CN1933699A - Method for producing antipressing linear circuit board and products thereof - Google Patents

Method for producing antipressing linear circuit board and products thereof Download PDF

Info

Publication number
CN1933699A
CN1933699A CN 200510102896 CN200510102896A CN1933699A CN 1933699 A CN1933699 A CN 1933699A CN 200510102896 CN200510102896 CN 200510102896 CN 200510102896 A CN200510102896 A CN 200510102896A CN 1933699 A CN1933699 A CN 1933699A
Authority
CN
Grant status
Application
Patent type
Prior art keywords
circuit
board
pressure
linear
method
Prior art date
Application number
CN 200510102896
Other languages
Chinese (zh)
Inventor
陈进容
Original Assignee
优盛医学科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

A method for preparing linear circuit board of pressure resistance type includes providing the first circuit board and preparing initial cut in the first circuit board by cutting process then utilizing said initial cut to define out the second circuit board connected with the first circuit board, setting pressure transducer and OP amplifier both having been accuracy-calibrated on the second circuit board then connecting the second circuit board to the first circuit board with learning point by connection unit for finalizing preparation of linear circuit board of pressure resistance type.

Description

抗压力线性电路板的制造方法及其制成品 The method of manufacturing a circuit board of the anti-stress and manufactures linear

技术领域 FIELD

本发明涉及一种抗压力线性电路板的制造方法及其制成品,特别涉及一种将压力传感器、OP放大器配置在第一电路板切割后定义出的第二电路板(其不与第一电路板同受外力影响、变形)上的抗压式线性电路板制造方法及其制成品,其可以改善外力与点测压力对精确度的影响,同时降低返工率及制造过程中的废品率。 The present invention relates to a method for producing an anti-linear stress and finished circuit board, particularly to a pressure sensor, OP amplifier circuit board defining a second configuration of the circuit board after the first cutting (which is not the first affected by external force with the circuit board, deformation of the linear compression circuit board manufacturing method and finished on), which can ameliorate the effects of an external force to the point where the pressure of accuracy, while reducing scrap and rework of the manufacturing process .

背景技术 Background technique

如图1所示,目前配置有压力传感器与放大电路的电路板的制作方法,是在电路板1上,根据其电路配置设计插设组成主电路的电子无源组件11,并将已经经过精确度调整校准的压力传感器12与OP放大器13电结合于电路板1的预设位置,并进一步将电路板1通过螺丝锁装在电子器件成品的外壳(图中未示出)中,接着,电路板1必需经过学习站和校准站等制造过程,使电路板1上的中央控制器10进行压力传测学习,以及利用探针点测以进一步校准芯片读取的精确度,但在该组装和探针点测过程中,都会对电路板1施加外力,如锁装或进行气压学习时的下压力、或者由探针所施加的检测压力,而这些外力及检测压力都可能造成电路板1的微小变形,进而造成设定值改变,从而容易使所读取的压力值产生误差,由此直接影响到学习后存入的数值,甚至无法完成压力的对 As shown, there is disposed a method for manufacturing a circuit board of the pressure sensor and the amplifier circuit is on the circuit board 1, according to the circuit configuration is designed interposed passive components constituting the electron main circuit 11, and has an accurately adjusting the calibration of the pressure sensor 13 is electrically bonded to the OP amplifier 12 and the predetermined position of the circuit board 1, the circuit board 1 and further through the housing (not shown) mounted on the screws of the finished electronic device, then the circuit plate 1 must go through the manufacturing process of learning station and calibration station, so that the central controller on a circuit board 10 pass the pressure test study, and the use of the accuracy of measurement points to further calibrate the probe chip is read, but the assembling and point probe measurement process, are applied to the circuit board 1 under the external pressure, or pneumatic lock means learning, or detecting a pressure exerted by the probe, and detecting a pressure force which may cause the circuit board 1 slight deformation, thereby causing the set value is changed, thereby easily read the pressure values ​​of an error, thereby directly affecting the stored learning value, the pressure can not be completed even 学习功能,并且降低制造过程中的成品率以及增加返工制造过程的成本。 Learning function, and reduce the yield in the manufacturing process and increases the cost of manufacturing rework process.

