CN1913179A - Luminous module and LED package structure - Google Patents
Luminous module and LED package structure Download PDFInfo
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- CN1913179A CN1913179A CNA2005100897662A CN200510089766A CN1913179A CN 1913179 A CN1913179 A CN 1913179A CN A2005100897662 A CNA2005100897662 A CN A2005100897662A CN 200510089766 A CN200510089766 A CN 200510089766A CN 1913179 A CN1913179 A CN 1913179A
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- light
- central shaft
- lens section
- refraction
- reflection subassembly
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Abstract
An illuminating module includes a light source, a reflection component and a lens part, in which, the source is suitable for providing a ray, the reflection component is matched above the source, the lens part is set between the source and the reflection component and includes two opposite refraction sides and a base, besides, the illuminating module has a central shaft vertical to the transfer path of the ray reflected by the reflection component and part of the rays is reflected and its transfer path is almost vertical to the central shaft. This invention also provides a package structure of LED.
Description
Technical field
The invention relates to a kind of light emitting module and package structure for LED (LED packagestructure), and particularly relevant for a kind of light emitting module and package structure for LED of lateral direction light emission.
Background technology
Figure 1A and Figure 1B illustrate the structural representation of the light emitting module of two kinds of lateral direction light emission types of tradition.Please refer to Figure 1A and Figure 1B, the light emitting module 100a/100b of tradition lateral direction light emission type comprises a light-emitting diode chip for backlight unit (LED chip) 110 and one lens section 120a/120b, and lens section 120a/120b comprises a bottom surface 122a/122b, a reflecting surface 124a/124b and a plane of refraction 126a/126b.Wherein, reflecting surface 124a/124b is relative with plane of refraction 126a/126b, and plane of refraction 126a/126b and reflecting surface 124a/124b are connected to each other.
Among the above-mentioned light emitting module 100a/100b, light-emitting diode chip for backlight unit 110 is suitable for providing a light 112, wherein Yi Bufen light 112 by bottom surface 122a/122b incident lens section 120a/120b after, can be passed to reflecting surface 124a/124b, therefore and because of it is incident on the angle of total reflection of the incidence angle of reflecting surface 124a/124b greater than reflecting surface 124a/124b, face 124a/124b reflection and from plane of refraction 126a outgoing can be reflected.The light 112 of another part by bottom surface 122a/122b incident lens section 120a/120b after, can be directly from plane of refraction 126a outgoing.In addition, the direction of transfer of light 122 after lens section 120a/120b outgoing is haply perpendicular to central shaft 50.
Among the tradition light emitting module 100a/100b, because the light 112 of part can be passed to reflecting surface 124a/124b once more from plane of refraction 126a/126b reflection, and because of it is incident on the angle of total reflection of the incidence angle of reflecting surface 124a/124b less than reflecting surface 124a/124b, so can penetrate through reflective face 124a/124b.So not only reduce the efficient of lateral direction light emission, cause the loss of light energy, lens section 120a/120b top also can form bright spot or aperture and unexpected smooth shape occur, therefore need additionally expend cost and use anti-dazzling screen or diffusion sheet to repair this unexpected smooth shape.
In addition, structurally comparatively fragile because the intersection of reflecting surface 124a/124b and plane of refraction 126a/126b is thinner, thereby fracture easily, and injection molding the time, the bad situation of moulding takes place easily.
Summary of the invention
In view of this, purpose of the present invention is providing a kind of light emitting module exactly, to improve luminous efficiency.
Another object of the present invention provides a kind of package structure for LED, to improve luminous efficiency.
Based on above-mentioned and other purpose, the present invention proposes a kind of light emitting module, and it comprises a light source, a reflection subassembly and a lens section.Wherein, light source is suitable for providing a light, and reflection subassembly is configured in the light source top.Lens section is configured between light source and the reflection subassembly, and has a plane of refraction respect to one another and a bottom surface.In addition, light emitting module has a central shaft, and light via the bang path after the reflection subassembly reflection haply perpendicular to central shaft, and the light of part is refracted bang path after the face refraction haply perpendicular to central shaft.
