CN201382279Y - Ceramic Semiconductor Thermoelectrically Cooled LEDs - Google Patents

Abstract

A ceramic semiconductor thermoelectric cooling LED lamp comprises: a lighting element, which is a light emitting diode; a semiconductor thermoelectric cooling element, which is a ceramic entity as a cooling substrate (referred to as a ceramic cooling substrate); a conduction circuit, which is a circuit directly laid on one surface of the ceramic entity and then applied with an electroplated metal film; wherein the conduction circuit mainly provides current to the LED to make the LED emit light; and a heat dissipation module, which is connected to the other surface of the ceramic entity. When a bias is applied to the light emitting diode, heat energy is released. The temperature difference between the two dissimilar metals of the conduction circuit and the ceramic cooling substrate, which are tightly bonded to form a closed circuit, will generate a thermoelectric potential, causing the current to flow inside the ceramic cooling substrate, thereby greatly reducing the temperature and achieving the purpose of temperature control, which is beneficial to preventing thermal decay of electronic components to ensure the stability and safety of the system operation.

Description

Ceramic Semiconductor Thermoelectrically Cooled LEDs

technical field

The utility model relates to an LED lamp, in particular to a ceramic semiconductor thermoelectric cooling LED lamp.

Background technique

Recently, global warming has occurred all over the world. The government strongly appeals to the people of the country to save energy and reduce carbon emissions, and to protect the earth's ecology together. Therefore, more and more attention has been paid to energy-saving products. Therefore, LED lighting is used to replace traditional light bulbs. However, heat will be generated during lighting. Many heat dissipation modules on the market use copper, aluminum or their alloys as the main base material, but The efficiency is low, so it is easy to cause the temperature in the lamp to be too high, which will deteriorate the characteristics of the LED and attenuate the brightness of the LED. This problem has always been an unfavorable factor in the popularization of traditional high-power LED lamps. Because of this, it will be necessary to equip a bulky and heavy heat dissipation module, but the heat dissipation effect is quite limited, so that the high heat will cause the life of the LED lamp to be attenuated. Therefore, relatively high-power LED lamps cannot achieve the purpose of saving cost and energy.

Traditionally, disulfur trioxide or graphite is added between the LED and the cooling module for heat conduction, but the effect is still ineffective. In addition, bismuth tritelluride or bismuth triselenide is also used as the conductive medium, but the effect is still not good, and the price of these two materials is quite expensive, which is not suitable for mass use.

The thermoelectric refrigeration technology in the prior art has been applied to the cooling and temperature control of small components such as laser diode charge-coupled devices, and it has been practiced for many years. However, the thermoelectric cooling air must be supplied with DC power from the outside to produce a thermal cooling effect, and a radiator or heat conduction sheet must be connected to the heat release end to export the heat to the atmosphere or even be equipped with an electric fan for forced cooling. The problem of component thermal decay does leave a lot of room for technical solutions that need to be broken through.

Therefore, if the semiconductor thermoelectric cooling element can be used as a way to improve the heat dissipation effect and lower the temperature, the LED will be more widely used. Among them, the semiconductor thermoelectric cooling element is made of a variety of transition metal elements, and has a low-dimensional superlattice film. Under the influence of quantum effects, the energy gap of electrons in the internal energy band structure of the crystal is changed and increased, and then manipulated. The physical characteristics that best meet the thermoelectric effect enable the semiconductor thermoelectric cooling element to have excellent thermoelectric transfer efficiency and thermoelectric value of merit. It is a high-function overheating protection element that can simultaneously cool the temperature of heat energy emitted by electronic components and precisely control the temperature. device.

Contents of the invention

Therefore, the purpose of this utility model is to solve the above-mentioned problems in the conventional technology. In this utility model, a ceramic semiconductor thermoelectric cooling LED lamp is proposed. Transfer to the ceramic cooling substrate. At this time, the temperature difference between the conductive circuit and the two dissimilar metals in the ceramic cooling substrate is tightly bonded to form a closed circuit, which will generate thermal electromotive force, and the current will circulate inside the ceramic cooling substrate. Using the ceramic cooling In the substrate, the direction of the current that absorbs the heat phenomenon will greatly reduce the temperature and achieve the purpose of temperature control, which is beneficial to curb the problem of thermal decay of electronic components, so as to ensure the temperature stability and safety of the system operation circuit.

