CN1831171A - Aluminum alloy heat sinks of heat exchanger and heat exchanger - Google Patents
Aluminum alloy heat sinks of heat exchanger and heat exchanger Download PDFInfo
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- CN1831171A CN1831171A CN 200610059440 CN200610059440A CN1831171A CN 1831171 A CN1831171 A CN 1831171A CN 200610059440 CN200610059440 CN 200610059440 CN 200610059440 A CN200610059440 A CN 200610059440A CN 1831171 A CN1831171 A CN 1831171A
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- heat exchanger
- aluminum alloy
- solder
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- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 57
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000012535 impurity Substances 0.000 claims abstract description 20
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 20
- 229910052742 iron Inorganic materials 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 148
- 229910000679 solder Inorganic materials 0.000 claims description 54
- 229910052804 chromium Inorganic materials 0.000 claims description 11
- 229910052719 titanium Inorganic materials 0.000 claims description 11
- 229910052720 vanadium Inorganic materials 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910018125 Al-Si Inorganic materials 0.000 claims description 4
- 229910018520 Al—Si Inorganic materials 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 abstract description 21
- 229910052725 zinc Inorganic materials 0.000 abstract description 14
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 238000011156 evaluation Methods 0.000 description 41
- 238000005476 soldering Methods 0.000 description 41
- 239000013078 crystal Substances 0.000 description 40
- 238000012360 testing method Methods 0.000 description 40
- 239000011572 manganese Substances 0.000 description 36
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 34
- 239000010949 copper Substances 0.000 description 33
- 239000011777 magnesium Substances 0.000 description 32
- 238000002844 melting Methods 0.000 description 29
- 238000005260 corrosion Methods 0.000 description 28
- 230000007797 corrosion Effects 0.000 description 28
- 230000008018 melting Effects 0.000 description 28
- 230000003628 erosive effect Effects 0.000 description 26
- 239000011701 zinc Substances 0.000 description 25
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 23
- 230000000052 comparative effect Effects 0.000 description 20
- 229910052726 zirconium Inorganic materials 0.000 description 17
- 230000000694 effects Effects 0.000 description 13
- 239000011651 chromium Substances 0.000 description 11
- 239000010936 titanium Substances 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229910000765 intermetallic Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005219 brazing Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 4
- 238000007669 thermal treatment Methods 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 238000005097 cold rolling Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 229910018473 Al—Mn—Si Inorganic materials 0.000 description 2
- 229910019064 Mg-Si Inorganic materials 0.000 description 2
- 229910019406 Mg—Si Inorganic materials 0.000 description 2
- 229910018651 Mn—Ni Inorganic materials 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910018131 Al-Mn Inorganic materials 0.000 description 1
- 229910018461 Al—Mn Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010011376 Crepitations Diseases 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910018643 Mn—Si Inorganic materials 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 229910008071 Si-Ni Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910006300 Si—Ni Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
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Abstract
The present invention provides aluminum alloy heat sink with excellent strength performance, solderability and anticorrosion performance for heat exchanger and the heat exchanger. The aluminum alloy for heat sink consists of Si 0.6-1.2 wt%, Mn 1.5-2.5 wt%, Ni 0.01-0.15 wt%, Cu 0.01-0.25 wt%, Mg 0.01-0.03 wt%, Fe not more than 0.5 wt%, Zn 1-5 wt%, and Al and inevitable impurity for the rest. The present invention makes it possible to make thin wall and light heat sink and to provide high reliability of heat sink and heat exchanger.
Description
Technical field
The present invention relates to the heat exchanger that on the Al-alloy heat exchanger that adopts the method for brazing manufacturing, uses with aluminum alloy fin material (Off イ Application material) and possess the heat exchanger of this fin material.
Background technology
In recent years, because the lightweight of automobile, the heat exchanger that automobile is used also requires lightweight, for corresponding with it, requires fin material thin-walled property, high strength.
As the fin material that heat exchanger is used, used 1000 to be or 3000 aluminium alloys that are all the time., with the fin material that above-mentioned aluminium alloy is made, the intensity after the soldering may not be enough, in fin material thin-walled property process, and might undercapacity.
For the intensity of the fin material that improves soldering, the heat exchanger that is made of the aluminium alloy that has added Zn etc. in the Al-Mn-Si-Ni system has been proposed with aluminum alloy fin material (for example patent documentation 1).
In addition, the manufacture method of the heat exchanger fin material that uses following aluminium alloy is provided, described aluminium alloy, % counts by weight, contain Fe, and 0.001%～0.3% the Zr of 0.3%～2.0% Mn, 0.5%～1.5% Si, 0.05%～less than 0.7%, remainder is formed (for example patent documentation 2) by Al and unavoidable impurities.
In addition, also proposed to use the manufacture method of the heat exchanger fin material of following aluminium alloy, described aluminium alloy, it is the aluminium alloy that the fin material of heat exchanger is used, % meter contains Mn:0.3-2.0%, Si:0.5-1.5%, Ce:0.005-0.5% by weight, also contains 0.05%～Fe less than 1.0%, the content of Cu and Ni is all less than 0.1%, and remainder is formed (for example patent documentation 3) by Al and unavoidable impurities.
