CN1925146A - Driving chip packaging structure engaged by multilayer lug and driving chip - Google Patents
Driving chip packaging structure engaged by multilayer lug and driving chip Download PDFInfo
- Publication number
- CN1925146A CN1925146A CNA2005100938111A CN200510093811A CN1925146A CN 1925146 A CN1925146 A CN 1925146A CN A2005100938111 A CNA2005100938111 A CN A2005100938111A CN 200510093811 A CN200510093811 A CN 200510093811A CN 1925146 A CN1925146 A CN 1925146A
- Authority
- CN
- China
- Prior art keywords
- layer
- those
- chip
- metal layer
- projection
- Prior art date
Links
- 239000010410 layers Substances 0.000 claims abstract description 183
- 239000002184 metals Substances 0.000 claims abstract description 105
- 229910052751 metals Inorganic materials 0.000 claims abstract description 105
- 238000009413 insulation Methods 0.000 claims description 11
- 238000004804 winding Methods 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000010950 nickel Substances 0.000 claims description 6
- 230000001070 adhesive Effects 0.000 claims description 5
- 239000000853 adhesives Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 5
- 235000010384 tocopherol Nutrition 0.000 claims description 4
- 235000019731 tricalcium phosphate Nutrition 0.000 claims description 4
- 229910052728 basic metals Inorganic materials 0.000 abstract 1
- 150000003818 basic metals Chemical class 0.000 abstract 1
- 239000004020 conductors Substances 0.000 abstract 1
- 239000002365 multiple layers Substances 0.000 abstract 1
- 239000010408 films Substances 0.000 description 24
- 238000000034 methods Methods 0.000 description 14
- 230000005496 eutectics Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000007731 hot pressing Methods 0.000 description 6
- 239000000463 materials Substances 0.000 description 6
- 230000001808 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reactions Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 2
- 230000000875 corresponding Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering processes Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006011 modification reactions Methods 0.000 description 2
- 230000002093 peripheral Effects 0.000 description 2
- 229920000728 polyesters Polymers 0.000 description 2
- 239000011241 protective layers Substances 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 241000563949 Pentaphylacaceae Species 0.000 description 1
- 229920001721 Polyimides Polymers 0.000 description 1
- -1 copper Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000000750 progressive Effects 0.000 description 1
- 230000000754 repressing Effects 0.000 description 1
- 239000011122 softwood Substances 0.000 description 1
- 239000000758 substrates Substances 0.000 description 1
- 239000010409 thin films Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Abstract
Description
Technical field
The present invention relates to a kind of chip for driving packaging structure, particularly relate to a kind of chip for driving packaging structure of multi-layer projection joint and chip for driving utilized with multi-layer projection.
Background technology
Existing known chip for driving packaging structure includes winding packaging structure (Tape CarrierPackage, TCP) or thin-film flip-chip packaging construction (Chip On Film, COF), it is that elder generation forms golden projection at the weld pad of chip for driving, hot repressing is bonded to winding (Tape) or film (Film), and in encapsulation process, because of the variation of the hardness number of golden projection too big, process parameter must be controlled in the small range, be that processing procedure window (process window) is less, the hardness number of existing known golden projection is between Vickers hardness (Hv) 35 to 65, be that mobility scale is a Vickers hardness 30, (Inner Lead Bond, ILB) parameter changes less the pin joint in permissible.
A kind of existing known projection structure, be such as No. the 488052nd, TaiWan, China patent announcement " electroless plating forms the processing procedure of double-deck above metal coupling " announcement, it is to be provided with one to form an inner layer metal projection on the substrate of some weld pads, the material of this inner layer metal projection is to be nickel, it highly is more than 15 μ m, one material is to envelope this inner layer metal projection periphery fully for the peripheral metal layer of gold, make the gross thickness of the above metal coupling of this bilayer more than 18 μ m, after a plurality of weld pads of a chip form those projections, must pass through the step of wafer sort again, in the wafer sort process, probe must be inserted the double-deck above metal coupling on those weld pads, because the height of this peripheral metal layer (gold) is to be below 1/5th of this inner layer metal projection (nickel), promptly golden layer thinner thickness, probe can be because of piercing through the golden layer of harder nickel dam of hardness of conflicting easily, make probe wear away easily, when serious, even can be too thin because of the thickness of gold layer, make the material of whole projection make probe can't insert projection too firmly, can't do wafer sort, in addition, because projection and interior pin hot pressing are to utilize the tin generation eutectic (eutectic) that is plated on gold and the interior pin to engage, if the thickness of the gold layer of the above metal coupling of this bilayer is too thin, can make bad and intensity pin joint in the influence of eutectic.
