CN1878452A - Structure design of mobile terminal - Google Patents
Structure design of mobile terminal Download PDFInfo
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- CN1878452A CN1878452A CN 200510076623 CN200510076623A CN1878452A CN 1878452 A CN1878452 A CN 1878452A CN 200510076623 CN200510076623 CN 200510076623 CN 200510076623 A CN200510076623 A CN 200510076623A CN 1878452 A CN1878452 A CN 1878452A
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- portable terminal
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- high temperature
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Abstract
The invention relates to a structure design of mobile terminal. Wherein, the relative high-temperature area of circuit board is arranged with heat emitter, to emit the heat of said area through the frame of mobile terminal; or the relative high-temperature area and relative low-temperature area are mounted with heat emitters, to transmit the heat of high-temperature area to the low-temperature area; the heat emitter is made from carbon (graphite), with high thermal conductivity and low density. The invention has low cost, small volume, better temperature uniformity and the application for avoiding partly high temperature of element and frame.
Description
Technical field
The present invention relates to the structural design of electronic technology field product, relate in particular to a kind of structural design of portable terminal.
Background technology
Modern society, mobile phone just portable terminal has become the indispensable communication tool of people.People are more and more to the functional requirement of portable terminal.Along with the development of radio communication and chip encapsulation technology, more function can be integrated in the portable terminal.Because the function of portable terminal is more and more, increase trend also appears in power consumption of mobile terminals, the portable terminal of using in the third generation network especially, and its power consumption is more much bigger than former portable terminal.Yet people often need to wish that the volume of portable terminal is the smaller the better, and so, customer demand and pressure of competition force portable terminal manufacturer to pursue the portable terminal of small size again, and under the kindred circumstances, portable terminal unit volume heat generation density increases.And in limited portable terminal inner space, can't adopt fan again, and radiator, heat dissipation technologys such as heat pipe, this brings very big challenge for the portable terminal thermal design.
The temperature of portable terminal mainly shows non-uniform temperature two aspects that local temperature is too high with whole to user's influence.Under the technical conditions of existing hear rate, the portable terminal surface temperature is too high to cause customer complaint in order to avoid, and realizes that surface temperature is even, and avoiding heat spot is a focus of design, especially to the portable terminal of plastic basis material.Usually the plastics conductive coefficient is about 0.4W/m-K, and temperature distributing disproportionation is even can be reached more than 10 ℃.Some manufacturers provide the high thermal conductivity coefficient plastics as Chomerics company.This high thermal conductivity coefficient plastics are mainly by adding fibrous graphite or metal material acquisition in plastics.Its conductive coefficient is 0.7W/m-K, can satisfy instructions for use, and still, this technology is for to realize that electromagnetic shielding comes out; Can't make shades of colour as common plastics, outward appearance is subjected to some restrictions; This just causes and is not very attractive in appearance.Simultaneously, its cost increases more, can't generally use in the present circumstance.
In addition, also having a kind of mode, is exactly that portable terminal adopts metal shell, and this portable terminal is generally by magnesium alloy, and aluminium alloy etc. are made.Though its thermal conductivity ratio plastics are much higher, its cost is more much higher than plastics, can only use on the insensitive high-end portable terminal of cost; In addition, because metal heat-conducting coefficient ratio plastics are high a lot, the easier user of allowing of metal feels heating even scalds one's hand during same temperature.In fact, according to the UL60950-1 standard, under the long-term contact, the hot face temperature of the portable terminal permission of metal base is 55 ℃, and the maximum temperature of the portable terminal of plastic basis material permission is 75 ℃.The portable terminal big to hear rate, though the cooling-down effect that samming brings is obvious, the temperature after its cooling is easy to surpass 55 ℃, and especially the responsive relatively zone of some temperature is as " replying " key or " OK " key, and the temperature of these keys may be higher.Reduce user satisfaction easily, cause and complain.
Be the following schemes of the many employings of a problem in order to solve at present:
First kind of scheme: the heat radiation volume and the area of dissipation that increase portable terminal.The obvious incompatibility mobile terminal user of this scheme requires the requirement of small volume and less weight to portable terminal.Be difficult for being accepted by market.
Second kind of scheme: reduce power consumption of mobile terminals.This scheme is limited by the exploitation level of hardware and software; Can't realize simultaneously that communication quality again low in energy consumption is good.So this scheme is difficult to use.
Therefore, how to solve the heat dissipation problem of portable terminal, make the small volume and less weight of third generation portable terminal, cost low, uniform temperature is good, avoid device localized hyperthermia and mobile terminal case localized hyperthermia.
