2C interface communication.It is that microprocessor is synchronous with the communication between the serial single-chip sensor of SHTxx that the serial clock input SCK of described SHTxx series single-chip sensor is used for central processing unit 1.The serial data interface SDA of described SHTxx series single-chip sensor is that triple gate is used for reading of data, and SDA is the change state after SCK clock negative edge, and only effective at the SCK rising edge clock.Thereby during the data transmission, when SCK clock high level, it is stable that SDA must keep.For avoiding signal conflict, described microprocessor should drive the pull-up resistor of DATA in an outside of low level needs, and signal is lifted to high level.In the present embodiment, it is chip U102 that described SHTxx series single-chip sensor is specially SHT75 single-chip sensor.The SDA of described SHT75 single-chip sensor and SCK pin connect PD0 (SCL/INT0) and PD1 (SDA/INT1) pin of single-chip microcomputer Atmega1281V respectively, the SDA and the SCK pin of described SHT75 single-chip sensor connect behind resistance R 100 and R104 respectively+the 3.3V power end, and the VCC of SHT75 single-chip sensor connects+3.3V power end and its GND pin ground connection.
The PD of described smooth digital sensor ISL29001 (POWERDOWN model selection control end), SCL (being the serial clock input end) and SDA (being the serial data input end) pin connect PA3 (AD3), PA4 (AD4) and PA5 (AD5) pin of single-chip microcomputer Atmega1281V respectively, described smooth digital sensor ISL29001 REXT (being the intensity of illumination control end) pin ground connection after resistance R 109.The installation site of considering optical sensor is not very clear and definite.Therefore in the design, light digital sensor ISL29001 independently becomes plate and its to be connected with circuit main board of the present invention by soft arranging wire, with the suitable position of convenient installation.Described+3.3V power end joins with PA0 (AD0), PA1 (AD1) and PA2 (AD2) pin of Chip Microcomputer A tmega1281V behind resistance R 101 and light emitting diode D100, resistance R 102 and light emitting diode D101 and resistance R 103 and light emitting diode D102 respectively, simultaneously described+3.3V power end joins the PA3 of Chip Microcomputer A tmega1281V (AD3) pin ground connection after resistance R 106 with PA4 (AD4) and PA5 (AD5) pin of Chip Microcomputer A tmega1281V respectively behind resistance R 108 and R107.
To sum up, the IIC interface of Chip Microcomputer A tmega1281V connects optical sensor and Temperature Humidity Sensor.
The ADC0 of described Chip Microcomputer A tmega1281V~ADC2 pin for reserve to make three road AD mouths of expansion usefulness, above-mentioned ADC0~ADC2 pin and analog sensor join, promptly as the Data Input Interface of described analog sensor.
In the present embodiment, described radio transceiver unit 3 is the zigbee wireless communication module, being specially chip AT86RF230 is chip U201, carry out communication by SPI interface (being Serial Peripheral Interface) between described chip AT86RF230 and Chip Microcomputer A tmega1281V, particularly: the PB0 of Chip Microcomputer A tmega1281V ( / PCINT0), PB1 (SCK/PCINT1), PB2 (MOSI/PCINT2), PB3 (MISO/PCINT3), PB7 (OC0A/OC1C/PCINT7) and six pins of PD4 (ICP1) connect chip AT86RF230's respectively SCLK, KOSI, MISO, SLP_TR and six pins of IRQ, the PD6 of described Chip Microcomputer A tmega1281V (T1) and XTAL1 pin are respectively through resistance R 112 and R114 and all connect the CLKM pin of chip AT86RF230 after resistance R 203; Described chip AT86RF230's Pin connects PA6 (AD6) pin of single-chip microcomputer Atmega1281V.Because Chip Microcomputer A tmega1281V works in inner under the oscillation frequency of 7.3782MHz, thereby if Chip Microcomputer A tmega1281V will adopt the external timing signal synchronous with chip AT86RF230, then the CLKM pin of chip AT86RF230 will join with the XTAL1 pin of Chip Microcomputer A tmega1281V, and the fuse bit of chip AT86RF230 will be set to external clock.In addition, because the various duty look-at-mes of chip AT86RF230 are controlled by its IRQ pin, thereby among the present invention the IRQ pin of chip AT86RF230 is received on PD4 (ICP1) pin of Chip Microcomputer A tmega1281V to produce capture interrupt, because capture interrupt can reduce extraneous interference by the noise removing mode is set, thereby improves the reliability of interrupting.In addition, the XTAL2 of described chip AT86RF230 and XTAL1 pin two pins ground connection behind capacitor C 201 and C203 respectively of meeting two pins of crystal oscillator X200 and crystal oscillator X200 respectively.Be noted that: the long-term work frequency stability of the external crystal-controlled oscillation X1 that connects of chip AT86RF230 is less than and equals 40ppm, and selects suitable load capacitance according to the driving force of crystal oscillator X200 and chip AT86RF230.The VDEC2 of described chip AT86RF230, VDEC1 and VDD pin respectively behind capacitor C 202, C205 and C206 ground connection and its VDD pin connect+the 3.3V power end, the CLKM pin of chip AT86RF230 is ground connection after resistance R 203 and capacitor C 207.
