CN1960599A - 安装结构和电子设备 - Google Patents
安装结构和电子设备 Download PDFInfo
- Publication number
- CN1960599A CN1960599A CN 200610142928 CN200610142928A CN1960599A CN 1960599 A CN1960599 A CN 1960599A CN 200610142928 CN200610142928 CN 200610142928 CN 200610142928 A CN200610142928 A CN 200610142928A CN 1960599 A CN1960599 A CN 1960599A
- Authority
- CN
- China
- Prior art keywords
- terminal pad
- printed substrate
- printed
- mounting structure
- exhaust outlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005317233 | 2005-10-31 | ||
JP2005317233A JP2007123754A (ja) | 2005-10-31 | 2005-10-31 | 実装構造体および電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1960599A true CN1960599A (zh) | 2007-05-09 |
Family
ID=38072029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200610142928 Pending CN1960599A (zh) | 2005-10-31 | 2006-10-31 | 安装结构和电子设备 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2007123754A (ja) |
CN (1) | CN1960599A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102186315A (zh) * | 2011-04-21 | 2011-09-14 | 淳华科技(昆山)有限公司 | 上下层不同外形的软式印刷电路板的制作工艺 |
CN110958787A (zh) * | 2020-01-07 | 2020-04-03 | 珠海元盛电子科技股份有限公司 | 一种多层互联fpc预设锡膏的焊接方法 |
CN110996556A (zh) * | 2020-01-07 | 2020-04-10 | 电子科技大学 | 一种多层互联fpc的焊接方法 |
CN111328213A (zh) * | 2020-03-27 | 2020-06-23 | 珠海元盛电子科技股份有限公司 | 一种限高的多层fpc焊接方法 |
CN111629511A (zh) * | 2020-06-03 | 2020-09-04 | 成都羿发向荣芯能量材料科技有限公司 | 一种互联的fpc板气泡鼓包处理方法及互联fpc板、电子设备 |
CN112317900A (zh) * | 2019-08-05 | 2021-02-05 | 苹果公司 | 利用光子焊接技术的选择性焊接 |
CN114258735A (zh) * | 2019-08-22 | 2022-03-29 | 株式会社自动网络技术研究所 | 配线板的连接构造 |
US12041728B2 (en) | 2019-08-05 | 2024-07-16 | Apple Inc. | Selective soldering with photonic soldering technology |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102449353B1 (ko) * | 2015-11-18 | 2022-09-30 | 삼성전기주식회사 | 인쇄회로기판 및 회로배선 |
JP6629909B2 (ja) * | 2018-04-17 | 2020-01-15 | ミネベアミツミ株式会社 | フレキシブルプリント基板 |
-
2005
- 2005-10-31 JP JP2005317233A patent/JP2007123754A/ja not_active Withdrawn
-
2006
- 2006-10-31 CN CN 200610142928 patent/CN1960599A/zh active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102186315A (zh) * | 2011-04-21 | 2011-09-14 | 淳华科技(昆山)有限公司 | 上下层不同外形的软式印刷电路板的制作工艺 |
CN102186315B (zh) * | 2011-04-21 | 2013-06-05 | 淳华科技(昆山)有限公司 | 上下层不同外形的软式印刷电路板的制作工艺 |
CN112317900A (zh) * | 2019-08-05 | 2021-02-05 | 苹果公司 | 利用光子焊接技术的选择性焊接 |
US12041728B2 (en) | 2019-08-05 | 2024-07-16 | Apple Inc. | Selective soldering with photonic soldering technology |
CN114258735A (zh) * | 2019-08-22 | 2022-03-29 | 株式会社自动网络技术研究所 | 配线板的连接构造 |
CN114258735B (zh) * | 2019-08-22 | 2024-03-08 | 株式会社自动网络技术研究所 | 配线板的连接构造 |
CN110958787A (zh) * | 2020-01-07 | 2020-04-03 | 珠海元盛电子科技股份有限公司 | 一种多层互联fpc预设锡膏的焊接方法 |
CN110996556A (zh) * | 2020-01-07 | 2020-04-10 | 电子科技大学 | 一种多层互联fpc的焊接方法 |
CN111328213A (zh) * | 2020-03-27 | 2020-06-23 | 珠海元盛电子科技股份有限公司 | 一种限高的多层fpc焊接方法 |
CN111629511A (zh) * | 2020-06-03 | 2020-09-04 | 成都羿发向荣芯能量材料科技有限公司 | 一种互联的fpc板气泡鼓包处理方法及互联fpc板、电子设备 |
Also Published As
Publication number | Publication date |
---|---|
JP2007123754A (ja) | 2007-05-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1960599A (zh) | 安装结构和电子设备 | |
CN100556235C (zh) | 印刷电路板、其制造方法以及电子装置 | |
US6966482B2 (en) | Connecting structure of printed circuit boards | |
US6414248B1 (en) | Compliant attachment interface | |
CN1192429C (zh) | 线路 | |
KR100488412B1 (ko) | 내장된 전기소자를 갖는 인쇄 배선 기판 및 그 제조 방법 | |
US8238109B2 (en) | Flex-rigid wiring board and electronic device | |
EP0530840B1 (en) | Electric circuit board module and method for producing electric circuit board module | |
US6519161B1 (en) | Molded electronic package, method of preparation and method of shielding-II | |
KR20060123597A (ko) | 가요성 회로 기판 어셈블리 | |
KR20090094169A (ko) | 그의 상하면에 반도체 구성체를 갖는 반도체장치 및 그 제조방법 | |
CN101814465A (zh) | 电子元件安装结构以及电子元件安装方法 | |
JPH0779196B2 (ja) | 配線変更方法 | |
JPH06120670A (ja) | 多層配線基板 | |
US5641995A (en) | Attachment of ceramic chip carriers to printed circuit boards | |
WO2011071111A1 (ja) | 電子部品内蔵樹脂基板および電子回路モジュール | |
WO2002041397A2 (en) | Low profile integrated module interconnects | |
US20140118984A1 (en) | Electronic device and method of manufacturing the same | |
JPH1187984A (ja) | 実装回路装置 | |
US20050012198A1 (en) | Semiconductor device | |
JPH09232711A (ja) | 特に電子制御装置内で使用される装置 | |
US20080210743A1 (en) | Process of fabricating stack component | |
US20230328896A1 (en) | Circuit board with solder mask on internal copper pad | |
JP4547987B2 (ja) | 基板接続方法およびこの方法により製造された複合基板 | |
KR20090049015A (ko) | 회로 모듈 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |