CN201047510Y - High power LED lamp and LED element thereof - Google Patents

Abstract

The utility model discloses a high power LED lamp contains a cup lamp body, a LED component, a switching ring and a circuit board. The inner surface of the cup-shaped lamp shell is a reflecting curved surface which can reflect the light emitted by the LED element arranged at the bottom of the cup-shaped lamp shell, so that the luminous efficiency of the LED element is improved; the positions of the LED elements have a ratio relationship: h is more than 0.05_L/H_T< 0.35, wherein H_TIs the total vertical depth, H, of the cup-shaped lamp envelope_LIs the vertical distance from the surface of the LED element to the bottom of the cup-shaped lamp housing. The adapter ring is used for fixedly connecting the LED elements. The circuit board serves as an interface for providing power to the LED element. The LED element comprises an LED packaging piece, a ring body, an electrode plate and an insulating glue layer which are arranged in a laminated mode. The electrode plate is arranged below the ring body and comprises a vertical column penetrating through the ring body, and the top end of the vertical column is connected with the bottom of the LED packaging piece. The insulating glue layer is stacked between the electrode plate and the ring body and used for insulating the positive electrode and the negative electrode.

Description

High-power light-emitting diode lamp and its light-emitting diode element

technical field

The utility model relates to a high-power light emitting diode (Light Emitting Diode; LED) lamp and an LED element thereof.

Background technique

In recent years, white light-emitting diodes (LEDs) are the most promising emerging products that attract global attention. It has the advantages of small size, low power consumption, long life and good response speed, etc., and can solve the problems that incandescent bulbs were difficult to overcome in the past. LEDs are used in display backlights, mini projectors, lighting and automotive light sources and other markets are gaining more and more attention.

At present, countries such as Europe, America and Japan are actively developing white light-emitting diodes as a new light source for lighting in this century based on the consensus of energy conservation and environmental protection. In addition, many countries currently rely on imports of energy, which makes its development in the lighting market extremely valuable. According to expert evaluation, if Japan replaces all incandescent lamps with white light-emitting diodes, it can save the power generation of 1 to 2 power plants every year, indirectly reduce fuel consumption by 1 billion liters, and reduce emissions during power generation. Carbon dioxide will also be reduced, thereby inhibiting the greenhouse effect. Based on the above content, advanced countries such as Europe, America and Japan have invested a lot of manpower to promote research and development. It is expected that in the next ten years, traditional lighting fixtures can be generally replaced.

However, for high-power LEDs for lighting, only about 15-20% of the power input to the LED is converted into light, and the remaining 80-85% is converted into heat. If the heat cannot be dissipated to the environment in a timely manner, the interface temperature of the LED element will be too high, which will affect its luminous intensity and service life. Therefore, the problem of thermal management of LED components has been paid more and more attention.

Referring to Fig. 1, a high-power LED lamp 10 of a traditional MR-16 specification includes a cup-shaped lamp housing 11, a lamp holder 12, two plug-in pins 13, an LED element 14, wires 15, an insulating sheet 16, an Lens 17 and a mirror cover 18. The LED element 14 is fixed on the insulating sheet 16 , connected to the lamp holder 12 through the wire 15 , and then connected to a power source through the plug pin 13 to make the LED element 14 emit light. The inner surface of the general cup-shaped lamp housing 11 has no reflective effect, and a lens 17 is required to effectively emit light from the LED element 14 . The lamp cover 18 is used to fix the lens 17 . In addition, the lens 17 is replaced by a reflective mirror to enhance the emitting effect of the LED light.

However, the above-mentioned traditional LED lamps all need additional lenses or reflectors to effectively emit LED light, which increases the cost burden; and because the LED components are arranged on an insulating board, the heat dissipation effect is poor, resulting in the LED lamp due to the overall heat dissipation. Bad and rapid depletion of light intensity.

Due to the design of traditional LED lamps, it is difficult to achieve small size and high heat dissipation effect. The LED light source cannot be placed near the focus (bottom) of the arc-shaped cup-shaped lamp housing, causing the placement point of the LED light source to exceed the total depth of the arc-shaped cup-shaped lamp housing. 50%, that is, H _L /H _T >0.50, where H _T is the total vertical depth of the arc-shaped cup-shaped lamp housing, and H _L is the vertical distance from the surface of the LED component to the bottom of the cup-shaped lamp housing, because the LED light source If the placement point is too high, if there is no lens to correct the light, the LED lamp will lose its usability due to excessive divergence of light, but if a lens is added, the cost will increase and heat dissipation will not be easy. Furthermore, when the LED element is damaged, the entire set of LED lamps must be replaced, which is not economical.

Contents of the invention

The utility model provides a high-power LED lamp and an LED component thereof. The structure is simple and does not require lens or lampshade, and has good heat dissipation effect, which can not only increase the service life of the LED component, but also reduce the production cost. Furthermore, the LED element of the present invention can be disassembled from the LED lamp, so when the LED element is damaged, only the LED element therein needs to be replaced, thereby further reducing the maintenance cost.

The high-power LED lamp of the utility model comprises a cup-shaped lamp housing, an LED element, an adapter ring and a circuit board. The inner surface of the cup-shaped lamp housing is a reflective curved surface, which can reflect the light emitted by an LED element arranged at the bottom thereof, thereby improving the luminous efficiency of the LED element. The adapter ring is used for fixed connection of the LED elements. The circuit board serves as an interface for providing power to the LED elements. If _HT represents the total vertical depth of the cup-shaped lamp housing, H _L represents the vertical distance from the surface of the LED element to the bottom of the cup-shaped lamp housing, and the placement position of the LED element is 0.05<H _L / _HT <0.35 relationship.

Preferably, the inner surface of the adapter ring is provided with a female thread, and the side of the LED element is provided with a corresponding male thread, whereby the LED element can be locked in the adapter ring. The circuit board includes a conductive contact, which is connected to the bottom of the LED element as a positive connection; the male thread on the side of the LED element is used as a negative connection. Through the arrangement of the above-mentioned male and female threads, damaged LED elements can be easily replaced without replacing the entire set of LED lamps.

The high-power LED element of the utility model includes an LED package, a ring body and an electrode sheet, which are stacked. The LED package includes an LED tube core, and the ring is disposed under the LED package. The electrode sheet is disposed under the ring body, and includes a vertical post passing through the ring body, and the top of the vertical post is connected to the bottom of the LED package. The electrode sheet and the ring body are respectively used as positive and negative electrodes of the LED element.

The high-power LED lamp of the utility model not only has a simple structure, but also the adapter ring and the cup-shaped lamp housing have heat dissipation effect, and the setting without lens or lampshade can further improve the heat dissipation effect, thereby solving the current problem of high-power LED The most serious heat dissipation problem of the lamp.

Description of drawings

Figure 1 is an exploded schematic diagram of a conventional high-power LED lamp;

Fig. 2 is an exploded schematic view of the high-power LED lamp of the first embodiment of the present invention;

Fig. 3 (a) is the three-dimensional schematic diagram of the combination of the high-power LED lamp of the first embodiment of the present invention;

Fig. 3 (b) is the side view of the high-power LED lamp of the utility model first embodiment;

Fig. 4 is an exploded schematic view of the high-power LED lamp of the second embodiment of the present invention;

Fig. 5 is a three-dimensional schematic diagram of the combination of high-power LED lamps according to the second embodiment of the present invention; and

Fig. 6 is an exploded schematic view of the LED element of the present invention.

Detailed ways

2, 3(a) and 3(b) are schematic diagrams of the high-power LED lamp of the first embodiment of the present invention; FIG. 2 is an exploded schematic diagram thereof, and FIG. 3(a) shows the three-dimensional state when combined, and FIG. 3( b) is its side view.

Referring to FIG. 2 , a high power LED lamp 20 includes a cup-shaped lamp housing 21 , a lamp holder 22 , a heat dissipation gel 23 , a circuit board 24 , an adapter ring 26 and an LED element 27 .

Because a general high-power LED can withstand a voltage of 3.4V and 350mA, compared with the 12V or 110V used by the traditional halogen lamp of MR-16 specification, the high-power LED lamp needs the circuit board 24 for voltage conversion. The circuit board 24 has two plug-in pins 25 for connecting to a power supply, and has a conductive contact 241 for conductively connecting the anode of the LED element 27 . The circuit board 24 is disposed therein in conjunction with the heat dissipation gel 23 to match the inner shape of the lamp holder 22 . The adapter ring 26 has a female thread 261 inside, and the female thread 261 corresponds to the male thread 271 of the LED element 27 for locking the LED element 27 . In addition, the adapter ring 26 in this embodiment can be made of metal, because it directly contacts the LED element 27 with screw teeth, which can further increase the heat dissipation effect.

Referring to FIG. 3( a ), the inner surface of the cup-shaped lamp housing 21 is provided with a reflective curved surface 211 to effectively emit the light emitted by the LED element 27 . After the combination of the high-power LED lamps 20 , because the LED elements 27 are disposed at the bottom of the cup-shaped lamp housing 21 , that is, close to the focal point of the reflective curved surface 211 , the emission effect is better. Fig. 3 (b) is the side view of the high-power LED lamp 20 of Fig. 3 (a), H _T is the total vertical depth of the cup-shaped lamp housing 21, H _L is the surface of the LED element 27 to the bottom of the cup-shaped lamp housing 21 The vertical distance, where the ratio of _HL to _HT is: 0.01< _HL / _HT <0.50, the preferred ratio is: 0.03< _HL / _HT <0.40, the best ratio is: 0.05< _HL / H _T < 0.35.

4 and 5 are schematic diagrams of a high-power LED lamp according to a second embodiment of the present invention; FIG. 4 is an exploded schematic diagram thereof, and FIG. 5 shows a three-dimensional state when assembled. Compared with the high-power LED lamp 20 of the first embodiment, the high-power LED lamp 30 of the second embodiment adds a heat dissipation cover 28 between the LED element 27 and the adapter ring 26, which can further improve the heat dissipation effect .