The present invention proposes a kind of package structure for LED in addition, and it comprises a supporting substrate, a light-emitting diode chip for backlight unit, a reflection subassembly and a lens section.Wherein, light-emitting diode chip for backlight unit is configured on the supporting substrate, and reflection subassembly is configured in the light-emitting diode chip for backlight unit top.Lens section coats supporting substrate, and is connected with reflection subassembly, and this lens section and has a plane of refraction respect to one another and a bottom surface between light-emitting diode chip for backlight unit and reflection subassembly.In addition, package structure for LED has a central shaft, and light-emitting diode chip for backlight unit is suitable for providing a light.Haply perpendicular to central shaft, and the light of part is refracted bang path after the face refraction haply perpendicular to central shaft to this light via the bang path after the reflection subassembly reflection.
The present invention is reflected light because of adopting a reflection subassembly, therefore can improve conventional art middle part light splitter can because of the incidence angle of incidence reflection face less than angle of total reflection penetrate through reflective face, cause the shortcoming of energy loss.In addition,, can avoid in the conventional art,, cause structure comparatively fragile because of the reflecting surface of lens section is thinner with the intersection of first plane of refraction because reflection subassembly of the present invention is different parts with lens section, and easy when injection moulding the bad phenomenon of generation moulding.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A and Figure 1B illustrate the structural representation of the light emitting module of two kinds of lateral direction light emission types of tradition.
Fig. 2 illustrates the structural representation of the light emitting module of one embodiment of the invention.
Fig. 3 illustrates the structural representation of the light emitting module of another embodiment of the present invention.
Fig. 4 illustrates the schematic diagram of the package structure for LED of one embodiment of the invention.
The primary clustering symbol description
50: central shaft
100a, 100b, 200,200 ': light emitting module
110,320: light-emitting diode chip for backlight unit
112,212,322: light
120a, 120b, 230,340: lens section
122a, 122b, 234,344: bottom surface
124a, 124b: reflecting surface
126a, 126b, 232,342: plane of refraction
210: light source
220,330: reflection subassembly
222,332: the taper reflecting surface
232a, 342a: first
232b, 342b: second portion
236,346: the extension
300: package structure for LED
310: supporting substrate
Embodiment
Fig. 2 illustrates the structural representation of the light emitting module of one embodiment of the invention.Please refer to Fig. 2, the light emitting module 200 of present embodiment comprises a light source 210, a reflection subassembly 220 and a lens section 230.Wherein, light source 210 is suitable for providing a light 212, and reflection subassembly 220 is configured in light source 210 tops.Lens section 230 is configured between light source 210 and the reflection subassembly 220, and has a plane of refraction 232 respect to one another and a bottom surface 234.In addition, light emitting module 200 has a central shaft 50, and the bang path of light 212 after via reflection subassembly 220 reflection be haply perpendicular to central shaft 50, and the light 212 of part is refracted bang path after face 232 refractions haply perpendicular to central shaft 50.
In the above-mentioned light emitting module 200, reflection subassembly 220 for example has a taper reflecting surface 222, and it is suitable for the light 212 of antireflection part.In addition, central shaft 50 is for example by light source 210, the summit of taper reflecting surface 222 and the central point of plane of refraction 232, and the bottom surface 234 of lens section 230 for example has a part at least perpendicular to central shaft 50.
In one embodiment of the present invention, light source 210 for example is light-emitting diode or other light source that is suitable for, some can be passed to the taper reflecting surface 222 of reflection subassembly 220 via the refraction of the 232a of first of plane of refraction 232 light that it sent 212, afterwards again via the reflection of taper reflecting surface 222 along haply perpendicular to the direction transmission of central shaft 50.After the refraction of the light 212 of another part via the second portion 232b of plane of refraction 232, can be along haply perpendicular to the direction transmission of central shaft 50.In other words, change the bang path of light 212 in the present embodiment by the second portion 232b of taper reflecting surface 222 and plane of refraction 232, to reach the effect of lateral direction light emission.
In the present embodiment, taper reflecting surface 222 for example is to plate reflective coating or form with other method at reflection subassembly 220, and it can prevent that also light 212 from penetrating taper reflecting surface 222 except the light 212 that is used for the reflecting part, cause the loss of light energy.Thus, not only can improve the efficient of lateral direction light emission, also can avoid above reflection subassembly 220 forming bright spot or aperture and cause unexpected smooth shape.Compared to conventional art, need not use anti-dazzling screen or diffusion sheet to repair unexpected smooth shape in the present embodiment, therefore can save the cost of anti-dazzling screen or diffusion sheet.In addition, more or less freely on making because the structure of reflection subassembly 220 and lens section 230 is comparatively simple, therefore can reduce reflection subassembly 220 and the bad probability of lens section 230 generation moulding.
