CN201540906U - LED conduction heat dissipation packaging structure - Google Patents

Abstract

The utility model discloses an LED heat conducting and radiating encapsulation structure which comprises a main bracket, an auxiliary bracket and a supporting plate, wherein the plane part of the upper end of the main bracket is provided with a concave cup which is internally provided with an LED wafer; and the side of the main bracket is provided with at least one heat conducting and radiating sheet. The LED heat conducting and radiating encapsulation structure is simple, has good radiating effect as the main bracket adopts the heat conducting and radiating sheet with larger heat conducting and radiating area, effectively solves the heat conducting and radiating problem when a high-current high-power LED works and generates heat, reduces the optical attenuation and prolongs the service life.

Description

LED conduction heat dissipation packaging structure

technical field

The utility model relates to an LED package structure, in particular to an LED conduction and heat dissipation package structure.

Background technique

LED is a kind of light-emitting device that can directly convert electrical energy into visible light and radiant energy. It has low working voltage, low power consumption, high luminous efficiency, extremely short luminous response time, pure light color, firm structure, impact resistance and vibration resistance. , stable and reliable performance, light weight, small size and low cost, etc., have developed by leaps and bounds, and are now able to mass-produce high-brightness, high-performance products of various colors in the entire visible spectrum. In order to further expand the application occasions of LEDs, many manufacturers have begun to study high-current and high-power LEDs and LEDs that package multiple LED chips in one LED unit. However, the above-mentioned high-current and high-power LED heat dissipation problems and technical problems such as the packaging diversity of multi-chip LEDs, the diversity of electrical connections, and the convenience of electrical connection inspections, as well as how to use existing traditional automated production equipment to mass-produce LEDs, are problems. The current LED bracket structure is difficult to effectively solve. For this reason Chinese patent ZL200720058098.1 discloses a kind of multifunctional support, and it has a main support, the secondary support that is positioned at the main support both sides and is used for connecting the supporting plate of supporting main support and secondary support, and main support and secondary support are There are pins, which solve the technical problems of multi-chip LED packaging diversity, electrical connection diversity, and the convenience of electrical connection detection. At the same time, it has better heat dissipation than the existing general LED bracket, but it still cannot meet the requirements of high current and high power. LED thermal requirements.

Contents of the invention

The purpose of this utility model is to provide an LED conduction and heat dissipation packaging structure for the shortcomings of the above problems, which can more effectively solve the problem of conduction and heat dissipation of heat generated by high-current and high-power LEDs, reduce light decay and prolong service life.

The package structure of LED conduction and heat dissipation includes a main support, an auxiliary support and a support plate. A concave cup is provided on the upper plane of the main support, and an LED chip is housed in the concave cup. At least one heat conduction and heat dissipation piece.

Further, in order to increase the effect of conduction and heat dissipation, a heat conduction fin is respectively provided on the front and rear sides of the above-mentioned main bracket.

More preferably, a thermally conductive phosphor adhesive layer is provided around the above-mentioned LED chip to enclose it in the concave cup.

The upper ends of the main support and the auxiliary support are encapsulated with a colorless and transparent resin.

The utility model has a simple structure, and its main bracket adopts heat conduction fins with a large conduction and heat dissipation area for heat dissipation, which has a good heat dissipation effect, effectively solves the conduction and heat dissipation problem of heat generated by high-current and high-power LEDs, reduces light decay and prolongs service life.

Description of drawings

Fig. 1 is a sectional view of the utility model packaging structure;

Figure 2 is an exploded view of the utility model.

In the picture:

1-main support; 2-secondary support; 3-supporting plate;

4-LED chip; 5-wire; 6-phosphor glue layer;

7-High temperature curing epoxy resin; 11-Plane part of the main bracket; 12-Heat sink of the main bracket;

13-main bracket mounting feet; 21-sub-bracket flat part; 22-sub-bracket pins;

23-Auxiliary bracket mounting feet; 31-Avoid perforation; 32-Pin vias;

33-mounting hole; 34-via hole

Below by accompanying drawing and specific embodiment the utility model is further described:

Detailed ways

As shown in FIGS. 1 and 2 , the LED conduction and heat dissipation packaging structure described in the present invention includes a main support 1 , a secondary support 2 and a support plate 3 .