The RFP of described chip AT86RF230 and RFN pin connect BAL2 and the BAL1 pin that meets chip HHM1711D1 behind capacitor C 200 and the C204 respectively, and the UNB1 pin of chip AT86RF230 connects all the other 4 equal ground connection of pin of the 5th pin and the chip CIRDIN_5-P of chip CIRDIN_5-P.
For the mimic channel of chip AT86RF230, in order to reduce the annoyance level of other parts, improve the RF performance, need take interference protection measure.For example, the analog power input end increases magnetic bead or inductance; AT86RF230 simulation ground and digitally will separately connecting up, and ground connection on one point; In order to reduce effects of distribution parameters, floor file is big as far as possible, and will suitably stamp via hole; The electric capacity that filtering is used also will be tried one's best near chip.
In addition, for chip AT86RF230, notice that impedance matching promptly need design impedance matching circuit 5, the antenna port of chip AT86RF230 is the difference output of 2 tunnel 100 Ω, can directly connect the antenna of differential feed, all compare difficulty, generally can become one tunnel 50 Ω output to the difference output transform of 2 tunnel 100 Ω with Ba Lun but shortcoming is impedance matching and test, connect the antenna of all kinds of end feds then, the feeder line design guarantees the impedance in 50 Europe.
Described data-carrier store 6 is chip U105 for chip AT45DB041, this chip has plurality of advantages such as capacity is big, read or write speed is fast, peripheral circuit is few, therefore and this chip can minimumly be operated in 2.5v, and working current only is 4mA, has obtained using widely in mobile communication, occasion such as portable.The VCC of described chip AT45DB041 and Pin all connects+3.3V power end and its Pin connects PE3 (OC3A/A1N1) pin of single-chip microcomputer Atmega1281V, the SCK pin of described chip AT45DB041 meets PE5 (OC3C/INT5) and PE6 (T3/INT6) pin that PE4 (OC3B/INT4) pin of single-chip microcomputer Atmega1281V and its SI and SO pin meet single-chip microcomputer Atmega1281V, described chip AT45DB041's Pin connects single-chip microcomputer Atmega1281V's Pin,
In conjunction with Fig. 2, described power module 7 is made up of supply module 7-1 and the low pressure difference linear voltage regulator 7-2 and the DC/DC converter 7-3 that join with supply module 7-1 respectively.In the present embodiment, described power module 7 comprises supply module 7-1, joins and be used to provide with supply module 7-1+the low pressure difference linear voltage regulator 7-2 of 3.3V power supply is LDO and join with supply module 7-1 and be used to provide+and the DC/DC converter 7-3 of 5V power supply.In the present embodiment, described low pressure difference linear voltage regulator 7-2 is respectively Chip Microcomputer A tmega1281V, chip AT45DB041, chip AT86RF230, SHTxx series single-chip sensor and light digital sensor ISL29001 and provides+the 3.3V power supply, and described DC/DC converter 7-3 is described 6004 infrared CO 2Module provides+the 5V power supply.Comprise two kinds of parallel power supply modes among the described supply module 7-1: one to be to use lithium battery be that J100 carries out continued power, and the voltage of used lithium battery is 4.2V, capacity 〉=2000mAH; The 2nd, outside 5V adapter is J106 power supply, the power output end of described J100 and J106 all behind the magnetic bead L100 of a series connection the stable+5V of output or+the 4.2V power supply.Be connected to ground connection behind the divider resistance R117 of two serial connections and R119 on the power output end of described J100, it is resistance R 117 and R119 detect divider resistance and the order of the contact mutually sheet machine Atmega1281V of the two for lithium battery voltage PF3 (ADC3) pin, that is to say, analyze the voltage value that relatively draws lithium battery in the A/D translation interface with the intermediate value Chip Microcomputer A tmega1281V of voltage between resistance R 117 and R119.
