CN201467564U - Improved frame structure for improving copper raising at edge of PCB (printed circuit board) - Google Patents
Improved frame structure for improving copper raising at edge of PCB (printed circuit board) Download PDFInfo
- Publication number
- CN201467564U CN201467564U CN200920045053XU CN200920045053U CN201467564U CN 201467564 U CN201467564 U CN 201467564U CN 200920045053X U CN200920045053X U CN 200920045053XU CN 200920045053 U CN200920045053 U CN 200920045053U CN 201467564 U CN201467564 U CN 201467564U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- edge
- frame
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an improved frame structure for improving the copper raising at the edge of a PCB (printed circuit board). A plurality of elastic buffering objects which are used for bearing a plate inserted into a frame are arranged at the bottom part of the frame. The buffering objects can buffer the contact between the frame and the edge of the plate, so as to avoid both the copper raising at the edge of the plate and the fixed point scratching, thereby exerting the function of improving the quality of the PCB. As the buffering objects can be waste rubber skins, the investment cost is low. The improved frame structure is simple and is easy for implementation.
Description
Technical field
The utility model relates to used framework in a kind of print circuit plates making process, specifically a kind of framework that can improve the copper tilted edge of printed circuit board problem.
Background technology
It is other that framework is mainly used in the following station that PCB makes in the flow process: PTH (heavy copper), do skin, seal is anti-welding and the lettering symbol.In the PTH process, framework mainly plays the effect that keeps holding plate and distance between plates, is beneficial to hole copper deposition; In doing surrounding procedure, framework mainly plays the effect that prevents by the outer-layer circuit scratch; In the process of the anti-welding and character of seal, framework mainly plays and prevents that printing ink is counter and be stained with and the effect of plate face scratch.But when using the framework plate, thereby all there is the excessive problem that causes edges of boards to pound base of frame of operator action, causes copper tilted edge.
Summary of the invention
In order to overcome above-mentioned defective, the utility model provides a kind of frame improved structure that improves copper tilted edge of printed circuit board, this frame improved structure that improves copper tilted edge of printed circuit board can improve copper tilted edge effectively, improves product quality, and simple in structure, cost is low, easy to implement.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of frame improved structure that improves copper tilted edge of printed circuit board, base of frame are provided with some cushions that are used for carrying the plate that inserts framework, and described cushion has elasticity.Described cushion can cushion contacting of framework and edges of boards, thereby the effect that improves the printed circuit board (PCB) quality is played in the fixed point scratch of avoiding copper tilted edge and producing thereupon.
Further technical scheme of the present utility model is:
Described cushion is rubber skin (as the discarded glue that falls), and is positioned over described base of frame, makes that this frame improved structure is simple in structure, input cost is low.
Described rubber skin is interval with two, and is symmetric arrangement.
The beneficial effects of the utility model are: because base of frame is provided with some rubber-like cushions, described cushion can cushion contacting of framework and edges of boards, therefore the effect that improves the printed circuit board (PCB) quality is played in the fixed point scratch that can avoid copper tilted edge and produce thereupon; Because this cushion can be the rubber skin of discarding, and makes input cost low; The utility model is simple in structure, easy to implement.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
Embodiment: a kind of frame improved structure that improves copper tilted edge of printed circuit board, framework 1 bottom are provided with some cushions 2 that are used for carrying the plate 3 that inserts framework, and described cushion has elasticity.Described cushion can cushion contacting of framework and edges of boards, thereby the effect that improves the printed circuit board (PCB) quality is played in the fixed point scratch of avoiding copper tilted edge and producing thereupon.
Described cushion is rubber skin (as the discarded glue that falls), and is positioned over described base of frame, makes that this frame improved structure is simple in structure, input cost is low.
Described rubber skin is interval with two, and is symmetric arrangement.
Claims (3)
1. frame improved structure that improves copper tilted edge of printed circuit board is characterized in that: framework (1) bottom is provided with some cushions (2) that are used for carrying the plate (3) that inserts framework, and described cushion has elasticity.
2. the frame improved structure that improves copper tilted edge of printed circuit board according to claim 1 is characterized in that: described cushion is the rubber skin, and is positioned over described base of frame.
3. the frame improved structure that improves copper tilted edge of printed circuit board according to claim 2 is characterized in that: described rubber skin is interval with two, and is symmetric arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920045053XU CN201467564U (en) | 2009-05-26 | 2009-05-26 | Improved frame structure for improving copper raising at edge of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920045053XU CN201467564U (en) | 2009-05-26 | 2009-05-26 | Improved frame structure for improving copper raising at edge of PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201467564U true CN201467564U (en) | 2010-05-12 |
Family
ID=42394908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920045053XU Expired - Fee Related CN201467564U (en) | 2009-05-26 | 2009-05-26 | Improved frame structure for improving copper raising at edge of PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201467564U (en) |
-
2009
- 2009-05-26 CN CN200920045053XU patent/CN201467564U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100512 Termination date: 20140526 |