CN1960619B - 热管理系统及其装配方法 - Google Patents
热管理系统及其装配方法 Download PDFInfo
- Publication number
- CN1960619B CN1960619B CN200610144559.7A CN200610144559A CN1960619B CN 1960619 B CN1960619 B CN 1960619B CN 200610144559 A CN200610144559 A CN 200610144559A CN 1960619 B CN1960619 B CN 1960619B
- Authority
- CN
- China
- Prior art keywords
- heat
- graphite
- conducting piece
- plane element
- graphite plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (23)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/267,933 US7889502B1 (en) | 2005-11-04 | 2005-11-04 | Heat spreading circuit assembly |
US11/267,933 | 2005-11-04 | ||
US11/339,338 | 2006-01-25 | ||
US11/339,338 US7303005B2 (en) | 2005-11-04 | 2006-01-25 | Heat spreaders with vias |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1960619A CN1960619A (zh) | 2007-05-09 |
CN1960619B true CN1960619B (zh) | 2012-09-05 |
Family
ID=38072040
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610144559.7A Expired - Fee Related CN1960619B (zh) | 2005-11-04 | 2006-11-03 | 热管理系统及其装配方法 |
CN200610172381.7A Expired - Fee Related CN100539815C (zh) | 2005-11-04 | 2006-11-04 | 循环led的散热器 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610172381.7A Expired - Fee Related CN100539815C (zh) | 2005-11-04 | 2006-11-04 | 循环led的散热器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7889502B1 (zh) |
CN (2) | CN1960619B (zh) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7505275B2 (en) * | 2005-11-04 | 2009-03-17 | Graftech International Holdings Inc. | LED with integral via |
US7922360B2 (en) * | 2007-02-14 | 2011-04-12 | Cree, Inc. | Thermal transfer in solid state light emitting apparatus and methods of manufacturing |
CN100556264C (zh) * | 2007-08-07 | 2009-10-28 | 哈尔滨工程大学 | 一种石墨-金属复合散热基材的制备方法 |
KR100910054B1 (ko) * | 2007-12-18 | 2009-07-30 | 에스엘 주식회사 | Led방열 장치 |
US9962284B2 (en) * | 2007-12-19 | 2018-05-08 | Johnson & Johnson Consumer Inc. | Thermal treatment device |
US20090165302A1 (en) * | 2007-12-31 | 2009-07-02 | Slaton David S | Method of forming a heatsink |
AU2009219411A1 (en) * | 2008-02-25 | 2009-09-03 | Mc Neil-Ppc, Inc. | Thermal treatment device |
US20100000441A1 (en) * | 2008-07-01 | 2010-01-07 | Jang Bor Z | Nano graphene platelet-based conductive inks |
US7740380B2 (en) * | 2008-10-29 | 2010-06-22 | Thrailkill John E | Solid state lighting apparatus utilizing axial thermal dissipation |
US20100161014A1 (en) * | 2008-12-23 | 2010-06-24 | Lynch Joseph M | Thermal treatment device |
TW201035513A (en) * | 2009-03-25 | 2010-10-01 | Wah Hong Ind Corp | Method for manufacturing heat dissipation interface device and product thereof |
US8955580B2 (en) | 2009-08-14 | 2015-02-17 | Wah Hong Industrial Corp. | Use of a graphite heat-dissipation device including a plating metal layer |
JP5421751B2 (ja) * | 2009-12-03 | 2014-02-19 | スタンレー電気株式会社 | 半導体発光装置 |
WO2011106771A1 (en) * | 2010-02-26 | 2011-09-01 | Graftech International Holdings Inc. | Thermal management for handheld projectors |
CN102564198B (zh) * | 2010-12-28 | 2014-08-20 | 碳元科技股份有限公司 | 金属拉丝型散热复合结构的制造方法及制造系统 |
CN102333414B (zh) * | 2011-09-02 | 2014-03-12 | 深圳创动科技有限公司 | 一种散热结构及其制作方法、具有散热结构的电子设备 |
CN102563578A (zh) * | 2011-11-30 | 2012-07-11 | 厦门市松竹精密科技有限公司 | 柔性石墨在led灯具散热领域的应用 |
US8946561B2 (en) | 2012-01-18 | 2015-02-03 | Apple Inc. | Flexible circuitry with heat and pressure spreading layers |
US9201262B2 (en) | 2012-04-20 | 2015-12-01 | Graftech International Holdings Inc. | Display device with thermal link |
