CN201018268Y - Semiconductor refrigeration system superheating protective equipment - Google Patents
Semiconductor refrigeration system superheating protective equipment Download PDFInfo
- Publication number
- CN201018268Y CN201018268Y CNU2007200482300U CN200720048230U CN201018268Y CN 201018268 Y CN201018268 Y CN 201018268Y CN U2007200482300 U CNU2007200482300 U CN U2007200482300U CN 200720048230 U CN200720048230 U CN 200720048230U CN 201018268 Y CN201018268 Y CN 201018268Y
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- China
- Prior art keywords
- chip microcomputer
- refrigeration system
- semiconductor refrigeration
- utmost point
- protection device
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- Expired - Fee Related
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Abstract
The utility model discloses a thermal protection device for a semiconductor refrigeration system, which is characterized in that: the utility model comprises a singlechip, a temperature collection circuit and a MOSFET tube; the output end of the temperature collection circuit is connected to the input end of the singlechip; the output end of the singlechip is connected to a G pole of the MOSFET tube. The utility model, which controls the power switch for a refrigeration chip by utilizing the MOSFET tube, does not result in mechanical failure and oxidation, so as to ensure the long-term stable operation of the protection device. The utility model, after controlling the power switch for the refrigeration chip for a plurality of times, will switch off the power source for the refrigeration chip, so as to prevent the failure resulted from the frequent switch-on and switch-off of power source.
Description
Technical field
It is a kind of overtemperature protection system that the utility model relates to, and is specifically related to the overtemperature protection system on a kind of radiator that is used for semiconductor refrigeration system.
Background technology
In the prior art, all has overtemperature protection system in the semiconductor refrigeration system.Overtemperature protection system commonly used is that core is formed with a kind of overheat protector, and the series connection of this kind overheat protector is connected with the refrigerating chip in the semiconductor refrigeration system, and its induction shell contacts with the heat radiation aluminium block of radiator.When the radiator fan of radiator breaks down; the heat radiation aluminium block temperature of radiator raises; after the temperature that the shell of overheat protector is sensed the heat radiation aluminium block was elevated to a certain value, the sensible heat switch of overheat protector moved, and overheat protector is equivalent to the power supply of switch disconnection refrigerating chip.After the temperature of heat radiation aluminium block drops to certain value, the sensible heat switch closure in the overheat protector, refrigerating chip gets electric working on.After the refrigerating chip work, when the temperature of heat radiation aluminium block rose to uniform temperature, overheat protector disconnected the power supply of refrigerating chip again, makes its cooling.So constantly circulate repeatedly, till it is found that.There is such defective in this kind overtemperature protection system: 1, the constantly closed or disconnection of the switch of overheat protector; the action of this mechanical closure or disconnection is when carrying out; can produce spark in the contact position; spark meeting oxidized metal sheet; cause the overtemperature protection job insecurity; also can cause overheat protector to damage, the overheat protector life-span is low.2, in or the process that disconnects constantly closed at overheat protector, the power supply of refrigerating chip can constantly carry out closure or disconnection, and under these circumstances, refrigerating chip is subjected to the influence of power supply easily and burns.
The utility model content
The utility model technical issues that need to address provide a kind of semiconductor refrigeration system overtemperature protection system, this kind overtemperature protection system working stability, and closure or deenergization repeatedly can not play reasonable protective effect to refrigerating chip.
Technical problem of the present utility model can solve by taking following measure:
A kind of semiconductor refrigerating thermel protection device is characterized in that: comprise single-chip microcomputer, temperature collection circuit, MOSFET pipe, the output of temperature collection circuit connects the input of single-chip microcomputer, and the output of single-chip microcomputer connects the G utmost point of MOSFET pipe.
The utility model technical solution problem, can also take following measure:
The model of described single-chip microcomputer is 501B, temperature collection circuit is made of a thermistor, a standard resistor and an electric capacity, one end of described standard resistor, thermistor is electrically connected with pin 2, the pin 3 of single-chip microcomputer respectively, the other end is electrically connected with a utmost point of electric capacity, another utmost point ground connection of electric capacity adopts the RC charge-discharge principle to measure temperature; The pin 5 of single-chip microcomputer is electrically connected with the G utmost point of MOSFET pipe by resistance.
The G utmost point of described MOSFET pipe is by a grounding through resistance.
Described monolithic under-chassis 7 is electrically connected the warning device input.
Described warning device is buzzer warning device or light-emitting diode warning device.
The utlity model has following technique effect:
The temperature that single-chip microcomputer is gathered semiconductor refrigeration system by temperature collection circuit obtains the temperature that detected by parameter comparison again.If the temperature that detects is low than the value that sets, then, the refrigerating chip of refrigerating system is powered by the OUT mouth driven MOS FET pipe conducting of single-chip microcomputer.If the value height that the temperature that detects contrast sets then disconnects by OUT mouth driven MOS FET pipe, the refrigerating chip outage, monolithic counter adds 1 simultaneously.Then, wait for that detecting temperature is lower than design temperature, connects the refrigerating chip power supply again.If detecting temperature raises once more, repeat top-operation, greater than 3 o'clock, single-chip microcomputer was then controlled the refrigerating chip power supply and is disconnected no longer repetitive operation up to counter.When being connected with warning device, single-chip microcomputer also can drive warning device, reminds the user to produce the heat radiation fault.