In order to achieve the above purpose, this utility model proposes a ceramic semiconductor thermoelectric cooling LED lamp, which is an application of combining semiconductor thermoelectric cooling elements with lighting elements for overheating protection, mainly absorbing the temperature of heat energy emitted by electronic components and reducing the temperature of the electronic components. Temperature, that is, to suppress the temperature at a constant low temperature level, the ceramic semiconductor thermoelectric cooling LED lamp includes: a lighting element, the lighting element is a light emitting diode (Light Emitting Diode, LED); a semiconductor thermoelectric cooling element, the semiconductor The thermoelectric cooling element uses a ceramic entity as a cooling substrate (referred to as a ceramic cooling substrate); a conduction circuit, the lighting element and the conduction circuit are on one side of the ceramic entity; wherein the conduction circuit mainly provides current to the LED, and The LED is made to emit light; a heat dissipation module is connected with the other surface of the ceramic body.

Preferably, the conduction circuit is directly laid on the ceramic body, and the electroplated metal film is applied.

The beneficial effect of the utility model is that when the forward voltage is applied to the PN junction of the light-emitting diode, the heat energy released due to the recombination of electrons and holes is transferred to the ceramic entity through the conduction circuit. At this time, the conduction circuit and the ceramic The temperature difference between the two dissimilar metals in the entity is tightly bonded to form a closed circuit, which will generate thermal electromotive force, and the current will flow inside the ceramic entity. Using the current direction of the thermal phenomenon in the ceramic entity, the temperature will be greatly reduced and temperature control will be achieved. The purpose is to help prevent the problem of thermal decay of electronic components to ensure the stability and safety of system operation. Moreover, the utility model can improve the brightness of the lighting without greatly increasing the weight of the article, and solves the problem of insufficient brightness of LEDs in the past.

The features and advantages of the present utility model can be further understood from the following description, and please refer to the accompanying drawings when reading.

Description of drawings

Fig. 1 shows the front view of the utility model;

Fig. 2 shows the three-dimensional schematic view of the utility model;

Fig. 3 is the comparative table of temperature and illuminance of the utility model and traditional element;

Fig. 4 is a comparison table of the weight and illuminance of the utility model and the traditional components.

Explanation of reference signs:

1-illumination element; 2-semiconductor thermoelectric cooling element; 3-conduction circuit; 4-radiation module.

Detailed ways

The above and other features and advantages of the present utility model will be described in detail below in conjunction with the accompanying drawings.

Please refer to Figures 1 to 4, which show that the ceramic semiconductor thermoelectric cooling LED lamp of the present invention is an application of combining semiconductor thermoelectric cooling elements with light-emitting diodes for overheat protection, mainly absorbing the heat energy emitted by electronic components and reducing its The temperature of electronic components, that is, to suppress the temperature at a constant low temperature level, the ceramic semiconductor thermoelectric cooling LED lamp, including:

A lighting element 1, the lighting element 1 is a light emitting diode (Light Emitting Diode, LED).

A semiconductor thermoelectric cooling element 2, the semiconductor thermoelectric cooling element 2 is a ceramic entity, which serves as a cooling substrate (ceramic cooling substrate for short).

The appearance structure, specification and size of the ceramic body can be manufactured according to the shape of the object to which it is applied, and there is no specific shape restriction.

A conductive circuit 3, the lighting element 1 and the conductive circuit 3 are on one side of the ceramic body. The conduction circuit 3 mainly provides current to the LED to make the LED emit light. Wherein the conductive circuit can be a simple conductive wire. According to a preferred embodiment of the present invention, the conduction circuit is directly laid with a "silver" circuit on one side of the ceramic body, and then given a metal film of electroplating "nickel and tin".

The laying of the conduction circuit can be determined according to the setting of the LED lights, and transmission elements such as power, signal, and various metadata can be laid at the same time.

A heat dissipation module 4, the heat dissipation module 4 is connected to the other surface of the ceramic body, wherein the heat dissipation module is made of aluminum or aluminum alloy.

In the present invention, the conduction circuit can be directly printed on the ceramic cooling substrate, and the conduction circuit can be connected in series and/or in parallel.