Patent documentation 1: the spy opens the 2004-59939 communique
Patent documentation 2: the spy opens the 2002-256403 communique
Patent documentation 3: the spy opens the 2002-256364 communique
Summary of the invention
The heat exchanger aluminum alloy fin material of record is grouped into formation by adopting above-mentioned one-tenth, with the fin material ratio in past, the excellent strength after the soldering in the patent documentation 1.
; use in the formation of aluminum alloy fin material at the heat exchanger of patent documentation 1; because the content of Ni surpasses 1% but be below 5%; when therefore Mn being set at high-content; when the casting fin material; the easy alligatoring of the intermetallic compound of Al-Mn-Ni system, the processibility of fin material might reduce.
The heat exchanger aluminum alloy fin material of record is grouped into formation by adopting above-mentioned one-tenth, from solidity to corrosion or rust resistance excellence in the patent documentation 2.
, for the heat exchanger of the patent documentation 2 record composition with aluminum alloy fin material, the intensity during with this fin material slimming might reduce.
The heat exchanger aluminum alloy fin material of record is grouped into formation by adopting above-mentioned one-tenth, from solidity to corrosion or rust resistance excellence in the patent documentation 3.
, for the heat exchanger of the patent documentation 3 record composition with aluminum alloy fin material, the intensity during with this fin material slimming might reduce.
About the solderability of heat exchanger with aluminum alloy fin material, be accompanied by fin material attenuation in recent years, solder becomes big problem to the erosion of fin material during soldering.The Al-Si solder that uses when engaging tubing corrodes the occasion in the fin material, and fin material generation buckling might cause the endurance strength of heat exchanger and heat exchanger effectiveness to reduce.Therefore, demand solderability, and the fin material of anti-solder aggressiveness excellence.
The present invention In view of the foregoing finishes, its objective is provide strength characteristics, solderability, and the heat exchanger of self corrosion resistance excellent with aluminum alloy fin material and heat exchanger.
The inventor be obtain strength characteristics, solderability, and from all excellent heat exchanger of corrosion proof any characteristic with aluminum alloy fin material and investigation repeatedly, finally obtain the heat exchanger aluminum alloy fin material of following formation.
(1) a kind of heat exchanger aluminum alloy fin material, it is characterized in that, % counts by weight, contain Si: greater than 0.6% and less than 1.2%, Mn: greater than 1.5% and be less than or equal to 2.5%, Ni:0.01%～0.15%, Cu:0.01%～0.25%, Mg:0.01%～less than 0.03%, Fe:0.5% or following, Zn: greater than 1% and be less than or equal to 5%, and contain the Al and the unavoidable impurities of surplus.
(2) according to above-mentioned (1) described heat exchanger aluminum alloy fin material, it is characterized in that, above-mentioned heat exchanger with aluminum alloy fin material also further contain be selected from Zr:0.05%～0.3%, Cr:0.05%～0.3%, Ti:0.05%～0.3%, V:0.05%～0.3% more than at least a kind or a kind.
(3) a kind of heat exchanger aluminum alloy fin material is characterized in that, be with above-mentioned (1) or (2) described heat exchanger with aluminum alloy fin material as core, coat Al-Si on the two sides of this core and be solder alloy (ろ う material) and constitute.
(4) a kind of heat exchanger is characterized in that, possesses any described heat exchanger aluminum alloy fin material in above-mentioned (1)-(3).
Heat exchanger aluminum alloy fin material of the present invention, be following composition: % counts by weight, contain Si: greater than 0.6% and less than 1.2%, Mn: greater than 1.5% and be less than or equal to 2.5%, Ni:0.01%～0.15%, Cu:0.01%～0.25%, Mg:0.01%～less than 0.03%, Fe:0.5% or following, Zn: greater than 1% and be less than or equal to 5%, and contain the Al and the unavoidable impurities of surplus.
Thus, obtain the soldering fin material and solderability during the assembled heat interchanger improves and high strength, from the fin material of corrosion resistance excellent.
Therefore, heat exchanger with the thin-walled property of aluminum alloy fin material, and lightweight become possibility, in addition, fin material, and the reliability of heat exchanger improve.
In addition, heat exchanger aluminum alloy fin material of the present invention, by form also further contain be selected from Zr:0.05%～0.3%, Cr:0.05%～0.3%, Ti:0.05%～0.3%, V:0.05%～0.3% more than at least a kind or a kind, the intensity of fin material improves more.
Possess heat exchanger of the present invention heat exchanger with aluminum alloy fin material, by adopting the fin material of strength characteristics, solderability excellence, further thin-walled property, and lightweight become possibility, in addition, reliability improves.
Description of drawings
Fig. 1 represents heat exchanger of the present invention with one of the aluminum alloy fin material example, and being explanation has assembled the stereographic map of heat exchanger with the example of aluminum alloy fin material at automobile on heat exchanger.
Nomenclature
1 ... heat exchanger aluminum alloy fin material (fin material); 2 ... pipe; 3 ... last lower header (ヘ Star ダ); 4 ... side support; 10 ... scatterer (heat exchanger)
Specific embodiments
The embodiment of heat exchanger of the present invention with aluminum alloy fin material below is described.