The utility model can not produce mechanical breakdown and oxidation to utilizing the on/off of MOSFET control refrigerating chip, can make protective device steady operation chronically.Behind the certain number of times of the utility model protective device control refrigerating chip power supply switching, can keep stopping the power supply of refrigerating chip, the power supply of having avoided refrigerating chip is switching band and the fault brought constantly.
Description of drawings
Fig. 1 is the circuit structure block diagram of the utility model overtemperature protection system.
Fig. 2 is the electrical schematic diagram of the utility model overtemperature protection system.
Embodiment
Below in conjunction with specific embodiment the utility model is specifically described.
As shown in Figure 1 and Figure 2.The semiconductor refrigeration system thermel protection device comprises single-chip microcomputer, temperature collection circuit, MOSFET pipe.To this device power supply is conventional power circuit.The output of temperature collection circuit connects the input of single-chip microcomputer, and the output of single-chip microcomputer connects the G utmost point of MOSFET pipe.Described single-chip microcomputer is the 501B integrated circuit (IC) chip for the model that sonix company produces.The pin 6 of single-chip microcomputer is electrically connected behind the switches ground connection again by resistance R 3.Temperature collection circuit is made of a thermistor, a standard resistor and an electric capacity, and an end of described standard resistor, thermistor is electrically connected with pin 2, the pin 3 of single-chip microcomputer respectively, and the other end is electrically connected with a utmost point of electric capacity, another utmost point ground connection of electric capacity.The pin 5 energising resistance R7 of single-chip microcomputer are electrically connected with the G utmost point of MOSFET pipe.The G utmost point of described MOSFET pipe is by a resistance R 1 ground connection.Monolithic under-chassis 7 is electrically connected a line connector, and this line connector can connect the warning device input, and described warning device is buzzer warning device or light-emitting diode warning device.
Operation principle: during use, the power input of refrigerating chip is connected with the power output end of protective device.Monolithic under-chassis 3 charges by thermistor R4 and electric capacity, by the single-chip microcomputer record charging interval, by 2 couples of standard resistor R5 of pin electric capacity is charged again, the record charging interval, the resistance that relatively draws thermistor by two times obtains the temperature that thermistor detects by parameter comparison again.If the temperature that detects is low than the value that sets, then, cooling piece is powered by the OUT mouth pin 5 driven MOS FET pipe conducting of single-chip microcomputer.If the value height that the temperature that detects contrast sets then disconnects the refrigerating chip power supply by OUT mouth driven MOS FET pipe, simultaneously, monolithic counter adds 1.Then, single-chip microcomputer waits for that detecting temperature is lower than design temperature, connects the refrigerating chip power supply by the MOSFET pipe again.If the temperature of surveying raises once more, repeat top-operation.When utilizing the on/off of MOSFET control refrigerating chip, mechanical breakdown and oxidation can be do not produced, protective device steady operation chronically can be made.When counter greater than 3 the time, single-chip microcomputer is then controlled the refrigerating chip power supply and is disconnected no longer repetitive operation.And, drive warning device by pin 7, remind the user to produce the heat radiation fault.Behind the certain number of times of the utility model protective device control refrigerating chip power supply switching, can keep stopping the power supply of refrigerating chip, the power supply of having avoided refrigerating chip is switching band and the fault brought constantly.
Claims (5)
1. a semiconductor refrigeration system thermel protection device is characterized in that: comprise single-chip microcomputer, temperature collection circuit, MOSFET pipe, the input of the output connection single-chip microcomputer of temperature collection circuit, the G utmost point of the output connection MOSFET pipe of single-chip microcomputer.
2. semiconductor refrigeration system thermel protection device according to claim 1, it is characterized in that: the model of described single-chip microcomputer is 501B, temperature collection circuit is made of a thermistor, a standard resistor and an electric capacity, one end of described standard resistor, thermistor is electrically connected with pin 2, the pin 3 of single-chip microcomputer respectively, the other end is electrically connected with a utmost point of electric capacity, another utmost point ground connection of electric capacity; The pin 5 of single-chip microcomputer is electrically connected with the G utmost point of MOSFET pipe by resistance.
3. semiconductor refrigeration system thermel protection device according to claim 2 is characterized in that: the G utmost point of described MOSFET pipe is by a grounding through resistance.
4. semiconductor refrigeration system thermel protection device according to claim 3 is characterized in that: described monolithic under-chassis 7 is electrically connected the warning device input.
5. semiconductor refrigeration system thermel protection device according to claim 4 is characterized in that: described warning device is buzzer warning device or light-emitting diode warning device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200482300U CN201018268Y (en) | 2007-02-05 | 2007-02-05 | Semiconductor refrigeration system superheating protective equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200482300U CN201018268Y (en) | 2007-02-05 | 2007-02-05 | Semiconductor refrigeration system superheating protective equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201018268Y true CN201018268Y (en) | 2008-02-06 |
Family
ID=39058768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200482300U Expired - Fee Related CN201018268Y (en) | 2007-02-05 | 2007-02-05 | Semiconductor refrigeration system superheating protective equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201018268Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102055170A (en) * | 2009-10-29 | 2011-05-11 | 喜来健株式会社 | Overheat prevention circuit for heat source of thermotherapy device |
-
2007
- 2007-02-05 CN CNU2007200482300U patent/CN201018268Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102055170A (en) * | 2009-10-29 | 2011-05-11 | 喜来健株式会社 | Overheat prevention circuit for heat source of thermotherapy device |
| CN102055170B (en) * | 2009-10-29 | 2013-09-18 | 喜来健株式会社 | Overheat prevention circuit for heat source of thermotherapy device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080206 Termination date: 20130205 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |