CN1982403A - 导热膏及使用该导热膏的电子装置 - Google Patents

导热膏及使用该导热膏的电子装置 Download PDF

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CN1982403A
CN1982403A CNA2005101206731A CN200510120673A CN1982403A CN 1982403 A CN1982403 A CN 1982403A CN A2005101206731 A CNA2005101206731 A CN A2005101206731A CN 200510120673 A CN200510120673 A CN 200510120673A CN 1982403 A CN1982403 A CN 1982403A
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heat
conducting cream
silicone oil
powder
oil
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CN100543104C (zh
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郑景太
郑年添
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US11/309,611 priority patent/US7541403B2/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y10T428/257—Iron oxide or aluminum oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Abstract

一种电子装置，包括一发热电子元件、一用于对该发热电子元件散热的散热元件及填充于该发热电子元件与散热元件之间的导热膏，该导热膏包括占8～11％质量百分比的基体及填充于基体内的热导填充物，该热导填充物占导热膏总质量的89～92％，该基体为甲基苯基硅油、氟硅油中至少一种与氨基改性硅油的混合物。

Description

导热膏及使用该导热膏的电子装置
【技术领域】
本发明关于一种导热膏及使用该导热膏的电子装置。
【背景技术】
为解决发热电子元件的散热问题，人们通常在发热电子元件上部设置散热器等散热元件，通过该散热元件的较大的散热面积，将发热电子元件产生的热量散发出去。
为使散热元件能快速地将发热电子元件产生的热量散发出去，发热电子元件与散热元件间需具有良好的热传递，即发热电子元件与散热元件间应具有较小的接触热阻，然而，由于生产条件及生产成本的限制，发热电子元件与散热元件的接触面并非完全平整的表面，故两者贴合时，其接触面无法完全接触而存在空气间隙，而空气的导热系数很低，一般约为0.025W/(m·℃)左右，严重影响整体的散热效果，为此，一般于散热元件与发热电子元件之间涂布热介面材料，以填补散热元件与发热电子元件间的空气间隙，减小介面热阻，提升散热效果，以保证发热电子元件的正常运作。
在现有的热介面材料中，导热膏由于具有较小的接触热阻而在目前的散热领域较为常用。导热膏一般包括基油及填充于基油内的热导填充物。目前导热膏中使用最为普遍的基油为二甲基硅油(dimethylsilicone oil)。该二甲基硅油的使用温度范围为-50℃～170℃，使该二甲基硅油在低温时具有较好的性能，但对于温度较高的场合，则略显不足。
【发明内容】
本发明以具体实施例说明一种具较大使用温度范围的导热膏及使用该导热膏的电子装置。
一种导热膏，包括占8～11％质量百分比的基体及填充于基体内的热导填充物，该热导填充物占导热膏总质量的89～92％，该基体为甲基苯基硅油、氟硅油中至少一种与氨基改性硅油的混合物。
一种电子装置，包括一发热电子元件、一用于对该发热电子元件散热的散热元件，上述导热膏填充于该发热电子元件与散热元件之间。
该导热膏利用甲基苯基硅油、氟硅油中至少一种与氨基改性硅油的混合物作为基体，该甲基苯基硅油、氟硅油的温度使用范围与氨基改性硅油的温度使用范围不同，使该甲基苯基硅油、氟硅油中至少一种与氨基改性硅油混合后可扩大该导热膏的温度使用范围。
【附图说明】
下面参照附图结合实施例作进一步描述：
图1为本发明电子装置的示意图。
【具体实施方式】
该导热膏包括基体及填充于该基体内的热导填充物。
基体的质量约占导热膏总质量的至少8％且至多11％。该基体包括在25℃时粘度均为50～5000cs的甲基苯基硅油(methylphenysilicone fluid)、氟硅油(fluorosilicone fluid)和氨基改性硅油(amino-modified silicone fluid)。该甲基苯基硅油与氟硅油的使用温度范围均为-30℃～250℃，该氨基改性硅油的使用温度范围为-50℃～200℃，该甲基苯基硅油、氟硅油与氨基改性硅油按1∶1∶2的质量比均匀混合，可将该导热膏的温度使用范围扩充为-50℃～250℃。
可以理解地，该基体也可为甲基苯基硅油、氟硅油中之一种与氨基改性硅油的混合物，此种情况下，甲基苯基硅油或氟硅油与氨基改性硅油的质量比为1∶1。
该热导填充物的质量约占该导热膏总质量的至少89％且至多92％。该热导填充物是平均粒径均为0.1～5μm的铝粉、氧化铝粉末与氧化锌粉末的混合物。该铝粉、氧化铝粉末与氧化锌粉末的质量比为3∶1∶1～6∶1∶1。
可以理解地，该热导填充物也可为铝粉、氧化铝粉末与氧化锌粉末中之任一种粉末，或铝粉、氧化铝粉末与氧化锌粉末中任两种粉末的混合物，即铝粉与氧化铝粉末、氧化铝粉末与氧化锌粉末或铝粉与氧化锌粉末的混合物。当该热导填充物为两种粉末的混合物时，该铝粉与氧化铝粉末、氧化铝粉末与氧化锌粉末或铝粉与氧化锌粉末的质量比均为1∶1～10∶1。
如图1所示为一种使用该导热膏的电子装置10，该电子装置10包括一设于电路板11上的发热电子元件12、一用于对该发热电子元件12散热的散热元件13，上述导热膏14填充于该发热电子元件12与散热元件13之间。该散热元件13包括一基板131及设于基板131上的若干散热鳍片133。该散热元件13通过一固定元件15固定至电路板11上，并向下按压该导热膏14，使该导热膏14充分填充于发热电子元件12与散热元件13的基板131间形成的空隙内，由于该导热膏具有较小的热阻值，因此，该发热电子元件12与散热元件13间具较小的接触热阻，使该发热电子元件12与该散热元件13间存在良好的热传递，进而使该电子装置10具较好的散热效果。

Claims (9)

1.一种导热膏，包括占8～11％质量百分比的基体及填充于基体内的热导填充物，该热导填充物占导热膏总质量的89～92％，该基体为甲基苯基硅油、氟硅油中至少一种与氨基改性硅油的混合物。
2.如权利要求1所述的导热膏，其特征在于：该基体在25℃时的粘度为50～5000cs。
3.如权利要求1所述的导热膏，其特征在于：该甲基苯基硅油、氟硅油与氨基改性硅油的质量比为1∶1∶2。
4.如权利要求1所述的导热膏，其特征在于：该甲基苯基硅油或氟硅油与氨基改性硅油的质量比为1∶1。
5.如权利要求1所述的导热膏，其特征在于：该热导填充物为铝粉、氧化铝粉末与氧化锌粉末至少其中一种。
6.如权利要求5所述的导热膏，其特征在于：该热导填充物的平均粒径为0.1～5μm。
7.如权利要求5所述的导热膏，其特征在于：该铝粉、氧化铝粉末与氧化锌粉末的质量比为3∶1∶1～6∶1∶1。
8.如权利要求5所述的导热膏，其特征在于：该铝粉与氧化铝粉末、氧化铝粉末与氧化锌粉末或铝粉与氧化锌粉末的质量比均为1∶1～10∶1。
9.一种使用如权利要求1至8项中任一项所述的导热膏的电子装置，包括一发热电子元件、一用于对该发热电子元件散热的散热元件，上述导热膏填充于该发热电子元件与散热元件之间。
CNB2005101206731A 2005-12-16 2005-12-16 导热膏及使用该导热膏的电子装置 Expired - Fee Related CN100543104C (zh)

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US11/309,611 US7541403B2 (en) 2005-12-16 2006-08-31 Thermal interface material

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102024505A (zh) * 2010-10-12 2011-04-20 北京国电富通科技发展有限责任公司 一种硅油电力复合脂及其制备方法
CN111234784A (zh) * 2020-01-21 2020-06-05 深圳德邦界面材料有限公司 一种具有良好的可返修性能的导热凝胶及其制备方法
CN111378286A (zh) * 2019-11-26 2020-07-07 东莞市美庆电子科技有限公司 一种低热阻导热膏及其制备工艺

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US20110265979A1 (en) * 2010-04-30 2011-11-03 Sihai Chen Thermal interface materials with good reliability

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JP2646926B2 (ja) * 1992-01-21 1997-08-27 信越化学工業株式会社 シリコーングリース
JPH08143883A (ja) * 1994-11-17 1996-06-04 Dow Corning Asia Ltd 耐熱性グリース組成物
US6114429A (en) * 1997-08-06 2000-09-05 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition
JP3504882B2 (ja) * 1999-05-24 2004-03-08 富士高分子工業株式会社 熱伝導性・電気絶縁性シリコーン組成物及びこれを用いたシリコーン成形物
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Publication number Priority date Publication date Assignee Title
CN102024505A (zh) * 2010-10-12 2011-04-20 北京国电富通科技发展有限责任公司 一种硅油电力复合脂及其制备方法
CN102024505B (zh) * 2010-10-12 2016-03-09 北京国电富通科技发展有限责任公司 一种硅油电力复合脂及其制备方法
CN111378286A (zh) * 2019-11-26 2020-07-07 东莞市美庆电子科技有限公司 一种低热阻导热膏及其制备工艺
CN111234784A (zh) * 2020-01-21 2020-06-05 深圳德邦界面材料有限公司 一种具有良好的可返修性能的导热凝胶及其制备方法

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