CN201592858U - A composite board for electrical packaging - Google Patents
A composite board for electrical packaging Download PDFInfo
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- CN201592858U CN201592858U CN2009203123879U CN200920312387U CN201592858U CN 201592858 U CN201592858 U CN 201592858U CN 2009203123879 U CN2009203123879 U CN 2009203123879U CN 200920312387 U CN200920312387 U CN 200920312387U CN 201592858 U CN201592858 U CN 201592858U
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Abstract
本实用新型公开了一种用于电器包装的复合板,由EPE材料制成,垫于外包装箱与电器之间,它包括:一普通密度层,它包括一层或多层单层,各层之间采用热复合或超声波焊接或胶接连接在一起;至少一高密度层,它包括一层或多层单层,各层之间采用热复合或超声波焊接或胶接连接在一起;所述的高密度层位于普通密度层的一面或双面,两者之间采用热复合或超声波焊接或胶接连接在一起;所述的普通密度层,其密度为0.025g/cm3~0.035g/cm3;所述的高密度层,其密度为0.08g/cm3~0.12g/cm3。普通密度EPE层起缓冲作用,高密度EPE层起加强支撑强度及保护作用,该设计体积小,且轻。
The utility model discloses a composite board used for electrical appliance packaging, which is made of EPE material and placed between the outer packing box and the electrical appliances. It includes: a common density layer, which includes one or more single layers, each The layers are connected together by thermal lamination or ultrasonic welding or adhesive bonding; at least one high-density layer, which includes one or more single layers, is bonded together by thermal lamination or ultrasonic welding or adhesive bonding; The above-mentioned high-density layer is located on one side or both sides of the ordinary density layer, and the two are connected together by thermal lamination, ultrasonic welding or adhesive bonding; the density of the above-mentioned ordinary density layer is 0.025g/cm 3 ~0.035g /cm 3 ; the high-density layer has a density of 0.08g/cm 3 to 0.12g/cm 3 . The ordinary density EPE layer acts as a buffer, and the high-density EPE layer acts as a strengthening support and protection. This design is small in size and light.
Description
技术领域technical field
本实用新型涉及包装技术领域,特别是涉及一种用于电器包装的复合板。The utility model relates to the technical field of packaging, in particular to a composite board used for electrical packaging.
背景技术Background technique
为减少电器在流通过程中的损害,如在运输过程的振动,撞击,在商城和仓库里堆垛,抛掷等动作过程中的冲击,都会作用于电器,因而,电器在以上过程中都需用缓冲垫包装和保护。现有的缓冲垫大多采用EPS(Expanded polystyrene)制作,然而,EPS却具有很具有很多弊端:一是生产时需要燃烧大量的煤或石油等;二是EPS的原料苯乙烯有毒,而且聚苯乙烯的化学稳定性比较差,受热时有可能产生有毒物质;三是EPS在环境中不分解,可保持几百万年;四是EPS的耐热度只有75~95℃,高于此温度会产生致癌物质苯乙烯。In order to reduce the damage of electrical appliances in the process of circulation, such as vibration and impact during transportation, stacking in shopping malls and warehouses, and impact during throwing, etc., will act on electrical appliances. Therefore, electrical appliances need to be used in the above process. Cushioned packaging and protection. Most of the existing cushioning pads are made of EPS (Expanded polystyrene). However, EPS has many disadvantages: first, it needs to burn a large amount of coal or oil during production; second, the raw material styrene of EPS is poisonous, and polystyrene The chemical stability of EPS is relatively poor, and toxic substances may be produced when heated; the third is that EPS does not decompose in the environment and can be kept for millions of years; The carcinogen styrene.
实用新型内容Utility model content
本实用新型的目的在于克服现有技术之不足,提供一种用于电器包装的复合板,其采用节能环保的EPE(Expanded Polyethylene,聚乙烯泡沫塑料)材料制作。The purpose of the utility model is to overcome the deficiencies of the prior art and provide a composite board for electrical packaging, which is made of energy-saving and environment-friendly EPE (Expanded Polyethylene, polyethylene foam).
