CN201156225Y - computer cooling device - Google Patents
computer cooling device Download PDFInfo
- Publication number
- CN201156225Y CN201156225Y CNU2008200430688U CN200820043068U CN201156225Y CN 201156225 Y CN201156225 Y CN 201156225Y CN U2008200430688 U CNU2008200430688 U CN U2008200430688U CN 200820043068 U CN200820043068 U CN 200820043068U CN 201156225 Y CN201156225 Y CN 201156225Y
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- Prior art keywords
- fan
- pedestal
- computer
- composite material
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001816 cooling Methods 0.000 title abstract description 29
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000002131 composite material Substances 0.000 claims abstract description 14
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 14
- 239000010439 graphite Substances 0.000 claims abstract description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract 18
- 230000017525 heat dissipation Effects 0.000 abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 239000010949 copper Substances 0.000 abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 3
- 239000004411 aluminium Substances 0.000 abstract 1
- 230000004308 accommodation Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
技术领域: Technical field:
本实用新型涉及散热装置技术领域,特指一种电脑散热装置。The utility model relates to the technical field of cooling devices, in particular to a computer cooling device.
背景技术: Background technique:
目前,电脑上的中央处理器、显卡等电脑配件作为高端的电子产品,其在运行过程中会产生大量的热量,如果不能够及时散发聚积在这些电脑配件上的热量,降低其温度,则会直接影响其正常运作及使用寿命,所以在中央处理器、显卡等电脑配件上一般设置有散热装置。尤其是伴随着电脑技术的不断发展,很多电脑配件的性能越来越强,与此同时功耗也出现大幅上涨,其发热量也大幅上升,因此,如何提高这些散热装置的散热效率和降温效果,成为现在电脑技术必须解决的重大问题。At present, computer accessories such as the central processing unit and graphics card on the computer are high-end electronic products, which will generate a lot of heat during operation. If the heat accumulated on these computer accessories cannot be dissipated in time to reduce their temperature, it will It directly affects its normal operation and service life, so a cooling device is generally installed on computer accessories such as a central processing unit and a graphics card. Especially with the continuous development of computer technology, the performance of many computer accessories is getting stronger and stronger. At the same time, the power consumption has also risen sharply, and its calorific value has also risen sharply. Therefore, how to improve the cooling efficiency and cooling effect of these cooling devices , has become a major problem that computer technology must solve now.
现有的电脑散热装置主要是由铜或铝合金制造的基座、散热鳍片组及辅助吹散热量的风扇等组成,而由于现在全球资源的紧缺,铜和铝的价格正在逐步上升,由纯铜或铝制成的电脑散热装置,其成本较高。而且,因为铜和铝的密度较大,所制成的电脑散热装置重量大,容易压坏芯片,不方便安装。Existing computer cooling devices are mainly composed of bases made of copper or aluminum alloys, cooling fins, and fans for assisting in blowing heat. However, due to the shortage of global resources, the prices of copper and aluminum are gradually increasing. Computer heat sinks made of pure copper or aluminum are relatively expensive. Moreover, because the density of copper and aluminum is relatively high, the computer cooling device made is heavy, easily crushes the chip, and is inconvenient to install.
实用新型内容:Utility model content:
本实用新型的目的就是针对现有技术存在的不足而提供一种成本低、散热效率高的电脑散热装置。The purpose of the utility model is to provide a computer cooling device with low cost and high cooling efficiency aiming at the deficiencies in the prior art.
为了实现上述目的,本实用新型采用的技术方案是:它包括风扇、石墨复合材料制成的基座和散热鳍片组,所述的散热鳍片组位于基座的顶端,且基座和散热鳍片组为一体成型,其中基座和散热鳍片组共同构成用于放置风扇的容置区,风扇放置于容置区中。In order to achieve the above object, the technical solution adopted by the utility model is: it includes a fan, a base made of graphite composite material and a heat dissipation fin group, the heat dissipation fin group is located at the top of the base, and the base and heat dissipation The fin group is integrally formed, wherein the base and the heat dissipation fin group jointly constitute an accommodating area for placing the fan, and the fan is placed in the accommodating area.
所述的散热鳍片组中的散热鳍片与风扇相比为横向排列。Compared with the fan, the heat dissipation fins in the heat dissipation fin group are arranged laterally.
所述风扇的外围设有风罩。The periphery of the fan is provided with a windshield.
所述的基座底端固定连接有背板支架。The bottom end of the base is fixedly connected with a backplane bracket.
所述的背板支架与基座之间设有缓冲垫。A buffer pad is provided between the backplane support and the base.
所述的风扇下面设有固定座,风扇固定在固定座上,且固定座上设有固定孔。A fixing seat is arranged under the fan, and the fan is fixed on the fixing seat, and a fixing hole is arranged on the fixing seat.
所述基座上设有用于固定风扇下面的固定座的螺丝孔。The base is provided with screw holes for fixing the fixing seat under the fan.
