CN201004467Y - A white light emitting device - Google Patents
A white light emitting device Download PDFInfo
- Publication number
- CN201004467Y CN201004467Y CNU2006201562670U CN200620156267U CN201004467Y CN 201004467 Y CN201004467 Y CN 201004467Y CN U2006201562670 U CNU2006201562670 U CN U2006201562670U CN 200620156267 U CN200620156267 U CN 200620156267U CN 201004467 Y CN201004467 Y CN 201004467Y
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- light
- light emitting
- white light
- emitting device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
Description
技术领域technical field
本实用新型提供一种改变光源波长之发光装置,特别是指一种白光发光装置。The utility model provides a light-emitting device for changing the wavelength of a light source, in particular to a white-light light-emitting device.
背景技术Background technique
所谓白光是多种色光混合而成的光,以人类眼睛所能看见的白光形式至少需两种光混合,二波长光(蓝色光+黄色光)或三波长光(蓝色光+绿色光+红色光),目前已商品化的产品有二波长蓝光单芯片加上黄色(YAG)荧光粉,及在未来较看好的三波长光,尤其是以紫外光芯片加上红蓝绿三色荧光粉。The so-called white light is a mixture of various colors of light. In the form of white light that can be seen by human eyes, at least two kinds of light are mixed, two-wavelength light (blue light + yellow light) or three-wavelength light (blue light + green light + red light) light), the currently commercialized products include two-wavelength blue light single-chip plus yellow (YAG) phosphors, and three-wavelength light that is more promising in the future, especially ultraviolet light chips plus red, blue and green phosphors.
白光LED用在照明或是LCD面板光源块的光源上,前景备受全球瞩目,欧、美及日本等先进国家也投注许多人力,并成立专门的机构推动白光LED研发工作。LED目前的技术都是利用黄色荧光粉如YAG、TAG直接涂于蓝光芯片上以产生白光,或是将三色荧光粉涂于紫外光LED芯片上以产生白光。White LEDs are used for lighting or as light sources for LCD panel light source blocks. The prospect has attracted global attention. Advanced countries such as Europe, the United States, and Japan have invested a lot of manpower and established special institutions to promote the research and development of white LEDs. The current LED technology is to use yellow phosphors such as YAG and TAG to directly coat blue light chips to produce white light, or to apply three-color phosphors to ultraviolet LED chips to produce white light.
实用新型内容Utility model content
本实用新型的目的是提供一种组合式以产生白光的白光发光装置。The purpose of the utility model is to provide a combined white light emitting device for generating white light.
为实现上述目的,本实用新型的解决方案是:一种白光发光装置,是由发光芯片与其光线经过的配件构成,其中在发光芯片光线经过的配件上涂覆有荧光粉层。In order to achieve the above object, the solution of the present invention is: a white light emitting device, which is composed of a light-emitting chip and the accessories through which the light passes, wherein a phosphor layer is coated on the accessories through which the light of the light-emitting chip passes.
所述的发光芯片为蓝光芯片,则其光线经过的配件上的荧光粉层为黄色(YAG)荧光粉。The light-emitting chip is a blue light chip, and the phosphor layer on the accessory through which the light passes is yellow (YAG) phosphor.
所述的发光芯片为紫外光芯片,则其光线经过的配件上的荧光粉层为红蓝绿三色荧光粉。The light-emitting chip is an ultraviolet light chip, and the fluorescent powder layer on the accessory through which the light passes is red, blue and green three-color fluorescent powder.
所述的发光芯片光线经过的配件为涂覆有荧光粉层的壳体。The accessory through which light from the light-emitting chip passes is a shell coated with a phosphor layer.
所述的壳体为透光体。The shell is a transparent body.
所述的壳体形状为镜面半弧形、平板型、管状、圆筒状、柱状或其它形状。The shape of the shell is mirror semi-arc, flat plate, tube, cylinder, column or other shapes.
所述的发光芯片可置于涂覆有荧光粉层的配件之底部、中间、内层或外侧,其数目可为单个或复数个串列、各种几何形状排列。The light-emitting chip can be placed on the bottom, middle, inner layer or outer side of the accessory coated with the phosphor layer, and its number can be single or multiple in series and arranged in various geometric shapes.
所述的涂覆有荧光粉层的配件为镜片,其是利用粘看剂贴合于封装时所用发光芯片上。The accessory coated with the phosphor layer is a lens, which is pasted on the light-emitting chip used for packaging by using an adhesive.
所述的镜片可利用树脂、粘着剂、接合剂贴合于发光芯片上。The lens can be pasted on the light-emitting chip by using resin, adhesive and bonding agent.
所贴合的发光芯片可为单个或矩阵排列方式的复数个。The bonded light-emitting chips can be single or multiple in a matrix arrangement.
采用上述方案后,本实用新型是将荧光粉层涂覆于发光芯片光线经过的配件上,则成型的配件上的荧光粉层在受发光芯片照射后部份光线线改变光源波长再经混光效果,以得出人类眼睛所能感觉之白光的效果。本实用新型藉由发光二极管(LED芯片)作为光源来激发荧光粉,而达到产生白光的效果,大大降低生产成本及提高产品之竞争力。After adopting the above scheme, the utility model is to coat the fluorescent powder layer on the accessories through which the light-emitting chip light passes, then the fluorescent powder layer on the formed accessories will change the wavelength of the light source after being irradiated by the light-emitting chip and then mix the light. Effect, in order to obtain the effect of white light that human eyes can perceive. The utility model uses light-emitting diodes (LED chips) as a light source to excite fluorescent powder to achieve the effect of generating white light, greatly reducing production costs and improving product competitiveness.
下列结合附图和实施例对本实用新型进一步说明:The utility model is further described below in conjunction with accompanying drawing and embodiment:
附图说明Description of drawings
图1为本实用新型第一实施例的示意图;Fig. 1 is the schematic diagram of the utility model first embodiment;
图2、图3、图4、图5为本实用新型第一实施例应用于不同发光装置的示意图;Fig. 2, Fig. 3, Fig. 4 and Fig. 5 are schematic diagrams of the application of the first embodiment of the utility model to different light-emitting devices;
图6、图7为本实用新型第二实施例之示意图;Fig. 6, Fig. 7 are the schematic diagrams of the second embodiment of the utility model;
图8、图9为本实用新型第二实施例应用于不同芯片组合之示意图。8 and 9 are schematic diagrams of the second embodiment of the present invention applied to different chip combinations.
具体实施方式Detailed ways
本实用新型所述的白光发光装置,其第一实施例如图1所示,该发光装置1包括发光芯片和涂覆有荧光层3的配件4,该发光芯片为发光二极管2,该配件4罩覆于发光二极管2上,发光时当蓝光二极管2照射此一黄色荧光粉层3,以产生与蓝光互补的黄光,再利用混光原理将互补的黄光、蓝光予以混合,便可得出产生人类眼睛所能感觉的白光的发光装置1,如为紫外光二极管2照射此一红蓝绿三色荧光粉层3,以产生与紫外光互补的红蓝绿三色光,再利用混光原理将互补的红蓝绿三色光、紫外光予以混合,便可得出产生人类眼睛所能感觉的白光的发光装置1。The first embodiment of the white light emitting device described in the present invention is shown in FIG. 1. The
本实施例可应用于不同形式的发光装置,如图2所示,圆形的发光装置1,其发光二极管2可置于配件4底部;如图3所示,长形的发光装置1,其发光二极管2可置于配件4两侧;或如图4所示,在长形的发光装置1内亦可形成发光二极管串列5。此处的配件4为罩覆于发光二极管2或发光二极管串列5上的上的壳体,该壳体上的荧光粉层3中采用涂布或喷涂的方式涂覆于其上,该配件4可为玻璃、塑胶或其它半透明或透明的透光材质。This embodiment can be applied to different forms of light emitting devices. As shown in FIG. The
如图5所示,本实用新型亦可在一平板玻璃6上涂覆荧光粉层3,当发光二极管2所发出的有色光激发平板玻璃6上的荧光粉层3混合成白光再透过平板玻璃6发射出去,亦可达到极佳之白光效果。As shown in Figure 5, the utility model can also coat a
本实用新型的第二实施例如图6、图7所示,它包括导线架8、环氧树脂9、发光二极管10、涂覆有荧光粉层3的镜片7,将发光二极管芯片10置于导线架8上,再加上环氧树脂9后完成芯片封装,之后再将涂覆有荧光粉层3的镜片7以粘着剂或树脂、接合剂11贴合于环氧树脂9上,亦可经由有色光芯片作为激发光源产生混光效果,以得出人类眼睛所能感觉的白光。其发光二极管10可以单颗与涂覆有荧光粉层3的镜片7结合,如图8所示,亦可以矩阵排列方式与涂覆有荧光粉层3参染注塑镜片7结合,如图9所示。The second embodiment of the present utility model is shown in Fig. 6, Fig. 7, and it comprises
综上,本实用新型是将荧光粉层3涂覆于发光芯片光线经过的配件上,则成型的配件上的荧光粉层3在受发光芯片照射后部份光线改变光源波长再经混光效果,以得出人类眼睛所能感觉的白光的效果。本实用新型藉由发光二极管(LED芯片)作为光源来激发荧光粉,而达到产生白光的效果,大大降低生产成本及提高产品之竞争力。To sum up, the utility model is to apply the
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201562670U CN201004467Y (en) | 2006-11-09 | 2006-11-09 | A white light emitting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006201562670U CN201004467Y (en) | 2006-11-09 | 2006-11-09 | A white light emitting device |
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| CN201004467Y true CN201004467Y (en) | 2008-01-09 |
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| CNU2006201562670U Expired - Fee Related CN201004467Y (en) | 2006-11-09 | 2006-11-09 | A white light emitting device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102022630A (en) * | 2009-09-17 | 2011-04-20 | 江苏日月照明电器有限公司 | Space isolation technology for LED and phosphor powder |
| CN102569593A (en) * | 2010-12-22 | 2012-07-11 | 展晶科技(深圳)有限公司 | led |
-
2006
- 2006-11-09 CN CNU2006201562670U patent/CN201004467Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102022630A (en) * | 2009-09-17 | 2011-04-20 | 江苏日月照明电器有限公司 | Space isolation technology for LED and phosphor powder |
| CN102569593A (en) * | 2010-12-22 | 2012-07-11 | 展晶科技(深圳)有限公司 | led |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080109 Termination date: 20091209 |