The heat exchanger of the present embodiment is with aluminum alloy fin material (the following fin material that abbreviates as sometimes), % counts by weight, contain Si: greater than 0.6% and less than 1.2%, Mn: greater than 1.5% and be less than or equal to 2.5%, Ni:0.01%～0.15%, Cu:0.01%～0.25%, Mg:0.01%～less than 0.03%, Fe:0.5% or following, Zn: greater than 1% and be less than or equal to 5%, and contain the Al of surplus and unavoidable impurities and constitute.
In addition, as required, can also contain be selected from Zr:0.05%～0.3%, Cr:0.05%～0.3%, Ti:0.05%～0.3%, V:0.05%～0.3% more than at least a kind or a kind.
The following numerical definiteness reason of alloy composition of the fin material of explanation the present embodiment.
[Mg]
Magnesium (Mg) Yi Yuwei when soldering remove purpose such as the oxide film of Al alloy and use fluoridize system non-aggressive brazing flux (ノ コ ロ Star Network Off ラ Star Network ス) reaction, generate MgF
2Deng compound, solderability is reduced.In addition, Mg easily separates out Mg at crystal boundary continuously when soldering
2Low melting components such as Si.At this moment, when coating soldering such as material, molten solder spreads in fin material, and partial melting takes place near crystal boundary and crystal boundary thus, thereby the erosion of solder to the crystal boundary of fin material easily takes place.
The content of Mg, by weight % meter, preferably 0.01%～scope less than 0.03%.
Content by making Mg 0.01%～scope less than 0.03%, the amount of separating out of the low melting component in the time of can reducing soldering significantly on the crystal boundary can improve solderability, and the anti-solder aggressiveness of fin material.
The present patent application people is a purpose to improve solderability (anti-solder aggressiveness), the optimum content of Mg in fin material diligently discussed, the result is clear and definite is set in 0.01% at the content with Mg～during less than 0.03% scope, and solderability (anti-solder aggressiveness) the highest (with reference to embodiment described later).
The Mg that contains in the fin material is 0.03% when above, the Mg-Si that separates out on the crystal boundary is that the amount and the size of low melting component increases significantly, when soldering, because the molten solder diffusion, thereby partial melting easily takes place, and solder might increase the erosion of fin material crystal boundary.
The Mg that contains in the fin material is less than 0.01% o'clock, because and to generate the Mg amount of compound between the Si few, and therefore the Si of free state amount increases on crystal boundary.Therefore, the thermal treatment during by soldering, the Si on the crystal boundary is that the amount of separating out of low melting component increases, because the diffusion of molten solder, thereby easily causes the partial melting of crystal boundary, solder might increase the erosion of fin material crystal boundary.
[Si]
Silicon (Si) and Mn coexistence and produce the fine precipitate of Al-Mn-Si system makes intensity after the fin material soldering, and the high temperature resistant buckling raising during the soldering heating.
The content of Si is by weight % meter, preferably greater than 0.6% and less than 1.2% scope.
Content by making Si is greater than 0.6% and less than 1.2% scope, the intensity after the fin material soldering, and the high temperature resistant buckling raising during the soldering heating.
The content of Si is 0.6% when following, though can reduce the amount of separating out of low melting component, adds intensity that Si brings and improves effect and diminish.
The content of Si is 1.2% when above, and the fusing point of fin material reduces, and fin material might melt when soldering.In addition, when Si contain quantitative change for a long time, be 0.01% at the content of Mg～situation of scope less than 0.03% under, when soldering, the amount of separating out of low melting point Si based compound increases on crystal boundary, solder might increase the erosion of fin material crystal boundary.
[Mn]
Manganese (Mn) improves the intensity of aluminium alloy, is precipitate (Al by generating Al-Mn simultaneously
6Mn) compound or between the fine metal of Al-Mn-Si system, the high temperature resistant buckling raising when making intensity after the soldering of fin material and soldering heating.
The content of Mn is by weight % meter, preferably greater than 1.5% and be less than or equal to 2.5% scope.
As above-mentioned, by the content that makes Mg be 0.01%～scope less than 0.03%, make Mn content for greater than 1.5% and be less than or equal to 2.5% scope, promoted to help to improve the generation of the Mn-Si based compound of fin material intensity, in addition, can reduce the Mg-Si system and the Si that become the factor that makes solderability and the reduction of anti-solder aggressiveness is the separate out amount of low melting component on crystal boundary.
The content of Mn is 1.5% when following, adds the effect that intensity that Mn brings improves and diminishes.In addition because and the Mn amount that generates compound between the Si reduce, the Si of free state increases, therefore, the amount of separating out of low-melting Si based compound increases on crystal boundary when soldering, solder might increase the erosion of fin material crystal boundary.
The content of Mn surpasses at 2.5% o'clock, intermetallic compound alligatoring when the casting fin material, the possibility that has the various characteristics of processibility and fin material to reduce.
[Cu]
Copper (Cu) makes the intensity after the soldering of fin material improve by solution strengthening.
The content of Cu is by weight % meter, preferably 0.01%～0.25% scope.
By the content that makes Cu is 0.01%～0.25% scope, can improve the intensity after the soldering of fin material.
The content of Cu was less than 0.01% o'clock, and the intensity that interpolation Cu brings improves effect and diminishes.