Summary of the invention
In view of above-mentioned existing in prior technology problem, the purpose of this invention is to provide a kind of structural design of portable terminal, help the portable terminal surface temperature distribution more even, reduce user sensitizing range temperature; And only needing a small amount of manufacturing cost that increases, its outward appearance should be very attractive in appearance simultaneously.Make portable terminal small volume and less weight, cost low, good heat dissipation effect, uniform temperature is good, avoid device localized hyperthermia and mobile terminal case localized hyperthermia.
The objective of the invention is to be achieved through the following technical solutions:
The invention provides a kind of structural design of portable terminal, comprise circuit board, heater element is arranged on circuit board, circuit board in the heater element zone during portable terminal work forms local relatively-high temperature district, other zone is exactly relative low-temperature space, and the relatively-high temperature district on circuit board is provided with radiator, distributes the heat in relatively-high temperature district by mobile terminal case, the material of described radiator is carbon, i.e. graphite.
Among the present invention, the relatively-high temperature district on circuit board is provided with radiator with relative low-temperature space, and the heat in relatively-high temperature district is transmitted to relative low-temperature space, and the material of described radiator is a carbon.
Described radiator is heat conduction carbon film, heat conduction carbon plate or heat conduction carbon piece.
The thickness of described heat conduction carbon film is 0.1mm～1mm.
Described radiator is the All Ranges on the whole covering board; Perhaps, described fin is a plurality of fritters, and each fritter covers at least one relatively-high temperature district and/or at least one relative low-temperature space.
Described radiator is fixed on the heater element on shell inner surface or the circuit board.
Described radiator is adhered on the heater element on shell inner surface or the circuit board by heat-conducting glue.
Described portable terminal comprises:
Global system for mobile communications GSM mobile handset, code division multiple access CDMA mobile phone, 3-G (Generation Three mobile communication system) 3G mobile or Personal Handyphone System.
As seen from the above technical solution provided by the invention, the structural design of described portable terminal of the present invention, the relatively-high temperature district on circuit board is provided with radiator, distributes the heat in relatively-high temperature district by mobile terminal case; Or the relatively-high temperature district on circuit board is provided with radiator with relative low-temperature space, and the heat in relatively-high temperature district is transmitted to relative low-temperature space; The material of described radiator is carbon (graphite).Because of the portable terminal shell generally mostly is plastic products.The advantage of plastic material and metal material has been concentrated in this design, and the shell common plastics can be made shades of colour, and outward appearance is unrestricted; Very attractive in appearance, simultaneously, it is low to have a cost, the advantage that local temperature sensitiveness is not high.Inside is provided with the heat conduction carbon film, has the high advantage of conductive coefficient.Only increased a spot of manufacturing cost, made portable terminal small volume and less weight, cost low, uniform temperature is good, avoid device localized hyperthermia and mobile terminal case localized hyperthermia.
Description of drawings
Fig. 1 is the structure chart one of portable terminal of the present invention;
Fig. 2 is the structure chart two of portable terminal of the present invention;
Fig. 3 is the structure chart three of portable terminal of the present invention.
Embodiment
The internal cause of portable terminal surface temperature distribution inequality is that wiring board PCB goes up the unbalanced of device heating.Plate PCB goes up heater members and mainly contains PA (power amplifier) device, LCD (liquid crystal display screen), radio frequency chip, and CPU, the charging triode, camera, and near the shielding box the high temperature etc.The higher relatively-high temperature district that is referred to as of the temperature in the circuit arc zone at these heater element places, other zone is referred to as relative low-temperature space.Wherein main thermal source is the PA device, accounts for the 40-60% of portable terminal overall heat consumption usually.To some PA of WCDMA and CDMA 2000, its efficient is below 40%, and PA device size 6 * 6 * 1.9mm normally
3To 3 * 3 * 1.8mm
3So when long-time high-power emission, its housing temperature rise can reach 30-50 ℃.In addition, because portable terminal is thinner, the high temperature of PA device is easy to be directly reflected into apart from the nearer portable terminal surface of PA device, as " OK " key of user's sensitive area.Because the plastics conductive coefficient is low, heat is difficult for diffusion, thereby causes portable terminal surface local high temperature.
Portable terminal of the present invention specifically can comprise following terminal equipment:
Global system for mobile communications GSM mobile handset, code division multiple access CDMA mobile phone, 3-G (Generation Three mobile communication system) 3G mobile or Personal Handyphone System, or the like.
The way that the present invention solves portable terminal localized hyperthermia is that the relatively-high temperature district on circuit board is provided with radiator, the heat transferred in relatively-high temperature district is arrived mobile terminal case or relative low-temperature space, reach and reduce relatively-high temperature district and temperature and make the uniform purpose of portable terminal surface temperature distribution.