另外,在传统技术中为了改善上述缺点和问题,一种方法是将主电路与压力传感器、OP放大器分别配置在不同的电路板上,再利用连线电连接,这种方式虽然可以使压力传感器或OP放大器在学习站和校准站制造过程中进行学习和探针点测时,不随主电路产生受压或变形而影响其压力读取值的精确度,但至少配置两个电路板使得制作成本增加将近一倍,相当不经济。 Further, in the conventional art, in order to improve the above disadvantages and problems, a method in which the main circuit pressure sensor, OP amplifiers are disposed on different circuit boards, wiring electrically connected to recycling, this approach, while the pressure sensor can be OP amplifier or when learning and learning point where the probe station and a calibration station in the manufacturing process, no compression or deformation which affects the accuracy of the pressure readings with the main circuit, but at least two circuit boards arranged so that the production costs nearly double, quite uneconomical. 另外一种方法是在该电路板配置压力传感器、OP放大器的位置罩设一个金属壳体,但这种方式并不能改善同一电路板受到压力所造成的略微变形,也未能改善检测压力对压力传感器、OP放大器压力读取的精确度的影响。 Another method for the circuit board is disposed in the pressure sensor, the position of the cover OP amplifier provided a metal housing, but this approach does not improve the same circuit board slightly deformed under pressure caused by the pressure also failed to improve the detection of pressure Effect sensor, the accuracy of the pressure reading of the OP amplifier.

发明内容 SUMMARY

本发明的主要目的是解决上述问题,避免问题的存在,本发明对电路板重新进行设计,利用切割工艺在第一电路板上切割一切槽,以形成第二电路板,将压力传感器和OP放大器,或者二者之一制作在第二电路板上,其不随第一电路板一起受外力影响、变形,从而改善制造过程中学习和校准站中的外力与点测压力对精确度的影响,同时降低返工率及制造过程中的废品率。 The main object of the present invention is to solve the above problems, to avoid problems, the present invention is to redesign the circuit board, a cutting process using a dicing groove all the first circuit board to a second circuit board, the pressure sensor and the amplifier OP , making one or both of the second circuit board, with the first circuit board which is not affected by external force, together, deformed, thereby improving the external force and the pressure point where the learning process and the manufacturing station of the calibration accuracy, while reduce scrap and rework of the manufacturing process.

为了实现上述目的,本发明的抗压力线性电路板的制造方法,其步骤包括:提供第一电路板;利用切割工艺在第一电路板上制作切槽,所述切槽定义出与第一电路板电连接的第二电路板;进行压力传感器与OP放大器等组件的单独调校程序;将已完成精确度调校的压力传感器及OP放大器,或者至少二者之一装设在所述第二电路板上,以完成抗压式线性电路板的制造。 To achieve the above object, a method for producing an anti-linear pressure of the circuit board of the present invention, comprising the steps of: providing a first circuit board; a cutting process using a first circuit board production slots, said slots defining a first circuit a second plate electrically connected to the circuit board; separate adjustment of the pressure sensor and the program components OP amplifier; calibration accuracy of the completed pressure sensor and an OP amplifier, at least one or both of the second mounted a circuit board to complete the manufacture of linear compression circuit board.

为了实现上述目的,利用本发明的抗压力线性电路板制造方法制作的抗压力线性电路板包括:第一电路板,其上具有切槽,所述切槽定义出与第一电路板电连接的第二电路板;将压力传感器和OP放大器之一或二者设置在所述第二电路板上。 To achieve the above object, the use of anti-stress linear circuit board manufacturing method of fabricating the linear pressure against the circuit board according to the present invention comprises: a first circuit board having a slot, said slot defining a cutting circuit board connected to the first electrically a second circuit board; and a pressure sensor and one or both of the OP amplifier disposed in said second circuit board.

