CN201527994U - Side light type light-emitting component package shell and package structure - Google Patents
Side light type light-emitting component package shell and package structure Download PDFInfo
- Publication number
- CN201527994U CN201527994U CN2009202664302U CN200920266430U CN201527994U CN 201527994 U CN201527994 U CN 201527994U CN 2009202664302 U CN2009202664302 U CN 2009202664302U CN 200920266430 U CN200920266430 U CN 200920266430U CN 201527994 U CN201527994 U CN 201527994U
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- China
- Prior art keywords
- light
- base
- emitting component
- cup
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The utility model discloses a side light type light emitting component package structure, comprising a shell and a light emitting component, wherein the cup shell of the shell is oblique outwards to lead the side wall and the base to form an included angle of 140-150 degrees; the depth of the cup shell is vertical to the base; the depth is 0.25-0.3mm; the cup rim of the cup shell is provided with a luminous surface; and the area of the luminous surface is 1.5-2 times of that of the base.
Description
Technical field
The utility model relates to a kind of light-emitting component (light emitting component) encapsulating housing and encapsulating structure, particularly a kind of side-lighting type light-emitting component package housing and encapsulating structure.
Background technology
Light-emitting diode (light emitting diode; LED) be used for lighting device, for example be applied to flashlight, auto bulb, bulb, fluorescent tube, in addition, also can be backlight as what install, for example be applied in the backlight liquid crystal display sub-assembly (backlight module) of TV, display monitor central monitoring system, mobile phone.The classification of sub-assembly backlight according to the difference of the light direction of led chip on the substrate, can be distinguished the design of straight-down negative is arranged (direct type) and side-light type (edge type), and dissimilar products respectively have its demand.
The side light type LED back light sub-assembly of prior art generally has a cup-shaped substrate, and led chip places on this substrate, and LED is luminous, and the light that has is directly penetrated to extraneous by rim of a cup, and the light that has is incident upon wall of cup and reflexes to the external world again.The schematic cross-section of cup-shaped board structure as shown in Figure 1, the dark D of cup of prior art
1Be generally 0.6mm, cup shell 10 tilt angle theta
1Be generally 90 degree to 110 degree.Yet such setting makes the part light 14 that is penetrated by led chip 12 need through just being penetrated to light receiving device 18 by exiting surface 16 behind sidewall 11 reflections and the diffraction, because the path of light is longer, loses easily and influences light extraction efficiency.
U.S. patent application case discloses the 2009/0114936th A1 number and discloses a kind of light-emitting device, its encapsulating structure has a groove, and light-emitting component places in this groove, and groove is a thin-and-long, two opposing sidewalls in long and narrow direction present inclined plane shape, the angle on this two inclined-plane be 90 the degree or greater than 90 the degree.In one embodiment, the angle on this two inclined-plane can be 135 to 165 degree, in another embodiment, the opening length of long and narrow direction can be 2 to 4 times of bottom portion of groove length, and in another embodiment again, depth of groove can be 0.2 to 0.4 times of bottom portion of groove length, and the light that makes light-emitting component send fully disperses in the long and narrow direction of groove, to make ribbon beam (band-shaped beam).When having a plurality of light-emitting components to place situation in this groove, such encapsulating structure can suppress inhomogeneous irradiation.
Yet, still continue to have demand for a kind of side-lighting type light-emitting component packaging structure of novelty, in the hope of having sufficient light extraction efficiency.
The utility model content
A purpose of the present utility model is that a kind of side-lighting type light-emitting component packaging structure will be provided, and via the unique design of cup hull shape shape, can make the direct bright dipping of most light, therefore has good light extraction efficiency.
According to a specific embodiment of the present utility model, a kind of side-lighting type light-emitting component packaging structure is provided, it comprises following: a base; At least one light-emitting component is positioned on the base; And one glass of shell, combine with base and around this light-emitting component, glass shell has reflectivity towards a sidewall of light-emitting component.The cup shell is outward-dipping and make sidewall and base form one 140 to 150 angles of spending, the cup shell has the degree of depth perpendicular to base, and just cup is dark, and this degree of depth is 0.25mm to 0.3mm, and the rim of a cup of cup shell is an exiting surface, and the area of exiting surface is 1.5 to 2 times of area of base.
According to another specific embodiment of the present utility model, a kind of side-light type SMD LED surface-mount device LED (surfacemount device is provided, SMD) LED encapsulating structure, comprise following: a cup-shaped substrate, comprise one a glass of shell and a base and form an accommodation space that the cup shell has reflectivity towards a sidewall of accommodation space; One lead frame (lead frame) is positioned on the base; At least one led chip is positioned on the lead frame and in accommodation space; And an adhesive layer, cover this led chip.The cup shell is outward-dipping and make sidewall and base form the angles of one 140 to 150 degree, and a cup shell has the degree of depth perpendicular to base, and this degree of depth is 0.25mm to 0.3mm, and the rim of a cup of glass shell is an exiting surface, and the area of exiting surface is 1.5 to 2 times of area of base.
According to another specific embodiment again of the present utility model, a kind of side-lighting type light-emitting component package housing is provided, comprise following: a base and one glass of shell.The cup shell combines with base and forms the accommodation space of a cup-shaped, the cup shell has reflectivity towards the sidewall in the cup, the cup shell is outward-dipping and make sidewall and base form the angles of one 140 to 150 degree, and the rim of a cup of glass shell is an exiting surface, and the area of exiting surface is 1.5 to 2 times of area of base.
In the utility model, because the cup shell is more shallow in terms of existing technologies, make light-emitting component nearer apart from the exiting surface of encapsulating structure, and increase cup shell angle of inclination, make the area of exiting surface and the functional areas area at light-emitting component place form a ratio, rising angle is big, can allow light one inferior to the exiting surface bright dipping as far as possible, or go through a total reflection promptly in the exiting surface bright dipping, so also can reduce refraction, diffraction, the generation of scattering, therefore can show the due optical property that goes out, the raising light emission rate, can be good be used in sub-assembly backlight or the lighting device.
Description of drawings
Fig. 1 shows the encapsulating structure of a prior art and the schematic cross-section of bright dipping.
Fig. 2 shows the schematic cross-section of the specific embodiment of foundation light-emitting component encapsulating housing of the present utility model.
Fig. 3 shows that light-emitting component encapsulating housing of the present utility model is carrying the schematic cross-section of the bright dipping of light-emitting component.
Fig. 4 shows the schematic cross-section of the specific embodiment of foundation side-lighting type light-emitting component packaging structure of the present utility model.
Fig. 5 shows the schematic top plan view as the side-lighting type light-emitting component packaging structure of Fig. 4.
Fig. 6 shows encapsulating structure and the encapsulating structure of the present utility model use prior art respectively, with the luminous intensity that the records result to the mapping of the cup shell degree of depth.
Fig. 7 shows that the luminous flux of the encapsulating structure of encapsulating structure of the present utility model and prior art compares the mapping of luminous intensity.
Wherein, description of reference numerals is as follows:
10 glasss of shell 11 sidewalls
12 led chips, 14 light
16 exiting surfaces, 18 light receiving devices
20 side-lighting type light-emitting component package housings, 22 bases
26 glasss of shells of 24 light-emitting components
27 sidewalls, 28 exiting surfaces
30 side-lighting type light-emitting component packaging structures, 32 bases
34 glasss of shell 35 sidewalls
36 lead frames, 361 lead frame component
362 lead frame component, 38 led chips
39 leads, 40 adhesive layers
42 exiting surfaces, 50 light
52 light, 54 light receiving devices
Embodiment
The light-emitting component of side-lighting type light-emitting component packaging structure of the present utility model is arranged in a cup-shaped substrate, wherein, the cup shell of cup-shaped substrate is outward-dipping and make sidewall and base form one 140 to 150 angles of spending, the cup shell has the degree of depth perpendicular to base, this degree of depth is 0.25mm 0.3mm, and the rim of a cup of cup shell is an exiting surface, and the area of exiting surface is 1.5 to 2 times of area of base.
The schematic cross-section of a specific embodiment as shown in Figure 2, side-lighting type light-emitting component package housing 20 comprises following: a base 22.Can carry light-emitting component on the base 22.Light-emitting component can be for example light-emitting diode (light emitting diode; LED), the semi-conductive chip of Organic Light Emitting Diode, resonant cavity light emitting diodes or laser.One glass of shell 26 combines with base 22 and forms a cup-shaped accommodation space.Cup shell 26 has reflectivity towards the sidewall 27 in the cup.Cup shell 26 is outward-dipping and make sidewall 27 and base 22 form the angle theta of one 140 to 150 degree
2Cup shell 26 has a depth D perpendicular to base 22
2, D
2For 0.25mm to 0.3mm.The rim of a cup of cup shell is an exiting surface 28, the area A of exiting surface 28
1For 26 on cup shell around the area A of base
21.5 to 2 times, that is to say A
1(exiting surface area): A
2(base area)=1.5: 1 to 2: 1.Rim of a cup and base can be respectively for example elliptical shape of a prolate, but also can be microscler or irregular shape.
Base with the cup shell can be ceramic material (for example: Al
2O
3, AlN) or plastic material engage one another or integrally formed.Also can use lead frame to replace, the material of lead frame can be aluminium, copper, aluminium electroplate or copper electroplate, alusil alloy, almag, aldray, aluminium copper etc.The cup shell has reflectivity towards the sidewall of light-emitting component, and this can utilize and adhere to the higher material of reflectivity on cup shell side wall surface, or utilizes the whiteware material to reach as reverberation.
Fig. 3 further shows that light-emitting component encapsulating housing of the present utility model is carrying the schematic cross-section of the bright dipping of light-emitting component, can with the luminous element packing structure of the prior art of Fig. 1 relatively.The depth D of cup shell as seen of the present utility model
2More shallow, the bright dipping distance L of light-emitting component 24 is short or nearer with exiting surface 28, and because of increasing cup shell angle of inclination, the area of exiting surface 28 is 1.5 to 2 times of base 22 areas, make than prior art constructions to be that many light 50 is directly in exiting surface 28 bright dippings, less light 52 is just via wall of cup 27 reflection bright dippings, and the loss that reduces anaclasis or diffraction, so the luminous flux that light receiving device 54 receives can be big than the encapsulating structure of prior art.
And for example shown in the schematic cross-section of Fig. 4, according to side-lighting type light-emitting component packaging structure 30 of the present utility model, its base 32 forms a cup-shaped substrate with cup shell 34, base 32 and cup shell 34 can be integrally formed or be interosculated with around a light-emitting component, and be an accommodation space, the cup shell has reflectivity towards a sidewall 35 of accommodation space (just towards light-emitting component); Base 32 has a lead frame 36, and it comprises two parts 361 and 362; At least one light-emitting component for example led chip 38 is positioned on the parts 362 of lead frame 36 and in accommodation space.Led chip can include a positive electrode and a negative electrode, and is connected to the parts 361 of lead frame 36 via lead 39 electric property.Lead frame 36 is by the outside that extends to cup-shaped substrate in the cup-shaped substrate, in order to the contact as follow-up backlight or illuminating assembly processing procedure.Can further comprise an adhesive layer 40, cover this led chip 38.Sidewall 35 is outward-dipping and form the angle theta of one 140 to 150 degree with base 32
3, cup shell 34 has a depth D perpendicular to base 32
3, this degree of depth is 0.25mm to 0.3mm, and the rim of a cup of cup shell 34 is an exiting surface 42, the area of exiting surface 42 is 1.5 to 2 times of area of base 32.
The adhesive layer covering luminous element.Adhesive layer can comprise epoxy resin or silica gel, is used for protection and fixing for example led chip and plain conductor of light-emitting component.And can in adhesive layer, comprise in addition and light color to carry out mixed light or to change by a fluorescent material.
The schematic top plan view of the side-lighting type light-emitting component packaging structure 30 of Fig. 5 displayed map 4.The area A of exiting surface 42 wherein
3Area A for base 32
41.5 to 2 times.Show among the figure that rim of a cup and base have the elliptical shape of a prolate respectively, but be not limited thereto.
Fig. 6 shows LED encapsulating structure (the cup shell forms 90 degree with base) and the side-light type SMD LED encapsulating structure of the present utility model (its glass shell side wall forms 140 with base and spends) use prior art respectively, the result who the cup shell degree of depth (unit is mm) is mapped with the luminous flux (luminous flux) (unit is lumen (lm)) that records.By among the figure as can be known, under the same cup shell degree of depth, compare, the luminous flux of encapsulating structure of the present utility model is big than the luminous flux of the encapsulating structure of prior art, moreover, when the cup shell degree of depth of the present utility model is kept to 0.3mm by 0.6mm, luminous flux can exceed 1lm nearly, just approximately exceeds 20%.As seen promote the effect of light emission rate.
Fig. 7 show specific embodiment of side-light type SMD LED encapsulating structure of the present utility model and prior art the LED encapsulating structure luminous flux to the mapping of luminous intensity relatively.Encapsulating structure of the present utility model uses the sidewall of cup shell and the angle that base forms 140 degree, and the cup shell degree of depth is 0.3mm.The encapsulating structure of prior art uses cup shell and base to form the angle of 90 degree, and reaching the cup shell degree of depth is 0.6mm.Abscissa is luminous intensity (Iv), and unit is candle light (cd), and ordinate is a luminous flux, and unit is lumen (lm).By among the figure as can be known, greater than about 1.46 candle power hours, under the identical luminous intensity, encapsulating structure of the present utility model has the luminous flux high than the encapsulating structure of prior art, and has preferable light emission rate.
The above only is a preferred embodiment of the present utility model, and all equalizations of being done according to the utility model claim change and modify, and all should belong to covering scope of the present utility model.
Claims (10)
1. a side-lighting type light-emitting component packaging structure is characterized in that, comprising:
One base;
At least one light-emitting component is positioned on this base; And
One glass of shell, combine with this base and around this at least one light-emitting component, this glass shell has reflectivity towards a sidewall of this at least one light-emitting component, this glass shell outward-dipping and make this sidewall and this base form one 140 to 150 the degree angles, this glass shell has the degree of depth perpendicular to this base, this degree of depth is 0.25mm to 0.3mm, and the rim of a cup of this glass shell is an exiting surface, and the area of this exiting surface is 1.5 to 2 times of area of this base.
