CN1968569A - Composite wiring board and manufacturing method thereof - Google Patents

Composite wiring board and manufacturing method thereof Download PDF

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Publication number
CN1968569A
CN1968569A CN 200610147049 CN200610147049A CN1968569A CN 1968569 A CN1968569 A CN 1968569A CN 200610147049 CN200610147049 CN 200610147049 CN 200610147049 A CN200610147049 A CN 200610147049A CN 1968569 A CN1968569 A CN 1968569A
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China
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mentioned
thin slice
wiring board
conductor
composite wiring
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Chinese (zh)
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上松博幸
宫越俊伸
小更恒
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TDK Corp
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TDK Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present invention can realize the predigestion of the manufacture process while improving the dimension precision and the complanation in the composite wiring board of an assembled ceramic substrate and a resin layer. A composite wiring board includes a ceramic substrate (1), a resin layer (3) in contact with at least one surface of the ceramic substrate (1) and a sintered metal conductor (6) piercing through the resin layer (3). The composite wiring board is manufactured by a method including the steps of forming a through hole in a sheet having a shrinkage-suppressing effect and filling the through hole with conductive paste to obtain a sheet for formation of a conductor, firing the conductor formation sheet and a green sheet for a substrate in their laminated state to obtain a ceramic substrate having a surface provided with a sintered metal conductor, removing from the surface of the ceramic substrate a fired product of the sheet having the shrinkage-suppressing effect and forming a resin layer on the surface of the ceramic substrate. The sheet having the shrinkage-suppressing effect may be a crude sheet having the shrinkage-suppressing or a calciferous sheet.

Description

Composite wiring board and manufacture method thereof
Technical field
The present invention relates to have the composite wiring board and the manufacture method thereof of ceramic substrate and the resin bed that contacts with at least one side's of above-mentioned ceramic substrate face and be provided with.
Background technology
In fields such as electronic equipment, be used to install the ceramic substrate of electronic device, in recent years according to the requirement of the miniaturization and of electronic equipment or multifunction etc., and multilayer ceramic substrate and practicability are proposed as ceramic substrate with high reliability.Multilayer ceramic substrate constitutes by stacked a plurality of ceramic layers, makes distribution conductor or electronic component etc. on each ceramic layer in the one, thereby realizes the densification of circuit substrate.
On the other hand, improve for the further multifunction of electronic equipment and the requirement of high precision int, the composite wiring board to compound ceramic wiring substrate and resin bed causes concern thereupon.In composite wiring board, wish by resin bed being set and improving surface smoothing significantly on the surface.Improve the result of surface smoothing, can realize the further granular of distribution, but also obtain the good advantage of installation of tabs product such as semiconductor.
In this composite wiring board, be purpose with the wiring graph that carries out outermost resin layer surface and the electrical connection of interior layer pattern or the heat radiation of ceramic substrate sometimes, path is set on resin bed.As the method that path is set, for example patent documentation 1 (spy opens the 2003-124435 communique) or patent documentation 2 (spy opens the 2004-253512 communique) are described, propose oriented through hole filled conductive resin or utilize electric plating method.And, also propose to have on semi-solid preparation impregnation thing thin slice to form through hole, filled conductive thickener in through hole then, be welded in its pressed and overlapped on the ceramic multi-layer baseplate after, make the method (opening 2003-188538 communique etc. with reference to patent documentation 3-spy) of its curing.
,, on resin bed, connect the operational difficulty of via conductor etc., cause variety of issue though think that wiring substrate and resin bed compound turns into to a kind of means of the multifunction of corresponding wiring substrate or miniaturization are more effective.For example, in patent documentation 1,2 described methods, need ceramic substrate comprehensively on form resin bed after, form through hole (through hole), carry out the filling or the plating of electroconductive resin afterwards, so operation quantity is very many.And, owing to cover the comprehensive of ceramic substrate, need high-precision contraposition in order to form through hole exactly by resin bed.
According to patent documentation 3 described inventions, though have the advantage that forms resin bed and path simultaneously, but by resin bed cover ceramic substrate comprehensively, so the connection status of the path of skin conductor that can not be by the Visual Confirmation ceramic substrate or inner conductor and resin bed.The result needs very high-precision contraposition, so might be related to numerous and diverseization of manufacturing process.
In addition, in ceramic substrates such as multilayer ceramic substrate, the dimensional accuracy that the contraction when burning till causes or the reduction of flatness become big problem.Multilayer ceramic substrate forms after the laminated body it is burnt till by stacked a plurality of raw cooks and forms.And above-mentioned raw cook is followed the sintering of firing process and is shunk, this shrinkage or shrinkage direction according to the composition of baseplate material, raw cook, make in batches, create conditions in addition etc. and different.Because this contraction is inhomogeneous, because the contraction of raw cook, the dimensional accuracy and the flatness of multilayer ceramic substrate reduce greatly, and in the multilayer ceramic substrate that finally obtains, for example dimensional accuracy is limited to about 0.5%.
Above-mentioned contraction is inhomogeneous to cause following various undesirable condition particularly.For example the web plate of internal electrode printing usefulness must inverse operation substrate shrinkage and make, but because the variation of aforesaid substrate shrinkage must repeatedly be made web plate in batches again according to making, so uneconomical.And, must form the electrode of area big more than necessity in order to allow deflation error in advance, also hinder the densification of distribution.Also have, be that purpose is when burning till baseplate material and dielectric material simultaneously with system large value capacitor in multilayer ceramic substrate, if baseplate material is different in the shrinkage of in-plane with dielectric material, then on the substrate surface of the part that forms dielectric, produce recess, the installation deterioration of portion's product.Have again, in raw cook because different, so this also becomes the problem in the manufacturing according to making the shrinkage of film direction Width and length direction.
Like this, if the dimensional accuracy of ceramic substrate or flatness reduce, then the dimensional accuracy of composite wiring board or flatness also reduce certainly, so seeking to improve countermeasure.
Summary of the invention
Therefore the present invention proposes in view of this existing truth, it is a kind of in the composite wiring board of compound ceramic substrate and resin bed that its purpose is to provide, when can realize the simplification of manufacturing process, realize the composite wiring board and the manufacture method thereof of the raising of dimensional accuracy and flatness.
In order to achieve the above object, composite wiring board of the present invention is characterised in that to have: ceramic substrate; The resin bed that contacts with at least one side's of above-mentioned ceramic substrate face and be provided with; And the sintering metal conductor that connects above-mentioned resin bed.
In addition, the manufacture method of composite wiring board of the present invention is characterised in that to have: form through hole on the thin slice with contraction inhibition effect, the filled conductive thickener obtains conductor and forms the operation of using thin slice in above-mentioned through hole; Burn till under the state with raw cook with thin slice and substrate in the above-mentioned conductor formation of stack, obtain having the operation of the ceramic substrate of sintering metal conductor on the surface; Remove above-mentioned operation from above-mentioned ceramic base plate surface with the burned material of shrinking the thin slice that suppresses effect; And the operation that on above-mentioned ceramic base plate surface, forms resin bed.
In the present invention, sintering metal conductor and the ceramic substrate that connects the resin bed of composite wiring board burnt till simultaneously and forms, form resin bed afterwards, with the sintering metal conductor as uses such as paths.By the sintering metal conductor is for example used as the path that connects resin bed, need on resin bed, not wear the operation that path forms the through hole of usefulness.And, connect the occasion that works with path as interlayer at the sintering metal conductor, the connection status of the surface conductor that can be by the Visual Confirmation ceramic substrate and the path (sintering metal conductor) of resin bed does not need to be used for forming the high-precision contraposition of through hole yet on resin bed.Have, the sintering metal conductor that connects resin bed can be used with mark as contraposition, the contraposition when for example forming skin conductor on resin layer surface becomes easy.
And, use thin slice owing to form as the conductor that is used to form the sintering metal conductor, utilize to have and shrink the thin slice that suppresses effect, so the contraction to the face direction of raw cook of the substrate can suppress to burn till the time.Its result, the dimensional accuracy of direction and flatness become well in face in the ceramic substrate that obtains, and dimensional accuracy or flatness also become good in the composite wiring board that uses it.Particularly, using and shrinking the occasion that suppresses with raw cook, the effect of the dimensional accuracy that significantly improves and flatness as having the thin slice that shrinks the inhibition effect.
In addition, for example open in the flat 6-53655 communique the spy, perforating on sintering thin slice not, in this hole, fill to convex to form and use conductor, it is carried out stacked, heating on raw cook, but only be conceived on ceramic substrate to form projection, can not find about with ceramic substrate and resin compoundedization, make the conductor perforation in addition for example as the record of path use etc.
In addition, open in the 2005-197663 communique the spy and to record, after making ceramic substrate, the sintering thin slice of back membrane element is filled in stacked and heating, thereby forms the method for protuberances such as conductor or insulator on ceramic substrate.Yet, must carry out burning till for twice (be used to make ceramic substrate burn till and protuberance forms the heating of usefulness), the problem that thereupon causes operation quantity to increase.
The present invention has following effect.
According to the present invention, when can simplify the manufacturing process of composite wiring board, realize the dimensional accuracy of ceramic substrate and the raising of flatness, the installation raising that can also realization portion product and the further densification of composite wiring board.
Description of drawings
Fig. 1 is the general profile chart that expression is suitable for an example of composite wiring board of the present invention.
Fig. 2 is the figure of an example of the manufacture method of explanation composite wiring board shown in Figure 1, is the general profile chart of expression substrate with raw cook.
Fig. 3 is the figure of an example of the manufacture method of explanation composite wiring board shown in Figure 1, is that the expression conductor forms the general profile chart with an example of thin slice.
Fig. 4 is that the expression conductor forms other the routine general profile chart with thin slice.
Fig. 5 is the figure of an example of the manufacture method of explanation composite wiring board shown in Figure 1, is that the expression conductor forms with thin slice and the substrate general profile chart with the stacked state of raw cook.
Fig. 6 is the figure of an example of the manufacture method of explanation composite wiring board, is the general profile chart that expression forms the ceramic substrate before the resin bed.
