CN201142322Y

CN201142322Y - Improved structure of carrier disk

Info

Publication number: CN201142322Y
Application number: CNU2007201255041U
Authority: CN
Inventors: 刘相贤; 刘奎江; 刘聪德; 江丰全
Original assignee: Leading Precision Inc
Current assignee: Leading Precision Inc
Priority date: 2007-08-17
Filing date: 2007-08-17
Publication date: 2008-10-29
Anticipated expiration: 2017-08-17

Abstract

The utility model relates to an improved structure of a loading disk, which is applicable to the wafer making process, and has simple operation, convenient maintenance, low cost and high wafer cooling efficiency. The loading disk comprises an upper cover, a lower cover, a cooling channel and a plurality of channel outlets. The upper cover is provided with an inward concave area and a helical rib group, and the helical rib group is arranged in the inward concave area. The lower cover is provided with a top surface and a side surface, the top surface is connected to a plurality of rib top parts of the helical rib group, while the side surface is connected to one side wall of the inward concave area. The cooling channel is arranged in a sealed space encircled by the inward concave area, the helical rib group and the top surface. The channel outlets are connected to the cooling channel, wherein one cooling fluid flows in and out the cooling channel through the channel outlets to form a continuous cooling flow.

Description

The structure-improved of load plate

Technical field

The utility model relates to a kind of structure-improved of load plate, particularly relevant for a kind of silicon wafer process that is applicable to, has the structure-improved of the load plate of simple and easy, the low-cost and wafer high cooling efficiency of Operation and Maintenance.

Background technology

Generally speaking, manufacture of semiconductor often causes wafer to be in the condition of high temperature as processing procedures such as deposition or etchings, so one of significant consideration that the wafer heat radiation designs for wafer carrier.Existing wafer carrier 10 as shown in Figure 1 is comprising loam cake 11, heat-conducting layer 12, shrouding 13, Vacuumed insulation panel 14, cooling circuit 15 and a plurality of cooling line 16.Cooling circuit 15 is arranged in the enclosure space that shrouding 13 and Vacuumed insulation panel 14 surrounded, cooling fluid (graphic show) via a plurality of cooling lines 16 to connect the effect that cooling circuit 15 reaches a continuous cool stream.Vacuumed insulation panel 14 comprises a vacuum heat-insulation district 141, this vacuum heat-insulation district 141 by a plurality of joints 142 (the graphic joint that only shows) with the air in the extracting vacuum thermal insulation areas 141, to reach heat insulation to strengthen the cooling effect of wafer A.Yet the setting of this device is very loaded down with trivial details with operation, and for example a plurality of cooling lines 16 need outside the feeding means of external cooling fluid, also need dispose air exhauster with atmospheric density in controlling in the vacuum heat-insulation district 141.In addition, heat-conducting layer 12 also can increase and reduces thermal conduction effect along with the number of times of rising-heat contracting-cold, cause increasing maintenance cost, reduce cooling effectiveness, with possible operate miss.

Therefore, provide the load plate of simple and easy, the low-cost and wafer high cooling efficiency of an Operation and Maintenance, just become one of important topic of silicon wafer process.

Summary of the invention

In view of this, the purpose of this utility model is to overcome the deficiencies in the prior art and defective, propose a kind of structure-improved of load plate, particularly a kind of silicon wafer process that is applicable to has the structure-improved of the load plate of simple and easy, the low-cost and wafer high cooling efficiency of Operation and Maintenance.

For reaching above-mentioned purpose, the utility model provides a kind of structure-improved of load plate, comprising: a loam cake, have an indent district and a helical form fin group, and this helical form fin group is arranged in this indent district; One lower cover has an end face and a side, and this end face is connected in a plurality of fins top of this helical form fin group, and this side is connected in a sidewall in this indent district; One coolant flow channel is in the enclosure space that be arranged at this indent district, this helical form fin group, is surrounded with this end face; And a plurality of runners gateway, be connected in this coolant flow channel, and wherein a cooling fluid passes in and out this coolant flow channel via described runner gateway, to form a continuous cool stream.

The utlity model has following useful technique effect: the utility model is applicable to silicon wafer process, has the advantage of simple and easy, the low-cost and wafer high cooling efficiency of Operation and Maintenance.

The structure-improved of the load plate of being narrated in the utility model can be used in the processing procedures such as wafer deposition and etching.

Description of drawings

Fig. 1 is existing load plate schematic diagram;

Fig. 2 A is the structure improved profile of load plate;

Fig. 2 B is the loam cake schematic diagram.

Symbol description among the figure

10 existing wafer carrier 11 loam cakes

12 heat-conducting layers, 13 shroudings

14 Vacuumed insulation panels, 141 vacuum heat-insulation districts

More than 142 joint 15 cooling circuits

More than 16 cooling line A wafer

20 load plates, 21 loam cakes

211 indent districts, 2111 sidewalls

More than 2121 fin top of 212 helical form fin groups

22 lower covers, 221 end faces

More than 223 screw hole in 222 sides

More than 24 runner exit of 23 coolant flow channels.

Embodiment

Below with specific embodiment, each form content that the utility model is disclosed is described in detail.

