CN1645975A - 显示元件、光学元器件以及光学元器件的制造方法 - Google Patents
显示元件、光学元器件以及光学元器件的制造方法 Download PDFInfo
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- CN1645975A CN1645975A CNA2004101047020A CN200410104702A CN1645975A CN 1645975 A CN1645975 A CN 1645975A CN A2004101047020 A CNA2004101047020 A CN A2004101047020A CN 200410104702 A CN200410104702 A CN 200410104702A CN 1645975 A CN1645975 A CN 1645975A
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Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (27)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003398084 | 2003-11-27 | ||
JP2003398084A JP4643138B2 (ja) | 2003-11-27 | 2003-11-27 | 表示装置及びその製造方法 |
JP2004172450 | 2004-06-10 | ||
JP2004172450A JP2005353398A (ja) | 2004-06-10 | 2004-06-10 | 表示素子、光学デバイス、及び光学デバイスの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1645975A true CN1645975A (zh) | 2005-07-27 |
CN100472844C CN100472844C (zh) | 2009-03-25 |
Family
ID=34752040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004101047020A Active CN100472844C (zh) | 2003-11-27 | 2004-11-26 | 显示元件、光学元器件以及光学元器件的制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7612498B2 (zh) |
KR (1) | KR100688366B1 (zh) |
CN (1) | CN100472844C (zh) |
TW (1) | TWI254596B (zh) |
Cited By (9)
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CN102292816A (zh) * | 2010-04-13 | 2011-12-21 | 松下电器产业株式会社 | 有机半导体装置及其制造方法 |
CN102969452A (zh) * | 2011-08-29 | 2013-03-13 | 乐金显示有限公司 | 有机电致发光显示面板及其制造方法 |
CN104241550A (zh) * | 2014-08-05 | 2014-12-24 | 京东方科技集团股份有限公司 | Oled显示装置及其封装方法 |
CN105514298A (zh) * | 2015-12-31 | 2016-04-20 | 固安翌光科技有限公司 | 一种薄膜封装结构及薄膜封装方法 |
CN107154464A (zh) * | 2016-03-02 | 2017-09-12 | 三星显示有限公司 | 制造显示装置的方法 |
CN107611285A (zh) * | 2016-07-12 | 2018-01-19 | 圆益Ips股份有限公司 | 基板处理系统以及基板处理方法 |
CN108461523A (zh) * | 2013-11-28 | 2018-08-28 | 群创光电股份有限公司 | 有机发光二极管显示面板及其制作方法 |
CN108519709A (zh) * | 2018-06-01 | 2018-09-11 | Oppo广东移动通信有限公司 | 电致变色母板、电致变色单元、壳体以及电子设备 |
CN110010797A (zh) * | 2013-06-03 | 2019-07-12 | 三星显示有限公司 | 有机发光二极管显示器及其制造方法 |
Families Citing this family (22)
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JP4702009B2 (ja) * | 2005-11-22 | 2011-06-15 | セイコーエプソン株式会社 | 発光装置および電子機器 |
TWI396464B (zh) * | 2007-01-22 | 2013-05-11 | Innolux Corp | 有機電致發光顯示裝置及其製作方法 |
JP2009037809A (ja) * | 2007-07-31 | 2009-02-19 | Sumitomo Chemical Co Ltd | 有機エレクトロルミネッセンス装置およびその製造方法 |
WO2009053886A2 (en) * | 2007-10-25 | 2009-04-30 | Koninklijke Philips Electronics N.V. | Organic electro-optical device, light source, display device and solar cell |
JP2009238481A (ja) * | 2008-03-26 | 2009-10-15 | Toshiba Corp | 有機el表示装置 |
KR100943185B1 (ko) * | 2008-04-24 | 2010-02-19 | 삼성모바일디스플레이주식회사 | 유기 발광 디스플레이 장치 |
KR101634791B1 (ko) | 2008-11-28 | 2016-06-30 | 삼성디스플레이 주식회사 | 접촉 감지 기능이 있는 유기 발광 표시 장치 |
KR101084230B1 (ko) | 2009-11-16 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
KR20120065049A (ko) | 2010-12-10 | 2012-06-20 | 삼성모바일디스플레이주식회사 | 유기발광 표시장치 및 그 제조 방법 |
KR101352121B1 (ko) * | 2011-08-29 | 2014-01-15 | 엘지디스플레이 주식회사 | 유기 전계 발광 표시 패널 및 그의 제조 방법 |
KR101937258B1 (ko) | 2012-09-04 | 2019-01-11 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102022395B1 (ko) | 2013-04-02 | 2019-09-19 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 및 그 제조방법 |
JP6253923B2 (ja) * | 2013-08-30 | 2017-12-27 | 株式会社ジャパンディスプレイ | タッチセンサ内蔵有機エレクトロルミネッセンス装置 |
CN103956373A (zh) | 2013-12-18 | 2014-07-30 | 上海天马有机发光显示技术有限公司 | 一种疏水有机薄膜封装的有机发光显示装置及其制造方法 |
CN104795509A (zh) * | 2015-05-07 | 2015-07-22 | 京东方科技集团股份有限公司 | 一种oled器件的封装方法及封装结构、显示装置 |
KR102402195B1 (ko) * | 2015-06-30 | 2022-05-25 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
KR20170021431A (ko) | 2015-08-17 | 2017-02-28 | 삼성디스플레이 주식회사 | 플렉서블 표시 장치 |
JP2017152256A (ja) * | 2016-02-25 | 2017-08-31 | 株式会社ジャパンディスプレイ | 表示装置 |
JP6807178B2 (ja) | 2016-07-07 | 2021-01-06 | 株式会社ジャパンディスプレイ | 表示装置、表示装置の製造方法 |
JP6717700B2 (ja) * | 2016-07-28 | 2020-07-01 | 株式会社ジャパンディスプレイ | 表示装置の製造方法 |
JP2018181579A (ja) * | 2017-04-12 | 2018-11-15 | 株式会社ジャパンディスプレイ | 有機el表示装置 |
KR102692769B1 (ko) * | 2018-10-18 | 2024-08-08 | 삼성디스플레이 주식회사 | 표시 패널 검사 시스템, 표시 패널 검사 방법 및 이를 이용한 표시 패널. |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2553696B2 (ja) * | 1989-03-24 | 1996-11-13 | 松下電器産業株式会社 | 多色発光薄膜エレクトロルミネセンス装置 |
US6218219B1 (en) * | 1997-09-29 | 2001-04-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method thereof |
US6866901B2 (en) * | 1999-10-25 | 2005-03-15 | Vitex Systems, Inc. | Method for edge sealing barrier films |
TW522752B (en) * | 2000-10-20 | 2003-03-01 | Toshiba Corp | Self-luminous display panel and method of manufacturing the same |
TW535137B (en) * | 2000-11-09 | 2003-06-01 | Toshiba Corp | Self-illuminating display device |
US6650046B2 (en) * | 2000-11-17 | 2003-11-18 | Tdk Corporation | Thin-film EL device, and its fabrication process |
US6664137B2 (en) * | 2001-03-29 | 2003-12-16 | Universal Display Corporation | Methods and structures for reducing lateral diffusion through cooperative barrier layers |
US6649433B2 (en) * | 2001-06-26 | 2003-11-18 | Sigma Technologies International, Inc. | Self-healing flexible photonic composites for light sources |
JP2003217829A (ja) | 2002-01-22 | 2003-07-31 | Toyota Industries Corp | 有機elディスプレイパネル |
US6949389B2 (en) * | 2002-05-02 | 2005-09-27 | Osram Opto Semiconductors Gmbh | Encapsulation for organic light emitting diodes devices |
US6858464B2 (en) * | 2002-06-19 | 2005-02-22 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing light emitting device |
JP4185341B2 (ja) * | 2002-09-25 | 2008-11-26 | パイオニア株式会社 | 多層バリア膜構造、有機エレクトロルミネッセンス表示パネル及び製造方法 |
JP4789551B2 (ja) * | 2005-09-06 | 2011-10-12 | 株式会社半導体エネルギー研究所 | 有機el成膜装置 |
-
2004
- 2004-11-24 US US10/995,231 patent/US7612498B2/en active Active
- 2004-11-26 TW TW093136634A patent/TWI254596B/zh active
- 2004-11-26 CN CNB2004101047020A patent/CN100472844C/zh active Active
- 2004-11-26 KR KR1020040097905A patent/KR100688366B1/ko active IP Right Grant
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102292816B (zh) * | 2010-04-13 | 2015-01-14 | 松下电器产业株式会社 | 有机半导体装置及其制造方法 |
CN102292816A (zh) * | 2010-04-13 | 2011-12-21 | 松下电器产业株式会社 | 有机半导体装置及其制造方法 |
CN102969452A (zh) * | 2011-08-29 | 2013-03-13 | 乐金显示有限公司 | 有机电致发光显示面板及其制造方法 |
US8963420B2 (en) | 2011-08-29 | 2015-02-24 | Lg Display Co., Ltd. | Organic electro-luminescence display panel for preventing the display panel from degrading and a method for fabricating the same |
CN102969452B (zh) * | 2011-08-29 | 2016-04-13 | 乐金显示有限公司 | 有机电致发光显示面板及其制造方法 |
CN110010797A (zh) * | 2013-06-03 | 2019-07-12 | 三星显示有限公司 | 有机发光二极管显示器及其制造方法 |
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CN104241550A (zh) * | 2014-08-05 | 2014-12-24 | 京东方科技集团股份有限公司 | Oled显示装置及其封装方法 |
CN104241550B (zh) * | 2014-08-05 | 2017-08-15 | 京东方科技集团股份有限公司 | Oled显示装置及其封装方法 |
US10050228B2 (en) | 2014-08-05 | 2018-08-14 | Boe Technology Group Co., Ltd. | OLED display device and encapsulation method thereof |
CN105514298A (zh) * | 2015-12-31 | 2016-04-20 | 固安翌光科技有限公司 | 一种薄膜封装结构及薄膜封装方法 |
CN107154464A (zh) * | 2016-03-02 | 2017-09-12 | 三星显示有限公司 | 制造显示装置的方法 |
CN107154464B (zh) * | 2016-03-02 | 2021-01-29 | 三星显示有限公司 | 制造显示装置的方法 |
CN107611285A (zh) * | 2016-07-12 | 2018-01-19 | 圆益Ips股份有限公司 | 基板处理系统以及基板处理方法 |
CN108519709A (zh) * | 2018-06-01 | 2018-09-11 | Oppo广东移动通信有限公司 | 电致变色母板、电致变色单元、壳体以及电子设备 |
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US7612498B2 (en) | 2009-11-03 |
KR20050051570A (ko) | 2005-06-01 |
CN100472844C (zh) | 2009-03-25 |
TW200522777A (en) | 2005-07-01 |
TWI254596B (en) | 2006-05-01 |
KR100688366B1 (ko) | 2007-03-02 |
US20050156513A1 (en) | 2005-07-21 |
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