Fig. 7 is the figure of an example that is used to illustrate the manufacture method of composite wiring board, is the general profile chart that expression utilizes the bonding process of vacuum lamination.
Fig. 8 is the figure of an example that is used to illustrate the manufacture method of composite wiring board, is the general profile chart that expression utilizes the resin solidification operation of heating and pressurizing device.
Fig. 9 is other routine general profile chart that expression is suitable for composite wiring board of the present invention.
Figure 10 is that expression is used to make the general profile chart of the conductor formation of composite wiring board shown in Figure 9 with an example of thin slice.
Figure 11 is that expression is used to make the conductor formation of composite wiring board shown in Figure 9 other routine general profile chart with thin slice.
Figure 12 is other routine general profile chart of the manufacture method of expression composite wiring board shown in Figure 1.
Figure 13 is another other routine general profile chart of the manufacture method of expression composite wiring board shown in Figure 1.
Among the figure:
The 1-ceramic substrate; The 2-resin bed; The 3-resin bed; The 4-path; Layer pattern in the 5-; 6-sintering metal conductor; 11-substrate raw cook; The 12-supporter; 13,14-conducting resinl; The 15-conductor forms uses thin slice; The 16-conductor forms uses thin slice; 17-has the thin slice that shrinks the inhibition effect; The 18-conducting resinl; The 19-supporter; The 20-conductive pattern; The 41-vacuum lamination apparatus; The 42-heated plate; 43-silicone resin film; The 51-compression chamber; The 61-conductor forms uses thin slice; The 62-supporter; 63-has the thin slice that shrinks the inhibition effect; The 64-conducting resinl; 71,81, the 82-conductor forms and uses thin slice; 83-has the thin slice that shrinks the inhibition effect.
Embodiment
Below, describe suitable composite wiring board of the present invention and manufacture method thereof in detail with reference to accompanying drawing.
First execution mode
Being suitable for composite wiring board of the present invention is to be suitable as the substrate that the radio-frequency head product use.Composite wiring board shown in Figure 1 possesses that ceramic substrate 1 contacts with two sides with ceramic substrate 1 and the resin bed 2,3 that is provided with.
But ceramic substrate 1 is preferably by easy fired (LTCC) substrate that for example constitutes in the glass ceramics of easy fired below 1000 ℃.Ceramic substrate 1 is the stacked all-in-one-piece multilayer ceramic substrates of a plurality of ceramic layer 1a～1e, in be shaped on layer pattern 5 in the wiring graph that is formed at the ceramic layer surface, the electrode pattern etc., the interlayer that connects layer pattern 5 in each etc. connect with or the inner conductors such as path 4 of heat transmission.In addition, though the diagram of omission also can be made electronic components such as inductor or capacitor in the inside of ceramic substrate 1.As the ceramic material that constitutes ceramic substrate 1, also can use any of the general ceramic material that is used for this ceramic substrate.
The inner conductor of ceramic substrate 1 for example is made of sintering metal.Be not specially limited as the inner conductor material, can use for example metals such as Ag, Pd, Au, Cu, Ni.
Resin bed 2,3 is made of resin material.As resin material, can use any of the resin material that may be molded to sheet, film like etc.For example can use the both sides of thermoplastic resin, thermosetting resin as resin material, it is resin, polyimides, polyolefin-based resins, polyester, polyphenylene oxide, liquid crystal polymer, silicone resin, fluorine resin etc. that epoxy resin, phenolic resins, vinyl benzyl ether compound resin, bismaleimide-triazine resin, cyanate ester are arranged particularly, these independent or a plurality of combinations can be used.In addition, as resin material, can be elastomeric materials such as acrylate rubber, ethylene-acrylate rubber also, perhaps comprise the resin material of a part of rubber constituent.And, can also be the material that in resin material, contains inorganic fillers such as pottery.
On resin bed 2,3, be formed with the sintering metal conductor 6 that connects resin bed 2,3 and constitute by sintering metal.As the material that can be used for sintering metal conductor 6, so long as the metal of sintering state just can use any of the metal that is used for this substrate, for example can use metal or alloy such as Ag, Pd, Au, Cu, Ni etc. equally, wherein preferably use Ag with inner conductor.And sintering metal conductor 6 comprises above-mentioned metal more than 90% the time, comprises oxide.Have, sintering metal conductor 6 also can comprise glass ingredient again.As glass ingredient, can exemplify with from PbO, SiO 2, B 2O 3, at least a oxide selected among the ZnO, alkaline-earth metals oxide is as the glass ingredient of main component.But, not necessarily to comprise oxide, glass ingredient.
Sintering metal conductor 6 for example forms column, and the interlayer that the interlayer that can possess connects the distribution on top layer of resin bed 2,3 and the inner conductor of ceramic substrate 1 is connected with path, heat transmission path, contraposition when the skin conductor that forms resin bed 2,3 (omit and illustrate) etc. with functions such as marks.Sintering metal conductor 6 also can have as interlayer connecting path, heat transmission path, contraposition with independent functions such as marks, for example also can have interlayer connecting path and contraposition concurrently with the function of mark.
In this composite wiring board, by surface resin bed is set and can reduces the fluctuating of ceramic base plate surface or concavo-convex at ceramic wiring substrate, compare with existing ceramic substrate and improve surface smoothing significantly.For example, on common ceramic base plate surface, there is the fluctuating of 20 μ m～50 μ m, but can roughly eliminates the fluctuating on this surface by resin bed is set at ceramic base plate surface.In addition, above-mentioned fluctuating also can realize planarization by grinding substrate surface, and resin layer surface is compared the advantage that also has easy grinding with ceramic base plate surface.
And, by forming the result that resin bed improves surface smoothing, can be with for example carrying out the skin conductor use of the Cu of photoetching process processing, so can realize the further granular of distribution (skin conductor) as resin layer surface.The raising of surface smoothing can make photolithographic exploring degree rise, so help the further granular of distribution.For example, can be implemented in the ceramic substrate because the thin spaceization as wiring closet distance 10 μ m～80 μ m that the existence that rises and falls is difficult to realize further realizes the densification of circuit substrate.Have again, by improving surface smoothing, the advantage that also obtains making the installation of tabs product such as semiconductor to become good.
Below, an example of the manufacture method of composite wiring board shown in Figure 1 is described.A big characteristic point in the present invention is, make it only when the what is called that thickness direction shrinks does not have the process for calcining of contraction and makes ceramic substrate 1 by utilize suppressing substrate with the contraction of direction in the face of raw cook, conductor such as the path of perforation resin bed 2,3 and ceramic substrate are formed simultaneously.
Make the ceramic substrate 1 of multi-ply construction, as shown in Figure 2, prepare substrate raw cook 11a～11e of each ceramic layer 1a～1e of formation ceramic substrate 1.Substrate is with raw cook 11a～11e, by making the dielectric thickener of the pasty state that hybrid ceramic powder and organic vehicles obtain, its utilized scrape the skill in using a kitchen knife in cookery etc. and form film and form on supporters 12 such as polyethylene terephthalate (PET) sheet.As above-mentioned ceramic powders or organic vehicles, can use well-known any material.
But, on above-mentioned dielectric thickener, also use ceramic powders and glass powder in the occasion of making the glass ceramic baseplate of easy fired as ceramic substrate 1.At this moment, these glass ingredients and ceramic component are suitably selected to get final product based on dielectric constant or firing temperature as purpose.
Use among raw cook 11a～11e the inner conductors such as path 4 of layer pattern 5 or the interior layer pattern 5 of interlayer connection etc., electronic components such as inductor, capacitor (omitting diagram) in addition in the interior as required system at aforesaid substrate.Path 4 is by forming through hole on the position of aforesaid substrate with the regulation of raw cook 11a～11e, filled conductive thickener 14 and forming.In addition, interior layer pattern 5 is by on the surface of substrate with raw cook 11, promptly with on the face of supporter 12 opposition sides utilizes silk screen printing etc. that conducting paste 12 is printed as the regulation shape and forms.
Above-mentioned conducting paste is modulated by electric conducting material and organic vehicles that various conductive metal such as Ag, Pd, Au, Cu, Ni or alloy constitute by mixing.Organic vehicles with binding agent and solvent as main component, with the mixing ratio of above-mentioned electric conducting material be arbitrarily, cooperating with electric conducting material usually is binding agent 1～15 quality %, solvent 10～50 quality %.In conducting paste, also can add the additive of selecting from various dispersants or plasticizer etc. as required.
On the other hand, by on thin slice, forming through hole, filled conductive thickener in this through hole, and preparation conductor formation thin slice with contraction inhibition effect.Conductor forms the contraction with direction in the face of thin slice inhibition ceramic substrate 1, and is used for forming on the surface of ceramic substrate 1 purpose of sintering metal conductor 6.As having the thin slice that shrink to suppress effect, can unrestrictedly use with the state of substrate with the raw cook stack under can suppress the thin slice of contraction of the in-plane of ceramic substrate when burning till.Specifically, can use that non-shrinking contraction as raw cook suppresses with thin slice, comprises calcium carbonate (CaCO under firing temperature 3) thin slice, comprise the thin slice of zirconia (zirconium oxygen) or aluminium oxide (alumina) etc.Fig. 3 and Fig. 4 represent that conductor forms with thin slice 15,16.In the present embodiment, shrink the thin slice 17 that suppresses effect with having of thin slice 15,16, suppress to describe as example with the occasion of raw cook to use contraction as constituting conductor formation.On the corresponding position of the sintering metal conductor 6 with thin slice 17 of shrink suppressing effect, form through hole respectively, and filled conductive thickener 18 forms as conductor and uses thin slice in these through holes with in the resin bed 2.
Suppress to use raw cook as shrinking, can use the thin slice that for example comprises at least a and sintering adjuvant of from quartz, christobalite and tridymite, selecting.Suppress to comprise sintering adjuvant by shrinking with raw cook, the contraction that is layered on the two sides suppresses to be sintered to raw cook laminar, can peel off with the thin slice state from ceramic base plate surface after burning till and shrink the burned material that suppresses with raw cook, it is easy that the dismounting of above-mentioned burned material becomes.Shrinking the occasion that suppresses not comprise sintering adjuvant with raw cook, shrink to suppress with raw cook sintering not in firing process, state with coccoid on substrate surface exists, if the then particle movement in cooling of the state of coccoid is so even stress application also can relax this stress between transformation temperature pair and ceramic substrate.Relative therewith, the contraction that comprises sintering adjuvant by use suppresses to use raw cook, can avoid the problems referred to above, and its result makes removing of burned material become as mentioned above and is more prone to.