CN203482557U (zh) * | 2012-04-20 | 2014-03-12 | 格拉弗技术国际控股有限公司 | 具有热熔断体的显示装置 |
US9420722B2 (en) * | 2012-12-06 | 2016-08-16 | Gerald Ho Kim | Composite heat sink device for cooling of multiple heat sources in close proximity |
US10209016B2 (en) * | 2013-03-22 | 2019-02-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same |
US10094516B2 (en) | 2014-07-25 | 2018-10-09 | NeoGraf Solutions, LLC. | LED light arrangement with flexible circuit board having graphite substrate |
US20160081226A1 (en) * | 2014-09-11 | 2016-03-17 | Asia Vital Components Co., Ltd. | Heat dissipation structure for mobile device |
JP2016115080A (ja) * | 2014-12-12 | 2016-06-23 | 株式会社オートネットワーク技術研究所 | 情報処理装置 |
JP2016184648A (ja) * | 2015-03-26 | 2016-10-20 | 住友電気工業株式会社 | ヒートシンク及び電子機器 |
WO2016208690A1 (ja) | 2015-06-26 | 2016-12-29 | 株式会社カネカ | 熱輸送構造体、およびその製造方法 |
WO2017044712A1 (en) | 2015-09-11 | 2017-03-16 | Laird Technologies, Inc. | Devices for absorbing energy from electronic components |
EP3360400A4 (en) | 2015-10-08 | 2019-02-27 | Laird Technologies, Inc. | ROLLS OF SELECTIVE PLATING MATERIALS AND ASSOCIATED METHODS |
US10389397B2 (en) | 2016-07-26 | 2019-08-20 | Laird Technologies, Inc. | Small form-factor pluggable (SFP) transceivers |
US10965333B2 (en) | 2016-07-26 | 2021-03-30 | Laird Technologies, Inc. | Thermal management assemblies suitable for use with transceivers and other devices |
EP3540770B1 (en) * | 2018-03-15 | 2022-06-01 | Aptiv Technologies Limited | Heat transfer device |
CN109592988A (zh) * | 2019-01-24 | 2019-04-09 | 北京科技大学 | 一种金刚石微柱增强高导热石墨材料的制备方法 |
CN111935946B (zh) * | 2019-05-13 | 2023-07-04 | 群创光电股份有限公司 | 电子装置 |
US11483948B2 (en) | 2019-08-28 | 2022-10-25 | Laird Technologies, Inc. | Thermal interface materials including memory foam cores |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1169235A (zh) * | 1995-01-25 | 1997-12-31 | 北方电讯有限公司 | 印刷电路板和热沉装置 |
Family Cites Families (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB991581A (en) | 1962-03-21 | 1965-05-12 | High Temperature Materials Inc | Expanded pyrolytic graphite and process for producing the same |
US3678995A (en) | 1970-06-22 | 1972-07-25 | Rca Corp | Support for electrical components and method of making the same |
JPS5313610A (en) | 1976-07-23 | 1978-02-07 | Nippon Carbon Co Ltd | Compound sheet materials |
US4812792A (en) | 1983-12-22 | 1989-03-14 | Trw Inc. | High-frequency multilayer printed circuit board |
US4739448A (en) * | 1984-06-25 | 1988-04-19 | Magnavox Government And Industrial Electronics Company | Microwave multiport multilayered integrated circuit chip carrier |
US4782893A (en) | 1986-09-15 | 1988-11-08 | Trique Concepts, Inc. | Electrically insulating thermally conductive pad for mounting electronic components |
FR2616997B1 (fr) | 1987-06-16 | 1989-08-25 | Thomson Csf | Support pour circuit imprime, formant drain thermique a dilatation controlee, et procede de fabrication |
US4895713A (en) | 1987-08-31 | 1990-01-23 | Union Carbide Corporation | Intercalation of graphite |
US4961991A (en) | 1990-01-29 | 1990-10-09 | Ucar Carbon Technology Corporation | Flexible graphite laminate |
US5316080A (en) | 1990-03-30 | 1994-05-31 | The United States Of America As Represented By The Administrator Of The National Aeronautics & Space Administration | Heat transfer device |
US5224030A (en) | 1990-03-30 | 1993-06-29 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Semiconductor cooling apparatus |
US5111359A (en) | 1991-04-17 | 1992-05-05 | E-Systems Inc. | Heat transfer device and method |
US5192605A (en) | 1991-10-01 | 1993-03-09 | Ucar Carbon Technology Corporation | Epoxy resin bonded flexible graphite laminate and method |
US5255738A (en) | 1992-07-16 | 1993-10-26 | E-Systems, Inc. | Tapered thermal substrate for heat transfer applications and method for making same |
US5366688A (en) | 1992-12-09 | 1994-11-22 | Iowa State University Research Foundation, Inc. | Heat sink and method of fabricating |
DE9300865U1 (de) * | 1993-01-22 | 1994-05-26 | Siemens AG, 80333 München | Einstückiges Kunststoffteil, insbesondere Spritzgießteil |
DE4309700C2 (de) | 1993-03-25 | 1995-02-23 | Sigri Great Lakes Carbon Gmbh | Verfahren zur Herstellung eines Schichtstoffes aus Metall und Graphit |
DE69328687D1 (de) * | 1993-07-06 | 2000-06-21 | Toshiba Kawasaki Kk | Wärmeleitende platte |
US5542471A (en) * | 1993-11-16 | 1996-08-06 | Loral Vought System Corporation | Heat transfer element having the thermally conductive fibers |
KR100261634B1 (ko) | 1995-01-11 | 2000-07-15 | 모리시타 요이찌 | 그래파이트클래드구조체 |
US6208513B1 (en) | 1995-01-17 | 2001-03-27 | Compaq Computer Corporation | Independently mounted cooling fins for a low-stress semiconductor package |
US5902762A (en) | 1997-04-04 | 1999-05-11 | Ucar Carbon Technology Corporation | Flexible graphite composite |
US5944097A (en) * | 1997-05-06 | 1999-08-31 | Northrop Grumman Corporation | Composite substrate carrier for high power electronic devices |
US6131651A (en) | 1998-09-16 | 2000-10-17 | Advanced Ceramics Corporation | Flexible heat transfer device and method |
US5958572A (en) | 1997-09-30 | 1999-09-28 | Motorola, Inc. | Hybrid substrate for cooling an electronic component |
US6147869A (en) * | 1997-11-24 | 2000-11-14 | International Rectifier Corp. | Adaptable planar module |
US6060166A (en) * | 1998-02-05 | 2000-05-09 | Raytheon Company | Flexible graphite fiber thermal shunt |
US6141216A (en) | 1999-03-31 | 2000-10-31 | International Business Machines Corporation | Quick-release hinge joint for heat pipe |
EP1097106A4 (en) | 1999-04-07 | 2009-12-02 | Graftech Inc | FLEXIBLE GRAPHITE OBJECT AND METHOD FOR THE PRODUCTION THEREOF |
US6075701A (en) | 1999-05-14 | 2000-06-13 | Hughes Electronics Corporation | Electronic structure having an embedded pyrolytic graphite heat sink material |
US6362964B1 (en) * | 1999-11-17 | 2002-03-26 | International Rectifier Corp. | Flexible power assembly |
US6503626B1 (en) | 2000-02-25 | 2003-01-07 | Graftech Inc. | Graphite-based heat sink |
US6555223B2 (en) | 2000-03-08 | 2003-04-29 | Sgl Technic, Inc. | Graphite structure with increased flexibility |
US6278613B1 (en) * | 2000-09-27 | 2001-08-21 | St Assembly Test Services Pte Ltd | Copper pads for heat spreader attach |
US20020157819A1 (en) | 2001-04-04 | 2002-10-31 | Julian Norley | Graphite-based thermal dissipation component |
US20020166654A1 (en) | 2001-05-02 | 2002-11-14 | Smalc Martin D. | Finned Heat Sink Assemblies |
US6538892B2 (en) | 2001-05-02 | 2003-03-25 | Graftech Inc. | Radial finned heat sink |
US6673289B2 (en) | 2001-05-30 | 2004-01-06 | Advanced Energy Technology Inc. | Manufacture of materials from graphite particles |
US6812503B2 (en) | 2001-11-29 | 2004-11-02 | Highlink Technology Corporation | Light-emitting device with improved reliability |
US6758263B2 (en) | 2001-12-13 | 2004-07-06 | Advanced Energy Technology Inc. | Heat dissipating component using high conducting inserts |
US6771502B2 (en) * | 2002-06-28 | 2004-08-03 | Advanced Energy Technology Inc. | Heat sink made from longer and shorter graphite sheets |
