CN201004467Y - A white light emitting device - Google Patents

A white light emitting device Download PDF

Info

Publication number
CN201004467Y
CN201004467Y CNU2006201562670U CN200620156267U CN201004467Y CN 201004467 Y CN201004467 Y CN 201004467Y CN U2006201562670 U CNU2006201562670 U CN U2006201562670U CN 200620156267 U CN200620156267 U CN 200620156267U CN 201004467 Y CN201004467 Y CN 201004467Y
Authority
CN
China
Prior art keywords
light
light emitting
white light
emitting device
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2006201562670U
Other languages
Chinese (zh)
Inventor
童胜男
邱新旺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MINGDA OPTOELECTRONIC (XIAMEN) CO Ltd
Original Assignee
MINGDA OPTOELECTRONIC (XIAMEN) CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MINGDA OPTOELECTRONIC (XIAMEN) CO Ltd filed Critical MINGDA OPTOELECTRONIC (XIAMEN) CO Ltd
Priority to CNU2006201562670U priority Critical patent/CN201004467Y/en
Application granted granted Critical
Publication of CN201004467Y publication Critical patent/CN201004467Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

The utility model provides a white light luminous device which consists of a luminous chip and elements that the ray passing through, wherein on the elements that the ray passing through fluorescent powder is painted. By adopting painting the fluorescent powder on the elements that the ray passing through, part of ray of fluorescent powder on the formed elements will change the wave length after irradiated by the luminous chip and then being mixed the ray thus get a white light effect that can be felt by eyes. The utility model adopts led(LED chip) as a light source to trigger the fluorescent powder so as to generate an effect of white light, and can reduce the producing cost largely and also can improve the competitive strength of the product.

Description

一种白光发光装置A white light emitting device

技术领域technical field

本实用新型提供一种改变光源波长之发光装置,特别是指一种白光发光装置。The utility model provides a light-emitting device for changing the wavelength of a light source, in particular to a white-light light-emitting device.

背景技术Background technique

所谓白光是多种色光混合而成的光,以人类眼睛所能看见的白光形式至少需两种光混合,二波长光(蓝色光+黄色光)或三波长光(蓝色光+绿色光+红色光),目前已商品化的产品有二波长蓝光单芯片加上黄色(YAG)荧光粉,及在未来较看好的三波长光,尤其是以紫外光芯片加上红蓝绿三色荧光粉。The so-called white light is a mixture of various colors of light. In the form of white light that can be seen by human eyes, at least two kinds of light are mixed, two-wavelength light (blue light + yellow light) or three-wavelength light (blue light + green light + red light) light), the currently commercialized products include two-wavelength blue light single-chip plus yellow (YAG) phosphors, and three-wavelength light that is more promising in the future, especially ultraviolet light chips plus red, blue and green phosphors.

白光LED用在照明或是LCD面板光源块的光源上,前景备受全球瞩目,欧、美及日本等先进国家也投注许多人力,并成立专门的机构推动白光LED研发工作。LED目前的技术都是利用黄色荧光粉如YAG、TAG直接涂于蓝光芯片上以产生白光,或是将三色荧光粉涂于紫外光LED芯片上以产生白光。White LEDs are used for lighting or as light sources for LCD panel light source blocks. The prospect has attracted global attention. Advanced countries such as Europe, the United States, and Japan have invested a lot of manpower and established special institutions to promote the research and development of white LEDs. The current LED technology is to use yellow phosphors such as YAG and TAG to directly coat blue light chips to produce white light, or to apply three-color phosphors to ultraviolet LED chips to produce white light.

实用新型内容Utility model content

本实用新型的目的是提供一种组合式以产生白光的白光发光装置。The purpose of the utility model is to provide a combined white light emitting device for generating white light.

为实现上述目的,本实用新型的解决方案是:一种白光发光装置,是由发光芯片与其光线经过的配件构成,其中在发光芯片光线经过的配件上涂覆有荧光粉层。In order to achieve the above object, the solution of the present invention is: a white light emitting device, which is composed of a light-emitting chip and the accessories through which the light passes, wherein a phosphor layer is coated on the accessories through which the light of the light-emitting chip passes.

所述的发光芯片为蓝光芯片,则其光线经过的配件上的荧光粉层为黄色(YAG)荧光粉。The light-emitting chip is a blue light chip, and the phosphor layer on the accessory through which the light passes is yellow (YAG) phosphor.

所述的发光芯片为紫外光芯片,则其光线经过的配件上的荧光粉层为红蓝绿三色荧光粉。The light-emitting chip is an ultraviolet light chip, and the fluorescent powder layer on the accessory through which the light passes is red, blue and green three-color fluorescent powder.

所述的发光芯片光线经过的配件为涂覆有荧光粉层的壳体。The accessory through which light from the light-emitting chip passes is a shell coated with a phosphor layer.

所述的壳体为透光体。The shell is a transparent body.

所述的壳体形状为镜面半弧形、平板型、管状、圆筒状、柱状或其它形状。The shape of the shell is mirror semi-arc, flat plate, tube, cylinder, column or other shapes.

所述的发光芯片可置于涂覆有荧光粉层的配件之底部、中间、内层或外侧,其数目可为单个或复数个串列、各种几何形状排列。The light-emitting chip can be placed on the bottom, middle, inner layer or outer side of the accessory coated with the phosphor layer, and its number can be single or multiple in series and arranged in various geometric shapes.

所述的涂覆有荧光粉层的配件为镜片,其是利用粘看剂贴合于封装时所用发光芯片上。The accessory coated with the phosphor layer is a lens, which is pasted on the light-emitting chip used for packaging by using an adhesive.

所述的镜片可利用树脂、粘着剂、接合剂贴合于发光芯片上。The lens can be pasted on the light-emitting chip by using resin, adhesive and bonding agent.

所贴合的发光芯片可为单个或矩阵排列方式的复数个。The bonded light-emitting chips can be single or multiple in a matrix arrangement.

采用上述方案后,本实用新型是将荧光粉层涂覆于发光芯片光线经过的配件上,则成型的配件上的荧光粉层在受发光芯片照射后部份光线线改变光源波长再经混光效果,以得出人类眼睛所能感觉之白光的效果。本实用新型藉由发光二极管(LED芯片)作为光源来激发荧光粉,而达到产生白光的效果,大大降低生产成本及提高产品之竞争力。After adopting the above scheme, the utility model is to coat the fluorescent powder layer on the accessories through which the light-emitting chip light passes, then the fluorescent powder layer on the formed accessories will change the wavelength of the light source after being irradiated by the light-emitting chip and then mix the light. Effect, in order to obtain the effect of white light that human eyes can perceive. The utility model uses light-emitting diodes (LED chips) as a light source to excite fluorescent powder to achieve the effect of generating white light, greatly reducing production costs and improving product competitiveness.

下列结合附图和实施例对本实用新型进一步说明:The utility model is further described below in conjunction with accompanying drawing and embodiment:

附图说明Description of drawings

图1为本实用新型第一实施例的示意图;Fig. 1 is the schematic diagram of the utility model first embodiment;

图2、图3、图4、图5为本实用新型第一实施例应用于不同发光装置的示意图;Fig. 2, Fig. 3, Fig. 4 and Fig. 5 are schematic diagrams of the application of the first embodiment of the utility model to different light-emitting devices;

图6、图7为本实用新型第二实施例之示意图;Fig. 6, Fig. 7 are the schematic diagrams of the second embodiment of the utility model;

图8、图9为本实用新型第二实施例应用于不同芯片组合之示意图。8 and 9 are schematic diagrams of the second embodiment of the present invention applied to different chip combinations.

具体实施方式Detailed ways

本实用新型所述的白光发光装置,其第一实施例如图1所示,该发光装置1包括发光芯片和涂覆有荧光层3的配件4,该发光芯片为发光二极管2,该配件4罩覆于发光二极管2上,发光时当蓝光二极管2照射此一黄色荧光粉层3,以产生与蓝光互补的黄光,再利用混光原理将互补的黄光、蓝光予以混合,便可得出产生人类眼睛所能感觉的白光的发光装置1,如为紫外光二极管2照射此一红蓝绿三色荧光粉层3,以产生与紫外光互补的红蓝绿三色光,再利用混光原理将互补的红蓝绿三色光、紫外光予以混合,便可得出产生人类眼睛所能感觉的白光的发光装置1。The first embodiment of the white light emitting device described in the present invention is shown in FIG. 1. The light emitting device 1 includes a light emitting chip and an accessory 4 coated with a fluorescent layer 3. The light emitting chip is a light emitting diode 2, and the accessory 4 covers Covered on the light-emitting diode 2, when the blue light diode 2 irradiates the yellow phosphor layer 3 to generate yellow light complementary to the blue light when emitting light, and then use the light mixing principle to mix the complementary yellow light and blue light to obtain The light-emitting device 1 that produces white light that can be perceived by human eyes, such as an ultraviolet light diode 2, irradiates the red, blue, and green three-color phosphor layer 3 to generate red, blue, and green three-color light that is complementary to ultraviolet light, and then uses the light mixing principle By mixing complementary red, blue, green and ultraviolet light, a light-emitting device 1 that produces white light that can be perceived by human eyes can be obtained.

本实施例可应用于不同形式的发光装置,如图2所示,圆形的发光装置1,其发光二极管2可置于配件4底部;如图3所示,长形的发光装置1,其发光二极管2可置于配件4两侧;或如图4所示,在长形的发光装置1内亦可形成发光二极管串列5。此处的配件4为罩覆于发光二极管2或发光二极管串列5上的上的壳体,该壳体上的荧光粉层3中采用涂布或喷涂的方式涂覆于其上,该配件4可为玻璃、塑胶或其它半透明或透明的透光材质。This embodiment can be applied to different forms of light emitting devices. As shown in FIG. The light emitting diodes 2 can be placed on both sides of the accessories 4; or as shown in FIG. 4 , the light emitting diode series 5 can also be formed in the elongated light emitting device 1 . The accessory 4 here is a housing covered on the light emitting diode 2 or the LED series 5, the phosphor layer 3 on the housing is coated on it by coating or spraying, the accessory 4 can be glass, plastic or other translucent or transparent light-transmitting materials.

如图5所示,本实用新型亦可在一平板玻璃6上涂覆荧光粉层3,当发光二极管2所发出的有色光激发平板玻璃6上的荧光粉层3混合成白光再透过平板玻璃6发射出去,亦可达到极佳之白光效果。As shown in Figure 5, the utility model can also coat a phosphor layer 3 on a flat glass 6, when the colored light emitted by the light-emitting diode 2 excites the phosphor layer 3 on the flat glass 6 to mix into white light and then pass through the flat plate When the glass 6 is emitted, an excellent white light effect can also be achieved.

本实用新型的第二实施例如图6、图7所示,它包括导线架8、环氧树脂9、发光二极管10、涂覆有荧光粉层3的镜片7,将发光二极管芯片10置于导线架8上,再加上环氧树脂9后完成芯片封装,之后再将涂覆有荧光粉层3的镜片7以粘着剂或树脂、接合剂11贴合于环氧树脂9上,亦可经由有色光芯片作为激发光源产生混光效果,以得出人类眼睛所能感觉的白光。其发光二极管10可以单颗与涂覆有荧光粉层3的镜片7结合,如图8所示,亦可以矩阵排列方式与涂覆有荧光粉层3参染注塑镜片7结合,如图9所示。The second embodiment of the present utility model is shown in Fig. 6, Fig. 7, and it comprises lead frame 8, epoxy resin 9, light-emitting diode 10, the lens 7 that is coated with phosphor layer 3, and light-emitting diode chip 10 is placed on wire on the frame 8, and epoxy resin 9 is added to complete the chip package, and then the lens 7 coated with the phosphor layer 3 is attached to the epoxy resin 9 with an adhesive or resin or a bonding agent 11, or through The colored light chip is used as an excitation light source to produce a mixed light effect to obtain white light that human eyes can perceive. Its light-emitting diode 10 can be combined with the lens 7 coated with the phosphor layer 3 individually, as shown in Figure 8, and can also be combined with the injection molded lens 7 coated with the phosphor layer 3 in a matrix arrangement, as shown in Figure 9 Show.

综上,本实用新型是将荧光粉层3涂覆于发光芯片光线经过的配件上,则成型的配件上的荧光粉层3在受发光芯片照射后部份光线改变光源波长再经混光效果,以得出人类眼睛所能感觉的白光的效果。本实用新型藉由发光二极管(LED芯片)作为光源来激发荧光粉,而达到产生白光的效果,大大降低生产成本及提高产品之竞争力。To sum up, the utility model is to apply the fluorescent powder layer 3 on the accessories through which light from the light-emitting chip passes, then the fluorescent powder layer 3 on the molded accessories will change the wavelength of the light source after being irradiated by the light-emitting chip, and then undergo the light mixing effect. , to obtain the effect of white light that the human eye can perceive. The utility model uses light-emitting diodes (LED chips) as a light source to excite fluorescent powder to achieve the effect of generating white light, greatly reducing production costs and improving product competitiveness.

Claims (10)

1、一种白光发光装置,是由发光芯片与其光线经过的配件构成,其特征在于:在发光芯片光线经过的配件上涂覆有荧光粉层。1. A white light emitting device, which is composed of a light-emitting chip and its accessories through which the light passes, and is characterized in that: a phosphor layer is coated on the accessories through which the light passes of the light-emitting chip. 2、如权利要求1所述的白光发光装置,其特征在于:发光芯片为蓝光芯片,则其光线经过的配件上涂覆的荧光粉层为黄色(YAG)荧光粉。2. The white light emitting device according to claim 1, wherein the light emitting chip is a blue light chip, and the phosphor layer coated on the accessories through which the light passes is yellow (YAG) phosphor. 3、如权利要求1所述的白光发光装置,其特征在于:发光芯片为紫外光芯片,则其光线经过的配件上涂覆的荧光粉层为红蓝绿三色荧光粉。3. The white light emitting device according to claim 1, wherein the light emitting chip is an ultraviolet light chip, and the phosphor layer coated on the accessories through which the light passes is red, blue and green phosphor. 4、如权利要求1所述的白光发光装置,其特征在于:发光芯片可置于涂覆有荧光粉层的配件之底部、中间、内层或外侧,其数目可为单个或复数个串列排列。4. The white light emitting device according to claim 1, characterized in that: the light emitting chip can be placed on the bottom, middle, inner layer or outside of the accessories coated with the phosphor layer, and the number can be single or multiple in series arrangement. 5、如权利要求1所述的白光发光装置,其特征在于:发光芯片光线经过的配件为涂覆有荧光粉层的壳体。5. The white light emitting device according to claim 1, characterized in that: the accessory through which light from the light emitting chip passes is a shell coated with a phosphor layer. 6、如权利要求1所述的白光发光装置,其特征在于:壳体为透光体。6. The white light emitting device according to claim 1, wherein the housing is a light-transmitting body. 7、如权利要求1所述的白光发光装置,其特征在于:壳体形状为镜面半弧形、平板型、管状、圆筒状或柱状。7. The white light emitting device according to claim 1, characterized in that: the shape of the housing is mirror semi-arc, flat plate, tubular, cylindrical or columnar. 8、如权利要求1所述的白光发光装置,其特征在于:涂覆有荧光粉层的配件为镜片,其是利用粘着剂贴合于封装时所用的环氧树脂上。8. The white light emitting device according to claim 1, wherein the accessory coated with the phosphor layer is a lens, which is bonded to the epoxy resin used for packaging with an adhesive. 9、如权利要求1所述的白光发光装置,其特征在于:镜片可利用树脂、粘着剂、接合剂贴合于发光芯片上。9. The white light emitting device according to claim 1, characterized in that the lens can be bonded to the light emitting chip by using resin, adhesive or bonding agent. 10、如权利要求1所述的白光发光装置,其特征在于:所贴合的发光芯片可为单个或矩阵排列方式的复数个。10. The white light emitting device according to claim 1, characterized in that: the bonded light emitting chips can be a single one or a plurality of them arranged in a matrix.
CNU2006201562670U 2006-11-09 2006-11-09 A white light emitting device Expired - Fee Related CN201004467Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2006201562670U CN201004467Y (en) 2006-11-09 2006-11-09 A white light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2006201562670U CN201004467Y (en) 2006-11-09 2006-11-09 A white light emitting device

Publications (1)

Publication Number Publication Date
CN201004467Y true CN201004467Y (en) 2008-01-09

Family

ID=39040010

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2006201562670U Expired - Fee Related CN201004467Y (en) 2006-11-09 2006-11-09 A white light emitting device

Country Status (1)

Country Link
CN (1) CN201004467Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102022630A (en) * 2009-09-17 2011-04-20 江苏日月照明电器有限公司 Space isolation technology for LED and phosphor powder
CN102569593A (en) * 2010-12-22 2012-07-11 展晶科技(深圳)有限公司 led

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102022630A (en) * 2009-09-17 2011-04-20 江苏日月照明电器有限公司 Space isolation technology for LED and phosphor powder
CN102569593A (en) * 2010-12-22 2012-07-11 展晶科技(深圳)有限公司 led

Similar Documents

Publication Publication Date Title
CN203218260U (en) Dual Chip LED
CN101075655B (en) White surface light source lighting device
CN101093068A (en) White light parts, and fabricating method
EP2163594A3 (en) Light source module and display apparatus having the same
TW201320406A (en) White light diode package improved structure for enhancing light mixing effect
CN101625076A (en) Light-emitting diode backlight module with fluorescent powder
CN109103174A (en) It is a kind of close to sunlight full-spectrum LED light-source encapsulation
CN102072436A (en) Backlight source structure and working method thereof
CN106439736B (en) indirect lighting
CN201004467Y (en) A white light emitting device
CN102306698A (en) Novel LED packaging structure
CN101355132B (en) encapsulation method of white light LED for improving facula
CN101430065A (en) LED light source module group and its white light generation method
CN201041808Y (en) white light emitting device
JP2010206208A (en) Light emitting diode package structure and manufacturing method therefor
CN204167318U (en) A kind of LED special lighting light source
TW201003240A (en) Light emitting diode backlight module formed with photoluminescent phosphor
CN102751428B (en) A kind of light transformational structure and manufacture method thereof and light-emitting diode tube device
CN204905283U (en) Light emitting diode
TW200638558A (en) White light emitting diode device
CN203386804U (en) Ultraviolet and blue light LED dual-drive white light illuminating device
KR200404235Y1 (en) White Light Emitting Diode
JP3115554U (en) White light emitting diode
CN207938650U (en) The emitting semiconductor for sending out a variety of coloured light is realized based on a chip
CN101414604B (en) a light emitting diode

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080109

Termination date: 20091209