CN201672343U - light emitting device - Google Patents

Abstract

The utility model discloses a light emitting device. The light emitting device comprises a heat dissipation plate, a heat dissipation fin, a heat conduction device, a light emitting diode module and a cover body. The heat sink includes a first surface and a second surface. The heat dissipation fins include a plurality of heat dissipation fins disposed on the second surface of the heat dissipation plate. The heat conduction device includes a first part and a flat part, and the first part is connected with the first surface of the heat dissipation plate. The light emitting diode module is arranged on the flat part corresponding to the heat conduction device. The cover body is connected with the heat dissipation plate to form a closed space, and the closed space accommodates the heat conduction device and the light emitting diode module. The beneficial technical effect of the utility model is that the light-emitting device solves the heat dissipation problem of the light-emitting device without affecting its waterproof performance and sealing effect, and at the same time reduces its weight.

Description

light emitting device

technical field

The utility model relates to a light emitting device, and in particular, the utility model relates to a light emitting device using a light emitting diode as a light source.

Background technique

Nowadays, the light sources of lighting devices in flammable and explosive hazardous places (such as oil fields, transfer stations, infield pump rooms, joint stations, power distribution rooms, operation rooms, and duty rooms) are mostly traditional HID, fluorescent lamps, and incandescent bulbs. However, traditional light sources have problems such as high waste heat, low light efficiency, relatively short lifespan, and excessive infrared and ultraviolet rays.

Because light emitting diodes (Light emitting diodes, LEDs) have many advantages such as power saving, shock resistance, fast response and suitable for mass production. Therefore, at present, the lighting equipment using light emitting diodes as the light source continues to be researched, developed and applied to the above-mentioned places.

However, there is a common problem in various LED lamp body structures today. When they use a heat conduction tube combined with other means (such as heat dissipation fins) to conduct heat to the outside of the light emitting device, often due to the heat conduction element and the lamp body There is a gap at the joint of the shell, which affects its sealing effect and waterproof performance.

At the same time, the light-emitting device with explosion-proof function has high strength requirements. In the prior art, metal casings are often used to protect the internal parts of the light-emitting device, so that its weight is greatly increased, and the cost and difficulty of erecting the light-emitting device are increased.

Therefore, the utility model proposes a light emitting device, which solves the heat dissipation problem of the light emitting device and reduces its weight without affecting its waterproof performance and sealing effect.

Contents of the invention

The main purpose of the utility model is to provide a light-emitting device with high heat dissipation efficiency and low weight. The light-emitting diode lighting device according to the utility model also has a low-weight structure that is waterproof, heat-insulated, and evenly distributes heat.

According to a specific embodiment, the light emitting device includes a heat dissipation plate, a heat dissipation fin, a heat conduction device, a light emitting diode module and a cover.

The heat dissipation plate includes a first surface and a second surface, and the heat dissipation fins include a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged on the second surface of the heat dissipation plate; the heat conduction device includes a first part and a flat part, and the first part and the heat dissipation The first surface of the plate is connected; the light emitting diode module is arranged on the flat part of the corresponding heat conduction device; the cover body is connected with the heat dissipation plate to form a closed space, and the closed space accommodates the heat conduction device and the light emitting diode module.

In addition, in practical applications, the light-emitting device of the present invention further includes a partition body, which includes an upper surface and a lower surface, and the lower surface is connected to the first surface of the heat dissipation plate. The partition body is a disk-shaped structure, and a first chamber is formed between the partition body and the first surface. The cover body is a disc-shaped structure, and a second chamber is formed between the cover body and the partition plate.

Furthermore, the first chamber accommodates the heat conduction device, wherein the upper surface of the partition plate has a plurality of perforations for allowing one end of the corresponding heat conduction device to pass through the partition plate through the corresponding perforations. Wherein the partition plate and the cover body are components made of polymer materials. In addition, the cover body is clamped and fixed on the first surface of the heat dissipation plate through the ring body, and the cover body is made of transparent plastic, acrylic or plexiglass.

Furthermore, in practical application, the light emitting device of the present invention further includes a frame, and the middle part of the frame is a perforated structure for allowing the cover to penetrate and clamp the cover to the first surface of the heat sink.

Furthermore, in practical applications, the heat dissipation plate of the light emitting device of the present invention further includes a plurality of grooves disposed on the first surface, and the first part of the heat conduction device is disposed in the corresponding grooves.

In addition, in practical application, the light-emitting device of the present invention further includes a waterproof box disposed on the second surface of the heat dissipation plate, wherein the waterproof box and the heat dissipation plate have a common perforation through which electric wires pass.

Additionally, the heat conducting means can be a heat pipe or a vapor cavity.

Furthermore, in practical application, the light emitting device of the present invention further includes a control module, which includes a control circuit, and the control circuit is electrically connected to the LED module to control the LED module to emit light, wherein the control circuit is disposed in a closed space.

In addition, in practical application, the light emitting device of the present invention further includes a fixing module, the fixing module includes a fixing part and a hanging part, and the fixing part is fixed to the heat dissipation plate through the frame.

In addition, in practical applications, the light-emitting device of the present invention further includes a positioning member for fixing the heat conducting device on the first surface.

The beneficial technical effect of the utility model is that the light-emitting device solves the heat dissipation problem of the light-emitting device without affecting its waterproof performance and sealing effect, and at the same time reduces its weight.

Description of drawings

Fig. 1 shows a schematic diagram of a light emitting device according to a specific embodiment of the present invention.

Fig. 2 shows a cross-sectional view along line X-X in Fig. 1 according to a specific embodiment of the present invention.

Fig. 3 shows a schematic diagram of a light emitting device according to a specific embodiment of the present invention.

Fig. 4 shows a top view of a cooling plate according to a specific embodiment of the present invention.

Fig. 5 shows a schematic diagram of a fixing module according to a specific embodiment of the present invention.

Wherein, the reference signs are explained as follows:

1: Lighting device 10: Heat sink

12: First surface 14: Second surface

15: Perforation 16: Positioning piece

18: groove 20: cooling fins

212: protruding part 30: heat conduction device

32: Flat part 34: First part

36: Part 2 40: LED Module

42: Lens 44: Support frame body

46: Diode light-emitting chip 50: Cover body

52: Central part 54: Peripheral part

56: Second chamber body 58: Ring body

60: frame body 62: protruding structure

70: waterproof box 72: common perforation

74: Screw Kit 80: Fixed Module

82: Hanging part 822: Fixing hole

84: Fixed part 842: Perforation

844: common perforation 846: first clamping structure

848: Second clamping structure 90: Partition board

92: upper surface 94: lower surface

96: first chamber body 98: perforation

100: Control module 102: Control circuit

104: Regulator

Detailed ways

The main purpose of the utility model is to provide a light-emitting device with high heat dissipation efficiency and low weight. The light-emitting diode lighting device according to the utility model also has a light-weight structure that is waterproof, heat-insulated and evenly distributes heat.

Please refer to Figure 1 and Figure 2 together. Fig. 1 shows a schematic diagram of a light emitting device according to a specific embodiment of the present invention, and Fig. 2 shows a cross-sectional view along line X-X of Fig. 1 according to a specific embodiment of the present invention.

Wherein, the light emitting device 1 includes a heat dissipation plate 10 , heat dissipation fins 20 , heat conduction device 30 , LED module 40 , cover 50 , frame 60 , waterproof box 70 , fixing module 80 , partition plate 90 and control module 100 .

Referring to FIG. 2 , the heat sink 10 includes a first surface 12 and a corresponding second surface 14 . The second surface 14 is located outside the lamp body and is in direct contact with the outside air. While connecting and fixing the relative positions of the components, the heat dissipation plate 10 can also conduct the heat of the LED module 40 to the heat dissipation fins 20 through the heat conduction device 30 .

A plurality of grooves 18 are formed on the first surface 12 of the heat sink 10 for embedding the first portion 34 of the above-mentioned heat conduction device 30 to increase the contact area between the heat conduction device 30 and the heat sink 10, thereby maximizing its heat transfer efficiency. The shape of the groove 18 may be the same as that of the heat conducting device 30 .

Referring to FIG. 2 again, the peripheral portion of the cooling plate 10 has a plurality of through holes 15 for fixing the peripheral portion 54 of the cover 50 to the cooling plate 10 by screws.

In this specific embodiment, the heat dissipation plate 10 and the above-mentioned heat dissipation fins 20 are integrally formed, but the integral formation is not necessary. In this embodiment, the heat sink 10 is made of aluminum. However, in practical applications, iron, its alloys, or other materials with high thermal conductivity can also be used for manufacturing.

The heat dissipation fins 20 are disposed on the second surface 14 of the heat dissipation plate 10 , and the heat dissipation fins 20 extend from the vertical direction of the second surface 14 .