2. side-lighting type light-emitting component packaging structure as claimed in claim 1 is characterized in that, also comprises an adhesive layer, covers this at least one light-emitting component.
3. side-lighting type light-emitting component packaging structure as claimed in claim 1 is characterized in that, this at least one light-emitting component comprises light-emitting diode, Organic Light Emitting Diode, resonant cavity light emitting diodes or laser semiconductor.
4. side-lighting type light-emitting component packaging structure as claimed in claim 1 is characterized in that, also comprises at least one lead, is connected with the electric property of this at least one light-emitting component.
5. side-lighting type light-emitting component packaging structure as claimed in claim 1 is characterized in that, this side-lighting type light-emitting component packaging structure is a SMD LED surface-mount device LED.
6. a side-light type surface-mounting LED packaging structure is characterized in that, comprising:
One cup-shaped substrate, comprise one a glass of shell and a base and form an accommodation space, this glass shell has reflectivity towards a sidewall of this accommodation space, this glass shell outward-dipping and make this sidewall and this base form one 140 to 150 the degree angles, this glass shell has the degree of depth perpendicular to this base, this degree of depth is 0.25mm to 0.3mm, and the rim of a cup of this glass shell is an exiting surface, and the area of this exiting surface is 1.5 to 2 times of area of this base;
One lead frame is positioned on this base;
At least one light-emitting diode chip for backlight unit is positioned on this lead frame and in this accommodation space; And
One adhesive layer covers this at least one light-emitting diode chip for backlight unit.
7. side-light type surface-mounting LED packaging structure as claimed in claim 6 is characterized in that this adhesive layer also comprises a fluorescent material.
8. a side-lighting type light-emitting component package housing is characterized in that, comprising:
One base; And
One glass of shell, combine with this base and form the accommodation space of a cup-shaped, this glass shell has reflectivity towards the sidewall in the cup, this glass shell outward-dipping and make this sidewall and this base form one 140 to 150 the degree angles, the rim of a cup of this glass shell is an exiting surface, and the area of this exiting surface is 1.5 to 2 times of area of this base.
9. side-lighting type light-emitting component package housing as claimed in claim 8 is characterized in that this glass shell has the degree of depth perpendicular to this base, and this degree of depth is 0.25mm to 0.3mm.
10. side-lighting type light-emitting component package housing as claimed in claim 8 is characterized in that, comprises that also one is positioned at the lead frame on this base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202664302U CN201527994U (en) | 2009-11-06 | 2009-11-06 | Side light type light-emitting component package shell and package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202664302U CN201527994U (en) | 2009-11-06 | 2009-11-06 | Side light type light-emitting component package shell and package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201527994U true CN201527994U (en) | 2010-07-14 |
Family
ID=42519276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202664302U Expired - Lifetime CN201527994U (en) | 2009-11-06 | 2009-11-06 | Side light type light-emitting component package shell and package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201527994U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102792474A (en) * | 2010-11-03 | 2012-11-21 | 惠州科锐半导体照明有限公司 | Miniature surface mount device with large pin pads |
-
2009
- 2009-11-06 CN CN2009202664302U patent/CN201527994U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102792474A (en) * | 2010-11-03 | 2012-11-21 | 惠州科锐半导体照明有限公司 | Miniature surface mount device with large pin pads |
| CN102792474B (en) * | 2010-11-03 | 2017-05-24 | 惠州科锐半导体照明有限公司 | Miniature surface mount device with large pin pads |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ADERVANCED OPTOELECTRONIC TECHNOLOGY INC. Owner name: ZHANJING TECHNOLOGY (SHENZHEN) CO., LTD. Free format text: FORMER OWNER: ADVANCED DEVELOPMENT PHOTOELECTRIC CO., LTD. Effective date: 20101125 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: HSINCHU COUNTY, TAIWAN PROVINCE, CHINA TO: 518100 NO.2, NORTH RING ROAD 2, NO.10, YOUSONG INDUSTRIAL ZONE, LONGHUA SUBDISTRICT OFFICE, BAO'AN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20101125 Address after: 518100, Shenzhen, Guangdong, Baoan District province Longhua Street tenth Pine Industrial Zone, No. two, East Ring Road, No. 2 Co-patentee after: Advanced Optoelectronic Technology Inc. Patentee after: Zhanjing Technology (Shenzhen) Co., Ltd. Address before: Hsinchu County, Taiwan, China Patentee before: Advanced Development Photoelectric Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20100714 |
|
| CX01 | Expiry of patent term |