CN1960599A - 安装结构和电子设备 - Google Patents

安装结构和电子设备 Download PDF

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Publication number
CN1960599A
CN1960599A CN 200610142928 CN200610142928A CN1960599A CN 1960599 A CN1960599 A CN 1960599A CN 200610142928 CN200610142928 CN 200610142928 CN 200610142928 A CN200610142928 A CN 200610142928A CN 1960599 A CN1960599 A CN 1960599A
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CN
China
Prior art keywords
terminal pad
printed substrate
printed
mounting structure
exhaust outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200610142928
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English (en)
Chinese (zh)
Inventor
室生代美
深谷玄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
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Toshiba Corp
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Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of CN1960599A publication Critical patent/CN1960599A/zh
Pending legal-status Critical Current

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CN 200610142928 2005-10-31 2006-10-31 安装结构和电子设备 Pending CN1960599A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005317233 2005-10-31
JP2005317233A JP2007123754A (ja) 2005-10-31 2005-10-31 実装構造体および電子機器

Publications (1)

Publication Number Publication Date
CN1960599A true CN1960599A (zh) 2007-05-09

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ID=38072029

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200610142928 Pending CN1960599A (zh) 2005-10-31 2006-10-31 安装结构和电子设备

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JP (1) JP2007123754A (ja)
CN (1) CN1960599A (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102186315A (zh) * 2011-04-21 2011-09-14 淳华科技(昆山)有限公司 上下层不同外形的软式印刷电路板的制作工艺
CN110958787A (zh) * 2020-01-07 2020-04-03 珠海元盛电子科技股份有限公司 一种多层互联fpc预设锡膏的焊接方法
CN110996556A (zh) * 2020-01-07 2020-04-10 电子科技大学 一种多层互联fpc的焊接方法
CN111328213A (zh) * 2020-03-27 2020-06-23 珠海元盛电子科技股份有限公司 一种限高的多层fpc焊接方法
CN111629511A (zh) * 2020-06-03 2020-09-04 成都羿发向荣芯能量材料科技有限公司 一种互联的fpc板气泡鼓包处理方法及互联fpc板、电子设备
CN112317900A (zh) * 2019-08-05 2021-02-05 苹果公司 利用光子焊接技术的选择性焊接
CN114258735A (zh) * 2019-08-22 2022-03-29 株式会社自动网络技术研究所 配线板的连接构造
US12041728B2 (en) 2019-08-05 2024-07-16 Apple Inc. Selective soldering with photonic soldering technology

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102449353B1 (ko) * 2015-11-18 2022-09-30 삼성전기주식회사 인쇄회로기판 및 회로배선
JP6629909B2 (ja) * 2018-04-17 2020-01-15 ミネベアミツミ株式会社 フレキシブルプリント基板

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102186315A (zh) * 2011-04-21 2011-09-14 淳华科技(昆山)有限公司 上下层不同外形的软式印刷电路板的制作工艺
CN102186315B (zh) * 2011-04-21 2013-06-05 淳华科技(昆山)有限公司 上下层不同外形的软式印刷电路板的制作工艺
CN112317900A (zh) * 2019-08-05 2021-02-05 苹果公司 利用光子焊接技术的选择性焊接
US12041728B2 (en) 2019-08-05 2024-07-16 Apple Inc. Selective soldering with photonic soldering technology
CN114258735A (zh) * 2019-08-22 2022-03-29 株式会社自动网络技术研究所 配线板的连接构造
CN114258735B (zh) * 2019-08-22 2024-03-08 株式会社自动网络技术研究所 配线板的连接构造
CN110958787A (zh) * 2020-01-07 2020-04-03 珠海元盛电子科技股份有限公司 一种多层互联fpc预设锡膏的焊接方法
CN110996556A (zh) * 2020-01-07 2020-04-10 电子科技大学 一种多层互联fpc的焊接方法
CN111328213A (zh) * 2020-03-27 2020-06-23 珠海元盛电子科技股份有限公司 一种限高的多层fpc焊接方法
CN111629511A (zh) * 2020-06-03 2020-09-04 成都羿发向荣芯能量材料科技有限公司 一种互联的fpc板气泡鼓包处理方法及互联fpc板、电子设备

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Publication number Publication date
JP2007123754A (ja) 2007-05-17

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