附图的简要说明图1是现有技术中第一电路板的结构示意图;图2是本发明一个实施例的制造过程流程图;图3是本发明一个实施例的制成电路板的结构立体示意图; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a prior art schematic view of a first circuit board; FIG. 2 is a flow diagram of one embodiment of a manufacturing process embodiment of the present invention; FIG. 3 is a perspective view of the circuit board structure made according to one embodiment of the present invention schematic;

图4是本发明一个实施例的制成电路板的俯视示意图;图5是本发明一个实施例的制成电路板的局部剖视示意图;图6是本发明另一个实施例的制成电路板的俯视示意图;图7是本发明方法应用于电子血压计的实施例的制造过程流程图。 4 is a schematic top view of a circuit board made of an embodiment of the present invention; FIG. 5 is a partial circuit board made of an embodiment of the present invention, a schematic cross-sectional view; FIG. 6 is another embodiment of the present invention is made of a circuit board of the embodiment the top view; FIG. 7 is a method of the present invention is applied to an electronic sphygmomanometer according to a flowchart of a manufacturing process.

附图中,各标号所代表的部件列表如下:现有技术:电路板1 中央控制器10电子无源组件11 压力传感器12OP放大器13本发明:第一电路板2 压力传感器3OP放大器4 主电路20切槽21 切槽21'第二电路板22 连接部23学习点24 孔25压力感测端30 步骤500~508步骤600~608具体实施方式有关本发明的技术内容和详细说明,现结合附图说明如下:图2是本发明的抗压力线性电路板制造方法的制造过程示意图。 In the drawings, a list of members of each numeral represent the following: the prior art: a circuit board 10 of electronic central controller 1 passive pressure sensor assembly 11 12OP amplifier 13 of the present invention: a first pressure sensor circuit board 4 of the main amplifier circuit 20 3OP 21 '22 25 pressure of the second circuit board connecting portion 24 hole 23 learning point sensing terminal 30 in step 500 to the step 600 to 608 508 dETAILED DESCRIPTION slots 21 slots technical content of the invention and detailed description, the accompanying drawings are combined with as follows: FIG. 2 is a manufacturing process of the manufacturing method of the present invention is an anti-pressure boards linear circuit schematic. 如图所示,本发明的抗压力线性电路板的制造流程包括:电路板的制作:步骤500,提供第一电路板2;步骤502,在第一电路板2上配合切割工艺制作切槽21(如图3所示),切槽21定义出第二电路板22,同时形成用于连接至第一电路板2的连接部23,连接部23略具挠性,在第一电路板2上设有使主电路20与学习点24电连接的印刷电路,第二电路板22上设有使压力传感器3与OP放大器4连接的电路,或者使压力传感器3和OP放大器4之一与调校测试点电连接的印刷线路(图中未示出); As shown, the manufacturing process of the anti-stress linear circuit board according to the present invention comprises: a circuit board produced: Step 500, providing a first circuit board 2; step 502, on the first circuit board 2 with slots 21 cut production process (shown in FIG. 3), the slots 21 define a second circuit board 22, while forming the connecting portion 23 for connecting to a first circuit board 2, with the connecting portion 23 is slightly flexible, the first circuit board 2 with the main circuit of the printed circuit 24 is connected to the point 20 of the study, a circuit connected to the amplifier OP 4 of the pressure sensor 3 on the second circuit board 22, or to one of the pressure sensor 4 and the calibration and OP amplifier 3 test points electrically connected to printed wiring (not shown);

压力传感器与OP放大器的调校和配置:步骤504,将压力传感器3与OP放大器4等组件,预先分别独立进行精确度调校程序,使其设定在预设的精准值状态;步骤506,将已完成精确度调校的压力传感器3及OP放大器4,或者至少二者之一电连接于第二电路板22的印刷线路位置上;步骤508,完成抗压式线性电路板制造。 Pressure sensor configuration and calibration of the amplifier OP: Step 504, the pressure sensor 3 and the OP amplifier 4 and the like components, are previously independent calibration procedure accuracy, so precise values ​​set in the preset state; step 506, the pressure sensor has been completed and the accuracy of the calibration of 3 OP amplifier 4, both or at least one location is electrically connected to the printed wiring board 22 on the second circuit; step 508, to complete the linear compression circuit board manufacturing.

在所述的本发明的制造过程中,配置于第二电路板22上的压力传感器3与OP放大器4电路通过所述连接部23上的印刷电路与第一电路板2上的主电路20电连接。 In the manufacturing process according to the present invention, disposed on the second circuit board 22 of the pressure sensor 3 is electrically connected to the printed circuit 23 on the main circuit portion 2 on the first circuit board 20 via OP amplifier circuit 4 and connection.

由于第二电路板22与第一电路板2间仅通过连接部23电连接为一体,因此当第一电路板2安装锁固于电子器件的外壳时,或者在学习站或校准站制造过程中进行学习或处于点测的检测压力下时,该第二电路板22将通过连接部23产生的挠性,使第二电路板22保持在原位置状态,不会与第一电路板2一同受到外力作用或变形影响,其可以改善外力与点测压力对精确度的影响,同时降低返工率及制造过程中的废品率。 Since the second circuit board 22 and the first circuit board 2 integrally connected only by electrically connecting portion 23, so that when the first circuit board 2 is mounted on the housing of the electronic locking device, learning or calibration station or stations in the manufacturing process or at the point when learning sensed pressure detection, the second circuit board 22 through a flexible connector portion 23 generates the second circuit board 22 held at the home position, will not be subjected to external force together with the first circuit board 2 or deformation of action, which can ameliorate the effects of an external force and the point of pressure measurement accuracy, while reducing scrap and rework of the manufacturing process.

图3、图4和图5是通过本发明的抗压力线性电路板制造方法所制成的抗压力线性电路板结构示意图。 3, FIG. 4 and FIG. 5 is a schematic structural diagram of an anti-pressure linear pressure of the circuit board by an anti-linear method of manufacturing a circuit board according to the present invention is made of. 如图所示,本发明的抗压力线性电路板包括:第一电路板2;制作于所述第一电路板2上的至少一个切槽21;由所述切槽21定义出的第二电路板22,该第二电路板通过连接部23与第一电路板2连接;至少一个压力传感器3以及用于将测得的压力值信号放大的OP放大器4二者或其一电连接于第二电路板22上;所述压力传感器3进一步包括压力感测端30,当将其设置在第二电路板22上时,所述压力感测端30恰好贯穿第二电路板22上所设置的孔25,以进行压力感测。 As shown, the anti-stress linear circuit board of the present invention comprises: a first circuit board 2; fabricated on the first circuit board 21 on at least one of the two slots; a second circuit is defined by the slots 21 of the plate 22, the second circuit board 23 is connected to the first circuit board 2 through the connection portion; 3, and both the pressure value signal for the measured amplified or an OP amplifier 4 is electrically connected to the at least one pressure sensor to the second on the circuit board 22; said pressure sensor 3 further comprising a pressure sensing terminal 30, when the hole provided on the second circuit board 22, the end 30 of the pressure sensing just through the second circuit board 22 provided 25, for pressure sensing.

图6是通过本发明的抗压力线性电路板制造方法制造的另一个实施例的抗压力线性电路板结构示意图。 FIG 6 is a schematic view of an anti-pressure linear circuit board structure manufactured by other anti-stress linear circuit board manufacturing method of the present embodiment of the invention. 如图所示,本实施例与图3、图4和图5基本相同,其不同之处在于配合压力传感器3及OP放大器4在第一电路板2上形成有切割出的四边切槽21′,通过切槽21′定义出位于第一电路板2中的第二电路板22,其通过连接部23与第一电路板2连接,同样具有不会与第一电路板2一同受到外力作用或变形影响、可以改善外力与点测压力对精确度的影响的特点,其可以降低返工率及提高制作过程中的成品率,从而在不增加成本的情况下,提供高精确率的实用抗压式线性电路板。 As shown, this embodiment and FIG. 3, FIG. 4 and FIG. 5 is substantially the same, except that with which the pressure sensor 3 and amplifier OP 4 are formed cut-out slot 21 in the four sides of the first circuit board 2 ' , 'defined by the slot 21 of the second circuit board 2 is in the first circuit board 22, connection portion 23 through the first circuit board 2, and also has a first circuit board 2 is not subjected to an external force or with Effect of deformation, an external force may be improved with the point where the pressure effect on the characteristics of accuracy, which can reduce rework and improve the yield of the production process, so that without increasing the cost, providing high accuracy practical compression ratio of formula linear circuit board.

另外,图7是将本发明的抗压力线性电路板的制造方法应用于电子血压计电路板的制作流程示意图。 Further, FIG. 7 is a method for producing an anti-linear pressure of the present invention is applied to a circuit board production process of the electronic sphygmomanometer schematic circuit board. 如图所示,在进行了下盖加工制造过程(如步骤600)之后,利用本发明的抗压力线性电路板的制造方法,制作具有第一电路板2与第二电路板22的电子血压计电路板,在第一电路板2上设置电子血压计的主控制电路和LCD等电子组件,第二电路板22上则装设已完成精确度调校的压力传感器3和OP放大器4,或者所述二者之一,以组成电子血压计的内部件(如步骤602),然后进行步骤604的上下盖组装制造过程。 As shown, after the manufacturing process (e.g., step 600) is performed under the cover, by the method for producing an anti-linear pressure of the circuit board of the present invention, making a first circuit board having electronic sphygmomanometer 2 and the second circuit board 22 a circuit board disposed on the first circuit board of the electronic sphygmomanometer main control circuit 2 and electronic components such as LCD, is mounted on the second circuit board 22 has been completed the calibration accuracy of the pressure sensor 3 and the OP amplifier 4, or the either above, the internal member composed of the electronic sphygmomanometer (step 602), then assembling the cap up and down the manufacturing process of step 604.

接着,在学习过程(如步骤606)中,利用第一电路板2上的学习点24对血压计做气压压力学习,将模拟的压力值转换成数字的数值存入中央控制器(MCU)内,然后在校准过程中(如步骤608),利用探针进行压力感测的点测。 Next, in the learning process (e.g., step 606), the learning by the first two points on the circuit board 24 to make the air pressure sphygmomanometer study, the numerical simulation of the pressure value is stored into a digital (MCU) within the central controller then during the calibration process (step 608), using a pressure sensing probe measurement point.

由于利用本发明的方法制作的电子血压计电路板,将压力传感器3和OP放大器4设置在第二电路板22上,因此可以使其不会受到在学习和校准过程中施加在第一电路板上的检测压力影响,从而改善制造过程中学习站及校准站所造成的废品率,进而减少返工率,同时降低返工所产生的成本。 Since the electronic sphygmomanometer circuit board produced by the method of the present invention, the pressure sensor 3 and the OP amplifier 4 is provided on the second circuit board 22, so that it can not be applied to the first circuit board in the process of learning and calibration Effect on the detected pressure, thereby improving the rejection rate of learning stations and calibration station caused by the manufacturing process, thereby reducing rework rates, while reducing the cost of rework generated.

以上所述仅为本发明的优选实施例,并非用来限定本发明实施范围。 The above are only preferred embodiments of the present invention and is not intended to limit the scope of embodiments of the present invention. 凡是在本发明申请专利范围内所做的同等变化与修饰,均包括在本发明专利范围内。 Any equivalent changes and modifications made within the scope of this invention patent, are included within the scope of the present invention.

Claims (10)

  1. 1.一种抗压力线性电路板的制造方法,所述方法包括以下步骤:a)、提供第一电路板,所述第一电路板上设有主电路;b)、利用切割工艺在所述第一电路板上制作切槽,所述切槽定义出第二电路板,所述第二电路板通过连接部与所述第一电路板连接,从而完成抗压式线性电路板的制作。 1. A method for manufacturing a linear pressure against the circuit board, said method comprising the steps of: a), providing a first circuit board, the first circuit board is provided with a main circuit; B), the cutting process using a production of the first circuit board slots, the slots defining a second circuit board, the second circuit board connected by the connecting portion with the first circuit board, thereby completing the production of linear compression circuit board.
  2. 2.如权利要求1所述的抗压力线性电路板的制造方法,其中,所述方法进一步包括:在将压力传感器和OP放大器装设于所述第二电路板之前,分别单独进行精确度调校设定,在完成所述调校设定后将其装设于所述第二电路板上。 The method for producing an anti-pressure linear circuit board according to claim 1, wherein said method further comprising: prior to the pressure sensor and the second OP amplifier is mounted on the circuit board, the accuracy of the adjustment for individually correction is set, after completing the calibration set which is mounted on the second circuit board.
  3. 3.如权利要求1所述的抗压力线性电路板的制造方法,其中,所述方法进一步包括:设置于第二电路板上的压力传感器和OP放大器,利用所述第二电路板的所述连接部上的印刷电路与所述第一电路板上的所述主电路电连接。 The method for producing an anti-pressure linear circuit board according to claim 1, wherein said method further comprises: a pressure sensor disposed on the second circuit board and amplifier OP, using said second circuit board a printed circuit on the main circuit connection portion electrically connected to the first circuit board.
  4. 4.一种抗压力线性电路板的制造方法,所述方法包括以下步骤:a)、提供第一电路板;b)、利用切割工艺在所述第一电路板上制作切槽,所述切槽定义出第二电路板,所述第二电路板通过连接部与所述第一电路板连接;c)、将主电路和OP放大器设置在所述第一电路板上;d)、将经过调校设定的压力传感器,装设在所述第二电路板上,以完成抗压式线性电路板的制作。 A method for producing an anti-stress linear circuit board, said method comprising the steps of: a), providing a first circuit board; B), a cutting process using a slot made on the first circuit board, the cut groove defining a second circuit board, the second circuit board connected by the connecting portion with the first circuit board; C), the OP amplifier and the main circuit of the first circuit board is disposed; D), after the the pressure sensor calibration set is mounted on the second circuit board to complete the production of linear compression circuit board.
  5. 5.一种抗压力之线性电路板的制造方法,所述方法包括以下步骤:a)、提供第一电路板;b)、利用切割工艺在所述第一电路板制作切槽,所述切槽定义出第二电路板,所述第二电路板通过连接部与所述第一电路板连接;c)、将主电路和经过调校设定的压力传感器设置在所述第一电路板上;d)、将OP放大器设置在所述第二电路板上,以完成抗压式线性电路板的制作。 A method of manufacturing a circuit board of a linear pressure of anti-A, said method comprising the steps of: a), providing a first circuit board; B), a cutting process using a slot made in the first circuit board, the cut groove defining a second circuit board, the second circuit board connected by the connecting portion with the first circuit board; C), and the main circuit through a pressure sensor disposed in a calibration set of the first circuit board ; D), the second OP amplifier disposed in the circuit board to complete the production of linear compression circuit board.
  6. 6.一种抗压力线性电路板,其具有第一电路板,所述第一电路板上设有主电路和切槽,所示切槽定义出第二电路板,所述第二电路板通过连接部与所述第一电路板连接。 An anti-stress linear circuit board having a first circuit board, the first circuit board and a main circuit slots, the slots defining a second circuit board shown, the second circuit board by connecting portion connected to the first circuit board.
  7. 7.如权利要求6所述的抗压力线性电路板,其中,所述第二电路板上设置有压力传感器和OP放大器。 7. The anti-stress linear circuit board according to claim 6, wherein said second circuit board is provided with a pressure sensor and an OP amplifier.
  8. 8.如权利要求6所述的抗压力线性电路板,其中,所述第二电路板上设置有压力传感器、OP放大器中的任意一种,而另一种则设置在所述第一电路板上。 8. The anti-stress linear circuit board according to claim 6, wherein said second circuit board is provided with a pressure sensor, any one of the amplifier OP, and the other is disposed on the first circuit board on.
  9. 9.如权利要求6所述的抗压力线性电路板,其中,所述连接部设有印刷电路以将第一电路板与第二电路板电连接从而形成电路结构。 9. The anti-stress linear circuit board according to claim 6, wherein the connecting portion is provided with a printed circuit board to the first circuit and the second circuit board is electrically connected to form a circuit structure.
  10. 10.如权利要求6所述的抗压力线性电路板,其中,所述压力传感器进一步包括压力感测端,所述压力感测端恰好贯穿所述第二电路板上对应压力传感器装设位置设置的孔,以进行压力感测。 10. The anti-stress linear circuit board according to claim 6, wherein the pressure sensor further comprises a pressure sensing end, the sensing ends of pressure just through the second circuit board is provided corresponding to the pressure sensor mounting position holes, for pressure sensing.
CN 200510102896 2005-09-14 2005-09-14 Method for producing antipressing linear circuit board and products thereof CN1933699A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200510102896 CN1933699A (en) 2005-09-14 2005-09-14 Method for producing antipressing linear circuit board and products thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200510102896 CN1933699A (en) 2005-09-14 2005-09-14 Method for producing antipressing linear circuit board and products thereof