Sintering adjuvant is softening or generate select the oxide of liquid phase and the alkali metal compound at least a from beginning with the sintering of raw cook at substrate below the temperature.Begin the occasion of oxide softening below the temperature with the sintering of raw cook using, carry out sintering by combination between the softening particle that makes above-mentioned constituent of oxide at substrate.Begin to generate below the temperature occasion of the oxide of liquid phase with the sintering of raw cook using at substrate, by the particle surface reaction of the above-mentioned constituent of the oxide Generation Liquid mutual-assistance, combination between the particle and carry out sintering.Be not specially limited as this oxide, but preferably from lead silicate lead glass, lead silicate alkali glass, lead silicate alkaline earth glass, lead borosilicate glass, borosilicic acid alkali glass, aluminium borate lead glass, lead borate alkali glass, lead borate alkaline earth glass, lead borate zinc glass etc., select at least a.
Alkali metal compound has promotion SiO 2Carry out the effect of sintering.Therefore, comprise at least a constituent of from quartz, christobalite and tridymite, selecting, carry out sintering by adding alkali metal compound as sintering adjuvant.Be not specially limited as alkali metal compound, but preferably lithium carbonate, potash, sodium carbonate, lithia, potassium oxide etc.
Perhaps, suppress to use thin slice, also can use the tridymite that comprises sintering and by the above-mentioned not thin slice of the oxide of sintering that burns till by being used to obtain burning till of ceramic substrate as above-mentioned contraction.
At the tridymite of substrate, can make by in quartz, adding that alkali metal compound is heat-treated etc. of sintering in the sintering process of raw cook.
In addition, as substrate with the sintering process of raw cook in not the oxide of sintering be not specially limited, but be fit to use quartz, vitreous silica, aluminium oxide, mullite, zirconia etc.
Tridymite can carry out various changes to sintering temperature according to the selection of forming.And tridymite produces stress by sintering on the border with substrate.But the tridymite thermal coefficient of expansion is big, also has thermal coefficient of expansion to reach 40ppm/ ℃ situation according to temperature.Therefore, the contraction that comprises tridymite suppresses to use raw cook, and the excessive result of thermal expansion difference with glass ceramic material (about 3～10ppm/ ℃) just peels off before the sintering.In order to prevent this problem, be added under the firing temperature of ceramic substrate material not the oxide of sintering and regulate thermal coefficient of expansion, peel off naturally with the thin slice state behind the sintering.Thus, suppress to become easily, do not need ultrasonic wave cleaning etc. with the dismounting of the burned material of raw cook from the contraction of ceramic substrate.In addition, think, cause at least a middle same phenomenon of from quartz, christobalite and tridymite, selecting of material of adding sintering adjuvant with explanation before in the situation of burning till of this occasion.
Make conductor and form, at first prepare to have the thin slice 17 that shrinks the inhibition effect with thin slice 15,16.Having the thin slice 17 that shrinks the inhibition effect obtains by the following method, promptly, mix the constituent that comprises at least a and sintering adjuvant of from quartz, christobalite and tridymite, selecting as previously described, perhaps comprise the tridymite of sintering and by the above-mentioned not constituent of the oxide of sintering that burns till by being used to obtain burning till of ceramic substrate, make the thickener of pasty state with organic vehicles, with its utilize scrape the skill in using a kitchen knife in cookery etc. on supports 19 such as for example polyethylene terephthalate (PET) sheet with laminar film forming.
Then, has the through hole that is provided with on the thin slice 17 that shrinks the inhibition effect with sintering metal conductor 3 corresponding shape.Processing method when through hole is set is not specially limited, and can exemplify punching press, punching processing or the laser processing etc. that utilize mould.
Then, filled conductive thickener 18 in through hole.Method about the filled conductive thickener is not specially limited, and can exemplify print processes such as silk screen printing etc.As conducting paste, can use the identical thickener of conducting paste with the inner conductor figure that is used to form ceramic substrate 1.By filled conductive thickener 18 in through hole, obtain conductor shown in Figure 3 and form with thin slice 15.Have again,, obtain conductor shown in Figure 4 and form with thin slice 16 by on printing surface, conducting paste being printed as the regulation shape.Be printed on conductor forms becomes ceramic layer 1e with the lip-deep conductive pattern 20 of thin slice 16 the most surperficial conductor.
Then, as shown in Figure 5, on smooth platform T, stack gradually the conductor that obtains and form, thereby the stack conductor forms with thin slice and substrate raw cook with thin slice 15, substrate raw cook 11a～11e, conductor formation thin slice 16.At this moment, the substrate of peeling off from supporter with raw cook 11a～11e, conductor form with thin slice 15,16 stacked respectively for printing surface downward.Also can superpose and pressurize after these.
Then, burn till conductor and form the laminated body of using thin slice 16 with thin slice 15, substrate with raw cook 11a～11e, conductor formation.As burning till gas medium, can use for example oxidizing gas medium, reducing gas medium etc., use atmosphere to get final product particularly.The contraction of the interior direction of face of raw cook 11 of substrate when the effect that utilizes the formation of formation conductor to shrink the thin slice 17 that suppresses effect with having of thin slice 15,16 suppresses to burn till, only the result who shrinks at thickness direction realizes for example shrinkage of soil below 1% in the ceramic substrate 1 that obtains.At this moment dimensional accuracy is below 0.1%, and is very good.And, by further making the shrinkage optimization, can guarantee the better dimensional accuracy below 0.05%.
In addition, by burning till, used the lip-deep while of the conducting paste 18 of thin slice 15,16 maintenances attached to ceramic substrate 1 by conductor formation, the sintering reaction of the metal in the conducting paste 18 is proceeded.After burning till, constitute conductor and form the burned material of shrinking the thin slice 17 that suppresses effect that has,, perhaps peeled off to laminar, thereby removed it owing to become the state of peeling off easily with difference of the coefficient of linear expansion of ceramic substrate 1 etc. with thin slice 15,16.Thus, be filled in conductor formation and be transferred to ceramic substrate 1 side, obtain the ceramic substrate 1 that possesses sintering metal conductor 6 on the surface as shown in Figure 6 with the conductive pattern 20 that conducting paste 18 in the thin slice 15,16 (sintering metal conductor 6) and conductor form with thin slice 16 surfaces.
By on the surface of ceramic substrate shown in Figure 61, forming resin bed 2,3, obtain composite wiring board shown in Figure 1.Method as compoundization ceramic substrate 1 and resin bed 2,3 is also considered punching press etc., but the cracky of ceramic substrate becomes problem.Therefore, in order to prevent the breakage of ceramic substrate, and in composite wiring board, reach the surface smoothing of height, preferably carry out the following vacuum lamination that utilizes and fit.
At first, fit in the both sides of ceramic substrate 1 and become the resin flake of resin bed 2,3.In the present embodiment, characteristic point is to utilize the vacuum lamination that has for example used vacuum lamination apparatus 41 as shown in Figure 7 in this applying.This vacuum lamination apparatus 41 possesses the heated plate 42 of internal heater for example substantially and is configured in the silicone resin film 43 of the below of heated plate 42, and these are housed in the mould (not shown) that can reduce pressure to the inner space.
Use above-mentioned vacuum lamination apparatus 41 to carry out the formation of resin bed, at first shown in Fig. 7 (a), under the state of opening mould (omitting diagram), in a pair of resin flake 31 of the both sides of ceramic substrate 1 (outermost layer) configuration, these are configured between heated plate 42 and the silicone resin film 43.
Then, closing molding, shown in Fig. 7 (b), when the air of discharge between heated plate 42 and silicone resin film 43 reduces pressure in to mould, supply with heated compressed air from the below of silicone resin film 43 silicone resin film 43 is expanded, will push to heated plate 42 sides by the laminated body that resin flake 31, ceramic substrate 1 and resin flake 31 constitute.Utilize the condition of the applying of vacuum lamination, can be made as for example 80 ℃～120 ℃ of temperature, pressure 0.1MPa～0.8MPa, 30 seconds～120 seconds pressing time.Thus, ceramic substrate 1 and resin flake 31 driving fits, resin flake 31 attaches on the ceramic substrate 1.At this moment, by the height of suitable setting sintering metal conductor 6 and the thickness of resin flake 31, the lip-deep sintering metal conductor 6 that is formed on ceramic substrate 1 connects the resin material of resin flake 31.In addition, vacuum lamination apparatus itself for example is documented in that the spy opens on flat 11-320682 communique etc., but is applicable to that the example of the composite wiring board of ceramic layer and resin bed does not exist.
As mentioned above,, for example compare and under the low pressure of appropriateness, evenly to pressurize, can not cause the breakage of ceramic substrate 1 and realize the applying of ceramic substrate 1 and resin flake 31 with vacuum punching press etc. by utilizing vacuum lamination.And, pressurize by silicone resin film 43 in the side of the laminated body that is made of resin flake 31 and ceramic substrate 1, flow out from the laminated body side so can prevent resin, in the composite ceramic substrate that finally obtains, realize the reduction in uneven thickness or the raising of plane flatness.Have again,, can suppress to accompany the generation of undesirable conditions such as driving fit that bubble causes is bad owing to border at ceramic substrate 1 and resin bed 2,3 by utilizing vacuum lamination.
In addition, for example open in the flat 11-266080 communique, in the applying of the insulating resin film of expoxy glass copper plating film laminated plate, be suitable for vacuum lamination the spy, but not mentioned fully for ceramic substrate.And, open the above laminater of flat 11-266080 communique the spy and make it carry out lamination by a plurality of roll shop buildings, if the lamination of this mode is applicable to ceramic substrate, then ceramic substrate is damaged and can not make composite ceramic substrate.Relative therewith, in the present invention, be object with the ceramic substrate, by using the vacuum lamination of mode for example shown in Figure 7, can eliminate problem, and realize compoundization of ceramic substrate and resin bed as the breakage of the shortcoming of ceramic substrate.