US6749010B2 (en) * | 2002-06-28 | 2004-06-15 | Advanced Energy Technology Inc. | Composite heat sink with metal base and graphite fins |
US6930885B2 (en) | 2002-12-23 | 2005-08-16 | Eastman Kodak Company | Densely packed electronic assemblage with heat removing element |
US7095053B2 (en) * | 2003-05-05 | 2006-08-22 | Lamina Ceramics, Inc. | Light emitting diodes packaged for high temperature operation |
US7077858B2 (en) * | 2003-09-22 | 2006-07-18 | Coolhead Technologies, Inc. | Flexible heat exchangers for medical cooling and warming applications |
US20060191675A1 (en) * | 2003-09-22 | 2006-08-31 | Coolhead Technologies, Inc. | Apparatus and methods for warming and cooling bodies |
US7102172B2 (en) * | 2003-10-09 | 2006-09-05 | Permlight Products, Inc. | LED luminaire |
US20050116235A1 (en) * | 2003-12-02 | 2005-06-02 | Schultz John C. | Illumination assembly |
US7303005B2 (en) * | 2005-11-04 | 2007-12-04 | Graftech International Holdings Inc. | Heat spreaders with vias |
-
2005
- 2005-11-04 US US11/267,933 patent/US7889502B1/en not_active Expired - Fee Related
-
2006
- 2006-11-03 CN CN200610144559.7A patent/CN1960619B/zh not_active Expired - Fee Related
- 2006-11-04 CN CN200610172381.7A patent/CN100539815C/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1169235A (zh) * | 1995-01-25 | 1997-12-31 | 北方电讯有限公司 | 印刷电路板和热沉装置 |
Also Published As
Publication number | Publication date |
---|---|
US7889502B1 (en) | 2011-02-15 |
CN100539815C (zh) | 2009-09-09 |
CN1984543A (zh) | 2007-06-20 |
CN1960619A (zh) | 2007-05-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1960619B (zh) | 热管理系统及其装配方法 | |
KR100982583B1 (ko) | 비아를 구비하는 열 확산기 | |
EP1784007B1 (en) | Cycling LED heat spreader | |
US7393587B2 (en) | Sandwiched finstock | |
EP1454108B1 (en) | Heat dissipating component using high conducting inserts | |
US7385819B1 (en) | Display device | |
US6538892B2 (en) | Radial finned heat sink | |
US9253924B2 (en) | Optimized frame system for a display device | |
US20020166654A1 (en) | Finned Heat Sink Assemblies | |
US20060225874A1 (en) | Sandwiched thermal article | |
JP2009508786A (ja) | 可撓性グラファイト床放熱体 | |
US20020168526A1 (en) | Graphite article having predetermined anisotropic characteristics and process therefor | |
US20070030653A1 (en) | Anisotropic thermal solution | |
US20070257359A1 (en) | Thermal Management Device For A Memory Module | |
EP1401981A2 (en) | Graphite-based thermal dissipation component | |
US20130273349A1 (en) | Heat-emitting graphite material comprising amorphous carbon particles and a production method therefor | |
TW201009551A (en) | Improved heat dissipation for low profile devices | |
JPWO2018235918A1 (ja) | 樹脂材料、樹脂材料の製造方法及び積層体 | |
CN102088819A (zh) | 一种新型电子电路基板及其制造工艺 | |
TWI375493B (en) | Heat spreaders with vias |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Ohio, USA Patentee after: GRAFTECH INTERNATIONAL HOLDINGS Inc. Address before: Delaware Patentee before: Advanced Energy Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170926 Address after: Delaware Patentee after: Advanced Energy Technology Co.,Ltd. Address before: Ohio, USA Patentee before: Graftech International Holdings Inc. Effective date of registration: 20170926 Address after: Ohio, USA Patentee after: GRAFTECH INTERNATIONAL HOLDINGS Inc. Address before: Ohio, USA Patentee before: ADVANCED ENERGY TECHNOLOGY Inc. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20191103 |