With reference to Fig. 2 A, Fig. 2 A is the structure improved generalized section according to a kind of load plate provided by the utility model, and comprising a load plate 20, this load plate 20 comprises a loam cake 21, a lower cover 22, a coolant flow channel 23 and a plurality of runner exit 24.Loam cake 21 has an indent district 211 and a helical form fin group 212 (with reference to figure 2B, wherein helical form fin group 212 is surrounded on the geometric shape that becomes a circular spiral shape in the indent district 211).Lower cover 22 has an end face 221 and a side 222, and this end face 221 is connected in a plurality of fins top 2121 of helical form fin group 212, and side 222 is connected in a sidewall 2111 in indent district 211.In the enclosure space that coolant flow channel 23 is arranged at indent district 211, helical form fin group 212, surrounded with end face 221.A plurality of runners gateway 24 is connected in coolant flow channel 23, and wherein a cooling fluid (graphic demonstration) passes in and out coolant flow channels 23 to form a continuous cool stream via a plurality of runners gateway 24.

Further specify carrying one wafer on the load plate 21 (graphic demonstration).When beginning to cool down wafer, cooling fluid enters coolant flow channel 23 via gateway, first-class road 24, helical path along coolant flow channel 23 flows forward, sidewall to coolant flow channel 23 absorbs heat simultaneously, flows out from another runner gateway 24 then, and takes away the heat that absorbs from sidewall.Simultaneously, loam cake 21 temperature descend and take away unnecessary heat on the wafer.When cooling fluid by many more, the unnecessary heat of polycrystalline circle also is pulled away more, to reach the effect of wafer cooling.Because of coolant flow channel 23 is an annulo-spiral geometric shape, so the cooling effect of loam cake 21 also presents an annulo-spiral summary Temperature Distribution thereupon, this Temperature Distribution is one to be evenly distributed, and is evenly distributed so the cooling effect of wafer also is one.Thin speech, after cooling fluid enters coolant flow channel, alternately flow about in load plate and (that is flow at left right-hand part in turn, but not in the first half ones around just entering the second half ones after flowing), therefore can avoid cooling fluid when the second half, cause the second half cooling effects to descend because of heating up, make bulk temperature be non-and be evenly distributed.

Wherein, a plurality of runners gateway 24 is arranged at lower cover 22, yet a plurality of runners gateway 24 also can be arranged at loam cake 21 (graphic show), and the corresponding embodiment that the wafer cooling effect that produced and Fig. 2 A, 2B be set is similar.

In addition, loam cake 21 can be aluminium alloy or stainless steel made with lower cover 22, has good heat conduction and corrosion resistance characteristic.The sidewall 2111 in indent district 211 can be a tight assembly or a leakproof assembly with the connected mode of the side 222 of lower cover 22.This tight assembly can be one and interferes assembly, to reach sealing and hot linked effect.The leakproof assembly can be welding assembly or sealant assembly, and this sealant is arranged between side 222 and the indent district 211 to reach the effect that prevents the cooling fluid spill and leakage.

With reference to Fig. 2 B, wherein loam cake 21 has a plurality of screw holes 223 again, is used for and the locking assembly of 22 of lower covers.At this moment, the end face 221 of lower cover 22 can be connected in a plurality of fins top 2121 of helical form fin group 212, to prevent that cooling fluid is in 23 overflows of adjacent coolant flow channel.Further, end face 221 also can be hot link in a plurality of fins top 2121, to strengthen the cooling effect of load plate integral body.

Further, aforesaid cooling fluid can be the fluid of deionized water or other tool cooling effect, to produce the effect of cool wafers.

Though the utility model discloses as above with preferred embodiment, right its is not in order to limit the utility model, any those skilled in the art are not in breaking away from spirit and scope of the present utility model, when can doing a little change and retouching, for example former indent district that is arranged at loam cake and helical form fin group change and are arranged at lower cover etc.Therefore protection range of the present utility model is as the criterion as the scope person of defining that look claims.

Claims

1. the structure-improved of a load plate is characterized in that, comprising:

One loam cake has an indent district and a helical form fin group, and this helical form fin group is arranged in this indent district;

One lower cover has an end face and a side, and this end face is connected in a plurality of fins top of this helical form fin group, and this side is connected in a sidewall in this indent district;

One coolant flow channel is in the enclosure space that be arranged at this indent district, this helical form fin group, is surrounded with this end face; And

A plurality of runners gateway be connected in this coolant flow channel, and wherein a cooling fluid passes in and out this coolant flow channel via described runner gateway, to form a continuous cool stream.

2. load plate structure-improved as claimed in claim 1 is characterized in that, this lower cover is that aluminium alloy or stainless steel are made.

3. load plate structure-improved as claimed in claim 1 is characterized in that, this loam cake is that aluminium alloy or stainless steel are made.

4. load plate structure-improved as claimed in claim 1 is characterized in that, this end face hot link is in described fin top.

5. load plate structure-improved as claimed in claim 1 is characterized in that this side has a sealant, and the sealing floor is arranged between this side and this indent district.

6. load plate structure-improved as claimed in claim 1 is characterized in that, this cooling fluid is the fluid of deionized water or tool cooling effect.

7. load plate structure-improved as claimed in claim 1 is characterized in that, described runner gateway is connected in this lower cover.

8. load plate structure-improved as claimed in claim 1 is characterized in that, carrying one wafer on this load plate, and this cooling fluid cools off this wafer.

9. load plate structure-improved as claimed in claim 1 is characterized in that, this helical form fin group has spiral helicine geometric shape.