Be used to form resin flake 31 following the obtaining of resin bed, make hybrid resin powder and organic vehicles and the resin thickener of the pasty state that obtains, its is utilized scrape the skill in using a kitchen knife in cookery etc. and be coated on the supporter and make its drying.On supporter, form the resin material of film, be preferably made the state that when fitting, has sufficient flowability, for example become semi-cured state (B level state).In the occasion of using thermosetting resin as resin material, make above-mentioned semi-cured state by applying heat treatment.By resin material is made semi-cured state, with resin flake 31 when ceramic substrate 1 is fitted, adaptation to the surface of ceramic substrate 1 improves, and concavo-convex the fillibility that sintering metal conductor 6 causes improves, and realizes the further raising of surface balance in the composite wiring board that finally obtains.
The thickness of the resin material of resin flake 31 is suitably set according to the surface state of ceramic substrate etc. and get final product, but needs the fluctuating of ceramic base plate surface or the thickness more than the concavo-convex height at least, for example makes 10 μ m～100 μ m.
As the supporter that constitutes resin flake 31, for example can use metal formings such as resin film such as polyethylene terephthalate or Copper Foil.
In the aforesaid occasion of utilizing vacuum lamination to fit, from effectively being prevented the viewpoint of damaged effect, the preferably relative substrate area thin thickness of ceramic substrate 1.Particularly, be made as s (mm at area with ceramic substrate 2), when thickness is made as t (mm), preferably be that 10000～250000 ceramic substrate uses as ceramic substrate 1 with s/t.If be lower than above-mentioned scope, promptly substrate area thickness is big relatively, and then ceramic substrate does not have damaging problem.On the contrary, in the occasion that surpasses above-mentioned scope, promptly substrate area thickness is thin excessively relatively, then might can not get enough breakages and prevent effect.
In addition, also can before the bonding process of resin flake, carry out surface treatment to ceramic substrate 1.For example, by before the surface of ceramic substrate 1 applying resin flake with the surface of ceramic substrate 1 with organosilan coupling agent material processed, adaptability is improved, the caking property of ceramic substrate 1 and resin bed 2,3 is improved.
After carrying out above-mentioned applying, the resin material that constitutes resin flake 31 is solidified.For example the occasion that is formed by thermosetting resin at resin bed after the applying of the resin flake 31 that utilizes vacuum lamination apparatus 41, is proceeded heating and pressurizes to get final product with identical vacuum lamination apparatus 41.Thus, can carry out the curing of resin material, form resin bed 2,3 on the surface of ceramic substrate 1.
At the condition of cure of the occasion of utilizing vacuum lamination apparatus 41, need suitably set according to the kind of resin bed (resin material of resin flake), for example temperature is made as 150 ℃～180 ℃.And the pressure during curing is made as 0.1MPa～0.8MPa and gets final product.Pressurize the required time according to the change of the kind of resin bed, is about 1 hour～10 hours.
Utilize aforesaid manufacture method, form resin bed 2,3, obtain composite wiring board as shown in Figure 1 on the surface of ceramic substrate 1.
In addition, after forming resin bed 2,3, the occasion of sintering metal conductor 6 non-through resin beds 2,3 etc. also can be by the surface of grinding resin bed 2,3, makes the part of sintering metal conductor 6 be exposed to the surface of resin bed 2,3.
In addition, also can form skin conductor on the surface of resin bed 2,3 as required.Be not specially limited as the method that forms skin conductor, for example can be by after plating Cu etc., utilize lithography technology and etching etc. that Cu etc. is processed as the regulation shape and form.And, in the occasion of using resin films such as PET film as the supporter of resin flake 31, after peeling off this resin film, form skin conductor and get final product.On the other hand, in the occasion of using metal formings such as Cu paper tinsel as above-mentioned supporter, can utilize lithography technology and etching etc. that this metal forming is formed figure, thereby form skin conductor.
As mentioned above, manufacture method according to present embodiment, form the sintering metal conductor 6 of column for example on the surface of ceramic substrate 1 after, make sintering metal conductor 6 connect landform resin layer 2,3, thereby need be not the operation that purpose wears through hole between resin bed 2,3 cambium layer, to connect with path or heat transmission path.Therefore, operation is simplified, and high-precision contraposition that need be when through hole is not set.And the contraposition when sintering metal conductor 6 also can be used as and forms skin conductor on the surface of resin bed 2,3 etc. utilizes with mark.Therefore, can make more high-precision composite wiring board easily.
In addition, in aforesaid manufacture method, by utilizing the vacuum lamination under low pressure can carry out isotropic heating and pressurization, do not cause the breakage of ceramic substrate and realize the applying of ceramic substrate and resin bed, the result makes unabroken composite wiring board.At this moment, prevent to flow out resin from the composite wiring board section, obtain little composite wiring board in uneven thickness as what in utilizing dull and stereotyped punching press, take place.Have again, make the concavo-convex of ceramic base plate surface or rise and fall by the thicker resin flake of stacked thickness to become smooth, realize good flatness at resin layer surface.
In addition, when making above-mentioned composite wiring board,, the resin solidification operation carries out Yi Bian preferably pressurizeing the heated air medium on one side as media.Want the heated air medium to be carried out resin solidification on one side as the media pressurization on one side,, use heating and pressurizing device as shown in Figure 8 to carry out the curing of resin material from the laminated body that vacuum lamination apparatus 41 takes out behind applying resin flake 31 on the ceramic substrate 1.
The heating and pressurizing device possesses compression chamber 51, the heated air medium can be applied isotropic pressure as media to object.The resin flake 31 that will take out from vacuum lamination apparatus 41 and the laminated body of ceramic substrate 1 be housed in the above-mentioned compression chamber 51, when heating in the compression chamber 51, improve the pressure in the compression chamber 51.Because by the heated air medium is pressurizeed as media,,, make the surface smoothing of composite wiring board better so can prevent the expansion etc. of resin bed 2,3 while volatile ingredient or the bubble that is present in the resin material of crushing is cured.And, owing to can improve the curing rate of resin material by in compression chamber 51, the heated air medium being pressurizeed as media, so can shorten the required time of the curing of resin material.Solidify the kind change of required time according to resin bed 2,3, the short time about for example 1 hour～3 hours just can be realized the raising of productivity ratio.
Utilize the condition of cure of heating and pressurizing device, suitably set according to the kind of resin bed 2,3 and get final product, for example be made as 150 ℃～250 ℃ of temperature.The pressure of this moment is made as about 0.1MPa～1.5MPa and gets final product.And, gas medium can use air, nitrogen, these mist etc., be used for general gas any of this heating and pressurization.
As the technology of when resin combination is solidified, the heated air medium being pressurizeed as media, it is for example special that to open 2003-277479 communique etc. described be known technology, but imagine for example compoundization of metal material such as Copper Foil or aluminium sheet, corrosion resistant plate and resin combination in above-mentioned patent documentation, the utilization of ceramic substrate is imagination not fully.When the composite wiring board of the specific combination of making ceramic substrate and resin bed, at first utilize vacuum lamination to fit, then pressurization is cured important as media with the heated air medium.
In addition, in the above description, it is not necessary that the heated air medium is pressurizeed as media, under normal pressure, carries out the occasion of the curing of resin material in the heated air medium, can realize the shortening of curing time yet.But, from the viewpoint of the fillibility that improves resin material, preferably also and with pressurization.Do not pressurizeing when only utilizing the heated air medium to carry out the curing of resin material, can use cleaning stove or air drier etc.
Second execution mode
In addition, in the above-described first embodiment, form the sintering metal conductor 6 of the column that highly equates on the surface of ceramic substrate 1, but composite wiring board of the present invention as shown in Figure 9, also can form highly different sintering metal conductor 6a～6c on the surface of ceramic substrate 1.Below, the composite wiring board and the manufacture method thereof of second execution mode are described, the explanation of the part that repeats with first execution mode will be omitted.In addition, in Fig. 9, omitted the inner conductor of ceramic substrate 1.
The composite wiring board of second execution mode, as sintering metal conductor 6, except the sintering metal conductor 6c of the column that connects resin bed 3, also has sintering metal conductor 6c than column from the height on the surface of ceramic substrate 1 different sintering metal conductor 6a, 6b.For example in Fig. 9, be formed with the sintering metal conductor 6 of 3 kinds, promptly highly minimum sintering metal conductor 6a, the sintering metal conductor 6b highly higher, higher and connect the sintering metal conductor 6c of the column of resin bed 3 than above-mentioned sintering metal conductor 6a, 6b than sintering metal conductor 6a.The height of sintering metal conductor 6 gets final product according to suitable settings such as the functions that the sintering metal conductor is had, for example can be set in the scope of 5 μ m～200 μ m.In addition, in the present invention, the meaning of " the height difference of sintering metal conductor " does not comprise and results from the slight difference in height of degree of irregularity of manufacturing process.
Figure 10 is that the conductor that is used to form highly different mutually sintering metal conductor 6a～6c forms with thin slice 61.Conductor forms and obtains by the following method with thin slice 61, on the supporter 62 as have the thin slice 63 that shrinks a kind of effect for example form film shrink suppress with raw cook after, on the corresponding position of the sintering metal conductor 6c with the thin slice 63 that shrink to suppress effect, form through hole with connecting resin bed 3, and in through hole filled conductive thickener 64c.The method of filled conductive thickener is not specially limited, and can exemplify silk screen printing etc.
In addition, form with in the thin slice 61 at conductor, conducting paste 64a, the 64b corresponding with sintering metal conductor 6a, the 6b of non-through resin bed 3 remains on to have and shrinks on thin slice 63 surfaces that suppress effect.Conducting paste 64a, 64b utilize the printing of silk screen printing etc. to form the figure of regulation, and the height of conducting paste 64a, 64b is controlled by repeating print.