What deserves to be mentioned is, in the present embodiment when needs are adjusted light emitting module 200 bright dipping light shapes, only need finishing reflection subassembly 220 and lens section 230 one of them, so more or less freely in the finishing of mould.In addition, when a plurality of light emitting modules 200 when a direction is arranged, the reflection subassembly 220 of each light emitting module 200 can be integrated into parts.
Fig. 3 illustrates the structural representation of the light emitting module of another embodiment of the present invention.Please refer to Fig. 3, the light emitting module 200 ' of present embodiment is similar to above-mentioned light emitting module 200, difference is in the lens section 230 of light emitting module 200 ' and has an extension 236, and it is to be connected with reflection subassembly 220, and this extension 236 is parallel haply with central shaft 50.
Because the extension 236 of lens section 230 is parallel to central shaft 50 haply, the part light 212 of assembly 220 reflections and the bang path of part light 212 of second portion 232b refraction that is refracted face 232 are haply perpendicular to the extension 236 of lens section 230 so the 232a of first by plane of refraction 232 is reflected.In other words, the direction of transfer behind the extension 236 of light 212 scioptics portions 230 can not change (or having only slight change), therefore is unlikely to influence the bright dipping light shape of light emitting module 200 '.
Fig. 4 illustrates the schematic diagram of the package structure for LED of one embodiment of the invention.Please refer to Fig. 4, the package structure for LED 300 of present embodiment comprises a supporting substrate 310, a light-emitting diode chip for backlight unit 320, a reflection subassembly 330 and a lens section 340.Wherein, light-emitting diode chip for backlight unit 320 is configured on the supporting substrate 310 and electrically connects with supporting substrate 310, and reflection subassembly 330 is configured in light-emitting diode chip for backlight unit 320 tops.Lens section 340 coats supporting substrates 310, and is connected with reflection subassembly 330, and this lens section 340 and has a plane of refraction 342 respect to one another and a bottom surface 344 between light-emitting diode chip for backlight unit 320 and reflection subassembly 330.In addition, package structure for LED 300 has a central shaft 50, and light-emitting diode chip for backlight unit 320 is suitable for providing a light 322.The bang path of this light 322 after via reflection subassembly 330 reflection be haply perpendicular to central shaft 50, and the light 322 of part is refracted bang path after face 342 refractions haply perpendicular to central shaft 50.
In the above-mentioned package structure for LED 200, supporting substrate 310 for example is lead frame, circuit board or other substrate.In addition, the bang path of the reflection subassembly 330 of the package structure for LED 200 of present embodiment, lens section 340 and light 322 is similar to the bang path of the reflection subassembly 220 of light emitting module 200 ' illustrated in fig. 3, lens section 230 and light 212, will no longer repeat at this.
In sum, light emitting module of the present invention and package structure for LED have following advantage at least:
1. the present invention comes reflecting part light because of adopting a reflection subassembly, to prevent light penetration taper reflecting surface, causes the loss of light energy, and therefore light emitting module of the present invention and package structure for LED have higher luminous efficiency.
2. compared to conventional art, the present invention need not use anti-dazzling screen or diffusion sheet to repair unexpected smooth shape, therefore can save the cost of anti-dazzling screen or diffusion sheet.
3. because the structure of reflection subassembly and lens section is comparatively simple, more or less freely on making, therefore can reduce reflection subassembly and the bad probability of lens section generation moulding.
Though the present invention with preferred embodiment openly as above; right its is not in order to qualification the present invention, any insider, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (10)
1. light emitting module comprises:
One light source is suitable for providing a light;
One reflection subassembly is configured in this light source top; And
One lens section is configured between this light source and this reflection subassembly, and this lens section has a plane of refraction respect to one another and a bottom surface,
Wherein, this light emitting module has a central shaft, and the bang path of this light after via the reflection of this reflection subassembly be haply perpendicular to this central shaft, and the bang path of this light of part after by this plane of refraction refraction is haply perpendicular to this central shaft.