本实用新型有益效果在于:The beneficial effects of the utility model are:
本实用新型提供的一种电脑散热装置,它包括风扇、石墨复合材料制成的基座和散热鳍片组,所述的散热鳍片组位于基座的顶端,且基座和散热鳍片组为一体成型,其中基座和散热鳍片组共同构成用于放置风扇的容置区,风扇放置于容置区中;由于石墨复合材料要比铜和铝的价格低很多,本实用新型具有成本低的特点,而且由石墨复合材料制成的基座重量轻、导热快、散热效率高,本实用新型采用石墨复合材料制成的基座和散热鳍片组具有散热速度快、降温效果显著的特点。进一步,所述的散热鳍片组中的散热鳍片与风扇相比为横向排列,使位于散热鳍片组一端的风扇可以快速地把聚集在散热鳍片上的热量吹走。The utility model provides a computer heat dissipation device, which comprises a fan, a base made of graphite composite material and a cooling fin group, the cooling fin group is located at the top of the base, and the base and the cooling fin group It is integrally formed, wherein the base and the heat dissipation fin group jointly constitute the accommodation area for placing the fan, and the fan is placed in the accommodation area; since the price of graphite composite material is much lower than that of copper and aluminum, the utility model has the advantages of low cost. low, and the base made of graphite composite material is light in weight, fast in heat conduction, and high in heat dissipation efficiency. features. Further, compared with the fan, the heat dissipation fins in the heat dissipation fin group are arranged laterally, so that the fan located at one end of the heat dissipation fin group can quickly blow away the heat accumulated on the heat dissipation fins.
附图说明: Description of drawings:
图1是本实用新型的结构示意图;Fig. 1 is the structural representation of the utility model;
图2是本实用新型的主视图;Fig. 2 is the front view of the utility model;
图3是本实用新型的分解示意图。Fig. 3 is an exploded schematic diagram of the utility model.
具体实施方式: Detailed ways:
下面结合附图对本实用新型作进一步的说明,见图1、2、3所示,本实用新型提供的一种电脑散热装置,它包括风扇1、石墨复合材料制成的基座2和散热鳍片组3,所述的散热鳍片组3位于基座2的顶端,且基座2和散热鳍片组3为一体成型,其中基座2和散热鳍片组3共同构成用于放置风扇1的容置区4,风扇1放置于容置区4中,其中由石墨复合材料制成的基座2紧贴在中央处理器或显卡等电脑配件的芯片上,再把中央处理器、显卡等电脑配件上的热量快速地传递给散热鳍片组3,所述的散热鳍片组3中的散热鳍片31与风扇1相比为横向排列,使位于散热鳍片组3一端的风扇1可以快速地把聚集在散热鳍片31上的热量吹走。The utility model will be further described below in conjunction with the accompanying drawings, as shown in Figures 1, 2 and 3, a computer cooling device provided by the utility model, which includes a
所述风扇1的外围设有风罩5,风罩5配合横向排列的散热鳍片31,使中央处理器、显卡等电脑配件上的热量可以有效地散发到电脑机箱的外面。The periphery of described
所述的基座2底端固定连接有背板支架6,背板支架6和基座2是通过螺丝61连接在一起,在螺丝61的一端旋紧有螺母62,在背板支架6与基座2之间设有缓冲垫7,该缓冲垫7为橡胶垫,散热装置安装在显卡上时,基座2与显卡的芯片紧贴在一起,而缓冲垫7和背板支架6依次安装在显卡的背面,其中缓冲垫7起缓冲的作用,可以避免散热装置压坏体积较小的显卡芯片等电脑配件的芯片。The bottom end of the
所述的风扇1下面设有固定座11,风扇1固定在固定座11上,且固定座11上设有固定孔12,所述基座2上设有用于固定座11的螺丝孔21,其中用于固定的螺丝依次穿过固定座11的固定孔12和基座2上的螺丝孔21,将风扇1锁紧在基座2上。The
因为石墨复合材料要比铜和铝的价格低很多,具有成本低的特点,而且由石墨复合材料制成的基座2和散热鳍片组3,重量轻、导热快、散热效率高,所以本实用新型选用以石墨复合材料制成的基座2和散热鳍片组3,其可以快速地把中央处理器、显卡等电脑配件上的热量散发出去。综上所述,本实用新型不仅散热速度快、降温效果显著,而且重量轻,不容易压坏中央处理器、显卡等电脑配件的芯片。Because the price of graphite composite material is much lower than that of copper and aluminum, it has the characteristics of low cost, and the
当然,以上所述仅是本实用新型的较佳实施例,故凡依本实用新型专利申请范围所述的构造、特征及原理所做的等效变化或修饰,均包括于本实用新型专利申请范围内。Of course, the above are only preferred embodiments of the utility model, so all equivalent changes or modifications made according to the structure, features and principles described in the scope of the utility model patent application are included in the utility model patent application within range.
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNU2008200430688U CN201156225Y (en) | 2008-01-15 | 2008-01-15 | computer cooling device |
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CNU2008200430688U CN201156225Y (en) | 2008-01-15 | 2008-01-15 | computer cooling device |
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CN201156225Y true CN201156225Y (en) | 2008-11-26 |
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CNU2008200430688U Expired - Fee Related CN201156225Y (en) | 2008-01-15 | 2008-01-15 | computer cooling device |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102196707A (en) * | 2010-03-08 | 2011-09-21 | 富准精密工业(深圳)有限公司 | Heat radiating device |
CN102569220A (en) * | 2010-12-28 | 2012-07-11 | 常州碳元科技发展有限公司 | Folding high-heat-radiation body |
-
2008
- 2008-01-15 CN CNU2008200430688U patent/CN201156225Y/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102196707A (en) * | 2010-03-08 | 2011-09-21 | 富准精密工业(深圳)有限公司 | Heat radiating device |
CN102569220A (en) * | 2010-12-28 | 2012-07-11 | 常州碳元科技发展有限公司 | Folding high-heat-radiation body |
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Legal Events
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081126 |