本实用新型提供的技术方案如下:The technical scheme provided by the utility model is as follows:
一种用于电器包装的复合板,由EPE材料制成,垫于外包装箱与电器之间,包括:A composite board for electrical packaging, made of EPE material, placed between the outer packaging box and electrical appliances, including:
一普通密度层,包括一层或多层单层,各层之间采用热复合或超声波焊接或胶接连接在一起;A common density layer, including one or more single layers, and the layers are connected together by thermal lamination or ultrasonic welding or adhesive bonding;
至少一高密度层,包括一层或多层单层,各层之间采用热复合或超声波焊接或胶接连接在一起;At least one high-density layer, including one or more single layers, the layers are connected together by thermal lamination or ultrasonic welding or adhesive bonding;
所述的高密度层位于普通密度层的一面或双面,两者之间采用热复合或超声波焊接或胶接连接在一起;The high-density layer is located on one side or both sides of the ordinary density layer, and the two are connected together by thermal lamination or ultrasonic welding or glue bonding;
所述的普通密度层,其密度为0.025g/cm3~0.035g/cm3;The ordinary density layer has a density of 0.025g/cm 3 to 0.035g/cm 3 ;
所述的高密度层,其密度为0.08g/cm3~0.12g/cm3。The high-density layer has a density of 0.08g/cm 3 to 0.12g/cm 3 .
前述的普通密度层厚度为30mm~50mm。The aforementioned ordinary density layer has a thickness of 30 mm to 50 mm.
前述的高密度层厚度为3mm~15mm。The aforementioned high-density layer has a thickness of 3 mm to 15 mm.
前述的普通密度层,为多层单层组成,各单层的密度相同或不同。The aforementioned ordinary density layer is composed of multiple single layers, and the density of each single layer is the same or different.
前述的高密度EPE层,为多层单层组成,各单层的密度相同或不同。The aforementioned high-density EPE layer is composed of multiple monolayers, and the density of each monolayer is the same or different.
所述的复合板为衬垫于电器的顶部和外包装箱顶部内壁的上复合板;上复合板包括左上复合板和右上复合板,左上复合板和右上复合板为轴对称结构;左、右上复合板分别由两个上下连接的单体组成,每个单体一面间隔设有凹槽,与凹槽相反的另一面为一平面,位于顶部的单体其设有凹槽的面向下,位于底部的单体其设有凹槽的面向内。The composite board is an upper composite board that is lined on the top of the electrical appliance and the inner wall of the top of the outer packing box; the upper composite board includes a left upper composite board and a right upper composite board, and the left upper composite board and the right upper composite board are axisymmetric structures; the left and right upper The composite board is composed of two upper and lower connected monomers. Each monomer is provided with grooves at intervals, and the other side opposite to the groove is a plane. The bottom unit has its grooved side facing inward.
所述的复合板为衬垫于电器的侧面和外包装箱侧面内壁的侧复合板;侧复合板包括左侧复合板和右侧复合板,左侧复合板和右侧复合板为轴对称结构;左、右侧复合板分别由两个上下连接的单体组成,每个单体一面间隔设有凹槽,与凹槽相反的另一面为一平面,设有凹槽的面向内。The composite board is a side composite board that is lined on the side of the electrical appliance and the inner wall of the side of the outer box; the side composite board includes a left composite board and a right composite board, and the left composite board and the right composite board are axisymmetric structures The left and right composite boards are respectively composed of two monomers connected up and down, each monomer is provided with grooves at intervals on one side, and the other side opposite to the grooves is a plane, and the grooved side faces inward.
所述的复合板为衬垫于电器的底面和外包装箱底面内壁的底复合板;底复合板包括多个间隔设置的单体,每个单体一面间隔设有凹槽,与凹槽相反的另一面为一平面,设有凹槽的面向上。The composite board is a bottom composite board that is lined on the bottom surface of the electrical appliance and the inner wall of the bottom surface of the outer packaging box; the bottom composite board includes a plurality of monomers arranged at intervals, and grooves are arranged on one side of each monomer at intervals, opposite to the grooves. The other side is a plane, and the grooved side faces upward.
所述的底部单体,其位于左右两侧的两个分别与左侧复合板和右侧复合板下端部靠接在一起。As for the bottom unit, the two on the left and right sides are respectively abutted against the lower ends of the left composite board and the right composite board.
由上述描述可知,本实用新型采用EPE制作,所使用的原料无毒,可反复回收利用,不污染环境,即使燃烧,产生的CO2也较少;生产该结构不产生工业废弃物;该设计体积小,且轻,同一货柜运输量远超EPS的运输量,降低交通压力。本实用新型结构中,普通密度EPE层起缓冲作用,高密度EPE层起加强支撑强度及保护作用。单体的间隔凹槽结构,起良好的缓冲作用。It can be seen from the above description that the utility model is made of EPE, the raw materials used are non-toxic, can be recycled repeatedly, does not pollute the environment, even if it is burned, the CO produced is less; the production of this structure does not produce industrial waste; the design Small in size and light in weight, the transportation volume of the same container far exceeds that of EPS, reducing traffic pressure. In the structure of the utility model, the ordinary-density EPE layer plays a buffering role, and the high-density EPE layer plays a role of strengthening support strength and protection. The single groove groove structure plays a good buffer role.
附图说明Description of drawings
图1为本实用新型复合板的一个实施例;Fig. 1 is an embodiment of the utility model composite panel;
图2为本实用新型复合板的另一个实施例;Fig. 2 is another embodiment of the composite panel of the present invention;
图3为本实用新型用于电器包装的一个实施例;Fig. 3 is an embodiment that the utility model is used for electrical appliance packaging;
图4为图3中A处的局部放大图。FIG. 4 is a partial enlarged view of A in FIG. 3 .
具体实施方式Detailed ways
实施例1Example 1
本实用新型的具体实施例,参照图1。图1中,1为普通密度层,密度为0.025g/cm3~0.035g/cm3,厚度为30mm~50mm;2为高密度层,其密度为0.08cm3~0.12g/cm3,厚度为3mm~15mm。普通密度层1与高密度层2之间采用热复合粘合。The specific embodiment of the utility model, with reference to Fig. 1. In Figure 1, 1 is an ordinary density layer with a density of 0.025g/cm 3 to 0.035g/cm 3 and a thickness of 30mm to 50mm; 2 is a high density layer with a density of 0.08cm 3 to 0.12g/cm 3 and a thickness of 3mm to 15mm. The
在本实施例中,普通密度层1为单层结构,显然,普通密度层1也可以是多层单层结构,各层之间采用热复合连接在一起,并且各层的密度可以是相同的或是不同的;In this embodiment, the
普通密度EPE层1的上表面有一高密度层2(见图1),在本实施例中,高密度层2为单层结构,显然,高密度层2也可以是多层单层结构,各层之间采用热复合连接在一起,并且各层的密度可以是相同的或是不同的。The upper surface of common
在本实施例中,各EPE层之间采用热复合方式连接,显然,采用胶接或超声波焊接或其它适合于塑料之间的连接方式也可用于本实用新型。In this embodiment, the EPE layers are connected by thermal compounding. Obviously, glue bonding or ultrasonic welding or other suitable connection methods between plastics can also be used in the present invention.
实施例2Example 2
见图2,本实施例与实施例1类型,所不同的是,普通密度层1的上、下表面各有一高密度层2,与实施例1一样,高密度层2可以是单层或多层单层结构,各层之间采用胶接连接在一起,并且各层的密度可以是相同的或是不同的。See Fig. 2, present embodiment and
实施例3Example 3
本实用新型用于电器包装的具体实施例,见图3及图4。本实用新型复合板,包括上复合板,侧复合板及下复合板。各复合板衬垫于电器与外包装箱10(图中仅显示侧面及底部,顶部未显示)之间。The utility model is used for the concrete embodiment of electric appliance packaging, see Fig. 3 and Fig. 4. The composite board of the utility model comprises an upper composite board, a side composite board and a lower composite board. Each composite board is lined between the electrical appliance and the outer packing box 10 (only the side and the bottom are shown in the figure, and the top is not shown).
上复合板衬垫于电器(图中未显示)的顶部和外包装箱顶部内壁;上复合板包括左上复合板22和右上复合板21,左上复合板22和右上复合板21为轴对称结构;左、右上复合板分别由两个上下连接的单体组成,以左上复合板22为例,其由上下重叠的单体221和222组成,单体221和222左侧对齐。每个单体一面间隔设有多个凹槽,与凹槽相反的另一面为一平面,其中单体221设有凹槽的面向下,单体222设有凹槽的面向内。The upper composite board is lined on the top of the electrical appliance (not shown in the figure) and the top inner wall of the outer packing box; the upper composite board includes a left
侧复合板衬垫于电器的侧面和外包装箱侧面内壁之间;侧复合板包括左侧复合板31和右侧复合板32,左侧复合板31和右侧复合板32为轴对称结构;左、右侧复合板分别由两个上下连接的单体组成,以左侧复合板为例,其由上下重叠单体311和312组成,单体311和312左侧对齐,每个单体一面间隔设有多个凹槽,与凹槽相反的另一面为一平面,设有凹槽的面向内。The side composite board is lined between the side of the electrical appliance and the inner wall of the side of the outer box; the side composite board includes a
底复合板衬垫于电器的底面和外包装箱10底面内壁之间;底复合板包括多个间隔设置的单体41,42,43,44,45,每个单体一面间隔设有多个凹槽,与凹槽相反的另一面为一平面,设有凹槽的面向上。其中,位于左右两侧的两个单体45和41分别与左侧复合板31和右侧复合板32下端部靠接在一起。The bottom composite board is lined between the bottom surface of the electrical appliance and the inner wall of the bottom surface of the
本实施例中的包装结构,耐破强度为18Kgf/cm2,抗压强度为1000kgf/cm2,抗击穿强度为80Kgf/cm2。The packaging structure in this embodiment has a bursting strength of 18Kgf/cm 2 , a compressive strength of 1000kgf/cm 2 , and a breakdown strength of 80Kgf/cm 2 .
上述仅为本实用新型的一个具体实施例,但本实用新型的设计构思并不局限于此,凡利用此构思对本实用新型进行非实质性的改动,均应属于侵犯本实用新型保护范围的行为。The above is only a specific embodiment of the present utility model, but the design concept of the present utility model is not limited thereto, and any insubstantial modification of the utility model by using this concept shall be an act of violating the protection scope of the present utility model .
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| CN2009203123879U CN201592858U (en) | 2009-10-13 | 2009-10-13 | A composite board for electrical packaging |
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| CN2009203123879U CN201592858U (en) | 2009-10-13 | 2009-10-13 | A composite board for electrical packaging |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103803176A (en) * | 2012-11-13 | 2014-05-21 | 纬创资通股份有限公司 | Method and packaging material for strengthening packaging material |
| CN105416853A (en) * | 2015-12-16 | 2016-03-23 | 珠海格力电器股份有限公司 | Buffering packaging structure |
| CN106581953A (en) * | 2016-12-30 | 2017-04-26 | 平湖市圣柔得塑业有限公司 | Antistatic yoga rod |
| CN106621222A (en) * | 2016-12-30 | 2017-05-10 | 平湖市圣柔得塑业有限公司 | Self-heating yoga rod |
| CN110815972A (en) * | 2019-11-26 | 2020-02-21 | 徐州金桥电气有限公司 | Special composite board structure for electric appliance |
-
2009
- 2009-10-13 CN CN2009203123879U patent/CN201592858U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103803176A (en) * | 2012-11-13 | 2014-05-21 | 纬创资通股份有限公司 | Method and packaging material for strengthening packaging material |
| CN105416853A (en) * | 2015-12-16 | 2016-03-23 | 珠海格力电器股份有限公司 | Buffering packaging structure |
| CN106581953A (en) * | 2016-12-30 | 2017-04-26 | 平湖市圣柔得塑业有限公司 | Antistatic yoga rod |
| CN106621222A (en) * | 2016-12-30 | 2017-05-10 | 平湖市圣柔得塑业有限公司 | Self-heating yoga rod |
| CN110815972A (en) * | 2019-11-26 | 2020-02-21 | 徐州金桥电气有限公司 | Special composite board structure for electric appliance |
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