CN201621899U - Semiconductor multi-temperature box - Google Patents

Semiconductor multi-temperature box Download PDF

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Publication number
CN201621899U
CN201621899U CN201020149876XU CN201020149876U CN201621899U CN 201621899 U CN201621899 U CN 201621899U CN 201020149876X U CN201020149876X U CN 201020149876XU CN 201020149876 U CN201020149876 U CN 201020149876U CN 201621899 U CN201621899 U CN 201621899U
Authority
CN
China
Prior art keywords
chamber
peripheral
cooling chamber
locular wall
heating clamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201020149876XU
Other languages
Chinese (zh)
Inventor
陈建卫
钱俊有
张文涛
陈磊
赵丽萍
张甜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henan Hongchang Electronics Co Ltd
Original Assignee
Henan Hongchang Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henan Hongchang Electronics Co Ltd filed Critical Henan Hongchang Electronics Co Ltd
Priority to CN201020149876XU priority Critical patent/CN201621899U/en
Application granted granted Critical
Publication of CN201621899U publication Critical patent/CN201621899U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a multi-temperature box, in particular to a semiconductor multi-temperature box which comprises a cooling chamber, a heating chamber and a semiconductor device, wherein the cooling chamber and the heating chamber are respectively formed chamber walls, a common chamber wall is arranged between the cooling chamber and the heating chamber, the other chamber walls are peripheral chamber walls, that is, the peripheral chamber wall is arranged on the periphery of the cooling chamber, the peripheral chamber wall is arranged on the periphery of the heating chamber, the semiconductor device which is connected with a direct current power supply is arranged in the middle of the common chamber wall, and the semiconductor multi-temperature box is characterized in that other semiconductor devices connected with the direct current power supply are further arranged in the peripheral chamber walls, or another semiconductor device is positioned in the peripheral chamber wall of the cooling chamber, or another semiconductor device is positioned in the peripheral chamber wall of the heating chamber. Therefore, the semiconductor multi-temperature box can not only simultaneously reduce the temperature of the cooling chamber and increase the temperature of the heating chamber, but also have the advantage of leading the two chambers to change the temperature independently.

Description

A kind of multichip semiconductor incubator
Technical field
The utility model relates to many incubators, relates to a kind of casing that can have refrigerating box and incubator simultaneously, relates to a kind of multichip semiconductor incubator.
Background technology
Related multichip semiconductor incubator has cooling chamber and heating clamber at present, double wall at cooling chamber and heating clamber has semiconductor devices, semiconductor will make one side temperature raise by DC current, promptly cause heating clamber to heat up, one side temperature reduces, promptly cause the cooling chamber cooling, many incubators so only have one group of semiconductor devices, this just has the shortcoming that cooling chamber is lowered the temperature and heating clamber heats up and carries out simultaneously, can not solve in the actual life, after a temperature reached, another did not need the contradiction that changes.
Summary of the invention
The purpose of this utility model is to provide a kind of both can make cooling chamber cooling and heating clamber intensification carry out simultaneously, can make two Room change the multichip semiconductor incubator of temperature separately again.
The technical solution of the utility model is achieved in that the multichip semiconductor incubator, comprise cooling chamber, heating clamber and semiconductor devices, cooling chamber and heating clamber are made of locular wall, in the middle of cooling chamber and the heating clamber is common locular wall, remaining is peripheral locular wall, be the cooling chamber periphery be the peripheral locular wall of cooling chamber, the heating clamber periphery be the peripheral locular wall of heating clamber, have the semiconductor devices that connects dc source in the middle of the common locular wall, it is characterized in that: also have the other semiconductor devices that connects dc source in the described peripheral locular wall.
Say that further described other semiconductor devices is positioned at the peripheral locular wall of cooling chamber.
Say that further described other semiconductor devices is positioned at the peripheral locular wall of heating clamber.
The beneficial effects of the utility model are: such multichip semiconductor incubator has both can make cooling chamber cooling and heating clamber intensification carry out simultaneously, can make two Room change the advantage of temperature separately again.
Description of drawings
Fig. 1 is the structural representation of the utility model multichip semiconductor incubator
Wherein, 1, cooling chamber 2, heating clamber 3, semiconductor devices 4, locular wall 5, common locular wall 6, peripheral locular wall 61, the peripheral locular wall 62 of cooling chamber, the peripheral locular wall 7 of heating clamber, other semiconductor devices
The specific embodiment
The utility model will be further described below in conjunction with accompanying drawing.
Multichip semiconductor incubator as shown in Figure 1, comprise cooling chamber 1, heating clamber 2 and semiconductor devices 3, cooling chamber 1 and heating clamber 2 are made of locular wall 4, in the middle of cooling chamber 1 and the heating clamber 2 is common locular wall 5, remaining is peripheral locular wall 6, be cooling chamber 1 periphery be the peripheral locular wall 61 of cooling chamber, heating clamber 2 peripheries be the peripheral locular wall 62 of heating clamber, have the semiconductor devices 3 that connects dc source in the middle of the common locular wall 4, it is characterized in that: also have the other semiconductor devices 7 that connects dc source in the described peripheral locular wall 6.
Say that further described other semiconductor devices 7 is positioned at the peripheral locular wall 61 of cooling chamber.
Say that further described other semiconductor devices 7 is positioned at the peripheral locular wall 62 of heating clamber.
After a chamber reaches temperature, can use the other semiconductor devices in the peripheral locular wall that cooling chamber or heating clamber are changed temperature, and another is temperature-resistant, easy to use.

Claims (3)

1. multichip semiconductor incubator, comprise cooling chamber, heating clamber and semiconductor devices, cooling chamber and heating clamber are made of locular wall, in the middle of cooling chamber and the heating clamber is common locular wall, remaining is peripheral locular wall, and promptly the cooling chamber periphery is the peripheral locular wall of cooling chamber, the heating clamber periphery be the peripheral locular wall of heating clamber, have the semiconductor devices that connects dc source in the middle of the common locular wall, it is characterized in that: also have the other semiconductor devices that connects dc source in the described peripheral locular wall.
2. multichip semiconductor incubator according to claim 1 is characterized in that: described other semiconductor devices is positioned at the peripheral locular wall of cooling chamber.
3. multichip semiconductor incubator according to claim 1 is characterized in that: described other semiconductor devices is positioned at the peripheral locular wall of heating clamber.
CN201020149876XU 2010-04-06 2010-04-06 Semiconductor multi-temperature box Expired - Fee Related CN201621899U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201020149876XU CN201621899U (en) 2010-04-06 2010-04-06 Semiconductor multi-temperature box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201020149876XU CN201621899U (en) 2010-04-06 2010-04-06 Semiconductor multi-temperature box

Publications (1)

Publication Number Publication Date
CN201621899U true CN201621899U (en) 2010-11-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201020149876XU Expired - Fee Related CN201621899U (en) 2010-04-06 2010-04-06 Semiconductor multi-temperature box

Country Status (1)

Country Link
CN (1) CN201621899U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105444522A (en) * 2016-01-23 2016-03-30 河南鸿昌电子有限公司 Split-box-body surrounding type cold and warm storage box
CN106829200A (en) * 2017-01-10 2017-06-13 北京师范大学珠海分校 A kind of cold and hot chain transport double-purpose case
CN108963130A (en) * 2018-07-09 2018-12-07 韩智强 A kind of new-energy automobile battery warmer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105444522A (en) * 2016-01-23 2016-03-30 河南鸿昌电子有限公司 Split-box-body surrounding type cold and warm storage box
CN106829200A (en) * 2017-01-10 2017-06-13 北京师范大学珠海分校 A kind of cold and hot chain transport double-purpose case
CN108963130A (en) * 2018-07-09 2018-12-07 韩智强 A kind of new-energy automobile battery warmer

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101103

Termination date: 20110406