Described low pressure difference linear voltage regulator 7-2 is chip U110 for step-down LDO, and in the present embodiment, described chip U110 is an XC6221 series low pressure difference linear voltage regulator, carries out exporting stable+3.3V power supply after the voltage stabilizing through chip U110.But described DC/DC converter 7-3 is chip U111 for independent power cutoff chip MIC2288, stable output+5V power supply after boosting through chip U111.
In the actual use, when adopting the power supply of 5V adapter, omit DC/DC converter 7-3, only need on the power output end of magnetic bead L100, connect a resistance R 120 and be used for output+5V voltage and get final product; Correspondingly, when adopting lithium battery power supply, then need use DC/DC converter 7-3, then should save with the resistance R 120 that the power output end of L100 joins.During physical cabling, the VIN of chip U110 and EN pin all connect the power output end of magnetic bead L100, and the VSS pin ground connection of chip U110 and its VO and NC pin be ground connection behind capacitor C 123 and C124 respectively, and the VO pin of chip U110 is+the 3.3V power output end.Power output end and its EN pin that the VIN pin of described chip U111 meets magnetic bead L100 connect+the 3.3V power output end, the SW pin of chip U111 output+5V power supply behind schottky diode D103, the output terminal of described schottky diode D103 respectively behind the resistance R 116 of two series connection and R118 the tie point of ground connection and resistance R 116 and R118 connect output terminal ground connection after capacitor C 115 of FB pin and the schottky diode D103 of chip U111.
When power module 7 was carried out practical wiring, according to the size of printed wiring board electric current, added rent power lead width reduced loop resitance as far as possible.Simultaneously, make the direction of the trend of power lead, ground wire and data transfer consistent, help to strengthen noise resisting ability like this.Simultaneously, should note: will digitally separate, and, should make them as far as possible separately if existing logical circuit has linear circuit again on the wiring board with simulation ground.The ground of low-frequency channel should adopt single-point ground connection in parallel, ground connection in parallel again after can partly connecting when practical wiring is had any problem as far as possible.High-frequency circuit should adopt multiple spot series connection ground connection, and ground wire should be lacked and thick, around the high-frequency component as far as possible with lattice-shaped paper tinsel in large area.The ground wire overstriking of should trying one's best, if ground wire is with the lines of threading very much, then earthing potential changes with the variation of electric current, and noiseproof feature is reduced.Therefore should be with the ground wire overstriking, make it can be by being three times in the permission electric current in the printed board.As possible, the length of ground wire should be more than 2~3mm.Ground wire constitutes closed-loop.The only printed board of being made up of digital circuit, the big multipotency of the agglomerating loop of its grounding circuit cloth improves noise resisting ability.
In the present embodiment, all Primary Components the decoupling capacitor in the radio transceiver unit 3 in SMA antenna, crystal oscillator and power module 7 all are integrated in the chip piece, packing forms adopts the QFN encapsulation of 32 pins, 5mm * 5mm * 0.9mm size, thereby only needs 6 external modules by the equipment that this chip constituted.Described chip AT86RF230 inside is integrated with 35 can be by the eight bit register of SPI control timing visit, 8 basic status (can expand to 14 as required) are arranged during work, the buffering that sends data and reception data in the sheet is respectively 129 bytes and 130 bytes, just in time can satisfy the requirement of maximum frame size 127 bytes of IEEE802.15.4 agreement regulation, the CRC16 check code that need add 2 bytes during transmission also will be added the link-quality indication of 1 byte during reception.

