CN201661945U - Integrated high-power LED light source - Google Patents
Integrated high-power LED light source Download PDFInfo
- Publication number
- CN201661945U CN201661945U CN2010201541859U CN201020154185U CN201661945U CN 201661945 U CN201661945 U CN 201661945U CN 2010201541859 U CN2010201541859 U CN 2010201541859U CN 201020154185 U CN201020154185 U CN 201020154185U CN 201661945 U CN201661945 U CN 201661945U
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- China
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- vacuum heat
- light source
- led chip
- led light
- power led
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Abstract
The utility model relates to a high-power LED illuminating light source, which comprises an LED chip group, a square ceramic insulating seat, a vacuum heat conducting base body and a free curved surface lens, wherein the LED chip group consists of LED chips through being connected in series, and each LED chip is connected in parallel with a Zener diode. The square ceramic insulating seat is welded on the vacuum heat conducting base body, the occurrence of looseness and separation phenomena caused by heated deformation of the traditional square plastic insulating frame can be effectively avoided, the waterproof and dustproof effects can be ensured, and the service life can be prolonged. The vacuum heat conducting base body is made of metals, such as copper and the like, a capillary pipe which is formed by copper sand through sintering and is used for flowing cold media is arranged inside the vacuum heat conducting base body, in addition, the cold media, such as water is filled in the capillary pipe, the capillary pipe is pumped into a vacuum state, the heat conduction is carried out in a liquification and vaporization circulation mode, heat generated by high-density clustered LED groups is fast conducted out, the use time is prolonged, and the aging yellow stain of sealing glue is reduced.
Description
Technical field
The utility model relates to a kind of integrated high power LED encapsulation technology and vacuum heat-conduction heat dissipation technology, the independent luminous intensity distribution novel large-power LED light source of particularly a kind of ultrafast heat radiation of collection that is widely used in illumination such as railway, highway needs, super high power, ceramic package.
Technical background
Current, along with social development of science and technology, the application of LED technology in people life more and more widely, it have energy-conservation, light efficiency is high, the life-span is long, non-maintaining, directionality good, advantages such as anti-vibration are the light sources of new generation of replacement conventional high-tension sodium vapor lamp, metalized lamp.
At present, the LED technology all belongs to low-power applications having obtained extensive use aspect display screen, the signal lamp, generally also all is independent use aspect street lamp.And integrated form high-power LED illumination technology, this at the high-power LED light source of having concentrated a lot of led chips to form very among a small circle, because problems such as heat radiation are difficult to resolve, and plastic stent commonly used is also aging easily, modification, therefore this technology can't ripely be used, so need the novel large-power LED light source of this integrated form vacuum heat-conduction ceramic package independence luminous intensity distribution especially.
Summary of the invention
The purpose of this utility model is the deficiency at existing high-power LED light source package cooling technology, a kind of novel large-power LED light source of integrated form vacuum heat-conduction ceramic package independence luminous intensity distribution is provided, to prolong the life-span of led light source, improve the illumination light efficiency, reduce maintenance cost.
For achieving the above object, the utility model provides a kind of high-power LED illuminating light source, comprise led chip group, square ceramic insulation seat, vacuum heat-conduction matrix and type free toroidal lens, wherein the led chip group is installed in square ceramic insulation seat the inside, and on the vacuum heat-conduction matrix that is fixed on, the type free toroidal lens is installed on the led chip group.
Described led chip group is composed in series by led chip, and one in parallel of every led chip is very received diode.
Above-mentioned integrated form high-power LED light source, wherein said square ceramic insulation seat is welded on the vacuum heat-conduction matrix.Described square ceramic insulation seat, the centre is a ceramic layer, and the upper strata is copper electrode layer, and lower floor is copper layer.
Above-mentioned integrated form high-power LED light source is formed the capillary that the cooling matchmaker is flowed by copper is husky in the middle of the wherein said vacuum heat-conduction matrix, and is filled with refrigerant, and is evacuated.Described vacuum heat-conduction matrix has plume vacuum heat-conduction matrix, heat-tube vacuum heat conduction substrate and three kinds of forms of heat-conducting plate.
Above-mentioned integrated form high-power LED light source, wherein said led chip group are mixed with the transparent adhesive tape water layer sealing of fluorescent material.
Major technique effect of the present utility model:
1, adopts the series connection high-power LED chip to form the LED group, reach real constant current.
2, adopt vacuum heat-conduction matrix heat dissipation technology, can improve radiating rate greatly, improve the LED light efficiency, life-saving.
3, adopt square ceramic insulation seat, the shortcoming of can avoid the distortion of conventional plastic frame, becoming flexible, separate, the sealing effectiveness height extends working time.
4, adopt every led chip, very receive pipe for one in parallel, can puncture conducting when single LEDs chip damages, can not influence the work of whole LED group, life-saving.
Below in conjunction with the drawings and specific embodiments technical solutions of the utility model are elaborated.
Description of drawings
Fig. 1: be led chip group electric diagram;
Fig. 2: be the led light source structure principle chart;
Fig. 3: be vacuum heat-conduction matrix plume type;
Fig. 4: be vacuum heat-conduction matrix heat pipe type;
Fig. 5: be vacuum heat-conduction matrix heat conduction template.