This shows that above-mentioned existing chip for driving packaging structure obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that the chip for driving packaging structure exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of chip for driving packaging structure of new structure, just become the current industry utmost point to need improved target.
Because the defective that above-mentioned existing chip for driving packaging structure exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of novel chip for driving packaging structure and the chip for driving of utilizing multi-layer projection to engage, can improve general existing chip for driving packaging structure and chip for driving, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, a kind of novel chip for driving packaging structure and the chip for driving of utilizing multi-layer projection to engage are provided, technical problem to be solved is when making this chip for driving and this circuit film hot pressing, prevent the excessive collapse of those links in those multi-layer projections, thereby be suitable for practicality more.
Another object of the present invention is to, a kind of novel chip for driving packaging structure and the chip for driving of utilizing multi-layer projection to engage are provided, technical problem to be solved is that the mobility scale of the hardness number of those multi-layer projections is dwindled, and can when this chip for driving of hot pressing, have bigger processing procedure window (processwindow), thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of chip for driving packaging structure that utilizes multi-layer projection to engage according to the present invention's proposition, it comprises: a circuit film, it includes an electric insulation mantle body and a conducting wire layer, and this conducting wire layer is to be formed at this electric insulation mantle body and to have a plurality of links; One chip for driving, it has an active surface, and this active surface is to be formed with a plurality of weld pads; And a plurality of multi-layer projections, it is provided in a side of on this active surface of this chip for driving, for those links of hot pressing, each multi-layer projection comprises a foundation metal layer and a jointing metal layer, those foundation metal layer are provided in a side of on those weld pads, those jointing metal layers are formed on those foundation metal layer and its hardness is less than those foundation metal layer, when those link eutectics of this circuit film were engaged in those jointing metal layers, those foundation metal layer were to prevent that the excessive collapse of those links is in those multi-layer projections.
The object of the invention to solve the technical problems also adopts following technical measures further to realize.
The aforesaid chip for driving packaging structure that utilizes multi-layer projection to engage, wherein said those foundation metal layer are to comprise nickel, and those jointing metal layers are to comprise gold.
The aforesaid chip for driving packaging structure that utilizes multi-layer projection to engage, the hardness of wherein said those foundation metal layer is the hardness that is not less than those links of this circuit film.
The aforesaid chip for driving packaging structure that utilizes multi-layer projection to engage, the thickness of wherein said those foundation metal layer is two times of thickness that are not more than those jointing metal layers.
The aforesaid chip for driving packaging structure that utilizes multi-layer projection to engage, the Vickers hardness of wherein said those foundation metal layer (Hv) is between 280～350, and the Vickers hardness of those jointing metal layers (Hv) is between 45～75.
The aforesaid chip for driving packaging structure that utilizes multi-layer projection to engage is to be formed with a projection lower metal layer on wherein said those weld pads.
The aforesaid chip for driving packaging structure that utilizes multi-layer projection to engage, it comprises an adhesive body in addition, it is to coat those multi-layer projections.
The aforesaid chip for driving packaging structure that utilizes multi-layer projection to engage, wherein said circuit film are to be the winding (Tape) of winding carrying encapsulation (TCP), and this circuit film has an opening, and those links are unsettled being formed in this opening.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of chip for driving according to the present invention's proposition with multi-layer projection, it has an active surface, this active surface is to be formed with a weld pad, this weld pad is to be formed with a multi-layer projection, this multi-layer projection comprises a foundation metal layer and a jointing metal layer, this foundation metal layer is to be engaged in those weld pads, and this jointing metal layer is formed on this foundation metal layer, the hardness of this foundation metal layer is greater than this jointing metal layer, and the thickness of this foundation metal layer is two times of thickness that are not more than this jointing metal layer.
The object of the invention to solve the technical problems also adopts following technical measures further to realize.
Aforesaid chip for driving with multi-layer projection is to be formed with a projection lower metal layer between wherein said weld pad and this foundation metal layer.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, major technique of the present invention thes contents are as follows:
In order to achieve the above object, the invention provides a kind of chip for driving packaging structure that utilizes multi-layer projection to engage, it comprises a circuit film, this circuit film includes an electric insulation mantle body and a conducting wire layer, this conducting wire layer is to be formed at this electric insulation mantle body, and have a plurality of links, to be electrically conducted a chip for driving, this chip for driving has an active surface, this active surface is those links towards this conducting wire layer, this active surface is to be formed with a plurality of weld pads, those weld pads are corresponding those links, and be to be formed with a plurality of multi-layer projections between those links and those weld pads, each multi-layer projection comprises a foundation metal layer and a jointing metal layer, the hardness of those foundation metal layer is greater than those jointing metal layers, the Vickers hardness of those foundation metal layer (Hv) is between 280～350, the Vickers hardness of those jointing metal layers is between 45～75, utilize the difference (gradually hard) of multi-level metal hardness, reach the big body profile (being basal layer) of keeping projection engages (knitting layer) with eutectic effect toward the projection bottom.And those foundation metal layer are to be engaged in those weld pads, and those jointing metal layers are that eutectic is engaged in those links, so that those links of those weld pads of this chip for driving and this circuit film electrically connect.