The content of Cu was above 0.25% o'clock, the current potential of fin material becomes noble potential (positive potential), between fin material and the pipe assembled (this pipe is for constituting the member of scatterer described later (heat exchanger)), can not get enough sacrificial anode oxidations (sacrificing Yang Very sclerosis), in addition, fin material might reduce from solidity to corrosion.
[Ni]
Nickel (Ni) makes intensity, the high temperature resistant buckling raising when reaching the soldering heating after the soldering.
The content of Ni is by weight % meter, preferably 0.01%～0.15% scope.
The content of Ni was less than 0.01% o'clock, and the intensity that interpolation Ni brings improves effect and diminishes.
The content of Ni surpasses at 0.15% o'clock, by with Cu coexistence, might the reducing of fin material from solidity to corrosion.
[about Mn, Ni, Cu]
By weight the % meter, with the content of Mn be limited to greater than 1.5% and be less than or equal to 2.5% this than higher addition, and the addition that makes Cu is 0.01%～0.25% occasion, Mn and Cu intensity separately improves effect and becomes big, therefore, even the content of Ni is 0.01%～0.15%, the intensity after the soldering also uprises.
On the other hand, as mentioned above, when the content of Ni surpasses 0.15%, by with Cu coexistence, might the reducing of fin material from solidity to corrosion.Therefore, in order under the composition range of each element of the fin material of the present embodiment, to guarantee, the content of Ni is decided to be 0.01%～0.15% scope from solidity to corrosion.
In addition, when the content of Ni is high because the Al-Mn-Ni series intermetallic compound increases, therefore and Si between generate the Mn of compound amount reduce, the Si of free state increases thus, the low melting point Si compound of separating out on the crystal boundary of fin material during soldering increases.Therefore, solder might become big to the erosion of the crystal boundary of radiator element.
In the fin material of the present embodiment, because by making it to improve the big Cu coexistence of effect, the content of Ni is suppressed at 0.01%～0.15% this lower ratio with intensity, therefore the amount of separating out of above-mentioned low melting component is suppressed lowly.
Promptly, be limited to above-mentioned scope by content with Mg and Mn, and the addition that makes intensity improve the high Cu of effect is 0.01%～0.25%, the addition of Ni is suppressed at 0.01%～0.15% this lower ratio, therefore suppressed on the crystal boundary of fin material, to separate out low melting component, solderability (anti-solder aggressiveness) is improved, by adding Mn, Cu, Ni, improve intensity and become possibility simultaneously.
[Fe]
Iron (Fe) on the other hand, easily generates thick intermetallic compound by the intensity of dispersion-strengthened raising fin material, this intermetallic compound becomes the nucleus of recrystallize, therefore the recrystal grain during soldering becomes fine, is vulnerable to the influence of solder erosive, and solderability might reduce.
Therefore, the content of Fe, by weight % meter, preferably 0.5% or below.
By the content that makes Fe be 0.5% or below, can improve intensity, solderability, anti-solder aggressiveness simultaneously.
When the content of Fe surpassed 0.5%, as mentioned above, solderability might reduce.
[Zn]
It is low potential (negative potential) that zinc (Zn) makes the current potential of fin material, gives and sacrificial anode effect (sacrificing Yang Very effect).
The content of Zn is by weight % meter, preferably greater than 1% and be less than or equal to 5% scope.
Be greater than 1% and be less than or equal to 5% scope by the content that makes Zn, between fin material and tubing, can obtain enough sacrificial anode effects.
The content of Zn is 1% when following, adds Zn and might can not get enough sacrificial anode effects.
The content of Zn surpasses at 5% o'clock, might the reducing from solidity to corrosion of fin material.
In addition, add In or Sn and also can obtain the sacrificial anode effect, but the addition of In or Sn is 0.1% or when above, may the reducing of fin material from solidity to corrosion.
[Zr、Cr、Ti、V]
High temperature resistant buckling when zirconium (Zr), chromium (Cr), titanium (Ti), vanadium (V) all improve intensity after the fin material soldering and soldering heating.
The content of Zr, Cr, Ti, V by weight the % meter, preferably is respectively 0.05%～0.3% scope.
The content of any element is 0.05%～0.3% among Zr, Cr, Ti, the V by making, as mentioned above, and the high temperature resistant buckling in the time of can improving intensity after the soldering and soldering heating.
The content of Zr, Cr, Ti, V was less than 0.05% o'clock, and the raising effect of the high temperature resistant buckling when intensity after the soldering and soldering heating diminishes.
The content of Zr, Cr, Ti, V surpasses at 0.3% o'clock, and the sorrow of processibility reduction is arranged.
As previously discussed, Zr, Cr, Ti, V are the elements that improves fin material intensity, add among them more than a kind or 2 kinds for well.
When making the fin material of the present embodiment, aluminum alloy melting, casting and the enforcement that for example will have the composition of above-mentioned OK range homogenize.Then, carry out hot rolling, cold rolling, process annealing and cold rolling and make fin material.
The heat exchanger aluminum alloy fin material of the present embodiment can also be that solder alloy uses with such composition-formed thereby coat Al-Si on the two sides of this core with this fin material as core.
Fig. 1 represent to use heat exchanger of the present invention with an example of aluminum alloy fin material, be the exploded perspective view of the scatterer (heat exchanger) 10 used of automobile.
In Fig. 1, symbol 1 is radiator element (fin material), and symbol 2 is pipes, and symbol 3 is to go up lower header, and symbol 4 is side supports.Scatterer shown in Figure 1, by having used the soldering of fluoridizing the system brazing flux, pipe 2, radiator element 1 and go up lower header 3 respectively by integrated, so by mechanical engagement (riveted joint is processed) thus resin container is installed to be produced.
Soldering thermal treatment is preferably carried out about 600 ℃ in nitrogen atmosphere, preferred about 3 minutes of hold-time, by the thermal treatment of this moment, in the alloy structure of fin material, generate various intermetallic compounds, and can improve the intensity of fin material.
As described above, according to heat exchanger aluminum alloy fin material of the present invention, by containing the element of above-mentioned composition, obtain the soldering fin material and solderability during the assembled heat interchanger improves and the intensity height, from the fin material of corrosion resistance excellent.
Therefore, the thin-walled property and the lightweight of fin material become possibility, and in addition, the reliability of fin material and heat exchanger improves.
Embodiment
The embodiment of heat exchanger of the present invention with aluminum alloy fin material below is described.
Become to be grouped under the condition in each shown in the hurdle of each embodiment described later and comparative example, make heat exchanger of the present invention aluminum alloy fin material, reach existing fin material (comparative example), carried out various evaluation tests.
Below production process, and each evaluation test project of explanation fin material.
[production process]
After use the has aluminium alloy cast ingot that the one-tenth shown in each embodiment described later and the comparative example is grouped into, thick 20mm * long 52mm * wide 125mm, 1/4 inch of each face cutting of each single face, under the temperature of defined, homogenize, carried out hot rolling.And then, be cold rolled to till the thickness of slab of defined, carry out process annealing, and cold rolling then, each one-tenth be grouped into all obtain thickness of slab 0.06mm, heat exchanger of the present invention is with aluminum alloy fin material, and existing fin material (comparative example).
About soldering thermal treatment, in nitrogen atmosphere after 600 ℃ temperature keeps 3 minutes, with-100 ℃/minute speed of cooling cool to room temperature (25 ℃).
[strength trial]
Use to adopt fin material of the present invention that above-mentioned production process obtains, and existing fin material, made the tension test sheet of wide 12.5mm * long 180mm.These test films as sample, are used the tensile testing machine AG-GI 10KN of Tianjin, island corporate system, divide with draw speed 2mm/ and carry out tension test, measured (the yield-point (endurance): MPa) of the tensile strength after the soldering thus.
Based on stretch test result, adopt following benchmark to judge (with ◎ zero △ * expression) about intensity evaluation.
(1) ◎: tensile strength surpasses 55MPa.
(2) zero: tensile strength is greater than 50MPa and be less than or equal to the scope of 55MPa.
(3) △: tensile strength is greater than 45MPa and be less than or equal to the scope of 50MPa.
(4) *: tensile strength is less than 45MPa.
[from corrosion resistant test]
Use to adopt fin material of the present invention that above-mentioned production process obtains, and existing fin material, making size is the square sample of 25mm * 120mm, has carried out SST (salt spray testing).As brine spray machine service-test machine corporate system: ISO-3-CYR, under based on the test conditions of spray amount JIS Z2371, carried out 48 hours test.
Measure corrosive wear after the above-mentioned test,, adopt following benchmark to judge (with ◎ zero △ * expression) about from the solidity to corrosion evaluation.
(1) ◎: corrosive wear are less than 25mg/dm
2
(2) zero: corrosive wear are 25mg/dm
2～less than 50mg/dm
2Scope.
(3) △: corrosive wear are 50mg/dm
2～less than 100mg/dm
2Scope.
(4) *: corrosive wear are 100mg/dm
2Or more than.
[solderability (anti-solder aggressiveness) test]
Make respectively to the fin material of the present invention that adopts above-mentioned production process to obtain, and existing fin material carried out the manufactured sample of ripple, be assembled in tubing (the brazing sheet: on solder face core 3003/ solder 4045 (coating 10%)) of thickness 0.3mm, after the coating brazing flux, in high-purity nitrogen atmosphere, carried out soldering.The temperature that soldering is handled at 600 ℃ keeps carrying out in 3 minutes.
After above-mentioned soldering is handled, use observation by light microscope core (fin material/pipe) cross section, carried out the evaluation of solderability.Evaluation is confirmed the result based on solder to the erosive of fin material crystal boundary, adopts following benchmark to judge.
(1) ◎: solder to the depth of erosion of fin material crystal boundary less than 10 μ m.
(2) zero: solder is 10 μ m～less than 20 μ m to the depth of erosion of fin material crystal boundary.
(3) △: solder is 20 μ m～less than 30 μ m to the depth of erosion of fin material crystal boundary.
(4) *: solder to the depth of erosion of fin material crystal boundary be 30 μ m or more than.
[mensuration of the dispersion state of compound between low melting point metal]
The fin material that each one-tenth that adopts above-mentioned production process to obtain is grouped into, and existing fin material as sample, use NEC corporate system scanning electron microscope: JSM-6360LA, the SEM that has carried out crystal boundary observes.A plurality of crystal grain in 1 in the sample as object, are resolved the number that reconnaissance has been decided the low melting component on the long crystal boundary of meter 10mm by particle.