Among the figure 1, led chip 2, square ceramic insulation seat 3, vacuum heat-conduction matrix 4, type free curved surface optical lens 5, very receive diode 6, transparent adhesive tape water layer 7, ceramic layer 8, electrode layer 9, copper layer 10, plume vacuum heat-conduction matrix 11, heat-tube vacuum heat conduction substrate 12, heat-conducting plate
The specific embodiment
Fig. 1 gets up the led chip series connection, and one in parallel of every LED very receives pipe (5) and forms the LED group, after a led chip damage, can not influence the work that LED organizes by very receiving the pipe conducting like this.Square ceramic insulation seat (2) electrode layer and led chip group are joined
Fig. 2 comprises the square ceramic insulation seat of led chip (1) (2) and vacuum heat-conduction matrix (3) and type free toroidal lens (4).The led chip series connection is got up, one in parallel of every LED very receives pipe (5) and forms the LED group, and square ceramic insulation seat (2) centre is ceramic layer (7), and the upper strata is electrode layer (8), join with the led chip group, lower floor is that copper layer (9) is welded on the vacuum heat-conduction body (3).The led chip group is fixed on the vacuum heat-conduction body that is positioned at square ceramic insulation seat.And the transparent adhesive tape water layer (6) that is mixed with fluorescent material seals.Type free curved surface optical lens (4) is installed in its top.
The vacuum heat-conduction matrix has plume, heat pipe and three kinds of forms of heat-conducting plate, and is shown in Figure 5 as Fig. 3 Fig. 4.
The vacuum heat-conduction matrix is made by metals such as copper, the capillary that the inner cooling coal of being made up of the husky sintering of copper flows, and be filled with refrigerant such as distilled water therein, and be evacuated by liquefaction vaporization circulation side, derive rapidly.The heat that the LED group of high density cluster produces, the temperature that reduces light source extends working time, and reduces the aging and xanthochromia of fluorescent material fluid sealant.The vacuum heat-conduction matrix is divided into plume, heat pipe and heat-conducting plate form, links to each other with external heat sink, can derive heat rapidly.Square ceramic insulation seat is that pottery is made, and has effectively avoided the temperature distortion of traditional square plastic insulation seat, causes loosening, the appearance of segregation phenomenon, guarantee the effect of light source water proof and dust proof high-seal, improve service life, the utility model compared with prior art has obvious advantage and beneficial effect.
The above, it only is preferable enforcement example of the present utility model, be not that utility model is done any pro forma restriction, any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified to the equivalent embodiment of equivalent variations, but every utility model technical scheme content that do not break away from,, all still belong in the scope of utility model technical scheme any simple modification, equivalent variations and modification that above embodiment did according to technical spirit of the present utility model.
Claims (7)
1. integrated form high-power LED light source, comprise led chip group, square ceramic insulation seat (2), vacuum heat-conduction matrix (3) and type free toroidal lens (4), it is characterized in that: the led chip group is installed in square ceramic insulation seat (2) the inside, and on the vacuum heat-conduction matrix (3) that is fixed on, type free toroidal lens (4) is installed on the led chip group.
2. integrated form high-power LED light source according to claim 1 is characterized in that described led chip group is composed in series by led chip (1), and one in parallel of every led chip (1) is very received diode (5).
3. integrated form high-power LED light source according to claim 1 and 2 is characterized in that described square ceramic insulation seat (2) is welded on the vacuum heat-conduction matrix (3).
4. integrated form high-power LED light source according to claim 3 is characterized in that described square ceramic insulation seat (2), and the centre is ceramic layer (7), and the upper strata is copper electrode layer (8), and lower floor is copper layer (9).
5. integrated form high-power LED light source according to claim 1 and 2 is characterized in that forming the capillary that the cooling matchmaker is flowed by copper is husky in the middle of the described vacuum heat-conduction matrix (3), and is filled with refrigerant, and is evacuated.
6. integrated form high-power LED light source according to claim 5 is characterized in that described vacuum heat-conduction matrix (3), and plume vacuum heat-conduction matrix (10), heat-tube vacuum heat conduction substrate (11) and (12) three kinds of forms of heat-conducting plate are arranged.
7. integrated form high-power LED light source according to claim 1 and 2 is characterized in that described led chip group is mixed with transparent adhesive tape water layer (6) sealing of fluorescent material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010201541859U CN201661945U (en) | 2010-04-09 | 2010-04-09 | Integrated high-power LED light source |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201541859U CN201661945U (en) | 2010-04-09 | 2010-04-09 | Integrated high-power LED light source |
Publications (1)
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CN201661945U true CN201661945U (en) | 2010-12-01 |
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CN2010201541859U Expired - Fee Related CN201661945U (en) | 2010-04-09 | 2010-04-09 | Integrated high-power LED light source |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105870309A (en) * | 2015-02-06 | 2016-08-17 | Lg伊诺特有限公司 | Light-emitting device package and lighting apparatus including the package |
-
2010
- 2010-04-09 CN CN2010201541859U patent/CN201661945U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105870309A (en) * | 2015-02-06 | 2016-08-17 | Lg伊诺特有限公司 | Light-emitting device package and lighting apparatus including the package |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
DD01 | Delivery of document by public notice |
Addressee: Lu Beiqin Document name: Notification to Pay the Fees |
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C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101201 Termination date: 20130409 |