When making composite wiring board shown in Figure 9, substrate formed with thin slice 61 with raw cook 11a～11e and conductor shown in Figure 10 superpose and dispose.At this moment, these are stacked for conductor forms the printing surface of using thin slice 61, i.e. the conducting paste 64a, the 64b that keep on the surface of conductor formation with thin slice 61 contact with raw cook 11e with substrate.In addition, in second execution mode, only form sintering metal conductor 6a～6c on the one side of ceramic substrate 1, so use the conductor of raw cook 11a～11e to form a side and the opposition side that contacts with thin slice 61 at substrate, disposing not, the contraction of filled conductive thickener suppresses to use raw cook.Afterwards, burn till, remove the burned material that contraction suppresses to use raw cook, thereby on the surface of ceramic substrate 1, form the sintering metal conductor 6a～6c of highly different multiple classes.
Then, by on the surface of ceramic substrate 1, forming resin bed 2,3, obtain composite wiring board shown in Figure 9.
The composite wiring board of second execution mode as sintering metal conductor 6, except the sintering metal conductor 6c that connects resin bed 2, also has from the apparent height of ceramic substrate 1 different sintering metal conductor 6a, 6b.Highly low sintering metal conductor 6a is worked as electrode for capacitors, work with distribution etc. as big electric current than its highly high sintering metal conductor 6b, the sintering metal conductor 6c of the highest highly column connects with path, heat transmission path, contraposition when the skin conductor of formation resin bed 3 as interlayer and works etc. with mark etc., can make resin bed 3 have multiple function according to the height of sintering metal conductor 6.Therefore, by making the height difference of sintering metal conductor 6, can realize further multifunction, the miniaturization of composite wiring board.
The 3rd execution mode
The 3rd execution mode, be that the conductor that replacement is used in second execution mode forms with thin slice 61, the use conductor being arranged at recess filled conductive thickener 64a, 64b on the thin slice 63 with contraction inhibition effect as shown in figure 11 forms the example with thin slice 71.
This conductor forms with thin slice 71 following making.At first, on supporter 62, suppress to use raw cook, at the sintering metal conductor 6c corresponding through hole of the position of regulation setting with column as having the thin slice 63 formation contractions of shrinking the inhibition effect.And, in the present embodiment, be provided with and sintering metal conductor 6a, the 6b corresponding concave part highly lower than sintering metal conductor 6c in position with the regulation of shrinking the thin slice 63 that suppresses effect.At the corresponding sintering metal conductor 6a of the concave depth decision of this formation, the height of 6b.Processing method when recess and through hole are set is not specially limited, and can exemplify punching press, punching processing or the laser processing etc. that utilize mould.These processing methods are carried out the shape control of concave depth control or shape control or through hole easily, are method for optimizing.
Then, filled conductive thickener in recess and through hole.The method of filled conductive thickener is not specially limited, and can exemplify silk screen printing etc.Thus, obtain the conductor formation thin slice 71 of filled conductive thickener 64a, 64b, 64c.
Then, substrate formed with thin slice 71 with raw cook 11a～11e and conductor shown in Figure 11 superpose and dispose, at this moment with they stacked be to form printing surface with thin slice 71 at conductor, promptly conductor forms with the conducting paste 64a, the 64b that fill in the recess of thin slice 71 and contacts with raw cook 11e with substrate.Afterwards, burn till, remove the burned material that contraction suppresses to use raw cook, thereby on the surface of ceramic substrate 1, form the sintering metal conductor 6a～6c of highly different multiple classes.
Then, by on the surface of ceramic substrate 1, forming resin bed 2,3, obtain composite wiring board shown in Figure 9.
In the above-described 2nd embodiment, owing to when forming highly different sintering metal conductor 6a, 6b (conducting paste 64a, 64b), need repeat print, so be difficult to the control height, and might make printing process become numerous and diverse.
Relative therewith, in the 3rd execution mode, also have the height of sintering metal conductor 6a, 6b according to being arranged at the concave depth decision conducting paste 64a, the 64b that have on the thin slice 63 that shrinks the inhibition effect,, can simplify printing process so do not need to repeat print.And, utilizing the height control of the conducting paste of concave depth control, the height control of the conducting paste of repeating print with utilization is compared, and is also very favourable on this point easily.
The 4th execution mode
The 4th execution mode is to shrink the thin slice that suppresses effect as constituting conductor formation with having of thin slice, uses to comprise calcium carbonate (CaCO 3) the example of thin slice.
The conduction formation that use comprises the thin slice of calcium carbonate obtains with thin slice is following,, after the formation film comprises the thin slice of calcium carbonate on the supporter, forms through hole, filled conductive thickener in this through hole that is.The conductor that comprises the thin slice of calcium carbonate in use forms with also can the printing conductive thickener on the surface of thin slice, but also the conducting paste of can repeating print.Have again, also can on conductor forms with thin slice (thin slice that comprises calcium carbonate), recess be set, filled conductive thickener in this recess.
The above-mentioned thin slice that comprises calcium carbonate forms film and carries out sheet and form by the calcium carbonate thickener that contains that will mix binding agent and calcium carbonate on supporter.
Above-mentionedly comprise binding agent contained in the thin slice of calcium carbonate, for example can use any resin material, but preferably use can rapid thermal decomposition when burning till material.Especially preferably use than being contained in aforesaid substrate with the material of thermal decomposition easily also of the organic vehicles in the raw cook, perhaps with the equal material of organic vehicles that is contained in the substrate usefulness raw cook.
In the present embodiment, as shown in figure 12, used the conductor of the thin slice that comprises calcium carbonate to form in stack and burnt till under the state with raw cook 11a～11e with thin slice 81,82 and substrate.In addition, also can the stack these after pressurize.Burn till by above-mentioned, be filled in conductor formation and be transferred to the ceramic substrate side with the conducting paste 18 in the through hole of thin slice 81,82, can obtain possessing the ceramic substrate of sintering metal conductor, obtain composite wiring board by on this ceramic base plate surface, forming resin bed on the surface.
As having the thin slice that shrink to suppress effect, comprise the thin slice of calcium carbonate by use, can prevent to have the burned material of shrinking the thin slice that suppresses effect and stay on the surface (the particularly surface of conductor fig) of ceramic substrate as residue and residual.Having the burned material of shrinking the thin slice that suppresses effect is insulant, if it stays on the surface of conductor fig as residue and residual, then hinder conducting, but the thin slice that comprises calcium carbonate by use shrinks the thin slice that suppresses effect as having, residual hardly residue does not clean and can make the very good composite wiring board of connection reliability (conducting reliability) yet.In addition, also can eliminate residue according to the above-mentioned unclean ceramic substrate in back that burns till like that, the cleaning of the ceramic substrate after burning till being carried out ultrasonic wave cleaning etc. is for arbitrarily.
In addition, though to compare effect little with dimensional accuracy that utilize to shrink suppresses to realize with raw cook or flatness, but be used for the contraction that thin slice had that comprises calcium carbonate that conductor forms with thin slice and suppress effect, can the ceramic substrate after burning till in the raising of realization dimensional accuracy or flatness.
The 5th execution mode
The 5th execution mode is that (having the thin slice that shrinks the inhibition effect is the thin slice that comprises calcium carbonate with thin slice in the conductor formation of using in the 4th execution mode.) the outside again, stack has the example that burns till under the state of the thin slice that shrink to suppress effect.
Have the thin slice that shrink to suppress effect and can exemplify to shrink and suppress with raw cook, comprise the thin slice of calcium carbonate or comprise zirconia or the thin slice of aluminium oxide as above-mentioned, state especially in the use that to shrink the occasion substrate that suppresses with raw cook big with the contraction inhibition effect of raw cook.Suppress to use raw cook as above-mentioned contraction, the contraction that can use and be used in the first embodiment conductor to form with thin slice suppresses with the same raw cook of raw cook.Promptly, suppress to use raw cook as above-mentioned contraction, can use the contraction that comprises at least a and sintering adjuvant of from quartzy, christobalite and tridymite, selecting to suppress use raw cook, comprise the tridymite of sintering by being used to obtain burning till of ceramic substrate and by above-mentioned contraction inhibition of burning till the oxide of sintering not with raw cook etc.As the above-mentioned thin slice that comprises calcium carbonate, can use and be used for conductor in the above-described 4th embodiment to form with the same thin slice of the thin slice that comprises calcium carbonate of thin slice.
And, if use the thin slice that comprises zirconia or aluminium oxide, then suppress to compare, can reduce stress, reduce the sintering metal conductor effectively bad number of times takes place the effect of sintering metal conductor with the occasion of thin slice with using the above-mentioned contraction that for example comprises tridymite.
As shown in figure 13, used the conductor of the thin slice that comprises calcium carbonate to form with the both sides configuration of raw cook 11a～11e, and outside it, disposed respectively to have and shrink the thin slice 83 that suppresses effect, burnt till then with thin slice 81,82 at stacked a plurality of substrates.In addition, also can the stack these after pressurize.Burn till by above-mentioned, be filled in conductor formation and be transferred to the ceramic substrate side with the conducting paste 18 in the through hole of thin slice 81,82, can obtain possessing the ceramic substrate of sintering metal conductor, obtain composite wiring board by on this ceramic base plate surface, forming resin bed on the surface.
The conductor of the thin slice by comprising calcium carbonate in use forms with the outside of thin slice 81,82 is overlapping has a thin slice 83 that shrinks the inhibition effect, same with the above-mentioned conductor formation of independent use with the occasion of thin slice 81,82, can prevent to have the burned material of shrinking the thin slice that suppresses effect and stay on the surface (the particularly surface of conductor fig) of ceramic substrate as residue and residual.Especially, owing to utilize acting on of thin slice 83 to peel off conductor formation naturally with thin slice 81,82, so removing of residue becomes easier with the border of ceramic substrate with above-mentioned contraction inhibition effect.
Have again, combination had and shrinks the thin slice that suppresses effect on the conductor of the thin slice by comprising calcium carbonate in use formed with thin slice, particularly shrink and suppress to use raw cook, to the sufficient restraining force of substrate effect, compare the dimensional accuracy that can realize substrate and the raising of flatness so form with the occasion of thin slice with the above-mentioned conductor of independent use.