2. light emitting module according to claim 1 is characterized in that, wherein this reflection subassembly has a taper reflecting surface, is suitable for this light of antireflection part, and this central shaft system is by this light source, the summit of this taper reflecting surface and the central point of this plane of refraction.
3. light emitting module according to claim 1 is characterized in that, wherein this lens section has more an extension that is parallel to this central shaft haply, is connected with this reflection subassembly.
4. light emitting module according to claim 1 is characterized in that, wherein this bottom surface of this lens section has a part at least perpendicular to this central shaft.
5. light emitting module according to claim 1 is characterized in that wherein this light source comprises light-emitting diode.
6. package structure for LED comprises:
One supporting substrate;
One light-emitting diode chip for backlight unit is configured on this supporting substrate and electrically connects with this supporting substrate, and this light-emitting diode chip for backlight unit is suitable for providing a light;
One reflection subassembly is configured in this light-emitting diode chip for backlight unit top; And
One lens section coats this supporting substrate, and this lens section system is between this light-emitting diode chip for backlight unit and this reflection subassembly, and this lens section has a plane of refraction respect to one another and a bottom surface,
Wherein, this package structure for LED has a central shaft, and the bang path of this light after via the reflection of this reflection subassembly be haply perpendicular to this central shaft, and the bang path of this light of part after by this plane of refraction refraction is haply perpendicular to this central shaft.
7. package structure for LED according to claim 6, it is characterized in that, wherein this reflection subassembly has a taper reflecting surface, is suitable for this light of antireflection part, and this central shaft is by this light-emitting diode chip for backlight unit, the summit of this taper reflecting surface and the central point of this plane of refraction.
8. package structure for LED according to claim 6 is characterized in that, wherein this lens section has more an extension that is parallel to this central shaft haply, is connected with this reflection subassembly.
9. package structure for LED according to claim 6 is characterized in that, wherein this bottom surface of this lens section has a part at least perpendicular to this central shaft.
10. package structure for LED according to claim 6 is characterized in that, wherein this supporting substrate comprises a lead frame or a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100897662A CN100448038C (en) | 2005-08-09 | 2005-08-09 | Luminous module and LED package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100897662A CN100448038C (en) | 2005-08-09 | 2005-08-09 | Luminous module and LED package structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1913179A true CN1913179A (en) | 2007-02-14 |
| CN100448038C CN100448038C (en) | 2008-12-31 |
Family
ID=37722038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100897662A Expired - Fee Related CN100448038C (en) | 2005-08-09 | 2005-08-09 | Luminous module and LED package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100448038C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102121601A (en) * | 2010-01-08 | 2011-07-13 | 夏普株式会社 | Led light bulb |
| CN103836412A (en) * | 2012-11-22 | 2014-06-04 | 恩普乐股份有限公司 | Lighting device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11261109A (en) * | 1999-01-18 | 1999-09-24 | Toshiba Corp | Callium nitride semiconductor light-emitting device and light-emitting device |
| KR100779771B1 (en) * | 2000-09-13 | 2007-11-27 | 언액시스 인터내셔널 트레이딩 엘티디 | Apparatus for mounting of semiconductor chips |
| US6803607B1 (en) * | 2003-06-13 | 2004-10-12 | Cotco Holdings Limited | Surface mountable light emitting device |
-
2005
- 2005-08-09 CN CNB2005100897662A patent/CN100448038C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102121601A (en) * | 2010-01-08 | 2011-07-13 | 夏普株式会社 | Led light bulb |
| US8342719B2 (en) | 2010-01-08 | 2013-01-01 | Sharp Kabushiki Kaisha | LED light bulb |
| CN102121601B (en) * | 2010-01-08 | 2013-07-24 | 夏普株式会社 | Led light bulb |
| CN103836412A (en) * | 2012-11-22 | 2014-06-04 | 恩普乐股份有限公司 | Lighting device |
| CN103836412B (en) * | 2012-11-22 | 2017-03-01 | 恩普乐股份有限公司 | Illuminator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100448038C (en) | 2008-12-31 |
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Granted publication date: 20081231 Termination date: 20110809 |