6 is an exploded view of the LED element 27, which includes an LED package 272, a ring 273, an insulating adhesive layer 274, and an electrode sheet 275, which are stacked. The LED package 272 is an assembly of LED die 277 packages. The LED package 272 and the ring body 273 are adhered by applying solder paste or silver glue or thermal conductive film through reflow or high temperature curing. A vertical post 276 protrudes from the center of the electrode piece 275 , passes through the central hole of the insulating adhesive layer 274 and the ring body 273 and connects to the bottom of the LED package 272 , serving as the anode of the LED package 272 . In contrast, the male thread 271 connected to the ring body 273 of the adapter ring 26 serves as the negative pole of the LED package 272 . The insulating adhesive layer 274 is stacked between the electrode sheet 275 and the ring body 273 for positive and negative insulation. The thermal conductivity of the insulating adhesive layer 274 is greater than 1.0 W/mK.

The high-power LED lamp 20 or 30 of the present utility model does not need the setting of the traditional lens or lampshade, and directly exposes the LED element 27 to the air, and adds the adapter ring 26, the cup-shaped lamp housing 21 and the heat-dissipating gel 23, etc. Both have heat dissipation effect, so the heat dissipated by the LED element 27 can be effectively dissipated, thereby prolonging the service life of the LED element 27 . In addition, when the LED element 27 is damaged, it can be replaced directly without replacing the entire set of LED lamps 20 or 30 , which can greatly reduce the maintenance cost of the user.

The technical content and technical features of the present utility model have been disclosed above, but those skilled in the art may still make various replacements and modifications based on the teaching and disclosure of the present utility model without departing from the spirit of the present utility model. Therefore, the protection scope of the utility model should not be limited to the contents disclosed in the embodiments, but should include various replacements and modifications that do not depart from the utility model, and are covered by the appended claims.

Claims (12)

1. A high-power light-emitting diode LED lamp, characterized in that it comprises: A cup-shaped lamp housing, the inner surface of which is a reflective curved surface; An LED element is arranged at the bottom of the cup-shaped lamp housing, and the light emitted by it can be reflected by the reflective curved surface. The total vertical depth of the cup-shaped lamp housing is the same as the surface of the LED element to the cup-shaped lamp housing The ratio of the vertical distance of the bottom is greater than 0.05 and less than 0.35; an adapter ring for fixed connection of the LED element; and A circuit board serves as an interface for providing power to the LED element. 2. The high-power light-emitting diode (LED) lamp according to claim 1, wherein the side of the LED element is provided with a male thread, and the adapter ring is provided with a corresponding female thread for locking the LED element. 3. The high-power light-emitting diode (LED) lamp according to claim 1, wherein the circuit board includes a conductive contact connected to the bottom of the LED element as a positive connection. 4. The high-power light-emitting diode (LED) lamp according to claim 1, further comprising a lamp holder arranged at the bottom of the cup-shaped lamp housing, wherein the circuit board is arranged on the lamp holder in combination with heat-conducting gel middle. 5. The high-power light-emitting diode (LED) lamp according to claim 1, further comprising a heat dissipation cover disposed between the LED element and the adapter ring. 6. The high-power light-emitting diode (LED) lamp according to claim 2, wherein said LED element comprises: An LED package comprising at least one LED die; a ring body, disposed under the LED package, and its side contains the male thread; an electrode sheet, disposed under the ring body, and includes a straight post pierced through the ring body, the top of the upright post is connected to the bottom of the LED package; and An insulating glue layer is stacked between the electrode sheet and the ring body for positive and negative insulation. 7. The high-power light-emitting diode (LED) lamp according to claim 6, characterized in that the electrode sheet is used as the anode of the LED element. 8. The high-power light-emitting diode (LED) lamp according to claim 6, characterized in that the male thread is used as the negative pole of the LED element. 9. The high-power light-emitting diode LED lamp according to claim 6, characterized in that the thermal conductivity of the insulating adhesive layer is greater than 1.0 W/mK. 10. A high-power LED component for installation in a high-power LED lamp, said LED lamp comprising an adapter ring with a female thread inside, characterized in that said high-power LED component comprises: An LED package comprising at least one LED die; A ring body is disposed under the LED package, and its side surface includes a male thread corresponding to the female thread; an electrode sheet, disposed under the ring body, and includes a straight post pierced through the ring body, the top of the upright post is connected to the bottom of the LED package; and An insulating glue layer is stacked between the electrode sheet and the ring body for positive and negative insulation. 11. The high-power LED element according to claim 10, characterized in that the ring body and the adapter ring are electrically connected to the negative electrode of the LED element. 12. The high-power LED element according to claim 10, characterized in that the electrode sheet is used as the positive pole of the LED element, and the male thread on the side of the ring body is used as the negative pole of the LED element.

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