More than, composite wiring board of the present invention and manufacture method thereof have been described, the present invention is not limited to above-mentioned record certainly.That is, in the above description, exemplified the ceramic substrate of multi-ply construction as ceramic substrate, but can obtain same effect in the occasion of the ceramic substrate that uses individual layer.
And, when the applying resin bed is made composite wiring board on ceramic substrate, be not limited to form the occasion of resin bed in the both sides of ceramic substrate, for example also can be only form resin bed in a side of the formation sintering metal conductor of ceramic substrate.
Have, when make constituting the ceramic substrate of composite wiring board, the various conductors that also can appropriate combination illustrate in first execution mode～the 5th execution mode form uses thin slices again.
Embodiment
Below, based on experimental result explanation embodiments of the invention.
The substrate making of raw cook
At first, having prepared alumina glass as substrate with ceramic material is dielectric material.It is mixed with organic binder bond and organic solvent, utilize the scraper legal system to make the substrate raw cook of thickness 40 μ m.Through hole is set at aforesaid substrate on raw cook, the filled conductive thickener forms path in this through hole.Form by conducting paste being printed as regulation on raw cook, form the inner conductor figure at substrate.Conducting paste is to use the Ag particle of average grain diameter 1.5 μ m, it is mixed with organic binder bond and organic solvent and modulates as electric conducting material.
Conductor forms the making with thin slice A
Preparing tridymite silica based material as shrink suppressing with material, it being mixed with organic binder bond and organic solvent and utilize the scraper legal system to make the contraction inhibition raw cook of thickness 50 μ m.On suppressing with raw cook, contraction utilize carbon dioxide laser that the through hole of aperture 40 μ m is set with spacing 80 μ m.Then, utilize silk screen printing filled conductive thickener in through hole, obtain conductor formation thin slice A.Conducting paste uses the Ag particle of average grain diameter 1.5 μ m as electric conducting material, it is mixed with organic binder bond and organic solvent and modulates.
Conductor forms the making with thin slice B
Suppress to prepare tridymite silica based material as shrinking, it is mixed the contraction that utilizes the scraper legal system to make thickness 125 μ m suppress to use raw cook with organic binder bond and organic solvent with material.On suppressing with raw cook, contraction utilize punching processing that the through hole of aperture 100 μ m is set with spacing 300 μ m.Then, utilize silk screen printing in through hole, to be filled in above-mentioned conductor and form, obtain conductor formation thin slice B with the conducting paste that uses among the thin slice A.
Conductor forms the making with chips C
After calcium carbonate and organic binder bond (allyl resin), plasticizer, dispersant and organic solvent hybrid modulation contained the calcium carbonate thickener, utilize the scraper method to make the thin slice of the calcium carbonate that comprises thickness 50 μ m.Comprising on the thin slice of calcium carbonate, utilizing the UV-YAG laser that the through hole of aperture 40 μ m is set with spacing 80 μ m.Then, utilize silk screen printing in through hole, to be filled in above-mentioned conductor and form, obtain conductor formation chips C with the conducting paste that uses among the thin slice A.
Conductor forms the making with thin slice D
After calcium carbonate and organic binder bond (allyl resin), plasticizer, dispersant and organic solvent hybrid modulation contained the calcium carbonate thickener, utilize the scraper method to make the thin slice of the calcium carbonate that comprises thickness 100 μ m.Comprising on the thin slice of calcium carbonate, utilizing punching processing that the through hole of aperture 100 μ m is set with spacing 250 μ m.Then, utilize silk screen printing in through hole, to be filled in above-mentioned conductor and form, obtain conductor formation thin slice D with the conducting paste that uses among the thin slice A.
Conductor forms the making with thin slice E
After calcium carbonate and organic binder bond (allyl resin), plasticizer, dispersant and organic solvent hybrid modulation contained the calcium carbonate thickener, utilize the scraper method to make the thin slice of the calcium carbonate that comprises thickness 60 μ m.Comprising on the thin slice of calcium carbonate, utilizing punching processing that the through hole of aperture 100 μ m is set with spacing 250 μ m.Then, utilize silk screen printing in through hole, to be filled in above-mentioned conductor and form, obtain conductor formation thin slice E with the conducting paste that uses among the thin slice A.
Has the making of shrinking the thin slice A that suppresses effect
Suppress to prepare tridymite silica based material as shrinking, it is mixed the contraction that utilizes the scraper legal system to make thickness 75 μ m suppress to use raw cook with organic binder bond and organic solvent with material.
Has the making of shrinking the thin slice B that suppresses effect
Suppress to prepare tridymite silica based material as shrinking, it is mixed the contraction that utilizes the scraper legal system to make thickness 125 μ m suppress to use raw cook with organic binder bond and organic solvent with material.
Has the making of shrinking the chips C that suppresses effect
Shrink the chips C that suppresses effect as having, making comprises zirconic thin slice.That is, prepare zirconia material, it is mixed the thin slice that utilizes the scraper legal system to make thickness 75 μ m with organic binder bond and organic solvent.
Has the making of shrinking the thin slice D that suppresses effect
Shrink the thin slice D that suppresses effect as having, make the thin slice that comprises aluminium oxide.That is, prepare alumina material, it is mixed the thin slice that utilizes the scraper legal system to make thickness 751 μ m with organic binder bond and organic solvent.
The making of resin flake
The following making of resin flake utilizes and to scrape skill in using a kitchen knife in cookery application of resin coating and make its drying on the PET film, applies heat treatment so that cold coating becomes the mode of semi-cured state (B level state).Cold coating comprises the Ethenylbenzene methyl as resin material, comprises spherical silicon dioxide 30vol% as filler, utilizes ball mill to modulate by disperseing, mixing.The film thickness monitoring of the resin material on the PET film is about 45 μ m or about 60 μ m.
Embodiment 1
The substrate raw cook of stacked many making, with these stacked be that overlapping conductor forms and use thin slice A, the contraction of overlapping thickness 50 μ m inhibition raw cook on the opposing party's face on the stacked substrate face with a side of raw cook.The laminated body that obtains is like this put into the smooth mould 700kg/cm of common last low punch 2Pressurize after 7 minutes, burn till with 900 ℃.After burning till, will be configured in stacked substrate forms with thin slice A with the conductor of the both sides of raw cook and shrinks the burned material that suppresses with raw cook, utilizes sanding machine (only making institute society make trade name (PNEUMA BLASTER (ニ ユ one マ Block ラ ス one))) to remove.Sandblast is used alumina abrasive grain No. 1000, carries out with air pressure 0.17MPa～0.2MPa.
By above method, obtain possessing the ceramic substrate of the sintering metal conductor of the column about height 40 μ m on the surface of ceramic substrate.Ceramic substrate after burning till does not shrink in the face direction all sidedly, only shrinks significantly at thickness direction.
Then, the both sides that form the ceramic substrate of sintering metal conductor on the surface respectively dispose the above-mentioned resin flake of a thickness 45 μ m, use vacuum lamination apparatus (name mechanism is done society of institute and made the VAII-700 type) to make these applyings.Laminating condition is made as 110 ℃ of temperature, 60 seconds pressing times.Pressure during applying is made as 0.5MPa.Then, with vacuum lamination apparatus resin material is solidified.Condition of cure is made as 180 ℃ of temperature, pressure 0.5MPa.Solidifying the required time is 4 hours.
With the resin face of the substrate after solidifying with wet abrasive blasting device (making of Macoho (マ コ one) society) grinding, make the sintering metal conductor above be exposed on the resin layer surface.Wet abrasive blasting is carried out under the condition of air pressure 0.15MPa～0.17MPa No. 2000, alumina abrasive grain.By through above operation, obtain the composite wiring board of embodiment 1.
Embodiment 2
Form with overlapping conductor on stacked many substrate face and use thin slice B, after mode that the contraction of overlapping thickness 125 μ m on the opposing party's the face suppresses the usefulness raw cook is stacked with it, under condition similarly to Example 1, pressurizes, burn till with a side of raw cook.After burning till, use thin slice B and shrink the burned material that suppresses with raw cook with the conductor formation of the both sides of raw cook, utilize wet abrasive blasting device (making of Macoho (マ コ one) society) to remove being configured in stacked substrate.Wet abrasive blasting is carried out under the condition of No. 2000, alumina abrasive grain, air pressure 0.17MPa～0.2MPa.
By above method, obtain possessing the ceramic substrate of the sintering metal conductor of the column about height 100 μ m on the surface of ceramic substrate.Ceramic substrate after burning till does not shrink in the face direction all sidedly, only in the bigger contraction of thickness direction.
Then, the above-mentioned resin flake of overlapping 2 thickness, 60 μ m is made the resin flake of thickness 120 μ m.The both sides that form the ceramic substrate of sintering metal conductor on the surface dispose the resin flake of this thickness 120 μ m respectively, make these applyings similarly to Example 1.Laminating condition is made as similarly to Example 1.Then, with vacuum lamination apparatus resin material is solidified.Condition of cure is made as similarly to Example 1.
The resin face of the substrate after solidifying is used amery wheel grinding machine (making of DISCO society) grinding, make the sintering metal conductor above be exposed on the resin layer surface.Abrasion wheel grinding carries out under the grinding speed condition of 1 μ m/ second, with resin bed grinding thickness 20 μ m.By through above operation, obtain the composite wiring board of embodiment 2.
Embodiment 3
Overlapping conductor forms and uses chips C on stacked many substrate face with a side of raw cook, the thin slice that comprises calcium carbonate of overlapping thickness 50 μ m on the opposing party's face, in this way with it stacked after, under condition similarly to Example 1, pressurize, burn till.After burning till, form with chips C with the conductor of the both sides of raw cook and comprise the burned material of the thin slice of calcium carbonate, utilize the ultrasonic wave cleaning to remove being configured in stacked substrate.The condition of ultrasonic wave cleaning is made as 45KHz, 60 seconds.
By above method, obtain possessing the ceramic substrate of the sintering metal conductor of the column about height 40 μ m on the surface of ceramic substrate.Ceramic substrate after burning till is suppressed at the inhibition of face direction all sidedly, only shrinks significantly at thickness direction.Shrinkage after burning till is about+2.6%～+ 3.0%.
Then, the both sides that form the ceramic substrate of sintering metal conductor on the surface respectively dispose the above-mentioned resin flake of a thickness 45 μ m, make these applyings similarly to Example 1.Laminating condition is made as similarly to Example 1.Then, with vacuum lamination apparatus resin material is solidified.Condition of cure is made as similarly to Example 1.
With the resin face of the substrate after solidifying with wet abrasive blasting device (making of Macoho (マ コ one) society) grinding, make the sintering metal conductor above be exposed on the resin layer surface.Wet abrasive blasting is carried out under the condition of No. 2000, alumina abrasive grain, air pressure 0.15MPa～0.17MPa.By through above operation, obtain the composite wiring board of embodiment 3.
Embodiment 4
In embodiment 4, form under the state that the configuration of the outside again with chips C has the thin slice A that shrinks the inhibition effect at conductor and to burn till.Promptly, form with chips C and have with overlapping conductor on the face of stacked many substrate and shrink the thin slice A that suppresses effect with a side of raw cook, and also overlapping conductor on the opposing party's the face form with chips C and have shrink the thin slice A that suppresses effect mode with it stacked after, under condition similarly to Example 1, pressurize, burn till.After burning till, form with chips C with the conductor of the both sides of raw cook and have the burned material of shrinking the thin slice A that suppresses effect being configured in stacked substrate, utilize sanding machine (society of only making institute makes, trade name (PNEUMA BLASTER (ニ ユ one マ Block ラ ス one))) to remove.Sandblast is carried out under the condition of air pressure 0.17MPa～0.2MPa No. 1000, alumina abrasive grain.
By above method, obtain possessing the ceramic substrate of the sintering metal conductor of the column about height 45 μ m on the surface of ceramic substrate.Ceramic substrate after burning till does not shrink in the face direction all sidedly, only shrinks significantly at thickness direction.Shrinkage after burning till is about+0.4%～+ 0.5%, compares with embodiment 3 and has suppressed the substrate contraction.
Then, the both sides that form the ceramic substrate of sintering metal conductor on the surface respectively dispose the above-mentioned resin flake of a thickness 45 μ m, make these applyings similarly to Example 1.Laminating condition is made as similarly to Example 1.Then, with vacuum lamination apparatus resin material is solidified.Condition of cure is made as similarly to Example 1.
With the resin face of the substrate after solidifying with wet abrasive blasting device (making of Macoho (マ コ one) society) grinding, make the sintering metal conductor above be exposed on the resin layer surface.Wet abrasive blasting is carried out under the condition of No. 2000, alumina abrasive grain, air pressure 0.15MPa～0.17MPa.By through above operation, obtain the composite wiring board of embodiment 4.
Embodiment 5
In embodiment 5, burn till with the having under the state that shrinks the thin slice B that suppresses effect of the configuration of the outside again thickness 125 μ m of chips C in conductor formation.Promptly, form with chips C and have with overlapping conductor on the face of stacked many substrate and shrink the thin slice B that suppresses effect with a side of raw cook, and form with chips C and shrink the mode that suppresses with raw cook B with after stacked at also overlapping conductor on the opposing party's the face, under condition similarly to Example 1, pressurize, burn till.After burning till, form with chips C with the conductor of the both sides of raw cook and have the burned material of shrinking the thin slice B that suppresses effect being configured in stacked substrate, utilize sanding machine (society of only making institute makes, trade name (PNEUMA BLASTER (ニ ユ one マ Block ラ ス one))) to remove.Sandblast is carried out under the condition of No. 1000, alumina abrasive grain, air pressure 0.17MPa～0.2MPa.
By above method, obtain possessing the ceramic substrate of the sintering metal conductor of the column about height 45 μ m on the surface of ceramic substrate.Ceramic substrate after burning till does not shrink in the face direction all sidedly, only shrinks significantly at thickness direction.Shrinkage after burning till is about+0.2%～+ 0.3%, compares with embodiment 4 and has suppressed the substrate contraction.
Then, the both sides that form the ceramic substrate of sintering metal conductor on the surface respectively dispose the above-mentioned resin flake of a thickness 45 μ m, make these applyings similarly to Example 1.Laminating condition is made as similarly to Example 1.Then, with vacuum lamination apparatus resin material is solidified.Condition of cure is made as similarly to Example 1.
With the resin face of the substrate after solidifying with wet abrasive blasting device (making of Macoho (マ コ one) society) grinding, make the sintering metal conductor above be exposed on the resin layer surface.Wet abrasive blasting is carried out under the condition of No. 2000, alumina abrasive grain, air pressure 0.15MPa～0.17MPa.By through above operation, obtain the composite wiring board of embodiment 5.
Embodiment 6
In embodiment 6, burn till with the having under the state that shrinks the thin slice B that suppresses effect of the configuration of the outside again thickness 125 μ m of thin slice D in conductor formation.Promptly, form with thin slice D and have the thin slice B that shrinks the inhibition effect with overlapping conductor on the face of stacked many substrate with a side of raw cook, and also overlapping conductor on the opposing party's the face form with thin slice D and mode with the thin slice B that shrinks the inhibition effect with it stacked after, under condition similarly to Example 1, pressurize, burn till.After burning till, form with thin slice D with the conductor of the both sides of raw cook and have the burned material of the thin slice B that shrinks the inhibition effect, utilize wet abrasive blasting device (making of Macoho (マ コ one) society) to remove being configured in stacked substrate.Wet abrasive blasting is carried out under the condition of No. 2000, alumina abrasive grain, air pressure 0.17MPa～0.2MPa.
By above method, obtain possessing the ceramic substrate of the sintering metal conductor of the column about height 85 μ m on the surface of ceramic substrate.Ceramic substrate after burning till does not shrink in the face direction all sidedly, only shrinks significantly at thickness direction.Shrinkage after burning till is about+0.7%～+ 0.8%, and comparing with embodiment 5 has increased the substrate contraction.
Then, the both sides that form the ceramic substrate of sintering metal conductor on the surface respectively dispose the above-mentioned resin flake of 2 thickness, 45 μ m, make these applyings similarly to Example 1.Laminating condition is made as similarly to Example 1.Then, with vacuum lamination apparatus resin material is solidified.Condition of cure is made as similarly to Example 1.
The resin face of the substrate after solidifying is used amery wheel grinding machine (making of DISCO society) grinding, make the sintering metal conductor above be exposed on the resin layer surface.Abrasion wheel grinding carries out under the grinding speed condition of 1 μ m/ second, with resin bed grinding thickness 20 μ m.By through above operation, obtain the composite wiring board of embodiment 6.
Embodiment 7
In embodiment 7, form under the state that the configuration of the outside again with thin slice E has the chips C of shrinking the inhibition effect at conductor and to burn till.Promptly, form with thin slice E and have the chips C of shrinking the inhibition effect with overlapping conductor on the face of stacked many substrate with a side of raw cook, and also overlapping conductor on the opposing party's the face form with thin slice E and mode with the chips C of shrinking the inhibition effect with it stacked after, under condition similarly to Example 1, pressurize, burn till.After burning till,, utilize wet abrasive blasting device (making of Macoho (マ コ one) society) to remove with being configured in the burned material that the conductor of stacked substrate with the both sides of raw cook forms with thin slice E and have the chips C of shrinking the inhibition effect.Wet abrasive blasting is carried out under the condition of No. 2000, alumina abrasive grain, air pressure 0.17MPa～0.2MPa.
By above method, obtain possessing the ceramic substrate of the sintering metal conductor of the column about height 55 μ m on the surface of ceramic substrate.Ceramic substrate after burning till does not shrink in the face direction all sidedly, only shrinks significantly at thickness direction.Shrinkage after burning till is about+0.1%～+ 0.3%.
Then, the both sides that form the ceramic substrate of sintering metal conductor on the surface respectively dispose the above-mentioned resin flake of 1 thickness, 60 μ m, make these applyings similarly to Example 1.Laminating condition is made as similarly to Example 1.Then, with vacuum lamination apparatus resin material is solidified.Condition of cure is made as similarly to Example 1.
The resin face of the substrate after solidifying is used amery wheel grinding machine (making of DISCO society) grinding, make the sintering metal conductor above be exposed on the resin layer surface.Abrasion wheel grinding carries out under the grinding speed condition of 1 μ m/ second, with resin bed grinding thickness 20 μ m.By through above operation, obtain the composite wiring board of embodiment 7.
Embodiment 8
In embodiment 8, form under the state that the configuration of the outside again with thin slice E has the thin slice D that shrinks the inhibition effect at conductor and to burn till.Promptly, form with thin slice E and have the thin slice D that shrinks the inhibition effect with overlapping conductor on the face of stacked many substrate with a side of raw cook, and also overlapping conductor on the opposing party's the face form with thin slice E and mode with the thin slice D that shrinks the inhibition effect with it stacked after, under condition similarly to Example 1, pressurize, burn till.After burning till, form with thin slice E with the conductor of the both sides of raw cook and have the burned material of the thin slice D that shrinks the inhibition effect, utilize wet abrasive blasting device (making of Macoho (マ コ one) society) to remove being configured in stacked substrate.Wet abrasive blasting is carried out under the condition of No. 2000, alumina abrasive grain, air pressure 0.17MPa～0.2MPa.
By above method, obtain possessing the ceramic substrate of the sintering metal conductor of the column about height 55 μ m on the surface of ceramic substrate.Ceramic substrate after burning till does not shrink in the face direction all sidedly, only shrinks significantly at thickness direction.Shrinkage after burning till is about+0.2%～+ 0.4%.
Then, the both sides that form the ceramic substrate of sintering metal conductor on the surface respectively dispose the above-mentioned resin flake of 1 thickness, 60 μ m, make these applyings similarly to Example 1.Laminating condition is made as similarly to Example 1.Then, with vacuum lamination apparatus resin material is solidified.Condition of cure is made as similarly to Example 1.
The resin face of the substrate after solidifying is used amery wheel grinding machine (making of DISCO society) grinding, make the sintering metal conductor above be exposed on the resin layer surface.Abrasion wheel grinding carries out under the grinding speed condition of 1 μ m/ second, with resin bed grinding thickness 20-.By through above operation, obtain the composite wiring board of embodiment 8.
Estimate
More than, confirmed in any composite wiring board of embodiment 1～embodiment 8, the sintering metal conductor perforation resin bed of the column that is formed at ceramic base plate surface is exposed above it, can be used as utilizations such as connection path, heat transmission path.
And, the observed result of the ceramic base plate surface after burn till, confirmed in the embodiment 3～8 that forms the thin slice that comprises calcium carbonate with the thin slice use as conductor, shrink the embodiment 1,2 that suppresses with raw cook and compare with forming as conductor only to use, on the ceramic matrix after burning till and the reduction significantly of the residue on the conductor (conductor forms the burned material with thin slice) amount with thin slice.Shrink among the embodiment 4～8 that burns till under the state that suppresses with raw cook in the outside stack that comprises the thin slice of calcium carbonate (conductor forms and uses thin slice), conductor forms with peeling off from ceramic substrate oneself rapidly in the cooling procedure of thin slice after burning till.Using separately among the embodiment 3 of the thin slice that comprises calcium carbonate with thin slice as conductor formation, conductor forms and can directly not peel off after burning till with thin slice, but pulverizes through decomposing after a few hours after burning till in atmosphere.
In addition, shrink the height of the sintering metal conductor of the embodiment 4 that burns till under the state of inhibition with raw cook and embodiment 5 in the outside stack that comprises the thin slice of calcium carbonate (conductor form use thin slice), comparing with embodiment 1 and embodiment 3 has increased by 5 μ m.This be because, the occasion that suppresses with raw cook is shunk in stack on conductor forms with thin slice, the conducting paste of filling in conductor forms with thin slice is projected into outermost layer (shrinking the inhibition raw cook) when pressurization.Above-mentioned overhang relies on the compactness of conducting paste and utilizes the contraction of pressurization to suppress to change with the shrinkage of raw cook.
Be used for conductor at the thin slice that will comprise calcium carbonate and form the occasion of using thin slice, substrate shrinkage after the burning till of embodiment 3～embodiment 8 more as can be known, suppress to use raw cook by shrinking in the outside configuration that comprises the thin slice of calcium carbonate (conductor forms and uses thin slice), to the sufficient restraining force of substrate effect, the contraction of control basal plate more reliably.And confirm that the bad frequency of the sintering metal conductor in embodiment 7 and embodiment 8 and embodiment 4～embodiment 6 relatively reduce.

Claims (25)

1. a composite wiring board is characterized in that,
Have: ceramic substrate; The resin bed that contacts with at least one side's of above-mentioned ceramic substrate face and be provided with; And the sintering metal conductor that connects above-mentioned resin bed.
2. composite wiring board according to claim 1 is characterized in that,
Above-mentioned ceramic substrate is the stacked all-in-one-piece multilayer ceramic substrates of a plurality of ceramic layers.
3. composite wiring board according to claim 2 is characterized in that,
On above-mentioned multilayer ceramic substrate, form inner conductor.
4. composite wiring board according to claim 1 is characterized in that,
Above-mentioned sintering metal conductor as from interlayer connecting path, heat transmission path, contraposition with at least a the working of selecting the mark.
5. composite wiring board according to claim 1 is characterized in that,
As above-mentioned sintering metal conductor, has sintering metal conductor from the different multiple class of the height of above-mentioned ceramic base plate surface.
6. composite wiring board according to claim 5 is characterized in that,
Highly low sintering metal conductor works as wiring graph or electrode, highly high sintering metal conductor as from interlayer connecting path, heat transmission path, contraposition with at least a the working of selecting the mark.
7. composite wiring board according to claim 1 is characterized in that,
Above-mentioned sintering metal conductor comprises select at least a from Ag, Pd, Au, Cu, Ni.
8. composite wiring board according to claim 1 is characterized in that,
Be used for the radio-frequency head product.
9. the manufacture method of a composite wiring board is characterized in that,
Have: form through hole on the thin slice with contraction inhibition effect, the filled conductive thickener obtains conductor and forms the operation of using thin slice in above-mentioned through hole;
Burn till under the state with raw cook with thin slice and substrate in the above-mentioned conductor formation of stack, obtain having the operation of the ceramic substrate of sintering metal conductor on the surface;
Remove above-mentioned operation from above-mentioned ceramic base plate surface with the burned material of shrinking the thin slice that suppresses effect; And
Form the operation of resin bed at above-mentioned ceramic base plate surface.
10. the manufacture method of composite wiring board according to claim 9 is characterized in that,
Above-mentioned thin slice with contraction inhibition effect is to shrink to suppress to use raw cook.
11. the manufacture method of composite wiring board according to claim 10 is characterized in that,
Above-mentioned contraction suppresses to comprise at least a and sintering adjuvant of selecting with raw cook from quartz, christobalite and tridymite,
Above-mentioned sintering adjuvant is softening or generate select the oxide of liquid phase and the alkali metal compound at least a from beginning with the sintering of raw cook at substrate below the temperature.
12. the manufacture method of composite wiring board according to claim 10 is characterized in that,
Above-mentioned contraction suppresses to comprise by above-mentioned with raw cook burns till the tridymite of sintering and by the above-mentioned not oxide of sintering that burns till.
13. the manufacture method of composite wiring board according to claim 9 is characterized in that,
Above-mentioned thin slice with contraction inhibition effect is the thin slice that comprises calcium carbonate.
14. the manufacture method of composite wiring board according to claim 13 is characterized in that,
Form under the state that the stack of the outside again with thin slice has the thin slice that shrinks the inhibition effect at above-mentioned conductor and to carry out above-mentioned burning till.
15. the manufacture method of composite wiring board according to claim 14 is characterized in that,
Form at above-mentioned conductor that to have the thin slice that shrinks the inhibition effect with the configuration of the outside again of thin slice above-mentioned be the thin slice that comprises zirconia or aluminium oxide.
16. the manufacture method of composite wiring board according to claim 9 is characterized in that,
Overlapping printing conductive thickener on above-mentioned surface with the thin slice that shrink to suppress effect.
17. the manufacture method of composite wiring board according to claim 9 is characterized in that,
Above-mentioned have on the thin slice that shrink to suppress effect form recess again, in above-mentioned recess, fill above-mentioned conducting paste, and make conducting paste and aforesaid substrate in the above-mentioned recess superpose above-mentioned conductor formation contiguously with thin slice and aforesaid substrate raw cook with raw cook.
18. the manufacture method of composite wiring board according to claim 9 is characterized in that,
Stacked a plurality of substrate is made the raw chip laminating body with raw cook, and the above-mentioned conductor of configuration forms and uses thin slice at least one side's of above-mentioned raw chip laminating body face.
19. the manufacture method of composite wiring board according to claim 9 is characterized in that,
After removing above-mentioned burned material with the thin slice that shrink to suppress effect, repeated configuration resin flake on above-mentioned ceramic base plate surface utilizes vacuum lamination that it is fitted, thereby forms above-mentioned resin bed.
20. the manufacture method of composite wiring board according to claim 19 is characterized in that,
Carry out above-mentioned applying as above-mentioned vacuum lamination is following, behind above-mentioned ceramic substrate of configuration and above-mentioned resin flake between heated plate and the film, when reducing pressure, will it be pressed on above-mentioned ceramic substrate and the above-mentioned resin flake to above-mentioned film that the direction of above-mentioned heated plate expands with heated air by above-mentioned heated plate and above-mentioned film formed space.
21. the manufacture method of composite wiring board according to claim 19 is characterized in that,
After carrying out above-mentioned applying, the heated air medium is carried out resin solidification as media.
22. the manufacture method of composite wiring board according to claim 21 is characterized in that,
By being pressurizeed as media, above-mentioned heated air medium carries out above-mentioned resin solidification.
23. the manufacture method of composite wiring board according to claim 19 is characterized in that,
Above-mentioned resin flake is the thin slice that makes the resin material film forming on supporter, and above-mentioned resin material becomes semi-cured state.
24. the manufacture method of composite wiring board according to claim 19 is characterized in that,
Be made as s (mm at area with above-mentioned ceramic substrate 2), when thickness is made as t (mm), s/t is 10000～250000.
25. the manufacture method of composite wiring board according to claim 9 is characterized in that,
After forming above-mentioned resin bed, the surface of the above-mentioned resin bed of grinding.
CN 200610147049 2005-11-14 2006-11-13 Composite wiring board and manufacturing method thereof Pending CN1968569A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005329337 2005-11-14
JP2005329337 2005-11-14
JP2006015652 2006-01-24

Publications (1)

Publication Number Publication Date
CN1968569A true CN1968569A (en) 2007-05-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200610147049 Pending CN1968569A (en) 2005-11-14 2006-11-13 Composite wiring board and manufacturing method thereof

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Country Link
CN (1) CN1968569A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103402342A (en) * 2013-07-29 2013-11-20 江西祥能科技有限公司 Cooling material
CN103906378B (en) * 2012-12-28 2017-02-08 深南电路有限公司 Manufacturing method of circuit board for bearing large current and circuit board for bearing large current
CN111096090A (en) * 2017-09-20 2020-05-01 株式会社村田制作所 Method for manufacturing ceramic substrate, and module
CN112437560A (en) * 2020-12-28 2021-03-02 珠海元盛电子科技股份有限公司 LCP-FPC pressing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103906378B (en) * 2012-12-28 2017-02-08 深南电路有限公司 Manufacturing method of circuit board for bearing large current and circuit board for bearing large current
CN103402342A (en) * 2013-07-29 2013-11-20 江西祥能科技有限公司 Cooling material
CN103402342B (en) * 2013-07-29 2015-07-08 江西祥能科技有限公司 Cooling material
CN111096090A (en) * 2017-09-20 2020-05-01 株式会社村田制作所 Method for manufacturing ceramic substrate, and module
CN112437560A (en) * 2020-12-28 2021-03-02 珠海元盛电子科技股份有限公司 LCP-FPC pressing method
CN112437560B (en) * 2020-12-28 2022-08-12 珠海元盛电子科技股份有限公司 LCP-FPC pressing method

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