CN1743963B - Method for developing processing - Google Patents
Method for developing processing Download PDFInfo
- Publication number
- CN1743963B CN1743963B CN 200510099555 CN200510099555A CN1743963B CN 1743963 B CN1743963 B CN 1743963B CN 200510099555 CN200510099555 CN 200510099555 CN 200510099555 A CN200510099555 A CN 200510099555A CN 1743963 B CN1743963 B CN 1743963B
- Authority
- CN
- China
- Prior art keywords
- developer solution
- wafer
- liquid
- developing
- pure water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The invention provides a developing processing method of a resist film processed the exposure treatment on a substrate, which is characterized in that: the method comprises following steps: coating the developing solution on the substrate; laying the substrate of the developing liquid for a certain time for developing; coating the solution on the substrate which is coated with the developing solution, in which the solution is selected from TMAH solution with a mixing rate of 0.1-1.5% with the pure water, diluted developing liquid, pure water, aqueous solution with pH value 9-12 or hydrophilic organic solution with pH value 9-12 when added with an interfacial agent in the pure water; laying the substrate coated with the liquid for a prescribed time to reduce the dissolution product concentration generated by the developing solution; rinsing the substrate coated with the liquid. The invention also provides a developing liquid coating device.
Description
The application is that number of patent application is 02143756.4, the applying date is on August 28th, 2002 and denomination of invention dividing an application for the Chinese patent application of " developing method and developing liquid coating device ".
Technical field
The substrate of the semiconductor wafer that the present invention relates to exposure-processed etc. is implemented the developing method and the developing liquid coating device of development treatment.
Background technology
In the manufacture process of semiconductor devices, use so-called photoetching technique, on the surface of semiconductor wafer, form the circuitous pattern of regulation.In this photo-mask process, for example carry out being coated with photographic emulsion cleaning on the semiconductor wafer of handling, form resist film, with the compulsory figure resist film that exposes, it is carried out a succession of processing of development treatment.
In this development treatment operation, keep the semiconductor wafer of initial exposure processing by the anchor clamps that rotate freely.Then, on the surface of the semiconductor wafer that keeps stationary state, be coated with developer solution, form the hole of developer solution, place the stipulated time and carry out developing reaction.Then, the limit provides the rinsing liquid limit rotation semiconductor wafer of pure water etc. to come the rinsing process semiconductor wafers to semiconductor wafer, stops at last supplying with rinsing liquid, high speed rotating semiconductor wafer, Rotary drying semiconductor wafer to semiconductor wafer.The developer solution that uses this moment almost all uses has fixed concentration to anticorrosive additive material, as the TMAH solution of 2.38wt%.
But strictness is said, is different to the suitable solution level of each anticorrosive additive material.Solution level and reaction time one suitable in the process that developing reaction is carried out change.In the past, even a plurality of anticorrosive additive materials are used certain density developer solution, also can obtain the form accuracy of necessary circuit figure, but in recent years, reactive high anticorrosive additive material, resist film to developer solution forms thinlyyer owing to using, the light short wavelengthization of the usefulness of exposing exposure figure towards reasons such as the development that becomes more meticulous, in the developing method of the developer solution of the concentration that use originally is certain, be difficult to form good circuitous pattern.
In the original developing method that carries out under making the semiconductor wafer stationary state, the part that has is owing to the dissolving product of the developing reaction generation of resist film dissolving is detained to get off because of concentration is high.Therefore, the development treatment later stage, the dissolving product that is detained because of this high concentration and the equilibrium state collapse of developer solution, the dissolving product is diffused into the developer solution side.The thing followed is because developer solution moves, and may cause part CD (critical dimension) in the wafer face, i.e. the line width of figure change.After the development treatment, begin to supply with rinsing liquid, rotate wafer simultaneously and remove the hole of developer solution and dissolving during product, when the dissolving product of high concentration spreads owing to centrifugal force, remaining trace in the surface of wafer, this vestige reduction quality.
Like this, though the dissolving product of resist exerted an influence to CD in the later stage of developing, because aperture opening ratio makes the generation difference of dissolving product, whether no matter be identical figure, it is different that the aperture opening ratio of mask causes the CD in the wafer face to distribute.In 1 range, the CD of its central portion and peripheral part is also different.Like this, with original developing method, always do not reach the homogeneity of CD in the substrate surface.For solving such problem, originally adopt countermeasures such as under the development treatment condition of regulation, proofreading and correct mask patterns to deal with, but the strength that need cost a lot of money when determining this condition, this is a problem.
After developing reaction finished, when semiconductor wafer provided pure water, the pH of the developer solution on the semiconductor wafer sharply reduced, and dissolved therefore that the product solid is separated out and attached on the development figure, produce defective sometimes.
Summary of the invention
First purpose of the present invention provides the suitable developing method of corresponding anticorrosive additive material to the characteristic of developer solution.Second purpose of the present invention provides and improves the inhomogeneity developing method of CD.The 3rd purpose of the present invention provides the developing method that the solid that dissolves product when suppressing development treatment is separated out the defective generation that causes.The 4th purpose of the present invention provides the developing liquid coating device that uses in this developing method.
According to the present invention, carrying out on a kind of substrate the is provided developing method of resist film of exposure-processed is characterized in that this developing method comprises following operation: be coated with developer solution on described substrate; The described substrate that is coated with described developer solution is placed the stipulated time to carry out developing reaction; Again to the described substrate coating liquid that is coated with described developer solution, described liquid is selected from developer solution, pure water that mixing ratio with pure water is 0.1% to 1.5% TMAH solution, dilution, added interfacial agent so that the pH value is 9 to 12 aqueous solution or pH value is a kind of in 9 to 12 the hydrophilic organic solvent in pure water; The described substrate that is coated with described liquid is placed the stipulated time, reduce the concentration of the dissolving product of described developer solution generation by described liquid; The described substrate that is coated with described liquid is carried out rinsing to be handled.
, can use the nozzle that is the described liquid of banded ejection to the operation that described liquid is coated on the described substrate here, wherein be the described liquid of banded ejection from described nozzle on one side, on described substrate Yi Bian described nozzle is scanned.In addition, be the time that developing reaction proceeds to described resist film bottom the standing time that is coated with the described substrate of described developer solution.In addition, the operation that described developer solution is coated on the described substrate is used the nozzle that is the described developer solution of banded ejection, wherein be the described developer solution of banded ejection from described nozzle on one side, on described substrate Yi Bian described nozzle is scanned.Described developer solution and described liquid are to carry out under the static situation of described substrate to the treatment process of described substrate, and the rinsing process of described substrate is to carry out under the situation that makes described substrate rotation.
The present invention also provides a kind of enforcement on the substrate developing liquid coating device of resist film coating developer solution of exposure-processed, it is characterized in that this developing liquid coating device comprises: have long in one direction shape, vertically be the developer solution nozzle of banded ejection developer solution along it; Send first carrying device of the developer solution of normal concentration to described developer solution nozzle; Send second carrying device of pure water or the developer solution different with the solution level of sending here from described first carrying device to described developer solution nozzle; Described developer solution nozzle has: first liquid reservoir compartment of storing the developer solution of sending here from described first carrying device; Pure water that storage is sent here from described second carrying device or second liquid reservoir compartment of developer solution; Liquid mixing chamber, this liquid mixing chamber have the developer solution ejiction opening of ejection developer solution or pure water and are communicated with described first liquid reservoir compartment and described second liquid reservoir compartment in the lower end; First path that is communicated with described first liquid reservoir compartment and described liquid mixing chamber; The alternate path that is communicated with described second liquid reservoir compartment and described liquid mixing chamber; Wherein, spray described developer solution or pure water or the different developer solution of described concentration from described developer solution ejiction opening respectively, in described liquid mixing chamber, mix pure water or the different developer solution of concentration stored in the developer solution stored in described first liquid reservoir compartment and described second liquid reservoir compartment and come the developer solution of modulation specifications concentration, from described developer solution ejiction opening ejection.
In addition, the developing liquid coating device of resist film coating developer solution of exposure-processed that the invention provides a kind of enforcement on substrate, it is characterized in that this developing liquid coating device comprises: have in one direction long shape, vertically be the developer solution nozzle of banded ejection developer solution along it; Send the developer solution carrying device of the developer solution of normal concentration to described developer solution nozzle; Send a plurality of carrying devices of multiple liquid respectively to described developer solution nozzle; Described developer solution nozzle has: the developer solution storeroom of storing the developer solution of sending here from described developer solution carrying device; Store a plurality of liquid reservoir compartment of the multiple liquid of sending here from described a plurality of carrying devices respectively; Liquid mixing chamber, this liquid mixing chamber have the liquid spraying outlet of ejection developer solution or described multiple liquid in the lower end, and are communicated with described developer solution storeroom and described a plurality of liquid reservoir compartment; First path that is communicated with described developer solution storeroom and described liquid mixing chamber; The alternate path that is communicated with described a plurality of liquid reservoir compartment and described liquid mixing chamber respectively; Wherein, spray described developer solution or described multiple liquid from described liquid spraying outlet respectively, to spray from described liquid spraying outlet by the liquid that in described liquid mixing chamber, mixes the normal concentration that at least two kinds of liquid selecting modulate from described multiple liquid, and as described multiple liquid, use developer solution, pure water, to pure water, added interfacial agent so that the pH value is 9 to 12 aqueous solution or pH value is the two or more liquid of selecting in 9 to 12 the hydrophilic organic solvent from dilution.
According to above-mentioned developing liquid coating device, adjust the concentration of developer solution easily, owing to do not need corresponding solution level to dispose a plurality of nozzles, can make apparatus structure simple.
Developing method of the present invention is implemented development treatment to the resist film of having implemented the exposure-processed on the substrate, and the characteristic of corresponding above-mentioned resist film is adjusted the concentration of developer solution and carried out development treatment.
In above-mentioned developing method, can use the developer solution of suitable concentration to carry out development treatment to the characteristic of developer solution by corresponding resist film, owing to wait meticulous control development treatment operation by the developer solution that uses a plurality of concentration in the development treatment operation, thereby can obtain the good circuitous pattern of form accuracy.
In substrate developing method according to the present invention, form resist film on this substrate and carry out exposure-processed, this method comprises: coating first developer solution on substrate; The substrate that is coated with first developer solution is placed the stipulated time carry out developing reaction; Be coated with second developer solution to the substrate that is coated with first developer solution again; Place the stipulated time by the substrate that will be coated with second developer solution, reduce the concentration of the dissolving product that the developing reaction of first developer solution generates by second developer solution; The substrate that scribbles second developer solution is carried out rinsing to be handled.
In above-mentioned developing method, by reducing the concentration of dissolving product, place the development vestige and produce, improve quality, can improve the CD homogeneity in the substrate surface.Especially, as liquid in developer solution coating back coating, preferably use the liquid that does not sharply change the pH of the developer solution that is coated with on the substrate, thus, can suppress to separate out the defective generation that is caused because the pH of the developer solution that is coated with on the substrate sharply changes the solid of the dissolving product that causes.
Description of drawings
Fig. 1 is the schematic plan view of an embodiment of expression resist-coating developing system;
Fig. 2 is the concise and to the point front elevation of resist-coating developing system;
Fig. 3 is the concise and to the point rear view of resist-coating developing system;
Fig. 4 is the fragmentary cross sectional view of an embodiment of the development treatment unit (DEV) equipped on the expression resist-coating developing system;
Fig. 5 is the schematic plan view of development treatment unit (DEV);
Fig. 6 is the fragmentary cross sectional view that an embodiment of the developer solution nozzle of equipping is gone up in expression development treatment unit (DEV);
Fig. 7 is the key diagram of expression to the brief configuration of the developer solution supply unit of development treatment unit (DEV) supply developer solution;
Fig. 8 is the process flow diagram that the developing method that normal concentration uses is adjusted to developer solution in expression;
Fig. 9 is the process flow diagram of expression formation to the developing method of the wafer of the fast resist film of the dissolution velocity of developer solution;
Figure 10 is the curve of the volume difference of the line width in the wafer face of expression when carrying out development treatment by the different developer solution of concentration;
Figure 11 is the process flow diagram of expression formation to the developing method of the wafer of the slow resist film of the dissolution velocity of developer solution;
Figure 12 is the process flow diagram of expression formation for the developing method of the wafer of the little resist film of the dissolubility difference of exposed portion and unexposed portion developer solution;
Figure 13 is that expression form to absorb the moisture in the developer solution and easily causes the process flow diagram of developing method of the wafer of swelling resist film;
Figure 14 is that expression is because the line width that the resist film swelling causes changes and the curve of the relation of solution level;
Figure 15 is the CD homogeneity (3 σ) of expression when using the different mask of aperture opening ratio the to carry out exposure-processed curve of the variation of development time relatively;
Figure 16 is the key diagram of distribution of the CD value of expression dark areas;
Figure 17 is the key diagram of distribution of the CD value of expression bright area;
Figure 18 is the process flow diagram of developing method of the concentration of the local dissolving product that reduces high concentration of expression;
Figure 19 A～19E is the key diagram of the developing process of modal representation developing method shown in Figure 180;
The key diagram of the CD value distribution of the wafer that the development treatment that Figure 20 is expression developer solution coating back by the coating pure water obtains;
The key diagram of the CD value distribution of Figure 21 wafer that to be expression developer solution coating back obtain by the development treatment that is coated with developer solution again;
Figure 22 is the fragmentary cross sectional view of another embodiment of expression developer solution nozzle;
Figure 23 is the fragmentary cross sectional view of an embodiment again of expression developer solution nozzle.
Embodiment
Describe embodiments of the invention in detail below with reference to accompanying drawing.Here, illustrate use to link up and carry out from the developing method of resist to the resist-coating developing system that is applied to development treatment of semiconductor wafer (wafer).
Fig. 1 is the schematic plan view of expression resist-coating developing system, and Fig. 2 is its front elevation, and Fig. 3 is its rear view.This resist-coating developing system 1 have as transport box 10 of platform, have that the treatment bench 11 of a plurality of processing units and adjacent treatment bench 11 be provided with and unshowned exposure device between the interface portion 12 of handing-over wafer W.
As shown in Figure 1, in box 10, directions X on case mounting table 20 in the figure forms a plurality of (among the figure being 4) determining positions projection 20a, but mounting 1 row wafer case CR on the position of this projection 20a, and the wafer gateway separately of wafer case CR is towards treatment bench 11 sides.Among the wafer case CR, go up the arrangement wafer W in vertical direction (Z direction).Has the wafer carrying structure 21 between case mounting table 20 and treatment bench 11 for box 10.