Specifically: the upper end of the above-mentioned main bracket 1 is a plane part 11, the side of the plane part 11 is provided with a straight-inserted mounting foot 13, and a recessed cup 111 is provided in the middle of the plane part 11, and the cross section of the recessed cup 11 is an upper bottom edge It is larger than the trapezoid of the lower base and LED chip 4 is housed in its cup. The auxiliary bracket 2 is composed of a plane portion 21 , two pins 22 extending downward from the plane portion 21 , and mounting feet 23 inserted directly.

In order to increase the effect of conduction and heat dissipation, at least one heat conduction fin 12 is provided on the side of the above-mentioned main support 1 , preferably, one heat conduction fin 12 is respectively provided on the front and rear sides of the above-mentioned main support 1 . The above-mentioned LED chip 4 is provided with a heat-conducting and heat-dissipating phosphor glue layer 6 encapsulating it in the concave cup. The upper ends of the main bracket and the sub bracket are encapsulated with a colorless and transparent resin 7 .

Further, the heat sink 12 of the above-mentioned main bracket and the pin 22 of the auxiliary bracket are arranged in a split double in-line structure, which enables the packaged LED to be assembled using the dual in-line package DIP (Dual In-line Package) packaging technology lamps. The plane part 11 of the main support and the plane 21 of the auxiliary support are located on the same horizontal plane. The above-mentioned support plate 3 is a PCB printed circuit board. The support plate 3 is provided with via holes 34 corresponding to the heat sink 12 of the main bracket and pin via holes 32 corresponding to the pins 22 of the sub bracket. It is also provided with the mounting feet 13 of the main bracket and the mounting feet 23 of the sub bracket. Corresponding to the mounting hole 33 , the support plate 3 is also provided with an escape perforation 31 corresponding to the concave cup 111 of the main bracket. The mounting feet 13 of the main bracket and the mounting feet 23 of the auxiliary bracket can pass through the mounting holes 33 and be bent and pressed against the bottom surface of the supporting plate 3 . In addition to supporting the main bracket 1 and the auxiliary bracket 2, the supporting plate 3 can also be selectively used for electrical connection of the LED chip 4; the supporting plate 3 is combined with the main bracket 1 and the auxiliary bracket 2 through machining, The pins of the multifunctional LED bracket are strengthened after being packaged.

When the utility model is used for high-current and high-power LED packaging, the main support 1 and the auxiliary support 2 are inserted on the support plate 3 first, and then formed by machining, and then the LED chip 4 with high current and high power is fixed on the plane of the main support. In the recessed cup 111 of the part, the LED chip 4 leads two wires 5, and then the LED crystal is encapsulated with a conductive heat-dissipating phosphor adhesive layer 6, and the high-temperature curing epoxy resin 7 is used on the plane part of the main support 1 and the sub-support 2. encapsulation. In this way, the contact surface between the plane part 11 of the main bracket 1, the heat conduction fin 12 and the concave cup 111 and the outside world can quickly dissipate the heat generated by the LED chip 4 during work, avoid accumulation, and control the working temperature of the LED below 65°C. Furthermore, the service life of the fluorescent powder reaches more than 40,000 hours, which effectively solves the problem of heat conduction and heat dissipation of high-current and high-power LEDs and the service life of the phosphor powder. The main bracket can carry one or more LED crystals or LED crystals with high current and high power, which effectively solves the problem of LED multi-style packaging; through the stamping parts and the printed circuit on the supporting board, the heat conduction fins on both sides of the main bracket can be effectively Selective electrical connection effectively solves the problem of diverse electrical connection of LEDs. Because the LED conduction and heat dissipation packaging structure has a DIP packaging structure, it can be mass-produced on existing traditional automatic production equipment, effectively solving the problem of LED automatic production.

Claims (4)

1.LED lead heat-dissipation packaging structure, comprise a main support, assistant support and supporting plate, described main support upper end planar portions is provided with a recess cup, and the LED wafer is housed in this recess cup, and it is characterized in that: described main support side is provided with at least one fin of leading.

2. LED according to claim 1 leads heat-dissipation packaging structure, it is characterized in that: dual-side is respectively equipped with one and leads fin before and after the described main support.

3. LED according to claim 1 leads heat-dissipation packaging structure, it is characterized in that: be provided with around the described LED wafer it is encapsulated in the heat radiation led fluorescent material glue-line in the recess cup.

4. LED according to claim 1 leads heat-dissipation packaging structure, it is characterized in that: described main support and assistant support upper end are encapsulated with colourless transparent resin.

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