As the compound of determination object, be decided to be particle diameter (circular diameter identical) and be the low melting component (Mg of 0.1-3 μ m with the particle shadow area
2Si or Si precipitate).
Table 1 gathers the result that each evaluation test is shown.
[table 1]
| Added ingredients | Intensity | Solidity to corrosion | Solderability | ||||||||||||
| Si | Mn | Ni | Cu | Mg | Fe | Zn | Zr | Yield-point | Estimate | Corrosive wear | Estimate | The solder depth of erosion | Estimate | Eutectic on the crystal boundary is revealed compound | |
| Embodiment 1 | 0.7 | 1.7 | 0.1 | 0.16 | 0.012 | 0.22 | 2.25 | 0.1 | 54Mpa | ○ | 14mg/dm 2 | ◎ | 4μm | ◎ | 2×10 2Individual |
| Embodiment 2 | 0.7 | 1.7 | 0.1 | 0.16 | 0.025 | 0.22 | 2.25 | 0.1 | 54Mpa | ○ | 15mg/dm 2 | ◎ | 5μm | ◎ | 2×10 2Individual |
| Embodiment 3 | 0.7 | 1.7 | 0.02 | 0.16 | 0.02 | 0.22 | 2.25 | 0.1 | 51Mpa | ○ | 6mg/dm 2 | ◎ | 3μm | ◎ | 2×10 2Individual |
| Embodiment 4 | 0.7 | 1.7 | 0.14 | 0.16 | 0.02 | 0.22 | 2.25 | 0.1 | 56Mpa | ◎ | 28mg/dm 2 | ○ | 8μm | ◎ | 3×10 2Individual |
| Embodiment 5 | 0.7 | 1.6 | 0.1 | 0.16 | 0.02 | 0.22 | 2.25 | 0.1 | 52Mpa | ○ | 13mg/dm 2 | ◎ | 8μm | ◎ | 3×10 2Individual |
| Embodiment 6 | 0.7 | 2.4 | 0.1 | 0.16 | 0.02 | 0.22 | 2.25 | 0.1 | 58Mpa | ◎ | 17mg/dm 2 | ◎ | 3μm | ◎ | 1×10 2Individual |
| Comparative example 1 | 0.7 | 1.7 | 0.1 | 0.16 | 0.006 | 0.22 | 2.25 | 0.1 | 54Mpa | ○ | 14mg/dm 2 | ◎ | 28μm | △ | 4×10 5Individual |
| Comparative example 2 | 0.7 | 1.7 | 0.1 | 0.16 | 0.033 | 0.22 | 2.25 | 0.1 | 54Mpa | ○ | 13mg/dm 2 | ◎ | 22μm | △ | 6×10 4Individual |
| Comparative example 3 | 0.7 | 1.7 | 0.005 | 0.16 | 0.02 | 0.22 | 2.25 | 0.1 | 49Mpa | △ | 5mg/dm 2 | ◎ | 3μm | ◎ | 2×10 2Individual |
| Comparative example 4 | 0.7 | 1.7 | 1.2 | 0.16 | 0.02 | 0.22 | 2.25 | 0.1 | 68Mpa | ◎ | 105mg/dm 2 | × | 23μm | △ | 5×10 4Individual |
| Comparative example 5 | 0.7 | 1.2 | 0.1 | 0.16 | 0.02 | 0.22 | 2.25 | 0.1 | 48Mpa | △ | 9mg/dm 2 | ◎ | 22μm | △ | 2×10 5Individual |
| Comparative example 6 | 0.7 | 2.7 | 0.1 | 0.16 | 0.02 | 0.22 | 2.25 | 0.1 | Because of difficulty processing,, can not make so the surface produces a large amount of crackles when making material | ||||||
[embodiment 1]
Made % meter by weight, contain Si:0.7%, Mn:1.7%, Ni:0.1%, Cu:0.16%, Mg:0.012%, Fe:0.22%, Zn:2.25%, Zr:0.1%, and contain the Al of surplus and the fin material of the present invention of unavoidable impurities.
The result of strength trial, yield-point are 59MPa, and evaluation is ◎.
From the result of corrosion resistant test, corrosive wear are 14mg/dm
2, evaluation is ◎.
The result of solderability (anti-solder aggressiveness) test, the depth of erosion of solder is 4 μ m, evaluation is ◎.
In addition, the number of the low melting component on the crystal boundary is 2 * 10
2Individual.
[embodiment 2]
Made % meter by weight, contain Si:0.7%, Mn:1.7%, Ni:0.1%, Cu:0.16%, Mg:0.025%, Fe:0.22%, Zn:2.25%, Zr:0.1%, and contain the Al of surplus and the fin material of the present invention of unavoidable impurities.
The result of strength trial, yield-point are 59MPa, and evaluation is ◎.
From the result of corrosion resistant test, corrosive wear are 15mg/dm
2, evaluation is ◎.
The result of solderability (anti-solder aggressiveness) test, the depth of erosion of solder is 5 μ m, evaluation is ◎.
In addition, the number of the low melting component on the crystal boundary is 2 * 10
2Individual.
[embodiment 3]
Made % meter by weight, contain Si:0.7%, Mn:1.7%, Ni:0.02%, Cu:0.16%, Mg:0.02%, Fe:0.22%, Zn:2.25%, Zr:0.1%, and contain the Al of surplus and the fin material of the present invention of unavoidable impurities.
The result of strength trial, yield-point are 51MPa, and evaluation is zero.
From the result of corrosion resistant test, corrosive wear are 6mg/dm
2, evaluation is ◎.
The result of solderability (anti-solder aggressiveness) test, the depth of erosion of solder is 3 μ m, evaluation is ◎.
In addition, the number of the low melting component on the crystal boundary is 2 * 10
2Individual.
[embodiment 4]
Made % meter by weight, contain Si:0.7%, Mn:1.7%, Ni:0.14%, Cu:0.16%, Mg:0.02%, Fe:0.22%, Zn:2.25%, Zr:0.1%, and contain the Al of surplus and the fin material of the present invention of unavoidable impurities.
The result of strength trial, yield-point are 56MPa, and evaluation is ◎.
From the result of corrosion resistant test, corrosive wear are 28mg/dm
2, evaluation is zero.
The result of solderability (anti-solder aggressiveness) test, the depth of erosion of solder is 8 μ m, evaluation is ◎.
In addition, the number of the low melting component on the crystal boundary is 3 * 10
2Individual.
[embodiment 5]
Made % meter by weight, contain Si:0.7%, Mn:1.6%, Ni:0.5%, Cu:0.16%, Mg:0.02%, Fe:0.22%, Zn:2.25%, Zr:0.1%, and contain the Al of surplus and the fin material of the present invention of unavoidable impurities.
The result of strength trial, yield-point are 52MPa, and evaluation is zero.
From the result of corrosion resistant test, corrosive wear are 13mg/dm
2, evaluation is ◎.
The result of solderability (anti-solder aggressiveness) test, the depth of erosion of solder is 8 μ m, evaluation is ◎.
In addition, the number of the low melting component on the crystal boundary is 3 * 10
2Individual.
[embodiment 6]
Made % meter by weight, contain Si:0.7%, Mn:2.4%, Ni:0.5%, Cu:0.16%, Mg:0.02%, Fe:0.22%, Zn:2.25%, Zr:0.1%, and contain the Al of surplus and the fin material of the present invention of unavoidable impurities.
The result of strength trial, yield-point are 58MPa, and evaluation is ◎.
From the result of corrosion resistant test, corrosive wear are 17mg/dm
2, evaluation is ◎.
The result of solderability (anti-solder aggressiveness) test, the depth of erosion of solder is 3 μ m, evaluation is ◎.
In addition, the number of the low melting component on the crystal boundary is 1 * 10
2Individual.
[comparative example 1]
Made % meter by weight, contain Si:0.7%, Mn:1.7%, Ni:0.1%, Cu:0.16%, Mg:0.006%, Fe:0.22%, Zn:2.25%, Zr:0.1%, and contain the Al of surplus and the existing fin material of unavoidable impurities.
The result of strength trial, yield-point are 59MPa, and evaluation is ◎.
From the result of corrosion resistant test, corrosive wear are 14mg/dm
2, evaluation is ◎.
The result of solderability (anti-solder aggressiveness) test, the depth of erosion of solder is 28 μ m, evaluation is △.
In addition, the number of the low melting component on the crystal boundary is 4 * 10
5Individual.
[comparative example 2]
Made % meter by weight, contain Si:0.7%, Mn:1.7%, Ni:0.1%, Cu:0.16%, Mg:0.033%, Fe:0.22%, Zn:2.25%, Zr:0.1%, and contain the Al of surplus and the existing fin material of unavoidable impurities.
The result of strength trial, yield-point are 59MPa, and evaluation is ◎.
From the result of corrosion resistant test, corrosive wear are 14mg/dm
2, evaluation is ◎.
The result of solderability (anti-solder aggressiveness) test, the depth of erosion of solder is 22 μ m, evaluation is △.
In addition, the number of the low melting component on the crystal boundary is 6 * 10
4Individual.
[comparative example 3]
Made % meter by weight, contain Si:0.7%, Mn:1.7%, Ni:0.005%, Cu:0.16%, Mg:0.02%, Fe:0.22%, Zn:2.25%, Zr:0.1%, and contain the Al of surplus and the existing fin material of unavoidable impurities.
The result of strength trial, yield-point are 49MPa, and evaluation is △.
From the result of corrosion resistant test, corrosive wear are 5mg/dm
2, evaluation is ◎.
The result of solderability (anti-solder aggressiveness) test, the depth of erosion of solder is 3 μ m, evaluation is ◎.
In addition, the number of the low melting component on the crystal boundary is 2 * 10
2Individual.
[comparative example 4]
Made % meter by weight, contain Si:0.7%, Mn:1.7%, Ni:1.2%, Cu:0.16%, Mg:0.02%, Fe:0.22%, Zn:2.25%, Zr:0.1%, and contain the Al of surplus and the existing fin material of unavoidable impurities.
The result of strength trial, yield-point are 68MPa, and evaluation is ◎.
From the result of corrosion resistant test, corrosive wear are 105mg/dm
2, evaluation is *.
The result of solderability (anti-solder aggressiveness) test, the depth of erosion of solder is 23 μ m, evaluation is △.