The specific embodiment of the present invention one is as shown in Figure 1: be provided with several heating elements 3 and conventional element 7 on the circuit board 6 of portable terminal.The peripheral region of heater element 3 forms relatively-high temperature district 4, and the peripheral region of conventional element 7 forms relative low-temperature space 5.Be provided with radiator at 4 places, relatively-high temperature district.Used radiator can adopt heat conducting film 2 or heat-conducting block 8.Heat conducting film 2 or heat-conducting block 8 are located at 1 of the housing of relatively-high temperature district 4 and portable terminal, and the heat of the relatively-high temperature district 4 localized hyperthermias housing 1 by portable terminal is distributed.The area of dissipation of heat conducting film 2 or heat-conducting block 8 will make heat distribute by the housing 1 of bigger area of dissipation from portable terminal much larger than heater element 3 in this case, reduces the localized hyperthermia on housing 1 surface of portable terminal.
The specific embodiment of the present invention two is as shown in Figure 2: be provided with several heating elements 3 and conventional element 7 on the circuit board 6 of portable terminal.The peripheral region of heater element 3 forms relatively-high temperature district 4, and the peripheral region of conventional element 7 forms relative low-temperature space 5.Be provided with radiator at 4 places, relatively-high temperature district.Used radiator can adopt heat-conducting plate 9 or heat-conducting block 8.Heat-conducting plate 9 is located at 1 of the housing of relatively-high temperature district 4 and portable terminal, and the heat of the localized hyperthermia housing 1 by portable terminal is distributed.Reduce the localized hyperthermia on housing 1 surface of portable terminal.Heat-conducting block 8 is located at relatively- high temperature district 4 and 5 of relative low-temperature spaces, with 5 of the extremely relative low-temperature spaces of the heat transferred of relatively-high temperature district 4 localized hyperthermias, the localized hyperthermia that reduces the portable terminal inner part.
The specific embodiment of the present invention three is as shown in Figure 3: be provided with several heating elements 3 and conventional element 7 on the circuit board 6 of portable terminal.The peripheral region of heater element 3 forms relatively-high temperature district 4, and the peripheral region of conventional element 7 forms relative low-temperature space 5.Be provided with radiator at 4 places, relatively-high temperature district.Used radiator can adopt heat conducting film 2.Heat conducting film 2 is the All Ranges on the whole covering board 6, simultaneously it is located at 1 of the housing of relatively-high temperature district 4 and portable terminal, not only the heat of the localized hyperthermia housing 1 by portable terminal is distributed, reduce the localized hyperthermia on housing 1 surface of portable terminal.Heat conducting film 2 also covers relatively-high temperature district 4 and relative low-temperature space 5 simultaneously simultaneously, with 5 of the extremely relative low-temperature spaces of the heat transferred of relatively-high temperature district 4 localized hyperthermias, the localized hyperthermia that reduces the portable terminal inner part.In this case, general requirement, the height of the heater element 3 on the circuit board 46 is consistent or differ very little.The height of the heater element 3 on circuit board 6 is different or differ greatly for a long time the general modes that adopt embodiment one and embodiment two more.
Among the above embodiment, described radiator can adopt carbon (graphite).Because the horizontal conductive coefficient of carbon can reach 400W/m-K, vertical conductive coefficient 15W/m-K.Simultaneously, density is 70% of aluminium, 21% of copper.It is little to have weight, the advantage of good heat dissipation effect.And use thin-film material not only can reduce cost, and can also save the space, saving the space is very important concerning wanting the small and exquisite portable terminal of cube.Therefore, preferred version of the present invention is to adopt carbon film.
Among the above embodiment, the thickness of the carbon film that uses is 0.1mm～1mm.The general thickness that is mostly commonly used is the carbon film of 0.2mm.
For example to sandwich the Temperature Distribution before and after the thick carbon film of 0.15mm between keyboard face and housing be that the test result contrast sees Table 1 to portable terminal.After using carbon film, surperficial maximum temperaturerise reduces by 3.07 ℃.Need to prove that because the characteristics of infrared imaging test own, ambient temperature is from the thermocouple assay result.
Table 1
| Test event | Test condition | |
| There is not carbon membrane between keyboard and the housing | Sandwich carbon membrane between keyboard and the housing | |
| Hear rate (W) | Q＝2.079 | Q＝2.08 |
| Ambient temperature (℃) | 22.2 | 21.3 |
| Maximum temperaturerise (℃) | 29.74 | 26.67 |
| The temperature rise of " OK " key (℃) | 28.68 | 25.31 |
| " 2 " key temperature rise (℃) | 22.8 | 21.47 |
| " 0 " key temperature rise (℃) | 20.42 | 21.45 |
Among the above embodiment, described radiator can be fixed on the heater element 3 on housing 1 inner surface or the circuit board 6.General fixed form adopts on the bonding heater element 3 that directly is adhered on housing 1 inner surface or the circuit board 6 of heat-conducting glue more.
The above; only for the preferable embodiment of the present invention, but protection scope of the present invention is not limited thereto, and anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claim.
Claims (8)
1, a kind of structural design of portable terminal, comprise circuit board, heater element is arranged on circuit board, circuit board in the heater element zone during portable terminal work forms local relatively-high temperature district, other zone is exactly relative low-temperature space, it is characterized in that, the relatively-high temperature district on circuit board is provided with radiator, distribute the heat in relatively-high temperature district by mobile terminal case, the material of described radiator is a carbon.
2, the structural design of portable terminal according to claim 1 is characterized in that, the relatively-high temperature district on circuit board is provided with radiator with relative low-temperature space, and the heat in relatively-high temperature district is transmitted to relative low-temperature space, and the material of described radiator is a carbon.
3, the structural design of portable terminal according to claim 1 and 2 is characterized in that, described radiator is heat conduction carbon film, heat conduction carbon plate or heat conduction carbon piece.
4, the structural design of portable terminal according to claim 3 is characterized in that, the thickness of described heat conduction carbon film is 0.1mm～1mm.
5, the structural design of portable terminal according to claim 1 is characterized in that, described radiator is the All Ranges on the whole covering board; Perhaps, described fin is several fritters, and each fritter covers at least one relatively-high temperature district and/or at least one relative low-temperature space.
6, the structural design of portable terminal according to claim 1 or 5 is characterized in that, described radiator is fixed on the heater element on shell inner surface or the circuit board.
7, the structural design of portable terminal according to claim 6 is characterized in that, described radiator is adhered on the heater element on shell inner surface or the circuit board by heat-conducting glue.
According to the structural design of claim 1,2 or 5 described portable terminals, it is characterized in that 8, described portable terminal comprises:
Global system for mobile communications GSM mobile handset, code division multiple access CDMA mobile phone, 3-G (Generation Three mobile communication system) 3G mobile or Personal Handyphone System.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510076623 CN1878452A (en) | 2005-06-10 | 2005-06-10 | Structure design of mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510076623 CN1878452A (en) | 2005-06-10 | 2005-06-10 | Structure design of mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1878452A true CN1878452A (en) | 2006-12-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510076623 Pending CN1878452A (en) | 2005-06-10 | 2005-06-10 | Structure design of mobile terminal |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103209574A (en) * | 2013-04-24 | 2013-07-17 | 惠州Tcl移动通信有限公司 | Heat dissipation device and method of mobile terminal, and mobile terminal |
| CN104601759A (en) * | 2015-02-02 | 2015-05-06 | 广东欧珀移动通信有限公司 | Cell phone heat radiation structure and cell phone |
| CN105050369A (en) * | 2015-08-26 | 2015-11-11 | 广东欧珀移动通信有限公司 | Intelligent terminal |
| CN105658020A (en) * | 2014-11-10 | 2016-06-08 | 奇鋐科技股份有限公司 | Wearable host device with heat radiation structure |
| US10130010B2 (en) | 2013-04-27 | 2018-11-13 | Zte Corporation | Internal heat-dissipation terminal |
| CN109923317A (en) * | 2016-11-11 | 2019-06-21 | 信浓绢糸株式会社 | Electrodynamic pump |
| CN111781967A (en) * | 2020-06-30 | 2020-10-16 | 深圳市有方科技股份有限公司 | Terminal device |
-
2005
- 2005-06-10 CN CN 200510076623 patent/CN1878452A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103209574A (en) * | 2013-04-24 | 2013-07-17 | 惠州Tcl移动通信有限公司 | Heat dissipation device and method of mobile terminal, and mobile terminal |
| CN103209574B (en) * | 2013-04-24 | 2017-04-12 | 惠州Tcl移动通信有限公司 | Heat dissipation device and method of mobile terminal, and mobile terminal |
| US10130010B2 (en) | 2013-04-27 | 2018-11-13 | Zte Corporation | Internal heat-dissipation terminal |
| CN105658020A (en) * | 2014-11-10 | 2016-06-08 | 奇鋐科技股份有限公司 | Wearable host device with heat radiation structure |
| CN104601759A (en) * | 2015-02-02 | 2015-05-06 | 广东欧珀移动通信有限公司 | Cell phone heat radiation structure and cell phone |
| CN105050369A (en) * | 2015-08-26 | 2015-11-11 | 广东欧珀移动通信有限公司 | Intelligent terminal |
| CN109923317A (en) * | 2016-11-11 | 2019-06-21 | 信浓绢糸株式会社 | Electrodynamic pump |
| CN111781967A (en) * | 2020-06-30 | 2020-10-16 | 深圳市有方科技股份有限公司 | Terminal device |
| CN111781967B (en) * | 2020-06-30 | 2022-02-22 | 深圳市有方科技股份有限公司 | Terminal device |
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