CN200980202Y - A copper foil board with metal matrix - Google Patents
A copper foil board with metal matrix Download PDFInfo
- Publication number
- CN200980202Y CN200980202Y CN 200620165311 CN200620165311U CN200980202Y CN 200980202 Y CN200980202 Y CN 200980202Y CN 200620165311 CN200620165311 CN 200620165311 CN 200620165311 U CN200620165311 U CN 200620165311U CN 200980202 Y CN200980202 Y CN 200980202Y
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- Prior art keywords
- adhesive linkage
- metal substrate
- copper foil
- utility
- model
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Abstract
The utility model discloses a metal-base copper foil cover press plate, composed of a metal base plate, an adhesive layer and a copper foil which are adhered and combined, substantially characterized in that the adhesive layer is a heat radiation insulation adhesive layer with thermal resistance lower than 1. The adhesive layer contains the mixture of micro granular alumina and resin. The utility model is characterized in high property/price cost, low thermal resistance, better insulation and large strip strength or the like, which is a high-quality multilayer press plate as modular power supply board, LED lighting base board and petrol engine igniter plate or the like.
Description
Technical field
The utility model relates to a kind of Metal Substrate copper clad laminate.Belong to the circuit board plate material technology.
Background technology
The utility model mainly is used as modular power source plate, LED illuminating board and petrol engine ignition plate etc., but is not limited to this.
Existing this laminated sheet is made up of metal substrate, adhesive linkage and Copper Foil compoiste adhering, in order to the development of the satisfying telecommunications demand to the high-performance metal base composite board of high frequencyization, microwave technology.
Existing this laminated sheet because adhesive linkage or title composite layer are glass fibre/ceramic powder and polytetrafluoroethylene/resin mixed material layers, so that there is deficiencies such as thermal resistance big (thermal resistance＞1.5), heat dispersion difference.Especially because polytetrafluoroethylene price comparison height, thereby the production cost of this laminated sheet is also just than higher.It is found that in addition this laminated sheet is as modular power source plate, LED illuminatian plate and petrol engine ignition plate etc., tend to because its heat dispersion is poor, separate with adhesive linkage and produce Copper Foil, especially as the LED illuminating board, because substrate is overheated, can cause light decay to exhaust, even burn out the LED luminescent diode.
Along with the fast development of electronic product and auto industry and the deep expansion of establishment energy-efficient society work, especially adopt LED brightening city, beautify the extensively enforcement day by day of the illuminating engineering at home, a kind of heat radiation, insulation high-performance metal base copper-clad laminate are provided, just become people's expectation.
Summary of the invention
The purpose of this utility model is to provide a kind of heat radiation, Metal Substrate copper clad laminate that insulation property are high, to overcome the deficiency of prior art, satisfies the growing requirement of society.
The utility model realizes that the technical scheme of its purpose technology is:
A kind of Metal Substrate copper clad laminate is made up of metal substrate, adhesive linkage and Copper Foil compoiste adhering, and its innovative characteristics is that adhesive linkage is the radiating insulating adhesive linkage of thermal resistance＜1.This is through institute's optimized technical scheme after repeatedly user investigation is proved repeatedly.That is to say that the thermal resistance of adhesive linkage＜1 just can make adhesive linkage have good heat-conducting, and be enough to effectively to avoid the problems of excessive heat that produced under the utility model operating mode, separate with adhesive linkage thereby effectively overcome Copper Foil, the LED light decay exhausts and burns out the deficiency of LED, realizes the purpose of this utility model.
Further innovative point of the present utility model is:
Said adhesive linkage is subparticle shape alundum (Al and resin compound adhesive linkage.This is the preferred a kind of adhesive linkage of the utility model.And said resin preferably epoxy resin E-20, E-44, or phenolic resins, or promise volt inspection gram resin and two or more hybrid resins thereof.Because alundum (Al has littler thermal resistance than the glass fibre that prior art adopted, thereby can reduce thermal resistance of the present utility model significantly.According to test, thermal resistance of the present utility model can reach 0.3-0.7.
Said adhesive linkage is subparticle shape alundum (Al, boron nitride and/or aluminium nitride and resin compound adhesive linkage.Owing in the mixture of adhesive linkage alundum (Al and resin, added boron nitride and/or aluminium nitride, can further reduce thermal resistance of the present utility model, improve its heat conduction efficiency.
The particle diameter of said alundum (Al, boron nitride and aluminium nitride≤3 micron.Play purpose and obviously be, effectively guarantee the adhesive strength and the further heat conductivility that improves adhesive linkage of adhesive linkage.
The thickness of metal substrate is in the 0.5-4mm scope; The thickness of adhesive linkage is in the 0.05-0.30mm scope; The thickness of Copper Foil is in the scope of 0.01-0.30mm.The thickness of given metal substrate, adhesive linkage and Copper Foil is that heat conductivility is relevant with its thermal resistance all.Can carry out autotelic selection according to its different instructions for uses.LED illuminating board for example, the thickness of its metal substrate, adhesive linkage and Copper Foil all can be suitably thicker.
Metal substrate is a copper coin, or aluminium sheet, or steel plate.This is according to the preferred three kinds of metallic plates of cost performance.Certainly be not limited thereto.Because used metal substrate and its integral heat sink performance have direct relation, thereby must careful selection.
After technique scheme was implemented, the utility model had the cost performance height, and bonding force is strong, and characteristics such as heat radiation, good insulation preformance are conspicuous.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
Below contrast accompanying drawing, by the description of embodiment, the utility model is described in further detail.
One of embodiment.As shown in Figure 1.
The Metal Substrate copper clad laminate of a kind of particularly suitable and LED illuminating board is made up of metal substrate 1, adhesive linkage 2 and Copper Foil 3 compoiste adherings, and adhesive linkage 2 is radiating insulating adhesive linkages of thermal resistance＜1.And said adhesive linkage 2 is subparticle shape alundum (Al, boron nitride and aluminium nitride and the resin compound adhesive linkage of particle diameter＜3 micron.Metal substrate 1 is an aluminium sheet, and its thickness is 1.5mm; The thickness of adhesive linkage 2 is 80 microns; The thickness of Copper Foil 3 is 35 microns.
Two of embodiment, as shown in Figure 1.
A kind of Metal Substrate copper clad laminate that is specially adapted to the gasoline engine igniter board is made up of metal substrate 1, adhesive linkage 2 and Copper Foil 3 compoiste adherings, and adhesive linkage 2 is radiating insulating adhesive linkages of thermal resistance＜1.And said adhesive linkage 2 is the subparticle shape alundum (Al and the resin compound tack coat of particle diameter＜3 micron.Metal substrate 1 is a corrosion resistant plate, and its thickness is in the 2mm scope; The thickness of adhesive linkage 2 is 100 microns; The thickness of Copper Foil 3 is 50 microns.
The preparation method's of the present utility model who describes as one of embodiment concise and to the point description is that carry out according to following steps successively: aluminium sheet deoils with NaOH; Aluminium sheet carries out anodic oxidation in the sulfuric acid water-bath, 20 ℃ of temperature, 30 minutes time; Aluminium sheet after the oxidation cleans, oven dry, and bake out temperature is about 100 ℃; Adhesive linkage is coated on the aluminium sheet, dries, temperature is about 200 ℃; Be covered with Copper Foil and implement lamination on the aluminium sheet after applying adhesive linkage, temperature is about 200 ℃, and the time is about 1 hour; The utility model is promptly made in cooling, discharging, and said adhesive linkage is mixed to stir by alundum (Al, boron nitride, aluminium nitride, epoxy resin, solvent, promoter, flexibilizer, curing agent and fire resistant resin and forms.
The performance test results of the utility model first sample is: peel strength 〉=1.8N/mm, surface resistivity＞4.5 * 10
6M Ω, specific insulation＞1.9 * 10
7M Ω m, puncture voltage 〉=2.5KV, thermal coefficient of expansion≤42, thermal resistivity≤0.7.All meet or exceed the correlation technique requirement.
The utility model is good as the result of use of LED illuminating board.
The scope of application of the present utility model, the restriction that not described by this specification.
Claims (6)
1, a kind of Metal Substrate copper clad laminate is made up of metal substrate (1), adhesive linkage (2) and Copper Foil (3) compoiste adhering, and it is characterized in that: adhesive linkage (2) is the radiating insulating adhesive linkage of thermal resistance＜1.
2, Metal Substrate copper clad laminate according to claim 1 is characterized in that: said adhesive linkage (2) is subparticle shape alundum (Al and resin compound adhesive linkage.
3, Metal Substrate copper clad laminate according to claim 1 is characterized in that: said adhesive linkage (2) is subparticle shape alundum (Al, boron nitride and/or aluminium nitride and resin compound adhesive linkage.
4, Metal Substrate copper clad laminate according to claim 3 is characterized in that: the particle diameter of said alundum (Al, boron nitride and aluminium nitride≤3 micron.
5, Metal Substrate copper clad laminate according to claim 3 is characterized in that: the thickness of metal substrate (1) is in the 0.5-4mm scope; The thickness of adhesive linkage (2) is in the 0.05-0.30mm scope; The thickness of Copper Foil (3) is in the 0.01-0.30mm scope.
6, Metal Substrate copper clad laminate according to claim 1 is characterized in that: metal substrate (1) is a copper coin, or aluminium sheet, or steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620165311 CN200980202Y (en) | 2006-12-05 | 2006-12-05 | A copper foil board with metal matrix |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620165311 CN200980202Y (en) | 2006-12-05 | 2006-12-05 | A copper foil board with metal matrix |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200980202Y true CN200980202Y (en) | 2007-11-21 |
Family
ID=38980585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620165311 Expired - Lifetime CN200980202Y (en) | 2006-12-05 | 2006-12-05 | A copper foil board with metal matrix |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200980202Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101534599B (en) * | 2008-03-14 | 2010-08-25 | 西安孚莱德光电科技有限公司 | LED radiating substrate and manufacturing method thereof |
| CN102390127A (en) * | 2011-08-05 | 2012-03-28 | 金安国纪科技（珠海）有限公司 | Iron-based laminated sheet with copper foil coating, and preparation method thereof |
| CN102870512A (en) * | 2010-03-23 | 2013-01-09 | 东洋铝株式会社 | Mounting board heat dissipating laminate |
| CN107567209A (en) * | 2017-09-30 | 2018-01-09 | 华宇华源电子科技（深圳）有限公司 | A kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method |
| CN109842988A (en) * | 2017-11-29 | 2019-06-04 | 东莞新科技术研究开发有限公司 | Printed circuit board |
| CN111270232A (en) * | 2020-03-10 | 2020-06-12 | 张柱琼 | Double-sided multilayer single-side aluminum substrate machining process |
| WO2020133965A1 (en) * | 2018-12-29 | 2020-07-02 | 广东生益科技股份有限公司 | Metal base copper foil-coated laminate and preparation method therefor |
-
2006
- 2006-12-05 CN CN 200620165311 patent/CN200980202Y/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101534599B (en) * | 2008-03-14 | 2010-08-25 | 西安孚莱德光电科技有限公司 | LED radiating substrate and manufacturing method thereof |
| CN102870512A (en) * | 2010-03-23 | 2013-01-09 | 东洋铝株式会社 | Mounting board heat dissipating laminate |
| CN102390127A (en) * | 2011-08-05 | 2012-03-28 | 金安国纪科技（珠海）有限公司 | Iron-based laminated sheet with copper foil coating, and preparation method thereof |
| CN102390127B (en) * | 2011-08-05 | 2014-07-30 | 金安国纪科技（珠海）有限公司 | Iron-based laminated sheet with copper foil coating, and preparation method thereof |
| CN107567209A (en) * | 2017-09-30 | 2018-01-09 | 华宇华源电子科技（深圳）有限公司 | A kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method |
| CN109842988A (en) * | 2017-11-29 | 2019-06-04 | 东莞新科技术研究开发有限公司 | Printed circuit board |
| WO2020133965A1 (en) * | 2018-12-29 | 2020-07-02 | 广东生益科技股份有限公司 | Metal base copper foil-coated laminate and preparation method therefor |
| CN111270232A (en) * | 2020-03-10 | 2020-06-12 | 张柱琼 | Double-sided multilayer single-side aluminum substrate machining process |
| CN111270232B (en) * | 2020-03-10 | 2022-02-11 | 宏桥金属制品(昆山)有限公司 | Double-sided multilayer single-side aluminum substrate machining process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20071121 |
|
| EXPY | Termination of patent right or utility model |