In addition, the number of the low melting component on the crystal boundary is 5 * 10
4Individual.
[comparative example 5]
Made % meter by weight, contain Si:0.7%, Mn:1.2%, Ni:0.5%, Cu:0.16%, Mg:0.02%, Fe:0.22%, Zn:2.25%, Zr:0.1%, and contain the Al of surplus and the existing fin material of unavoidable impurities.
The result of strength trial, yield-point are 48MPa, and evaluation is △.
From the result of corrosion resistant test, corrosive wear are 9mg/dm
2, evaluation is ◎.
The result of solderability (anti-solder aggressiveness) test, the depth of erosion of solder is 22 μ m, evaluation is △.
In addition, the number of the low melting component on the crystal boundary is 2 * 10
5Individual.
[comparative example 6]
Made % meter by weight, contain Si:0.7%, Mn:2.7%, Ni:0.5%, Cu:0.16%, Mg:0.02%, Fe:0.22%, Zn:2.25%, Zr:0.1%, and contain the Al of surplus and the existing fin material of unavoidable impurities., when making test sample, because difficult processing, therefore crackle takes place in the surface, can not carry out the evaluation test of use-testing sample.
Following table 2 illustrates the supplementary test result.Identical with the situation that is equipped with example shown in the table 1 about each routine manufacture method with test method.In embodiment 7,8,9, be that 0.8%, 1.0%, 1.1% sample is tested to the content of Si, but can both obtain excellent result.
About comparative example 7, Si is 0.6% sample, has intensity to reduce the tendency of some, and about comparative example 8, Si is 1.2% sample, and solderability reduces.
[table 2]
| Added ingredients | Intensity | Solidity to corrosion | Solderability | ||||||||||||
| Si | Mn | Ni | Cu | Mg | Fe | Zn | Zr | Yield-point | Estimate | Corrosive wear | Estimate | The solder depth of erosion | Estimate | Eutectic on the crystal boundary is revealed compound | |
| Embodiment 7 | 0.6 | 1.7 | 0.1 | 0.16 | 0.012 | 0.22 | 2.25 | 0.1 | 55Mpa | ◎ | 14mg/dm 2 | ◎ | 5μm | ◎ | 2×10 2Individual |
| Embodiment 8 | 1.0 | 1.7 | 0.1 | 0.16 | 0.025 | 0.22 | 2.25 | 0.1 | 56Mpa | ◎ | 15mg/dm 2 | ◎ | 13μm | ○ | 6×10 2Individual |
| Embodiment 9 | 1.1 | 1.7 | 0.02 | 0.16 | 0.02 | 0.22 | 2.25 | 0.1 | 53Mpa | ○ | 9mg/dm 2 | ◎ | 9μm | ◎ | 4×10 2Individual |
| Comparative example 7 | 0.6 | 1.7 | 0.1 | 0.16 | 0.02 | 0.22 | 2.25 | 0.1 | 49Mpa | △ | 12mg/dm 2 | ◎ | 3μm | ◎ | 1×10 2Individual |
| Comparative example 8 | 1.2 | 1.7 | 0.1 | 0.16 | 0.02 | 0.22 | 2.25 | 0.1 | 58Mpa | ◎ | 18mg/dm 2 | ◎ | 21μm | △ | 6×10 4Individual |
As can be known clear and definite by The above results: as to be the meter of % by weight by making the heat exchanger aluminum alloy fin material, contain Si: greater than 0.6% and less than 1.2%, Mn: greater than 1.5% and be less than or equal to 2.5%, Ni:0.01%～0.15%, Cu:0.01%～0.25%, Mg:0.01%～less than 0.03%, below the Fe:0.5%, Zn: greater than 1%～5%, and contain the Al of surplus and unavoidable impurities become to be grouped into, just obtain strength characteristics, solderability, and from all excellent fin material of solidity to corrosion.
Claims (4)
1. heat exchanger aluminum alloy fin material, it is characterized in that, % counts by weight, contain Si: greater than 0.6% and less than 1.2%, Mn: greater than 1.5% and be less than or equal to 2.5%, Ni0.01%～0.15%, Cu:0.01%～0.25%, Mg:0.01%～less than 0.03%, Fe:0.5% or following, Zn: greater than 1% and be less than or equal to 5%, and contain the Al and the unavoidable impurities of surplus.
2. heat exchanger aluminum alloy fin material according to claim 1, it is characterized in that, above-mentioned heat exchanger with aluminum alloy fin material also further contain be selected from Zr:0.0 5%～0.3%, Cr:0.05%～0.3%, Ti:0.0 5%～0.3%, V:0.05%～0.3% more than at least a kind or a kind.
3. a heat exchanger aluminum alloy fin material is characterized in that, is to use aluminum alloy fin material as core claim 1 or 2 described heat exchangers, and coating Al-Si on the two sides of this core is that solder alloy constitutes.
4. a heat exchanger is characterized in that, has any described heat exchanger aluminum alloy fin material among the claim 1-3.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005066187A JP2006250413A (en) | 2005-03-09 | 2005-03-09 | Aluminum alloy fin material for heat exchanger and heat exchanger |
| JP2005066187 | 2005-03-09 |
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Also Published As
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| JP2006250413A (en) | 2006-09-21 |
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