CN201075380Y - 一种塑封模具 - Google Patents

一种塑封模具 Download PDF

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Publication number
CN201075380Y
CN201075380Y CNU2007200329279U CN200720032927U CN201075380Y CN 201075380 Y CN201075380 Y CN 201075380Y CN U2007200329279 U CNU2007200329279 U CN U2007200329279U CN 200720032927 U CN200720032927 U CN 200720032927U CN 201075380 Y CN201075380 Y CN 201075380Y
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pit
carrier
plastic package
package die
utility
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CNU2007200329279U
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慕蔚
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Tianshui Huatian Machinery Co., Ltd.
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Tianshui Huatian Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

一种塑封模具，包括引线框架载体、框架内引脚、塑封模具下型腔及模具基体，其特征在于所述的塑封模具下型腔底部设有凹坑，使框架的内引脚部分嵌入其中。所述的引线框架的载体基岛既有不外露的，也有外露的，当所述的引线框架载体外露时，所述塑封模具下型腔底部除内引脚部位设有凹坑外，载体部位也设有凹坑，所述载体部位凹坑的深度比内引脚部位凹坑浅。本实用新型的下型腔底部有许多小凹腔使框架的内引脚部分在封装过程中嵌入其中，内引脚不被塑封料完全包围，有利于散热和提高产品的应用功率，增强产品的可靠性。

Description

一种塑封模具
技术领域
本实用新品涉及到电子信息自动化元器件制造技术领域，尤其涉及到一种半导体分立器件及集成电路封装结构，具体说是一种塑封模具。
背景技术
随着电子信息技术的高速发展，半导体材料的生产设备、工艺的日新月异，半导体工艺生产进入纳米时代。芯片的几何尺寸越来越小，器件的总功率和总电流相应降低。但相对尺寸的单位电流和功率相应增加，即客户对产品的散热提出了较高的要求，原有的封装模具结构不能满足特殊产品的封装要求，不仅要从框架、导电胶、塑封料等封装方面改进优选，而且必然对塑封模具的下型腔进行新的设计和精确加工，来满足客户特殊要求的需要。
实用新型内容
本实用新型要解决的技术问题主要是：现有的塑封模具的下型腔虽然下凹，但底部是一个平面，不能满足特殊产品要求部分内引脚外露，提高散热效果的需要，因此本实用新型的塑封模具下型腔的底部不是一个平面，而是有许多小凹腔使框架的内引脚部分在封装过程中嵌入其中，保证这部分内引脚不被包围而裸露的一种塑封模具。
本实用新型解决上述问题的技术方案为：
一种塑封模具，包括引线框架载体、框架内引脚、塑封模具下型腔及模具基体，其特征在于所述的塑封模具下型腔底部设有凹坑，使框架的内引脚部分嵌入其中。
所述的引线框架的载体基岛既有不外露的，也有外露的，当所述的引线框架载体外露时，所述塑封模具下型腔底部除内引脚部位设有凹坑外，载体部位也设有凹坑，所述载体部位凹坑的深度比内引脚部位凹坑浅。
本实用新型的塑封模具下型腔的底部不是一个平面，而是有许多小凹腔使框架的内引脚部分在封装过程中嵌入其中，保证这部分内引脚不被包围而裸露。这种封装的产品内引脚不被塑封料完全包围，至少有1/3～1/2引脚厚度部分裸露在塑封体外面，载体基岛既可以外露301，也可以不外露201。该封装的塑封模具的下型腔凹模中，根据框架的内引脚205、305位置、载体基岛301位置和裸露的厚度，精确制造出一定形状和深度的凹坑，满足产品的封装时内引脚205、305部分和载体基岛301部分外露的要求。本设计有利于散热和提高产品的应用功率，增强产品的可靠性。
附图说明
图1为本实用新型载体不外露的塑封产品剖视结构示意图；
图2为本实用新型载体不外露的模具型腔主视图；
图3为本实用新型载体不外露的模具型腔俯视图；
图4为本实用新型载体外露的塑封产品剖视结构示意图；
图5为本实用新型载体外露的模具型腔主视图；
图6为本实用新型载体外露的模具型腔俯视图。
具体实施方式
下面结合附图对本实用新型进行进一步详细说明：
一种塑封模具，包括引线框架载体、框架内引脚、塑封模具下型腔及模具基体，塑封模具下型腔的底部不是一个平面，而是有许多小凹坑使框架的内引脚部分在封装过程中嵌入其中，保证这部分内引脚在塑封时不被包围而裸露。
在附图1中，载体基岛201上是粘接材料202，粘接材料202上面是IC芯片203，金线204跨接在IC芯片203和内引脚205上，构成信号通道，塑封体206将内引脚205上层部分和基岛201、粘接材料202、IC芯片203包围形成电路整体。
在附图4中，载体基岛301上是粘接材料302，粘接材料302上面是IC芯片303，金线304跨接在IC芯片303和内引脚305上，构成信号通道，塑封体306将内引脚305和载体基岛301的上层部分、粘接材料302、IC芯片303包围形成电路整体。
在附图1的208和附图4的308是塑封模基体。
本实用新型的引线框架的载体基岛既有不外露的201，也有外露的301。
当框架载体不外露时，塑封模具下型腔207底部，除内引脚205部位设计为凹坑209外，下型腔207底部的其余部位不下凹，并且处于同一个平面。塑封时，引线框架放入下模中，框架的引脚205落入下型腔207预先设计的凹坑209内，每个引脚的一部份露在凹坑209外面，并且被塑封过程注入的塑封料包围，与其余部份的塑封料连在一起，形成电路的整体，而嵌入凹坑209内的引线裸露，有利于散热和提高产品的应用功率，增强产品的可靠性。
当框架载体基岛301外露时，塑封模具下型腔307底部除内305引脚部位设计为凹坑309外，载体部位301也要设计为凹坑310，但载体基岛301部位凹坑310的深度要比内引脚305凹坑309浅，塑封模具下型腔307的其余部位不下凹，并处于同一水平面。
塑封时，引线框架放入下模，框架的内引脚305落入下型腔307预先设计的凹坑309内，并且载体基岛301部位也落入预先设计的凹坑310内，但每个305的内引脚和载体基岛301侧面至少有三分之一部份露在凹坑309和310外面，并且被塑封过程注入的塑封料包围，与其余部份的塑封料连在一起，形成电路的整体，而嵌入凹坑309的引线和嵌入凹坑310的载体裸露，有利于散热和提高产品的应用功率，增强产品的可靠性。

Claims (3)

1.一种塑封模具，包括引线框架载体、框架内引脚、塑封模具下型腔及模具基体，其特征在于所述的塑封模具下型腔底部设有凹坑，使框架的内引脚部分嵌入其中。
2.根据权利要求1所述的一种塑封模具，其特征在于所述的引线框架的载体既有不外露的，也有外露的，当所述的引线框架载体外露时，所述塑封模具下型腔底部除内引脚部位设有凹坑外，载体部位也设有凹坑，所述载体部位凹坑的深度比内引脚部位凹坑浅。
3.根据权利要求1或2所述的一种塑封模具，其特征在于所述凹坑的形状和深度与所嵌入的内引脚位置、基岛位置及其裸露的厚度相对应。
CNU2007200329279U 2007-09-29 2007-09-29 一种塑封模具 Expired - Fee Related CN201075380Y (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103219297A (zh) * 2012-01-20 2013-07-24 矽品精密工业股份有限公司 承载板、半导体封装件及其制法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103219297A (zh) * 2012-01-20 2013-07-24 矽品精密工业股份有限公司 承载板、半导体封装件及其制法

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Address after: 741000 No. 14 Shuangqiao Road, Gansu, Tianshui

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