In the utility model, when the forward voltage is applied to the PN junction of the light-emitting diode, the heat energy released due to the recombination of electrons and holes is transferred to the ceramic entity through the conduction circuit. At this time, the conduction circuit and the ceramic entity are two The temperature difference between dissimilar metals tightly bonded to form a closed circuit will generate thermal electromotive force, and the current will flow inside the ceramic body. Using the current direction of the thermal phenomenon in the ceramic body, the temperature will be greatly reduced and the purpose of temperature control will be achieved. It is beneficial to prevent the problem of thermal decay of electronic components to ensure the stability and safety of system operation.

Please refer to Figure 3 and Figure 4 to show the advantages of the LED lighting product composed of the utility model, in which A is the case of using the ceramic cooling substrate (hereinafter referred to as A), and B is the case of using traditional metal heat dissipation (hereinafter referred to as B) ; As shown in Figure 3, the comparison between product temperature and illuminance is that when the illuminance is 1000, A is 40 degrees, and B is 60 degrees; between 2000 and 3000 illuminance, the temperature of A remains unchanged, and the temperature of B continues to rise to 80 degrees; at 4000 illuminance, the temperature of A rises by 10 degrees to 50 degrees, while B remains at a high temperature of 80 degrees; from this data, it can be proved that the ceramic cooling substrate has the effect of cooling and temperature control.

Furthermore, Figure 4 is a comparison of product weight and illuminance. When the illuminance is 1000, A is 0.5KG and B is 3.5KG; between 2000 and 3000 illuminance, the weight of A changes very little, while the weight of B continues to increase to 4.5KG; when the illuminance is 4000, the weight of A increases slightly, about 0.8KG, while the weight of B increases to 5KG.

From the data shown in the above two comparison charts (Fig. 3 and Fig. 4), it can be proved that the utility model can improve the brightness of lighting without greatly increasing the weight of items, and solves the problem of insufficient brightness of LEDs in the past.

To sum up, the humanized and thoughtful design of this case is quite in line with actual needs. Its concrete improvement existing deficiency, compared with the prior art obviously has the advantage of breakthrough progress, indeed has the enhancement of efficacy, and is not easy to achieve. This case has not been published or disclosed in domestic and foreign literature and market, which is in line with the provisions of the patent law.

The above detailed description is a specific description of a feasible embodiment of the utility model, but the embodiment is not used to limit the patent scope of the utility model, and any equivalent implementation or change that does not depart from the technical spirit of the utility model, should be included in the patent scope of this case.

Claims (8)

1. a ceramic semiconductors thermoelectric-cooled LED lamp is characterized in that, this ceramic semiconductors thermoelectric-cooled LED lamp comprises:

One illumination component, this illumination component are light emitting diode;

Semiconductor thermoelectric cooling element, this semiconductor thermoelectric cooling element are that it is as cooling base with a ceramic entity;

One order wire circuit, this illumination component and this order wire circuit are on the one side of this pottery entity; And this order wire circuit and this LED electrically connect, and provide electric current to give this LED and make LED luminous;

One radiating module, this radiating module links on the another side of this pottery entity.

2. ceramic semiconductors thermoelectric-cooled LED lamp according to claim 1 is characterized in that the laying of this order wire circuit is decided according to the setting of LED lamp, and lay electric power simultaneously, one or more transfer element in the signal, all metadata.

3. ceramic semiconductors thermoelectric-cooled LED lamp according to claim 1 is characterized in that this radiating module is the aluminum or aluminum alloy material.

4. ceramic semiconductors thermoelectric-cooled LED lamp according to claim 1 is characterized in that this order wire circuit is simple conductor wire.

5. ceramic semiconductors thermoelectric-cooled LED lamp according to claim 1 is characterized in that this order wire circuit directly is printed on this pottery entity, and this order wire circuit is for going here and there and or being connected in parallel.

6. ceramic semiconductors thermoelectric-cooled LED lamp according to claim 1 is characterized in that this order wire circuit directly is layed on this pottery entity, and is covered with plated metal film.

7. ceramic semiconductors thermoelectric-cooled LED lamp according to claim 6 is characterized in that, it is silver-colored circuit that this order wire circuit is laid circuit.

8. ceramic semiconductors thermoelectric-cooled LED lamp according to claim 6 is characterized in that, this order wire circuit institute electroplated metal film is nickel or tin.

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