Publications (1)

Publication Number Publication Date
CN1933699A true true CN1933699A (en) 2007-03-21

Family

ID=37879255

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200510102896 CN1933699A (en) 2005-09-14 2005-09-14 Method for producing antipressing linear circuit board and products thereof

Country Status (1)

Country Link
CN (1) CN1933699A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7331241B1 (en) * 2006-08-22 2008-02-19 Kulite Semiconductor Products, Inc. Low cost pressure sensor for measuring oxygen pressure
CN101572990B (en) 2008-04-28 2012-12-19 鸿富锦精密工业(深圳)有限公司 Circuit board primitive plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7331241B1 (en) * 2006-08-22 2008-02-19 Kulite Semiconductor Products, Inc. Low cost pressure sensor for measuring oxygen pressure
CN101572990B (en) 2008-04-28 2012-12-19 鸿富锦精密工业(深圳)有限公司 Circuit board primitive plate

Similar Documents

Publication Publication Date Title
US7162927B1 (en) Design of a wet/wet amplified differential pressure sensor based on silicon piezoresistive technology
US6655216B1 (en) Load transducer-type metal diaphragm pressure sensor
US20070044370A1 (en) Coil, coil module and method of manufacturing the same, current sensor and method of manufacturing the same
US4879903A (en) Three part low cost sensor housing
US6374191B1 (en) Self-calibrating sensor
JP2009008619A (en) Flow rate measuring device
US6973837B2 (en) Temperature compensated strain sensing apparatus
US5191798A (en) Pressure sensor
US6829942B2 (en) Pressure sensor
JP2006275660A (en) Semiconductor sensor and its manufacturing method
US20050103111A1 (en) Pressure sensor having sensor chip and signal processing circuit mounted on a common stem
US20050235753A1 (en) Pressure transducer for measuring low dynamic pressures in the presence of high static pressures
US7555956B2 (en) Micromechanical device having two sensor patterns
US20070017294A1 (en) Semiconductor pressure sensor
US6973836B2 (en) Semiconductor pressure sensor having diaphragm
US5174014A (en) Method of manufacturing pressure transducers
JPH08320341A (en) Dynamic-quantity detection device
CN201266074Y (en) Strain sensing module
US20110239772A1 (en) Differential temperature and acceleration compensated pressure transducer
JP2007248212A (en) Pressure sensor package and electronic component
US20040145577A1 (en) Input device and its manufacturing method
US7392687B2 (en) Method of calibrating zero offset of a pressure sensor
US6308575B1 (en) Manufacturing method for the miniaturization of silicon bulk-machined pressure sensors
US6062088A (en) Pressure sensor
DE3919059A1 (en) Pressure sensor esp. for vehicle engine compartment - has sensor resistances on membrane in sensor substrate base body

Legal Events

Date Code Title Description
C06 Publication
C10 Request of examination as to substance
C02 Deemed withdrawal of patent application after publication (patent law 2001)