Claims (10)

1. sensing node circuit that adapts to the polytype sensor, comprise the environmental parameter detecting unit, central processing unit, the radio transceiver unit, data-carrier store and power module, it is characterized in that: described environmental parameter detecting unit comprises the polytype sensor, environmental parameter is detected in real time, institute's detection signal is gathered and is handled by central processing unit, and be stored in the data-carrier store that joins with central processing unit, the SMA antenna that data after the processing match by the radio transceiver unit and with the radio transceiver unit and use, the impedance matching circuit that is connected between radio transceiver unit and SMA antenna sends, and power module is powered for each power unit.
2. the sensing node circuit of adaptation polytype sensor according to claim 1 is characterized in that: the polytype sensor in the described environmental parameter detecting unit comprises digital sensors and analog sensor, and described digital sensors comprises CO 2Sensor, Temperature Humidity Sensor and optical sensor, described analog sensor comprise the sensor of 4~20MA and the output of 0~5V analog quantity.
3. the sensing node circuit of adaptation polytype sensor according to claim 1 is characterized in that: described central processing unit is 8 high-performance AVR Chip Microcomputer A tmega1281V.
4. the sensing node circuit of adaptation polytype sensor according to claim 1 is characterized in that: described radio transceiver unit is chip AT86RF230.
5. the sensing node circuit of adaptation polytype sensor according to claim 1 is characterized in that: described data-carrier store is chip AT45DB041.
6. the sensing node circuit of adaptation polytype sensor according to claim 1 is characterized in that: described CO 2Sensor is 6004 infrared CO 2Module is connected to central processing unit by USART.
7. the sensing node circuit of adaptation polytype sensor according to claim 1 is characterized in that: described Temperature Humidity Sensor is a SHTxx series single-chip sensor, and the serial line interface by two-wire system is connected to central processing unit.
8. the sensing node circuit of adaptation polytype sensor according to claim 1 is characterized in that: described optical sensor is light digital sensor ISL29001, is connected to central processing unit by the I2C bus.
9. the sensing node circuit of adaptation polytype sensor according to claim 1 is characterized in that: described power module is made up of supply module and the low pressure difference linear voltage regulator and the DC/DC converter that join with supply module respectively.
10. the sensing node circuit of adaptation polytype sensor according to claim 1 is characterized in that: but described DC/DC converter is independent power cutoff chip MIC2288.
CN2010202986050U 2010-08-19 2010-08-19 Sensing node circuit applicable to various types of sensors CN201765685U (en)

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US10979095B2 (en) 2011-02-18 2021-04-13 Nxp Usa, Inc. Method and apparatus for radio antenna frequency tuning
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US9473216B2 (en) 2011-02-25 2016-10-18 Blackberry Limited Method and apparatus for tuning a communication device
TWI568073B (en) * 2011-05-16 2017-01-21 黑莓有限公司 Method and apparatus for tuning a communication device
US10218070B2 (en) 2011-05-16 2019-02-26 Blackberry Limited Method and apparatus for tuning a communication device
US9716311B2 (en) 2011-05-16 2017-07-25 Blackberry Limited Method and apparatus for tuning a communication device
US10624091B2 (en) 2011-08-05 2020-04-14 Blackberry Limited Method and apparatus for band tuning in a communication device
US9671765B2 (en) 2012-06-01 2017-06-06 Blackberry Limited Methods and apparatus for tuning circuit components of a communication device
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US10700719B2 (en) 2012-12-21 2020-06-30 Nxp Usa, Inc. Method and apparatus for adjusting the timing of radio antenna tuning
US9768810B2 (en) 2012-12-21 2017-09-19 Blackberry Limited Method and apparatus for adjusting the timing of radio antenna tuning
US10651918B2 (en) 2014-12-16 2020-05-12 Nxp Usa, Inc. Method and apparatus for antenna selection
US10003393B2 (en) 2014-12-16 2018-06-19 Blackberry Limited Method and apparatus for antenna selection
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