By technique scheme, this novel chip for driving packaging structure and the chip for driving with multi-layer projection have following advantage at least:
The present invention utilizes a plurality of multi-layer projections to be formed on a plurality of weld pads of a chip for driving, each multi-layer projection comprises a foundation metal layer and a jointing metal layer, those foundation metal layer are a plurality of weld pads that are engaged in this chip for driving, when this chip for driving and this circuit film hot pressing, those jointing metal layers are a plurality of links that eutectic is engaged in a circuit film, because the hardness of those foundation metal layer is greater than those jointing metal layers, can prevent the excessive collapse of those links in those multi-layer projections, and the intensity that pin engages in can not influencing because of eutectic is bad.
The present invention utilizes a plurality of multi-layer projections to be formed on a plurality of weld pads of a chip for driving, each multi-layer projection comprises a foundation metal layer and a jointing metal layer, and the hardness of those foundation metal layer is greater than those jointing metal layers, so that the jointing metal layer of those multi-layer projections all can engage link and excessive collapse not really, and can when a circuit film and this chip for driving hot pressing, have bigger processing procedure window (process window).
In sum, the chip for driving packaging structure and the chip for driving of utilizing multi-layer projection to engage of special construction of the present invention, it has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it all has bigger improvement on product structure or function, have large improvement technically, and produced handy and practical effect, and more existing chip for driving packaging structure and chip for driving have the multinomial effect of enhancement, thereby be suitable for practicality more, and have the extensive value of industry, really be a novelty, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic cross-section that utilizes the chip for driving packaging structure of multi-layer projection joint of the present invention.
Fig. 2 is that the part of chip for driving packaging structure of the present invention is amplified schematic cross-section.
100: the chip for driving packaging structure
110: circuit film 111: electric insulation mantle body
112: conducting wire layer 113: opening
114: link 120: chip for driving
121: active surface 122: protective layer
123: weld pad 124: the projection lower metal layer
130: multi-layer projection 131: foundation metal layer
132: jointing metal layer 140: adhesive body
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to chip for driving packaging structure and its embodiment of chip for driving, structure, feature and the effect thereof of utilizing multi-layer projection to engage that foundation the present invention proposes, describe in detail as after.
See also Figure 1 and Figure 2, it is a specific embodiment of the present invention, the chip for driving packaging structure 100 that this utilizes multi-layer projection to engage, it comprises a circuit film 110, this circuit film 100 is the films (Film) that can be the winding (Tape) or the membrane of flip chip encapsulation (COF) of winding carrying encapsulation (TCP), be to exemplify in the present embodiment with winding, this circuit film 110, include an electric insulation mantle body 111 and a conducting wire layer 112, and this electric insulation mantle body 111 has an opening 113, the material of this electric insulation mantle body 111 is to be pi (polyimide, PI) or polyester (polyester, PET), the material of this conducting wire layer 112 is to can be metals such as copper, and be formed at this electric insulation mantle body 111, this conducting wire layer 112 has a plurality of links 114, and is preferable, and those links 114 are to be electroplate with a tin layer (not shown), those links 114 are to be formed at opening 113, to be electrically conducted a chip for driving 120;
This chip for driving 120, has an active surface 121, this active surface 121 is those links 114 towards this conducting wire layer 112, this active surface 121 is to be formed with a protective layer 122 and a plurality of weld pad 123, be to be formed with a projection lower metal layer 124 on those weld pads 123, and those weld pads 123 are corresponding those links 114;
A plurality of multi-layer projections 130 are formed in the projection lower metal layer 124 of those weld pads 123 and are located between those links 114 and those weld pads 123, the height of those multi-layer projections is between 15 to 30 μ m, each multi-layer projection 130 comprises a foundation metal layer 131 and a jointing metal layer 132, those foundation metal layer 131 are the projection lower metal layers 124 that are engaged in those weld pads 123, and being eutectics, those jointing metal layers 132 are engaged in those links 114, so that those links 114 of those weld pads 123 of this chip for driving 120 and this circuit film 110 electrically connect, in the present embodiment, the hardness of those foundation metal layer 131 is greater than those jointing metal layers 132, the Vickers hardness of those foundation metal layer 131 (Hv) is between 280～350, hard material such as nickel for example, and the Vickers hardness of those jointing metal layers 132 is between 45～75, for example gold etc. is than softwood matter, make that the Vickers hardness of those multi-layer projections 130 is between 80 to 100, and the thickness of those foundation metal layer 131 is that two times of thickness that are not more than those jointing metal layers 132 are good, the thickness that is those foundation metal layer 131 be no more than those multi-layer projections 130 height 2/3rds, preferable, this chip for driving packaging structure 100 comprises an adhesive body 140 in addition, this adhesive body 140 is to be located at this opening 113, to coat those multi-layer projections 130 and those links 114.