The surface of the heat dissipation fin 20 can be formed with a plurality of protruding heat dissipation structures (not shown in the figure) to increase its surface area to improve heat dissipation performance. The horizontal cross-sectional area of the bottom of the heat dissipation fin 20 is larger than that of the upper structure. The horizontal cross-sectional area is small. Furthermore, since the temperature in the center of the heat dissipation fins is higher than that in the peripheral parts, the height of the heat dissipation fins 20 is arranged in a mound shape with the outside short and the inside long, so as to maximize the heat dissipation performance of the middle portion of the heat dissipation fins.

The heat conducting device 30 includes a flat portion 32 , a first portion 34 and a second portion 36 . In this specific embodiment, the first part 34 is connected to the first surface 12 of the heat sink 10, the extension direction of the second part 36 is perpendicular to the first part 34, and the flat part 32 is placed on an end surface of the second part 36 However, the extension directions of the first portion 34 and the second portion 36 are not necessarily completely perpendicular.

A plurality of grooves 18 are formed on the first surface 12 of the heat dissipation plate 10 of each heat conduction device 30 for embedding the first portion 34 of the above heat conduction device 30 to increase the contact area between the heat conduction device 30 and the heat dissipation plate 10, and further maximize its heat transfer efficiency. Referring to FIG. 2 again, the peripheral portion of the cooling plate 10 has a plurality of through holes 15 for fixing the peripheral portion 54 of the cover 50 on the cooling plate 10 by screws.

Corresponding LED modules 40 are disposed on the flat portions 32 . In this specific embodiment, the above-mentioned heat conduction device 30 is a heat pipe (Heat pipe), but it is not necessary for the heat pipe, and any heat conduction device that can be used for heat dissipation, such as a steam cavity or a heat conduction column, can be used as the above-mentioned heat pipe. The heat conduction device 30.

The heat conduction device 30 is used for extracting heat energy from the LED module 40 and conducting it to the first surface 12 of the heat dissipation plate 10 , and then to the heat dissipation fins 20 through the first surface 12 for dissipating. Different from the prior art, the utility model does not need to destroy the integrity of the heat dissipation plate 10 to allow the heat conduction device 30 to penetrate the heat dissipation plate 10, and the integrated design reduces the influence of external air and moisture on the interior of the lamp body.

In order to fix the heat conduction device 30 on the heat dissipation plate 10 , a plurality of positioning members 16 are used to respectively dispose the heat conduction device 30 in the groove 18 of the heat dissipation plate 10 . The shape of the positioning member 16 cooperates with the shape of the heat conducting device 30 .

Please refer to FIG. 2 again, which shows a plurality of LED modules 40 disposed on each corresponding flat portion 32 of the heat conducting device 30 . The aforementioned LED module 40 includes at least one LED light emitting chip 46 , which can be various chips, such as LED chips or laser diode chips of various colors.

The above LED module 40 also includes a supporting frame 44 for fixing the LED module 40 on the heat conducting device 30, and one end of the supporting frame 44 includes a lens 42 for secondary optical adjustment of the light. . The aforementioned light emitting diode module 40 may be, but not limited to, a surface mount type (SMD) module or a connected chip on package (COB) module. In addition, thermal conductive glue can be filled between the LED module 40 and the thermal conduction device 30 to fill the gap therebetween.

The cover body 50 is made of a translucent or transparent material, so as to allow the light emitted by the above-mentioned LED module 40 to pass through and at the same time be connected to the above-mentioned heat sink 10 to form a closed space to block foreign objects, air and moisture from the outside, and It has the function of protecting the internal structure of the device. Moreover, the cover body 50 is a disk-shaped structure, and its peripheral portion 54 is fixed on the first surface 12 of the heat dissipation plate 10, and the central portion 52 of the disk-shaped structure of the above-mentioned cover body 50 is protruding from the peripheral portion 54, so that its center An airtight space is formed between the portion 52 and the first surface 12 of the heat sink 10 , and the airtight space accommodates the heat conduction device 30 , the LED module 40 , the partition plate 90 , the control module 100 and other components. Wherein, the cover body is made of transparent plastic, acrylic or plexiglass, but it is not limited to the above materials, and any transparent or translucent material can be used here.

The central part of the frame body 60 is a perforated structure, and the central part 52 of the cover body 50 penetrates the above-mentioned perforated structure, and its central part 52 clamps and fixes the peripheral part 54 of the cover body 50 through the ring body (O-RING) 58. on the first surface 12 of the heat sink 10 .

In this specific embodiment, a plurality of protruding structures 62 may be provided on the vertical surface of the outer periphery of the frame body 60, which engage with through holes (not shown in the figure) on the fixing part (not shown in the figure) of the fixing module 80 However, the protruding structure 62 is not necessary. The protruding structure 62 of the frame body 60 can be replaced with a through hole and the frame body 60 can be fixed to the fixing part of the fixing module 80 by screws.

The waterproof box 70 is disposed on the second surface 14 of the heat sink 10 . It can be used for, but not limited to, storing power cables. According to the needs of its design, it can also be used to house different components, such as a power supply or a transformer.

The fixing module 80 includes a hanging part 82 and a fixing part (not shown in the figure).

A plurality of hanging holes 822 may be included on the top of the hanging part 82 for fixing the hanging part 82 of the fixing module 80 in the target place of use by using screws or other existing means. However, according to different designs, the hanging portion 82 can be presented in various forms, such as slots, rollers, etc., and its deformation will not be repeated here.

The partition plate 90 includes an upper surface 92 and a lower surface 94, the lower surface 94 is connected to the first surface 12 of the cooling plate 10, and a first chamber 96 is formed between the upper surface 92 of the partition plate 90 and the above-mentioned first surface 12 . In this specific embodiment, the above-mentioned first chamber body 96 accommodates the heat conduction device 30 and the control module 100 .

The upper surface 92 of the partition body 90 has a plurality of through holes 98 for one end of the corresponding heat conducting device 30 to pass through and extend out from the through holes 98 . The number of perforations 98 is the same as the number of heat conducting means 30 .

In the prior art, metal materials such as iron alloy and aluminum alloy are used to manufacture the panel structure. However, in order to reduce the overall weight of the lamp, the partition panel 90 of the present invention is made of polymer materials. Furthermore, the surface of the partition body 90 can be coated with a light-reflecting material, so as to increase the overall luminous efficiency of the light-emitting device. In addition, the upper surface 92 of the partition plate 90 is in contact with the supporting frame body 44 of the LED module 40 .

In addition, the second chamber body 56 is formed between the first surface 12 of the heat dissipation plate 10 , the partition plate body 90 and the cover body 50 , and the above-mentioned LED module 40 is placed in the second chamber body 56 .

The control module 100 may include a control circuit 102 and a voltage regulator 104 , the voltage regulator 104 is used to stabilize the output voltage or current, and the control circuit 102 is electrically connected to the LED module 40 to control the LED module 40 to emit light. In this specific embodiment, the control module 100 is disposed in the above-mentioned first chamber body 96 .

Please refer to FIG. 3 . FIG. 3 shows a schematic diagram of a light emitting device 1 according to a specific embodiment of the present invention. A plurality of protruding portions 212 can be formed on the surface of the heat dissipation fin 20 to increase the surface area contacting the air to improve the heat dissipation performance.

In this specific embodiment, the horizontal cross-sectional area of the bottom of the heat dissipation fin 20 is larger than the horizontal structural cross-sectional area of the end, but it is not limited thereto. Furthermore, since the temperature in the center of the heat dissipation fins is higher than that in the peripheral parts, the height of the heat dissipation fins 20 is arranged in a mound shape with the outside short and the inside long, so as to maximize the heat dissipation performance of the middle portion of the heat dissipation fins.

In this specific embodiment, a plurality of protruding structures 62 can be provided on the vertical surface of the outer periphery of the frame body 60, which are embedded with the through holes 842 on the fixing part 82 of the fixing module 80, but it does not use the protruding structures 62 and the through holes. The combination of 842 is necessary. The protruding structure 62 of the frame body 60 can be replaced with a screw hole to fix the frame body 60 and the fixing portion 82 of the fixing module 80 by screws.

Please refer to FIG. 4 . FIG. 4 shows a top view of a cooling plate according to a specific embodiment of the present invention. In this embodiment, the above-mentioned waterproof box 70 and the heat sink 10 have a common through hole 72 for the power cable to pass through. A screw sleeve 74 is provided between the waterproof box 70 and the common through hole 72 of the heat sink 10 to fix the waterproof box 70 on the second surface 14 of the heat sink 10 , which has a waterproof function. However, the present invention does not require the installation of the waterproof box 70, and the components placed in the waterproof box 70 can be integrated into the above-mentioned confined space according to design requirements. Meanwhile, the peripheral portion of the heat dissipation plate 10 has a plurality of perforations 15 .

Please refer to FIG. 5 , which shows a schematic diagram of a fixing module of a specific embodiment of the present invention.

The fixing module 80 includes a hanging portion 82 and a fixing portion 84 . A plurality of hanging holes 822 may be included on the top of the hanging part 82 for fixing the fixing module 80 at any position of the target place by using screws or other existing means.

However, according to different designs, the hanging portion 82 can be presented in various forms, such as slots, rollers, etc., and its deformation will not be repeated here.

The fixing portion 84 has a plurality of through holes 842 for engaging with the protruding structures 62 of the frame body 60 . However, by changing the protruding structure 62 of the frame body 60 into a screw hole, the two can also be fixed by screws.

Furthermore, the fixing portion 84 and the hanging portion 82 have a common through hole 844 for fixing their relative positions through screws or other existing means. Moreover, the fixing part 84 and the hanging part 82 respectively include a first clamping structure 846 and a second clamping structure 848 .

Please refer to FIG. 5 again, the first clamping structure 846 is formed on the peripheral portion of the fixing portion 84 or the hanging portion 82 , and is formed by cutting the peripheral portion and then folding it toward its respective vertical direction. The second clamping structure 848 is in a C shape for clamping the first clamping structure 846 . Through the cooperation of the first clamping structure 846 and the second clamping structure 848 , they can provide a support force in the vertical direction to reduce the burden on the common through hole 844 .

Through the detailed description of the preferred specific embodiments above, it is hoped that the features and spirit of the present utility model can be described more clearly, and the scope of the present utility model is not limited by the preferred specific embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent scope of the utility model. Therefore, the protection scope of the application for the utility model should be interpreted in the broadest way based on the above description, so as to cover all possible changes and equivalent arrangements.

Claims (18)

1. A light emitting device, characterized in that it comprises: A heat sink, including a first surface and a second surface; a plurality of heat dissipation fins, the plurality of heat dissipation fins are arranged on the second surface of the heat dissipation plate; A heat conduction device, which includes a first portion and a flat portion, the first portion is connected to the first surface of the heat dissipation plate; a light emitting diode module, which is arranged on the corresponding flat part of the heat conducting device; and A cover body is connected with the heat dissipation plate to form a closed space, and the closed space accommodates the heat conduction device and the light emitting diode module. 2. The light-emitting device according to claim 1, characterized in that, the light-emitting device further comprises a partition body, the partition body comprises an upper surface and a lower surface, the lower surface and the first surface of the heat dissipation plate connect. 3. The light emitting device according to claim 2, wherein the partition plate is a disc-shaped structure, and a first chamber is formed between the partition plate and the first surface. 4. The light emitting device according to claim 3, wherein the first chamber accommodates the heat conducting device. 5 . The light emitting device according to claim 2 , wherein the cover body is a plate-shaped structure, and a second chamber is formed between the partition plate body and the heat dissipation plate. 6 . 6 . The light emitting device according to claim 2 , wherein the upper surface of the partition body has perforations for allowing one end of the corresponding heat conducting device to pass through the corresponding perforations. 7 . 7. The light emitting device according to claim 2, characterized in that, the partition plate is made of polymer material. 8. The light emitting device of claim 1, wherein the cover is clamped and fixed on the first surface of the heat dissipation plate by a ring. 9. The lighting device according to claim 1, wherein the cover is made of light-transmitting plastic, acrylic or plexiglass. 10. The light-emitting device according to claim 1, characterized in that, the light-emitting device further comprises a frame body, the middle part of the frame body is a perforated structure for allowing the center part of the cover body to pass through, and the cover body The body is clamped on the first surface of the heat sink. 11. The light-emitting device according to claim 1, wherein the heat dissipation plate further comprises a plurality of grooves, the plurality of grooves are arranged on the first surface, and the first part of the heat conduction device is arranged on the corresponding in this groove. 12. The light emitting device according to claim 1, further comprising a waterproof box, the waterproof box is disposed on the second surface of the heat sink. 13. The light-emitting device according to claim 12, wherein the waterproof box and the heat dissipation plate have a common perforation through which electric wires pass. 14. The light emitting device of claim 1, wherein the heat conduction device is a heat pipe or a vapor cavity. 15. The light emitting device according to claim 1, characterized in that, the light emitting device further comprises a control module, the control module comprises a control circuit, the control circuit is electrically connected with the light emitting diode module to control the light emitting diode module to emit light . 16. The lighting device of claim 15, wherein the control circuit is disposed in the enclosed space. 17 . The light emitting device according to claim 1 , further comprising a fixing module, the fixing module comprising a fixing part and a hanging part, and the fixing part is fixed to the cooling plate through a frame. 18. The light emitting device according to claim 1, further comprising a positioning member, the positioning member fixing the heat conducting device on the first surface.

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