On the other hand, treatment bench 11 has enforcement wafer W is coated with a plurality of processing units of a succession of operation when developing, and these unit are multistage configuration on assigned position, handles wafer W by their 11 ground.As shown in Figure 1, this treatment bench 11 has wafer at central part and transports path 22a, and master wafer conveyer 22 wherein is set, and wafer disposes whole processing units around transporting path 22a.These a plurality of processing units are divided into a plurality of handling parts, and each handling part is along vertical direction (a plurality of processing units of the multistage configuration of Z direction O.
As shown in Figure 3, master wafer conveyer 22 can be gone up the wafer conveyer 46 of free lifting at above-below direction (Z direction) at tubular support 49 inboard equipments.Tubular support 49 can be followed this rotation by the rotary driving force rotation of unshowned motor, also one rotation of wafer conveyer 46.Wafer conveyer 46 has the many holding members 48 that can move freely on the fore-and-aft direction that transports base station 47, by the handing-over between these holding members 48 realization wafer W each processing units.
As shown in Figure 1, among this embodiment, actual have 4 handling part G1, and G2, G3, G4 are configured in wafer and transport around the 22a of path, configurable as required the 5th handling part G5.In these, the first and second handling part G1, G2 are configured in the face side (the place ahead of Fig. 1) of resist-coating developing system 1 side by side, adjacent box 10 configuration of the 3rd handling part G3, adjacent oral area 12 configurations of the 4th handling part G4.In the configurable portion in the back of the 5th handling part G5.
Among the first handling part G1, will as the developing cell (DEV) of the figure that wafer W is contained in the resist-coating unit (COT) of 2 rotary-type processing units that the enterprising professional etiquette of unshowned rolling clamp handles surely and development resist with paint cup (CP) by the order that begins from below divide 2 grades overlapping.Among the second handling part G2, same, divide 2 grades of overlapping resist-coating unit (COT) and developing cells (DEV) by the order that begins from below as 2 rotary-type processing units.
Among the 3rd handling part G3, as shown in Figure 3, multistage overlapping wafer W is positioned in the type of furnace processing unit that carries out predetermined process on the mounting table SP.That is, divide 8 grades of overlapping adhesion process unit (AD) that improve fixed so-called hydrophobic treatments of resist, carry out aligned units (ALIM) that the position cooperates, carry out extension apparatus (EXT), the cooling unit (COL) that carries out cooling processing, before exposure-processed and after the exposure-processed and 4 the heating plate unit (HP) that after the development treatment wafer W carried out heat treated that transporting of wafer W transports by the order that begins from below.Alternative aligned units (ALIM) and cooling unit (COL) is set makes cooling unit (COL) have alignment function.
Among the 4th handling part G4, multistage overlapping type of furnace processing unit.That is, the wafer that divides 8 grades of overlapping cooling units (COL), conduct to have coldplate by the order that begins from below is transported extension cooling unit (EXTCOL), extension apparatus (EXT), cooling unit (COL) and 4 heating plate unit (HP) of the portion of transporting.
The rear portion side of master wafer conveyer 22 is provided with under the situation of the 5th handling part G5, and the 5th handling part G5 looks from master wafer conveyer 22 and moves to the side along guide rail 25.Therefore, be provided with under the situation of the 5th handling part G5,, keep industry thereby from behind master wafer conveyer 22 is carried out easily by making its slip can guarantee spatial portion along guide rail 25.
Wafer transports can be in the rotation of θ direction with arm 24a, but also the access unshowned wafer that belongs to the extension apparatus (EXT) of the 4th handling part G4 of treatment bench 11 and adjacent exposure device side joins platform.
In the above-mentioned resist-coating developing system 1, at first, in box 10, the wafer of wafer carrying structure 21 transports with the wafer case CR of untreated wafer W on the arm 21a access storage case mounting table 20 and takes out 1 wafer W, is transported to the extension platform (EXT) of the 3rd handling part G3.
The wafer conveyer 46 of wafer W by master wafer conveyer 22 is after extend platform (EXT) and be transported to the aligned units (ALIM) of the 3rd handling part G3 and aim at, be transported to adhesion process unit (AD), implement to improve fixed hydrophobic treatments (HMDS processing) of resist there.Because heating is followed in this processing, so after, wafer W is transported to cooling unit (COL) by wafer conveyer 46 and cools off.
According to the kind of the resist that uses, can not carry out this HMDA sometimes and handle, and directly wafer is transported to resist-coating unit (COT), for example, can enumerate and use polyimide is the situation of resist.
The processing of adhesion process unit (AD) finishes and then is transported to resist-coating unit (COT) by wafer conveyer 46 by the wafer W of cooling unit (COL) cooling or the wafer W of not carrying out the processing of adhesion process unit (AD), painting erosion resistant agent there, formation is filmed.After the coating processing finished, wafer W was done prebake and is handled at the 3rd or the 4th handling part G3 in the heating plate unit (HP) of one of G4, cooled off by arbitrary cooling unit (COL) afterwards.
The wafer W of cooling is transported to the aligned units (ALIM) of the 3rd handling part G3, after aiming at there, is transported to interface portion 12 through the extension apparatus (EXT) of the 4th handling part G4.
Wafer W interface portion 12 carry out outside exposure by outside exposure device 23 and remove more than resist after, be transported to the unshowned exposure device with interface portion 12 adjacent settings, figure is implemented exposure-processed to the resist film of wafer W according to the rules there.
Wafer W after the exposure is returned interface portion 12 once more, is transported to the extension apparatus (EXT) that belongs to the 4th handling part G4 by wafer carrying structure 24.And wafer W is transported to a certain heating plate unit (HP) by wafer conveyer 46, implements the post-exposure oven dry and handles, and is then cooled off by cooling unit (COL).
Afterwards, wafer W is transported to developing cell (DEV), carries out the development of exposure figure there.Develop after the end, wafer W is transported to dry after a certain heating plate unit (HP) is implemented and handles, and is then cooled off by cooling unit (COL).After this a succession of processing finishes, return box 10, be contained among a certain wafer case CR through the extension apparatus (EXT) of the 3rd handling part G3.
Then describe above-mentioned development treatment unit (DEV) in detail.Fig. 4 is the fragmentary cross sectional view of the formation of expression development treatment unit (DEV), and Fig. 5 is its schematic plan view.The paint cup (CP) of the central portion configuration ring-type of development treatment unit (DEV) is at the inboard configuration of paint cup (CP) rolling clamp 52.Rolling clamp 52 under the fixing state that keeps is being driven wafer W by vacuum suction by CD-ROM drive motor 54 rotations.CD-ROM drive motor 54 liftables are configured in the opening part of unit base plate 50 movably, combine with for example lifting drive 60 and the lifting guiding device 62 of air cylinder formation through the vibrating part 58 of for example gap-like of aluminium formation.The for example tubular cooling jacket 64 of stainless steel (SUS) formation is installed in CD-ROM drive motor 54 sides, and vibrating part 58 is installed as the first half that is covered with cooling jacket 64.
During the developer solution coating, fit with unit base plate 50 near the opening periphery of unit base plate 50 in vibrating part 58 lower ends, thus sealing unit inside.Handing-over is during wafer W between rolling clamp 52 and the master wafer conveyer 22, and lifting drive 60 rises to the top with CD-ROM drive motor 54 or rolling clamp 52 makes vibrating part 58 lower ends float from unit base plate 50.Form the window 70 that holding member 48 inserts usefulness in the shell of development treatment unit (DEV).
It is microscler to provide the developer solution nozzle 86 of developer solution to make to the surface of wafer W, and it is (directions X) horizontal arrangement vertically.Send developer solution and pure water from developer solution supply unit 79a and pure water supply unit 79b respectively to developer solution nozzle 86.Fig. 6 is the fragmentary cross sectional view of developer solution nozzle 86.Developer solution nozzle 86 has can store the developer solution storeroom 87a that extends at directions X of developer solution and 2 communication path 89a that are communicated with developer solution storeroom 87a, and one of each communication path 89a brings in to spraying the seam type ejiction opening 88a of developer solution.The pure water storeroom 87b and the developer solution storeroom 87a that can store pure water are formed between the communication path 89a independently, and an end that is communicated with the communication path 89b of pure water storeroom 87b is the seam type ejiction opening 88b of ejection pure water.
Provide the developer solution of regulation from developer solution supply unit 79a to developer solution storeroom 87a, the developer solution of supplying with developer solution storeroom 87a like this is by the seam type ejiction opening 88a ejection of communication path 89a from each communication path 89a one end.Near configuration fender pile 85a (for example quartz pushrod or porous rod) the seam type ejiction opening 88a of communication path 89a, by this fender pile 85a, from the ejection pressure of the developer solution of seam type ejiction opening 88a ejection developer solution nozzle 86 vertically on evenly, and prevent that developer solution from leaking from seam type ejiction opening 88a.Have and the fender pile 85b of sort buffer rod 85a identical function also is arranged near the seam type ejiction opening 88b of communication path 89b.
Spray under the situation of a certain amount of developer solution to wafer W within a certain period of time, only a place is provided with under the situation of seam type ejiction opening in 1 developer solution nozzle, because developer solution ejection pressure increases, coating developer solution and when forming the hole of developer solution developer solution occurs from the wafer W problem that the amount that falls increases of overflowing.When the wafer W of coating developer solution is coated with developer solution, stir the developer solution of coating earlier.On the contrary, when widening the width of seam ejiction opening, ejection pressure reduces, but is difficult to stable ejection developer solution.Therefore, but at developer solution nozzle 86 seam type ejiction opening 88a limit is set in two places and reduces to be coated with a certain amount of developer solution to wafer W from the ejection pressure limit of place ejection developer solution.
Fig. 7 is the key diagram of the brief configuration of expression developer solution supply unit 79a.Supply with the developer solution that is adjusted into normal concentration from developer solution supply unit 79a to developer solution nozzle 86.Promptly, send pure water by the volume control device of solenoid valve 81a etc. to mixer 83 from unshowned pure water storage source, send for example 2.38% TMAH developer solution by solenoid valve 81b to mixer 83 from unshowned developer solution storage source, these pure water and developer solution evenly mix in mixer 83, and pass out to developer solution nozzle 86.
Supervision is set through the concentration sensor 84 of mixer 83 to the concentration of the developer solution of developer solution nozzle 86 supplies on the developer solution supply unit 79a, concentration sensor 84 is to solenoid valve 81a, and 81b transmits control signal, so that solution level is a setting.By control electromagnetic valve 81a, the switching amount Control Flow of 81b can be adjusted the developer solution of the concentration of hope.The supply route of the developer solution by this mixer 83 uses when the developer solution that uses 2.38%.Sending between solenoid valve 81b and the mixer 83 is provided with three joint valves 82 on the path, by controlling the action of this three joints valve 82,2.38% developer solution former state can be passed out to developer solution nozzle 86.
Supply with pure water from pure water supply unit 79b to pure water storeroom 87b, from the seam type ejiction opening 88b ejection in 1 place.It can be the structure of sending the developer solution of normal concentration from pure water supply unit 79b.
Like this, the developer solution nozzle 86 that can spray the developer solution of normal concentration and pure water is installed in the leading section of nozzle scan arm 92 removably.Nozzle scan arm 92 moves on the Y direction with vertical holding components 93 one by Y-axis driving mechanism 98 by be installed in the upper end of the vertical holding components 93 that can move horizontally at the guide rail 91 of a direction (Y direction) laying on unit base plate 50.Developer solution nozzle 86 can be gone up at above-below direction (Z direction) by Z axle driving mechanism 99 and move.
Coating process as developer solution, can enumerate the limit and spray developer solution to wafer W by band shape from developer solution nozzle 86, the limit makes developer solution nozzle 86 scan the method that moves by Y-axis driving mechanism 98 on wafer W along guide rail 91, perhaps move to the diameter position overlapped of the vertical and wafer W of developer solution nozzle 86, on the position for example shown in Figure 5, under this state to wafer W ejection developer solution and to the method for major general's wafer W rotation 1/2 etc.
In nozzle standby portion 94 (Fig. 5) standby, (seam type ejiction opening 88a, nozzle 88b) clean the 94a of mechanism's (nozzle bath) to developer solution nozzle 86 in the special machine of this nozzle portion 94 clean developer solution nozzle 86 to be set behind the coating developer solution.
Development treatment unit (DEV) has the rinse nozzle 95 to wafer W ejection rinsing liquid, supplies with rinsing liquid from rinsing liquid supply unit 90 to rinse nozzle 95.Rinse nozzle 95 is installed in the front end of the nozzle scan arm 96 that guide rail 91 is set with can move freely on the Y direction, the development treatment of developer solution finishes the back and moves on wafer W, to wafer W ejection rinsing liquid.
As rinsing liquid, preferably use broad pure water as developer solution.Do not limit the shape of rinse nozzle 95, for example can use the straight nozzle of tubulose etc.From wafer W overflow fall or the shake developer solution that falls and rinsing liquid discharge from leak 69.The available pure water that sprays from the seam type ejiction opening 86b of developer solution nozzle 86 carries out rinsing to be handled.Suppress by fender pile 85a from hanging of the developer solution of seam type ejiction opening 88a, but rinsing is when handling, from avoiding wishing that from the hanging and improve the viewpoint of the precision that rinsing handles of seam type ejiction opening 88a finally carrying out rinsing by rinse nozzle 95 handles really.
The action of the drive system of development treatment unit (DEV) is by control part 97 controls.That is, CD-ROM drive motor 54, Y-axis driving mechanism 98, Z axle driving mechanism 99 are according to the instruction drive controlling of control part 97.About developer solution supply unit 79a, pure water supply unit 79b, rinsing liquid supply unit 90, also by controlling simultaneously from the signal of control part 97 and the action of drive system.
Then the following describes the various developing methods that use the corresponding resist film in development treatment unit (DEV) that the characteristic of developer solution is carried out.In the developing method originally, use the TMAH developer solution for example be fixed as 2.38% concentration, but in developer solution supply unit 79a, can adjust the developer solution of any concentration, therefore can offer development treatment to the each developer solution of adjusting suitable concentration of the characteristic of developer solution by corresponding resist film.Thus, can obtain superior development figures (circuitous pattern) such as form accuracy.
Fig. 8 is the corresponding resist film of expression uses the developing method of the developer solution of adjusting to normal concentration to the characteristic of developer solution a process flow diagram.The circuitous pattern of regulation is for example used KrF line or ArF line or F2 line exposing, through post-exposure oven dry handle and the wafer W of cooling processing by the holding member 48 of master wafer conveyer 22 be transported to paint cup (CP) directly over, absorption remains on the rolling clamp 52 by lifting drive 60 risings.
Then, developer solution nozzle 86 is placed on the end of the Y direction of wafer W, for example among developer solution supply unit 79a, mix the TMAH developer solution of pure water and 2.38% and the TMAH developer solution limit of the normal concentration of modulating (for example 2.0%) moves to the other end of the Y direction of wafer W by Y-axis driving mechanism 98 with developer solution nozzle 86 from developer solution nozzle 86 sideband shapes ejections, to the developer solution (step 2) of wafer W coating normal concentration.After being coated with the developer solution of this normal concentration, wafer W being placed the stipulated time carry out developing reaction (step 3).
Then, developer solution nozzle 86 is moved to nozzle standby portion 94, hold to clean and handle.Through after the stipulated time rinse nozzle 95 being moved to the wafer W top, put regulation number of revolutions rotation rolling clamp 52 from ejection pure water (rinsing liquid) limit, rinse nozzle 95 limits, developer solution on the wafer W and rinsing liquid all shaken fall (step 4), afterwards, stopping to spray under the state of rinsing liquid with high speed rotating rolling clamp 52 drier (Rotary drying) wafer W (step 5).Dry wafer W transports (step 6) by order opposite when wafer W being transported development treatment unit (DEV) from development treatment unit (DEV).Afterwards, wafer W is transported predetermined heating plate unit (HP) and is implemented heated drying and handle.
Then, express the process flow diagram of an example of the developing method of recording and narrating the wafer W that forms the resist film fast (for example commodity UV6 by name) among Fig. 9 to the dissolution velocity of developer solution.At this moment, wafer W is remained on the rolling clamp 52 (step 11) has for example been mixed the TMAH developer solution of pure water and 2.38% and the TMAH developer solution of the low concentration modulated (for example 1.55%) from developer solution nozzle 86 to the wafer W coating afterwards.Repeatedly make the repeatedly developer solution of this low concentration of developer solution nozzle 86 scanning coatings.After this low concentration developer solution is coated on the wafer W, wafer W is placed the stipulated time carry out developing reaction (step 13).
Then, once more from the TMAH developer solution of the banded ejection of developer solution nozzle 86 high concentrations (for example 2.38%), be coated with the developer solution (step 14) of this high concentration to this wafer W.At this moment, Yi Bian the developer solution of the low concentration that is coated with previously presses to the direct of travel of developer solution nozzle 86, Yi Bian be coated with the developer solution of high concentration.Also can repeatedly make the repeatedly developer solution of this high concentration of developer solution nozzle 86 scanning coatings.
The wafer W placement stipulated time that is coated with this high concentration developer solution is carried out developing reaction (step 15).Processing from step 12 to step 15 can make it not rotating wafer W to carry out under the static state, thereby the dissolving product of resist film does not stir, and the mobile vestige that causes that suppresses the dissolving product produces.Through after the stipulated time of step 15, carry out rinsing equally with the step 4-step 6 of earlier in respect of figures 8 explanations and handle (step 16), Rotary drying processing (step 17) and a series of operation that transport (step 18) of wafer W outside the development treatment unit.
To above-mentioned static wafer W coating liquid and carry out in the method for developing reaction, the wafer W central part provides too much developer solution easily, therefore developing reaction is carried out soon in the wafer W central portion, the line width that circuitous pattern occurs tendency resist film that central portion attenuates than outside portion to the fast situation of the dissolution velocity of developer solution under, this tendency obviously occurs.
For example, Figure 10 is expression to the TMAH developer solution of 2 kinds of concentration of wafer W coating (1.55% and 2.38%) and the curve of the deviation of the line width that obtains when carrying out developing reaction.The measuring point in 17 places of the transverse axis of Figure 10 is cut apart the equal equal length of the diameter of wafer W, from one end to the other side adds sequence number successively.Therefore, near the measuring point 9 be the central part of wafer W.The longitudinal axis is represented the line width of each measuring point, and here, 0.18 micron line width is the development desired value.
From this result shown in Figure 10 as can be known, under the situation of the developer solution (2.38%) that is coated with high concentration, the line width deviation of the central portion of wafer W and outside portion increases, but under the situation of the developer solution (1.55%) of coating low concentration, the line width deviation of the central portion of wafer W and outside portion reduces.Therefore, can only finish developing reaction with the low concentration developer solution.At this moment, the developing reaction time is long, so handling capacity reduces.Here, developing method is such shown in the process flow diagram of above-mentioned Fig. 9, begin to develop with the low concentration developer solution at first, develop through carrying out the short time by the high concentration developer solution after the stipulated time, thereby can suppress the deviation of the line width of development initial stage generation, and can improve the development treatment of handling capacity.
Then, express the process flow diagram of record formation among Figure 11 to an example of the developing method of the wafer W of the slow resist film of the dissolution velocity of developer solution.At this moment, wafer W is remained on the rolling clamp 52 (step 21), be coated with developer solution from developer solution nozzle 86 to wafer W afterwards, when being coated with the low concentration developer solution here, the mistiming that the developer solution coating needs displays easily as the CD difference after the end of developing.Therefore, to the developer solution (step 22) of wafer W splendid attire high concentration (2.38%).Keep the stipulated time (step 23) afterwards.The deviation that can suppress thus, CD.
If through the stipulated time of this step 23, then, keep the stipulated time (step 25) to the developer solution (step 24) of wafer W coating than the high concentration developer solution low concentration that is coated with previously.The concentration of low concentration developer solution for example can be 0.5-2.0%.The developing reaction of the latter half of development treatment is slowly carried out, and conforms to the CD that wishes easily.
If the regulation development time finishes, then carry out rinsing equally and handle (step 26), Rotary drying (step 27) and a series of operation that transport (step 28) of wafer W outside the development treatment unit with the step 4-step 6 of earlier in respect of figures 8 explanations.
Then, Figure 12 records and narrates expression to form exposed portion and the unexposed portion process flow diagram to an example of the developing method of the wafer W of the resist film of the dissolubility difference little (contrast is little) of developer solution.At this moment, wafer W is remained on the rolling clamp 52 (step 31), to the developer solution (step 32) of wafer W coating normal concentration, keep the stipulated time (step 33) afterwards.This step 32, the concentration consideration handling capacity of 33 developer solutions that use can be selected suitable concentration, for example is 1.5-2.38%.
Through after the stipulated time of this step 33,, keep the stipulated time (step 35) to the wafer W coating developer solution (step 34) lower than the solution level that is coated with previously.In the low resist film of contrast, the influence of diffraction light during owing to exposure, the resist film of unexposed portion slowly dissolves, and may can not get the good figure of form accuracy thus.But, in the latter half of developing reaction,, can form good circuitous pattern by reducing the speed that solution level postpones developing reaction.
After the development time of regulation finishes, carry out rinsing equally with the step 4-step 6 of earlier in respect of figures 8 explanations and handle (step 36), Rotary drying processing (step 37) and a series of operation that transport (step 38) of wafer W outside development treatment unit (DEV).
Figure 13 is that expression forms the process flow diagram of an example of developing method of wafer W that absorbs the moisture of developer solution easily and cause the resist film of swelling.At this moment, wafer W is remained on the rolling clamp 52 (step 41), to the developer solution (step 42) of wafer W coating normal concentration, place the stipulated time (step 43) afterwards.This step 42, the concentration consideration handling capacity and the resist film of 43 developer solutions that use can be selected suitable optium concentration to the dissolution velocity of developer solution, for example are 0.5-2.0%.
In this developing reaction process, resist film absorbs the moisture of developer solution and when causing swelling, the remaining line width in back that develops is widened, and the state that its wall is thick reduces the form accuracy of the circuitous pattern that forms.Therefore,,, be coated with the developer solution (step 44) higher once more, keep the stipulated time (step 45) than the solution level that is coated with previously for being difficult to cause moisture from the absorption of developer solution to resist film through after the stipulated time of step 43.Therefore can suppress the resist film swelling.Resist film caused under the situation of swelling, this part during because of exposure the influence of diffraction light be dissolved in easily in the developer solution, therefore by the developing solution dissolution of high concentration.Obtain having the circuitous pattern of desirable shape precision.
Figure 14 is that line width that expression resist film swelling causes changes the curve with the relation of solution level, the line width that the TMAH developer solution that 2.38% TMAH developer solution and 0.5% are used in expression obtains during respectively to the figure development treatment of using same mask exposure 20 seconds or 40 seconds.When using 2.38% TMAH developer solution, the development time difference, line width is almost constant.But when using 0.5% TMAH developer solution, development time is elongated, and line width broadens.So-called alligatoring appears.This is owing to resist film swelling speed causes soon than developing powder.Cause in the resist film of this phenomenon, use developer solution to carry out development treatment in the latter half of development treatment, can suppress the resist film swelling, obtain the circuitous pattern of suitable line width than higher concentration.
After the development time of step 45 finishes, carry out rinsing equally with the step 4-step 6 of earlier in respect of figures 8 explanations and handle (step 46), Rotary drying processing (step 47) and a series of operation that transport (step 48) of wafer W outside development treatment unit (DEV).
Then explanation improves the interior inhomogeneity developing method of CD of face of wafer W.Only being coated with 1 a kind of developer solution on the wafer W of stationary state carries out in the existing method of development treatment, when finishing, developing reaction is detained because of dissolving product high concentration in the part of dissolving resist film, the equilibrium state of this dissolving product and TMAH developer solution the problem of portion C D change occurs causing in the later stage collapse of developing.The CD that the influence of the dissolving product of high concentration causes distributes and changes along with the aperture opening ratio of mask.In addition, after the developing reaction almost with begin to supply with rinsing liquid when rotating semiconductor wafer simultaneously and removing developer solution, the surface that the dissolving product of this high concentration moved wafer W by centrifugal force, remaining vestige reduces the quality of wafer W.
For example, use expression aperture opening ratio difference among Figure 15, promptly form identical figures such as line width but the curve of the variation of the CD homogeneity (3 σ) of the different 2 kinds of masks of the area of its outside exposure area (area of perimeter hour be called dark areas, the area of perimeter is called bright area when big) when on wafer W, carrying out development treatment.Figure 16 is the key diagram that the CD value of the dark areas of expression development time when being 60 seconds distributes, and Figure 17 is the key diagram of the CD value distribution of the bright area of expression development time when being 60 seconds.
3 σ are little to the development time dependence in the bright area, and the value of 3 σs of development time in the time of 60 seconds is little of 0.0107 micron.But in the dark areas, along with the extend value of 3 σ of development time increases, the value of 3 σs of development time in the time of 60 seconds is greatly to 0.0209 micron.That is, in the dark areas, along with development time lengthening CD homogeneity variation.The deviation of CD value is little in bright area, and is big in dark areas.Think that the deviation of this CD value is owing to occurred the development that the dissolving product is diffused into the developer solution side later at 20 seconds in by dark areas.
Figure 18 is the process flow diagram of an example of developing method that reduces the concentration of the dissolving product become high concentration in the latter half of expression developing reaction partly.Figure 19 A-19E is the key diagram of the developing process of modal representation developing method shown in Figure 180.At first, wafer W is remained on the rolling clamp 52 (step 51), to the developer solution (step 52) of wafer W coating normal concentration, place the stipulated time (step 53) afterwards.This step 42, the concentration consideration handling capacity of 43 developer solutions that use can be selected suitable optium concentration, for example is 1.5-2.38%.
The dissolving product R ' of Sheng Chenging time that the CD value is exerted an influence hardly like this, for example to behind the wafer W coating developer solution through 20 seconds before, from by seam type ejiction opening 88b coating (step 54) above the developer solution of wafer W coating pure water, keep the stipulated time (step 55).
If when being coated with pure water again on the developer solution of coating the dissolving product is stirred in a large number, then because moving of dissolving product R ' produces harmful effect to the CD homogeneity.Therefore the stirring limit of limit inhibition dissolving product R ' is coated with pure water for dilution dissolving product R ' in this step 54 on wafer W.When on wafer W, being coated with pure water.Dissolving product R ' is slowly to the pure water diffusion, and the concentration that the dissolving product is detained the dissolving product R ' of part reduces (Figure 19 D).
After not dissolving the local part of being detained because of high concentration of product R ' like this, carry out rinsing equally with the step 4 of earlier in respect of figures 8 explanations and handle (step 56) and remove dissolving product R ' (Figure 19 ED).At this moment,, can suppress to follow on the surface of wafer W the generation of the vestige that moves of dissolving product R ', will be restricted to Min. to the influence that CD produces simultaneously because the dissolving product R ' of high concentration do not move.After the rinsing processing finishes, carry out Rotary drying and handle (step 57) and a series of operation that transport (step 58) of wafer W outside development treatment unit (DEV).
Figure 20 be expression to the dark areas condition of the Figure 15 shown in the front, begin to distribution according to step 52-step 55 coating developer solution through the CD value that is coated with the wafer W that pure water obtains before 20 seconds.As shown in figure 20, being evenly distributed of CD value, consequently 3 σ values are 0.0209 micron in existing developing method (with reference to Figure 15,16), and are improved to 0.0126 micron.
In addition, from developer solution, also be coated with pure water in the step 54, also can be coated with and developer solution developer solution same concentrations or low concentration of front to the wafer W coating but substitute pure water in the step 54.At this moment, the dissolving product slowly spreads, and can reduce the concentration that the dissolving product is detained the dissolving product of part.Use under the situation of pure water, the development treatment cost reduces.
Figure 21 be expression to the dark areas condition of the Figure 15 shown in the front, begin after 20 seconds, to be coated with again the distribution of the CD value of the wafer W that the developer solution identical with the developer solution that is coated with previously obtain according to step 52-step 55 from the coating developer solution.At this moment, 3 σ values are improved to 0.0126 micron.
In the existing development treatment, from the developer solution of coating, be coated with developer solution again, its objective is that with the dissolving product fresh developer solution being contacted by the developer solution of removing or stir initial coating with undissolved resist film promotes developing reaction.But, this developing method as mentioned above, the stirring limit that suppresses the dissolving product on the limit causes that naturally concentration reduces, avoid dissolving product to CD influence the aspect difference, under the low situation of resist film thickness, be effective developing method especially.
Behind the developer solution of this normal concentration of the last coating in the surface of wafer W, compare the stirring that coating suppresses to dissolve product with developer solution below the isoconcentration or pure water with the developer solution that is coated with previously, the method that changes thereby the method for carrying out developing reaction is applicable to also that the corresponding resist film that illustrates previously is fit to the carrying out of developing reaction to the concentration of the developer solution of the dissolution characteristics use of developer solution.Thus, but the development figure that the form accuracy limit obtains the CD excellent uniformity is improved on the limit.
But, as mentioned above, by using behind the developer solution of the last coating in the surface of wafer W normal concentration, the coating pure water suppresses to dissolve the stirring of product and the method for carrying out developing reaction, can realize improving form accuracy, and improve the inhomogeneity development treatment of CD, but in recent years, when making in this way, when adding pure water dilute development liquid to developer solution, pH by rapid change developer solution will dissolve the product solid and separate out, and produce the problem of this precipitate attached to the development figure, anticorrosive additive material occur.
Improve form accuracy and improve the developing method that the frontier defense of CD homogeneity ends the generation of this solid precipitate as the limit, can enumerate behind the developer solution of the last coating in the surface of wafer W normal concentration, the oriented developer solution of applying implenent does not sharply change the pH of developer solution when adding pH adjusts the stirring that the liquid of function suppresses to dissolve product, makes the method for dissolving product diffusion.At this moment, have the liquid that pH adjusts function and need have following character: the composition that does not dissolve the low and discord developer solution of the dissolving power of resist film or resist film reacts with the dissolving product of resist and solid is separated out.
For example, though the pH of TMAH solution is 13-14, because the pH of pure water is almost 7, so its difference is big.Therefore, by using the solution of pH as 9-12, ammoniacal liquor for example adds the aqueous solution and the hydrophilic organic solvent of the interfacial agent of ormal weight in pure water, suppress the front to the pH of the developer solution of wafer W coating change, suppresses the generation of solid precipitate.Behind the developer solution of the last coating in the surface of wafer W normal concentration, can be coated with the pH lower and be the stirring that the developer solution of 9-12 suppresses to dissolve product than the solution level that is coated with previously.Specifically, under the situation of TMAH solution, its concentration is preferably in the scope of 0.1%-1.5% for example.
Then explanation is fit to the state of the developer solution nozzle of use in the development treatment that prevents the solid precipitate generation that above-mentioned dissolving product causes.Figure 22 is the fragmentary cross sectional view of developer solution nozzle 86a.Developer solution nozzle 86a and developer solution nozzle 86 are similarly oblong-shaped, and it is (vertical paper direction) horizontal arrangement vertically.The inside of the body 103 of developer solution nozzle 86a has the independently first developer solution storeroom 105a and the second developer solution storeroom 105b, by opening valve 102a, by opening valve 102b supplies with normal concentration to the second developer solution storeroom 105b from the second developer solution supply unit 101b developer solution (for example 0.5% TMAH solution) from the developer solution (for example 2.38% TMAH solution) of the first developer solution confession 101a of portion to first developer solution storeroom 105a supply normal concentration.
In the body 103, the first developer solution storeroom 105a and second developer solution storeroom 105b below are provided with the liquid mixing chamber 107 that the lower end has seam type ejiction opening 109, the first developer solution storeroom 105a and liquid mixing chamber 107 are communicated with by the first communication path 106a, and the second developer solution storeroom 105b and liquid mixing chamber 107 are communicated with by the second communication path 106b.Have among the developer solution nozzle 86a of this structure, one of the developer solution of supplying with from the first developer solution supply unit 101a and developer solution of supplying with from the second developer solution supply unit 101b can be by liquid mixing chamber 107 from 109 ejections of seam type ejiction opening.Like this, liquid mixing chamber 107 is as the simple path of developer solution.Among the developer solution nozzle 86a, the developer solution of supplying with from the first developer solution supply unit 101a and from the developer solution that the second developer solution supply unit 101b supplies with liquid mixing chamber 107 in, mixes solution level is adjusted into the concentration of hope after, developer solution that can adjustment sprays from seam type ejiction opening 109.
Figure 23 is the fragmentary cross sectional view of developer solution nozzle 86b.Developer solution nozzle 86b and developer solution nozzle 86 are similarly oblong-shaped, and it is (vertical paper direction) horizontal arrangement vertically.The inside of the body 119 of developer solution nozzle 86b has independently developer solution storeroom 113a and pure water storeroom 113b and the 3rd liquid reservoir compartment 113c, by opening valve 112a supplies with normal concentration to developer solution storeroom 113a from developer solution supply unit 111a developer solution (for example 2.38% TMAH solution), supply with pure water from pure water supply unit 111b to pure water storeroom 113b by opening valve 112b, supply with the 3rd liquid (for example having the solution that pH adjusts function) from the 3rd liquid supply unit 111c to the 3rd liquid reservoir compartment 113c by opening valve 112c.
In the body 119, each storeroom 113a-113c below forms liquid mixing chamber 118, each storeroom 113a, and 113b, 113c and liquid mixing chamber 107 are passed through communication path 114a respectively, 114b, 114c106a is communicated with.118 lower ends, liquid mixing chamber are seam type ejiction opening 117, and 118 inside, liquid mixing chamber are provided with fender pile 115.This fender pile 115 make from the ejection state of the developer solution of seam type ejiction opening 117 etc. developer solution nozzle 86b vertically on evenly and prevent leakage from the developer solution of seam type ejiction opening 117.
As the developing method that uses developer solution nozzle 86b, for example can enumerate following method.Initial developer solution from pure water storeroom 113b to liquid mixing chamber 118 and the pure water of sending ormal weight respectively from developer solution supply unit 111a and pure water supply unit 111b by developer solution storeroom 113a and.Its hybrid modulation is wished the developer solution limit of concentration sprays from the surface of seam type ejiction opening 117 to wafer W in the limit in liquid mixing chamber 118.On wafer W, be coated with developer solution thus, the beginning developing reaction.
Through after the stipulated time, send the pure water of ormal weight to pure water storeroom 113b from pure water supply unit 111b, send solution from the 3rd liquid supply unit 111c to the 3rd liquid reservoir compartment 113c simultaneously, they are mixed in liquid mixing chamber 118 with pH adjustment function.The pH of the concentration that limit modulation is wished in liquid mixing chamber 118 adjusts function solution limit the pH of modulation is adjusted function solution from 117 ejections of seam type ejiction opening like this, is coated on once more on the developer solution on surface of wafer W.Can sharply not change the pH of the developer solution that is coated with previously thus and wafer W is carried out development treatment.Alternative pure water and have the 3rd liquid that pH adjusts function to developer solution nozzle 86a, 86b supplies with different types of developer solution, and available thus 1 nozzle is carried out the development treatment of various regulations.
Embodiments of the invention more than have been described, but have the invention is not restricted to these forms.For example, developing method of the present invention can be adapted to pass through KrF line and ArF line or F2 line resist film is implemented under the situation of exposure-processed, but comparable under the situation of using g line or i line the high development treatment of precision.To being conceived to resist film (anticorrosive additive material) reactive developing method of developer solution all explanations have been done, as long as but fast and developer solution causes under the situation of swelling easily to the dissolution velocity of developer solution at resist film, the value that the solution level that uses in the latter half of developing reaction is set to not cause the excessive dissolution of resist film and dissolution velocity and swelling velocity balance just.The developer solution of variable concentrations is not that certain use is coated with for 2 kinds in addition, by carrying out more accurate development treatment through the developer solution that is coated with more variable concentrations to wafer W after the stipulated time.
As the high concentration developer solution, enumerated 2.38% TMAH developing solution, be limited under the form accuracy and the inhomogeneity situation of CD that obtains stipulating, can use the developer solution of higher concentration certainly.In addition, as the developer solution nozzle, configured in parallel forms 3 nozzles of seam type ejiction opening in 1 place, and establishes elevating mechanism in each nozzle, concerning the developer solution that the front is coated with, do not need spray nozzle front end on wafer W, new developer solution or pure water can be applied on the wafer W.In the foregoing description, enumerated the example of semiconductor wafer, but in the photo-mask process of glass substrate of LCD (LCD) usefulness etc., can adopt above-mentioned various developing method as substrate.
More than Shuo Ming embodiment is intended to clear and definite technology contents of the present invention, and the present invention should not be interpreted as this object lesson with limiting, in spirit of the present invention and the described scope of claim, can carry out various changes and implement.
Claims (3)
1. developing method carries out development treatment to the substrate that is formed with resist film and has carried out exposure-processed, it is characterized in that this developing method comprises following operation:
First operation of coating developer solution on described substrate;
The described substrate that is coated with developer solution is placed the stipulated time to carry out second operation of developing reaction;
Again to described the 3rd operation that is coated with the substrate coating liquid of developer solution, described liquid is selected from the developer solution of dilution, added interfacial agent so that the pH value is 9 to 12 aqueous solution or pH value is a kind of in 9 to 12 the hydrophilic organic solvent in pure water;
The described substrate that is coated with liquid is placed the stipulated time, be reduced in the 4th operation of the concentration of the dissolving product that is generated in described second operation by described liquid;
The described substrate that is coated with liquid is carried out the 5th operation that rinsing is handled;
The nozzle that adopts in described the 3rd operation is the nozzle that the developer solution of described dilution can be banded ejection, comprise: on Width, divide developer solution storeroom and the pure water storeroom that is arranged, the lower end has and alongst is the developer solution ejiction opening that sprays developer solution bandedly, and the liquid mixing chamber that is communicated with described developer solution storeroom and described pure water storeroom, first communication path with described developer solution storeroom and the connection of described liquid mixing chamber, with second communication path of described pure water storeroom and the connection of described liquid mixing chamber, it is indoor to be arranged on described liquid mixing, with the mixed uniformly fender pile of the liquid in the influent mixing chamber;
By send the pure water of ormal weight to described liquid mixing chamber from described pure water storeroom, and send the developer solution of ormal weight to described liquid mixing chamber from described developer solution storeroom, developer solution in the desired concentration of the indoor modulation of described liquid mixing, evenly mix by described fender pile, from described developer solution ejiction opening ejection.
2. developing method according to claim 1 is characterized in that, in described the 3rd operation, adopts the low developer solution of concentration than the developer solution that is adopted in described first operation.
3. developing method according to claim 1 and 2 is characterized in that, makes described substrate carry out described first operation still to described the 4th operation, makes described substrate carry out described the 5th operation rotatably.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP257810/01 | 2001-08-28 | ||
| JP2001257810 | 2001-08-28 | ||
| JP146594/02 | 2002-05-21 | ||
| JP2002146594A JP3869306B2 (en) | 2001-08-28 | 2002-05-21 | Development processing method and developer coating apparatus |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021437564A Division CN1289970C (en) | 2001-08-28 | 2002-08-28 | Development treating method and developing liquid coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1743963A CN1743963A (en) | 2006-03-08 |
| CN1743963B true CN1743963B (en) | 2010-12-22 |
Family
ID=36139382
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510099555 Expired - Fee Related CN1743963B (en) | 2001-08-28 | 2002-08-28 | Method for developing processing |
| CNA2008101796291A Pending CN101424886A (en) | 2001-08-28 | 2002-08-28 | Developing liquid coating device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101796291A Pending CN101424886A (en) | 2001-08-28 | 2002-08-28 | Developing liquid coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN1743963B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102109776A (en) * | 2011-03-18 | 2011-06-29 | 常州瑞择微电子科技有限公司 | Process for developing photoresist, and device thereof |
| TW201610609A (en) * | 2014-05-20 | 2016-03-16 | 柯達公司 | Silver halide solution physical developing solution and method of use |
| CN105954983B (en) * | 2016-07-18 | 2019-11-08 | 京东方科技集团股份有限公司 | Developing method and system |
| CN107329378A (en) * | 2017-09-01 | 2017-11-07 | 东莞通华液晶有限公司 | A kind of high-precision ITO photoetching processes |
| CN107680935A (en) * | 2017-09-28 | 2018-02-09 | 武汉华星光电技术有限公司 | The manufacture method and its display device of low temperature polycrystalline silicon array base palte, array base palte |
| CN108255024A (en) * | 2018-01-31 | 2018-07-06 | 京东方科技集团股份有限公司 | A kind of developing apparatus and its developing method, lithographic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4873177A (en) * | 1986-02-24 | 1989-10-10 | Tokyo Ohka Kogyo Co., Ltd. | Method for forming a resist pattern on a substrate surface and a scum-remover therefor |
| US5815762A (en) * | 1996-06-21 | 1998-09-29 | Tokyo Electron Limited | Processing apparatus and processing method |
| US5976256A (en) * | 1996-11-27 | 1999-11-02 | Tokyo Electron Limited | Film coating apparatus |
| US6159662A (en) * | 1999-05-17 | 2000-12-12 | Taiwan Semiconductor Manufacturing Company | Photoresist development method with reduced cycle time and improved performance |
-
2002
- 2002-08-28 CN CN 200510099555 patent/CN1743963B/en not_active Expired - Fee Related
- 2002-08-28 CN CNA2008101796291A patent/CN101424886A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4873177A (en) * | 1986-02-24 | 1989-10-10 | Tokyo Ohka Kogyo Co., Ltd. | Method for forming a resist pattern on a substrate surface and a scum-remover therefor |
| US5815762A (en) * | 1996-06-21 | 1998-09-29 | Tokyo Electron Limited | Processing apparatus and processing method |
| US5976256A (en) * | 1996-11-27 | 1999-11-02 | Tokyo Electron Limited | Film coating apparatus |
| US6159662A (en) * | 1999-05-17 | 2000-12-12 | Taiwan Semiconductor Manufacturing Company | Photoresist development method with reduced cycle time and improved performance |
Non-Patent Citations (1)
| Title |
|---|
| 同上. |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1743963A (en) | 2006-03-08 |
| CN101424886A (en) | 2009-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1289970C (en) | Development treating method and developing liquid coating device | |
| KR101160704B1 (en) | Development device and developing method | |
| KR940003373B1 (en) | Apparatus for treating a wafer surface | |
| KR100861046B1 (en) | Substrate processing method and substrate processing apparatus | |
| CN102289151B (en) | Coating method and coating apparatus | |
| KR101447759B1 (en) | Application processing method and application processing apparatus | |
| US7841787B2 (en) | Rinsing method, developing method, developing system and computer-read storage medium | |
| US9052610B2 (en) | Coating and developing system and coating and developing method | |
| KR20010091978A (en) | Substrate processing method and substrate processing apparatus | |
| WO2004109779A1 (en) | Method for improving surface roughness of processed film of substrate and apparatus for processing substrate | |
| KR20000071551A (en) | Film forming method and film forming apparatus | |
| CN101398627A (en) | Coating treatment method, coating treatment apparatus, and computer-readable storage medium | |
| KR100873720B1 (en) | Developing treatment method and developing treament unit | |
| CN1743963B (en) | Method for developing processing | |
| KR20090118945A (en) | Substrate processing device and substrate processing method | |
| JP2000306809A (en) | Substrate treating apparatus and method for treating substrate using the same | |
| KR100618723B1 (en) | Resist pattern forming method | |
| US20030168007A1 (en) | Apparatus for and method of processing substrate | |
| US7108750B2 (en) | Thinning agent supplying systems | |
| JPH05315314A (en) | Method for stirring processing liquid for substrate and equipment for processing liquid for substrate | |
| JPH0850361A (en) | Developing device | |
| JPS6015637A (en) | Resist film developing method | |
| JPH1097078A (en) | Developing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101222 Termination date: 20200828 |