Because being engaged in the hardness of those foundation metal layer 131 of those weld pads 123 is greater than those jointing metal layers 132 that are engaged in those links 114, when this chip for driving 120 and these circuit film 110 hot pressings, those link 114 excessive collapses can be prevented in those multi-layer projections 130, and the height after those multi-layer projections 130 combinations can be effectively controlled.Therefore, the permissible excursion of process parameter when this chip for driving 120 and these circuit film 110 hot pressings is bigger, has bigger processing procedure window (process window).
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the structure that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100938111A CN1925146A (en) | 2005-08-30 | 2005-08-30 | Driving chip packaging structure engaged by multilayer lug and driving chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100938111A CN1925146A (en) | 2005-08-30 | 2005-08-30 | Driving chip packaging structure engaged by multilayer lug and driving chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1925146A true CN1925146A (en) | 2007-03-07 |
Family
ID=37817704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100938111A CN1925146A (en) | 2005-08-30 | 2005-08-30 | Driving chip packaging structure engaged by multilayer lug and driving chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1925146A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8053906B2 (en) | 2008-07-11 | 2011-11-08 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and method for processing and bonding a wire |
| US8076786B2 (en) | 2008-07-11 | 2011-12-13 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and method for packaging a semiconductor package |
| US8110931B2 (en) | 2008-07-11 | 2012-02-07 | Advanced Semiconductor Engineering, Inc. | Wafer and semiconductor package |
| CN108962914A (en) * | 2017-05-19 | 2018-12-07 | 启耀光电股份有限公司 | Electronic device and its manufacturing method |
-
2005
- 2005-08-30 CN CNA2005100938111A patent/CN1925146A/en not_active Application Discontinuation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8053906B2 (en) | 2008-07-11 | 2011-11-08 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and method for processing and bonding a wire |
| US8076786B2 (en) | 2008-07-11 | 2011-12-13 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and method for packaging a semiconductor package |
| US8110931B2 (en) | 2008-07-11 | 2012-02-07 | Advanced Semiconductor Engineering, Inc. | Wafer and semiconductor package |
| CN108962914A (en) * | 2017-05-19 | 2018-12-07 | 启耀光电股份有限公司 | Electronic device and its manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101350337B (en) | IC having wafer paste sheet adhesive tape and encapsulation method tehreof | |
| CN100346678C (en) | Enhancement of current-carrying capacity of a multilayer circuit board | |
| CN1306600C (en) | Press pack power semiconductor module | |
| TWI237354B (en) | Stacked package structure | |
| CN1159956C (en) | Terminal electrode for circuit substrate on which chip pachage mounted and method for manufacturing the same | |
| CN100343987C (en) | Semiconductor device having metal plates and semiconductor chip | |
| CN100336220C (en) | Integrated core microelectronic package | |
| US20130161823A1 (en) | Semiconductor Device and Method of Manufacturing the Same | |
| US9560773B2 (en) | Electrical barrier layers | |
| CN1181716C (en) | Multilayer ceramic supporting base with anchored welding pad | |
| EP2980870B1 (en) | Light-emitting device, production method therefor, and device using light-emitting device | |
| CN102299082B (en) | Producing method of semiconductor bearing element and producing method of package using the semiconductor bearing element | |
| US20130149857A1 (en) | Solder interconnect by addition of copper | |
| CN1236491C (en) | Semiconductor device having flat electrode and protruding electrode directly contact with it | |
| US20130161816A1 (en) | Semiconductor package | |
| CN1231953C (en) | Method for forming packaging of flip-chip semiconductor | |
| CN100559577C (en) | Wafer packaging construction and manufacture method thereof with array connecting pad | |
| TWI286375B (en) | Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for fabricating the same | |
| US8450861B2 (en) | Integrated circuit device with semiconductor device components embedded in plastic housing composition | |
| US6331450B1 (en) | Method of manufacturing semiconductor device using group III nitride compound | |
| CN101188226B (en) | Chip package structure and fabricating process thereof | |
| CN1159756C (en) | Lead wire frame and its producing method | |
| CN1237614C (en) | High density rod grid array connection and method thereof | |
| TWI411081B (en) | Lead frame and method for manufacturing the same | |
| CN202275822U (en) | Semiconductor encapsulation piece and its substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |