CN1602235A - Low-cost electronic module and method for making same - Google Patents

Low-cost electronic module and method for making same Download PDF

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Publication number
CN1602235A
CN1602235A CN 02824806 CN02824806A CN1602235A CN 1602235 A CN1602235 A CN 1602235A CN 02824806 CN02824806 CN 02824806 CN 02824806 A CN02824806 A CN 02824806A CN 1602235 A CN1602235 A CN 1602235A
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low
cost
electronic
module
method
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CN 02824806
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Chinese (zh)
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弗朗索瓦·德罗兹
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纳格雷德股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2201/00Articles made by soldering, welding or cutting by applying heat locally
    • B23K2201/36Electric or electronic devices
    • B23K2201/40Semiconductor devices

Abstract

本发明的目的在于提供一种具有高收益性的电子模块制造方法。 Object of the present invention to provide a method for manufacturing an electronic module having high profitability. 更明确地说,此方法的特点是在于仅需要简单的工具,便可以大量制造该模块。 More specifically, the characteristics of this method is that it requires only simple tools, you can mass production of the module. 本发明的另一目的在于以极低的成本来制造可靠的电子模块。 Another object of the present invention is to be produced at very low cost reliable electronic module. 此目的是可通过一种电子模块的制造方法来予以达成,其中,该电子模块具有至少一电子元件(3),其可被运送至一用以处理电子元件的托盘上,且包含隔室(2)及一第二绝缘片,该方法的特征在于以下的步骤:-将构成一第一绝缘片(1)的隔室托盘放置在一工件表面上,该每一隔室(2)容纳至少一电子元件(3);以致使封闭容纳电子元件(3)的隔室(2)如此的方式来将第二绝缘片(4)叠置在第一绝缘片上;依照包括第一绝缘片(1)的至少一隔室(2)的轮廓来切割该模块。 This object may be achieved by a method of manufacturing an electronic module, wherein the electronic module having at least one electronic component (3), which can be transported onto a pallet for processing electronic components, and comprising compartments ( 2) and a second insulating sheet, the method being characterized by the steps of: - constituting a first insulating sheet (1) compartment tray placed on a surface of the workpiece, each of the compartments (2) receiving at least an electronic component (3); closing a container to cause the electronic element (3) of the compartment (2) in such a way that the second insulating sheet (4) stacked on the first insulating substrate; in accordance with a first insulating sheet comprising (1 profile) at least one compartment (2) to the cutting module.

Description

低成本电子模块及其制造方法 Method for producing low-cost electronic modules and

技术领域 FIELD

本发明涉及电子模块及该模块的制造方法的领域,其中该模块包括由叠置片所构成的多个层体及至少一电子元件。 The present invention relates to the field of electronic modules and a method of manufacturing the module, wherein the module body comprises a plurality of layers and at least one electronic component constituted by the stacked sheets.

背景技术 Background technique

本发明涉及通过加压及热成型不同连续层体所制成的模块,这些模块包括至少一电子元件,其中该电子元件在此是定义为一种诸如一连接至一晶片的线圈的元件,即一般所谓的应答器。 The present invention relates to different pressure and thermal molding module body is made of a continuous layer, which comprises at least one electronic component module, wherein the electronic component is defined herein as a connected to the coil as a component of a wafer, i.e., commonly called a transponder.

公知的智能卡、电子标识或电路的模块是通过组合数个片以构成一叠置层体而构成,其中该叠置层体是包括一称之为基板的支撑件、一导电层及用以覆盖模块表面的保护片。 Known smart card, or electronic identification circuit module by combining a plurality of sheets to form a laminated layer body is constituted, wherein the layer stacked body comprising a support member called a substrate, a conductive layer and to cover module surface protective sheet. 固定在基板上的电子元件是连接至导电层轨迹。 An electronic component is fixed on the substrate is connected to the conductive trace layer. 所有这些片是通过热粘合、加压或层叠而组合在一起。 All of these pieces are bonded by heat, pressure or stacked together.

其它的模块通过在电路上涂布一粘合剂所制成。 Other modules are made by applying an adhesive on the circuit. 在粘合剂硬化之后,模块的表面大体而言是由保护片所覆盖,以作为装饰之用。 After the adhesive is hardened, the surface of the module concerned is generally covered by a protective sheet, as decorative purposes.

上述两种类型的模块的制造方法是包括大量精密的、长时间的且高成本的操作步骤,而这是需要相当复杂的工具。 The method for producing the above-described two types of modules including a large number of sophisticated, long and costly procedure, which requires a rather complicated tools. 再者,制造极大量模块是需要相当先进合理的制程步骤,且具有最小的报废率。 Further, the manufacturing requires a very large number of modules is considerably advanced and reasonable process steps, with minimal scrap. 成品必须便宜,而且同时,直到使用寿命终了前,仍是可靠的。 The finished product must be cheap, but at the same time, until the end of life, is still reliable.

发明内容 SUMMARY

本发明的目的是要提供一种具有高收益性的模块制造方法。 Object of the present invention is to provide a high-yield method of producing a module. 更特别地,此方法的特点是在于仅需要简单的工具,便可以大量制造该模块。 More particularly, the characteristics of this method is that it requires only simple tools, you can mass production of the module.

本发明的另一目的是要以极低的成本来制造可靠的电子模块。 Another object of the present invention to be produced at very low cost reliable electronic module.

此目的可通过一种电子模块的制造方法来达成,其中该电子模块是具有至少一电子元件,其可被运送至一用以处理电子元件之托盘上,且包含隔室及一第二绝缘片,该方法之特征在于以下之步骤:-将构成一第一绝缘片之隔室托盘放置在一工件表面上,该每一隔室是容纳至少一电子元件;-将第二绝缘片叠置在第一绝缘片上,以便封闭容纳电子元件之隔室;-依照包括第一绝缘片之至少一隔室的轮廓工业来切割该模块。 This object can be achieved by a method of manufacturing an electronic module, wherein the electronic module having at least one electronic component, which can be transported to a tray for processing electronic components, comprising a compartment and a second insulating sheet, and the method is characterized by the steps of: - constituting a separator chamber of the first insulation sheet is placed on a tray surface of the workpiece, which is accommodated in each compartment at least one electronic component; - a second insulation sheet superposed a first insulating sheet, so as to close the receiving compartment of the electronic device; - in accordance with the contour of the industrial comprising at least a first compartment of the insulating sheet to the cutting module.

该电子元件,通常是应答器,是由供应器以一由热成型绝缘片所构成之托盘作为基部元件的方式来加以传送。 The electronic component, typically transponders, are molded by a supply tray formed of a heat insulating sheet to the base element as a means has to be transmitted. 此一用以输送及处理元件之托盘是包括隔室,该隔室是规律性地分布在托盘的表面上。 This element for the transfer and the processing tray comprises a compartment, the compartment is regularly distributed over the surface of the tray.

使用此一用以调整元件之构件是可减少模块制造方法的操作步骤数量。 Use this procedure for adjusting a component element of a module manufacturing method can reduce the number. 实际上,其不再需要第一片之先前预备步骤、以及应答器之困难的叠置及定位操作。 Indeed, it is no longer necessary preparatory steps previously, and stacking and difficult positioning operation of a transponder of the first sheet. 因此,该方法之第一步骤是将一第二绝缘片叠置在第一绝缘片上,使其可以封闭所有容纳一元件之隔室。 Accordingly, the first step of the method is a second insulating sheet is stacked on the first insulating sheet, so that it can accommodate all of the closure element of a compartment. 接着,此组件便可通过施加在第二绝缘片之加压板来进行热加压处理,以构成一具有大量电子元件之板体。 Next, this component can be applied to the pressure plate by the second insulating sheet to the heat-pressing treatment, to form a plate having a large number of electronic components. 此板体是可以以切割以获得个别之模块,其中该模块是包括至少一电子元件。 This plate may be cut to obtain the individual modules, wherein the module comprises at least one electronic component.

依照本方法之一实施例,一例如由树脂所制成之充填材料是可导入至第一绝缘片之隔室中,以在将第二片放置在定位之前来密封该电子元件。 In accordance with one embodiment of the present method, for example, a filler material made of a resin is introduced into the first compartment of the insulating sheet to the second sheet is placed in the sealed before positioning the electronic component. 该组件是可经过热加压,或者依照另一实施例,该第二绝缘片是可以仅施加粘胶而不需要加压。 This assembly is hot after pressing, or in accordance with another embodiment, the second insulating sheet is applied only to the adhesive without the need for pressurization. 在此例中,第二片是可在欲施加在第一绝缘层之表面上包括一自粘材料层。 In this embodiment, the second sheet is applied may comprise a layer of adhesive material on the surface of the first insulating layer of the desire. 以此方式所获得之模块是不需要加压,且在切割之后,可以保持托盘之隔室的原来形状。 In this manner the module is not required to obtain the pressure and, after cutting, can maintain the original shape of the compartments of the tray.

模块之最后切割是可通过冲压来处理,并且依照在第一绝缘片中之容纳有电子元件之隔室的轮廓来切割。 Finally the cutting module is processed by stamping, and in accordance with a first insulating sheet receiving compartment of contoured cutting electronic components. 在具有数个元件之模块的例子中,模块之轮廓是包括数个隔室。 In the case of modules having a plurality of elements, the profile comprising a plurality of modules are in the compartments.

本发明亦关于一种电子模块,其包含一具有至少一电子元件之第一绝缘片及一第二绝缘片的组件,其特征在于由处理电子元件之托盘所构成之第一绝缘片包括隔室,每一隔室是容纳至少一电子元件。 The present invention also relates to an electronic module, comprising a component having at least one electronic component of the first insulation sheet and a second insulation sheet, wherein said first processing tray by the insulating sheet for electronic components comprising a compartment consisting of each compartment is receiving at least one electronic component.

依照一实施例,模块是在第一及第二绝缘片之间包括一充填材料层。 In accordance with one embodiment, the module is between the first sheet and the second insulating layer comprises a filler material. 此一大致上为树脂之材料是可密封电子元件。 This material is generally a resin encapsulated electronic component is.

附图说明 BRIEF DESCRIPTION

本发明可由以下一非限制性实施例的详细说明,并配合后面所附的图例,而获得更深入的了解。 The present invention is described in detail by the following non-limiting embodiment, the back conjunction with the accompanying illustrations, to obtain a better understanding.

图1是一托盘的整体视图,其中该托盘包括数个隔室,每一隔室容纳一应答器。 FIG 1 is an overall view of a tray, wherein the tray comprises a plurality of compartments, each compartment containing a transponder.

图2是一容纳应答器的板体的剖视图。 FIG 2 is a cross-sectional view of a receiving plate of the transponder.

图3是一显示容纳应答器的托盘的截面视图,其中该托盘是具有一第二片封闭该隔室。 FIG 3 is a cross-sectional view of a receiving tray transponder display, wherein the second tray is a sheet having the closed compartment.

图4是一显示图3的实施例,其中该第二片是热成型。 FIG 4 is a diagram showing embodiment 3 of the embodiment, wherein the second sheet is thermoformed.

图5是一显示具有两叠置的托盘的实施例。 FIG 5 is an embodiment of a display having two stacked trays.

图6是一显示具有辅助性片的实施例。 FIG 6 is an exemplary embodiment of an auxiliary display piece.

图7是一显示组件在经过加压之后的截面视图。 7 is a sectional view of a display assembly after pressurization.

图8是一显示组件在加压数个叠置片之后的截面视图。 8 is a sectional view of a display assembly after pressurizing the number of stacked sheets.

具体实施方式 detailed description

图1是显示一具有托盘状的第一绝缘片(1)的整体视图,其中该第一绝缘片(1)是构成用以调整及处理电子元件的基部构件,其具有隔室(2),每一隔室(2)是皆容纳一应答器(3)。 Figure 1 is a tray-like having a first insulating sheet (1) is an overall view, wherein the first insulating sheet (1) is configured to adjust the processing of the base member and the electronic component, having a compartment (2), each compartment (2) is both receiving a transponder (3). 一般而言,隔室(2)是配合其内容物的尺寸及形状。 Generally, the compartment (2) is in line with the size and shape of its contents. 在模块的制造方法中,该托盘如上所述是具有元件(3)。 In the manufacturing method of the module, which is described above, having a tray element (3). 此方法的两个步骤在于,首先,准备一第一片,然后,将元件正确地放置在该片上并加压之。 Step two of this method is that, first of all, a prepared first sheet, and then the element is correctly placed on the sheet and pressurized.

图2是沿着第一绝缘片(1)的剖面线AA所取的截面,其中该隔室(2)是容纳有应答器(3)。 FIG 2 is a cross-section (1) is a cross-sectional taken along line AA of a first insulating sheet, wherein the compartment (2) containing a transponder (3).

图3是显示简化方法的第一步骤,其包含将一第二片(4)叠置在第一绝缘片(1)上,以封闭所有容纳一应答器(3)的隔室(2)。 A first step of FIG. 3 is a simplified method, which comprises a second sheet (4) stacked on the first insulating sheet (1), to close all receive a transponder (3) of the compartment (2). 此第二片在其叠合于第一片(1)的内表面上是可包括一自粘层材料。 This second sheet is laminated on the inner surface of the first sheet (1) may comprise a self-adhesive layer material.

依照本方法的一实施例,在结合第二绝缘片(4)之前,该隔室是可充填树脂,以将电子元件(3)密封于其中。 In accordance with an embodiment of the method, prior to bonding the second insulating sheet (4), which compartment is filled with resin to the electronic component (3) sealed therein.

图4是显示一实施例,其中第二片(5)包括通过热成型所制成的隔室。 FIG 4 is an embodiment wherein the second sheet (5) comprises a compartment made of thermoformed. 这些隔室的尺寸是使得当第二片(5)叠置在第一片(1)上时,其可以套入至该调整元件(1)的隔室(2)中。 The size of these compartments is such that when the second sheet (5) superposed on the first sheet (1), to which can be set into the adjustment element (1) of the compartment (2). 此第二片(5)亦可以是电子元件的第二托盘,而其中的隔室是留空的。 This second sheet (5) may also be a second tray of electronic components, and wherein the compartment is left blank.

图5是显示另一实施例,其中容纳一电子元件(3、3′)的两托盘(1、1′)是叠置在一起。 5 is another embodiment in which a receiving electronic device (3,3 ') of two trays (1, 1') are stacked together. 第二托盘是由如图4所示的隔室片(5)所覆盖。 The second tray is covered by a compartment plate (5) as shown in FIG. 4. 此一实例是显示数个容纳有元件的托盘可以堆叠在一起,而使隔室可以彼此套合在一起。 An example of this is a plurality of trays accommodated elements may be stacked together, the compartment may be set together with each other. 最后一个托盘是由一包括隔室或未包括隔室(参考图3)的片所覆盖。 Finally, a tray is covered by a compartment (refer to FIG. 3) or a sheet comprising a compartment comprising.

举例来说,此类设计是可相当具有优点地应用于制造具有数个应答器的模块,其中每一应答器是以不同的频率来运作。 For example, such design is quite advantageously applied to the production module having a plurality of transponders, wherein each transponder to operate in a different frequency.

图6是显示在调整元件(1)与第二片(4)之间所增设的一片(6)。 FIG 6 is a (6) between (1) and the second sheet (4) of the additional adjusting element. 一辅助性片(7)亦可组装组件的相对表面上。 Opposite surface (7) may also be assembled assembly on a supporting sheet. 组装在模块表面上的辅助性片的数量并未有所限制。 The number of assembly on the surface of the module supporting sheet is not restricted. 其有助于增加针对特殊应用所需的模块的厚度及刚性。 Which helps to increase the thickness required for a specific application module and rigid. 中间片或最后所组合的诸片,是可包括在加压板中修剪之后作为装饰模块或作为辨识模块的片。 An intermediate sheet or sheets such that the final composition is trimmed after the pressing may include a plate or a sheet as a decorative module identification module. 再者,组成最终模块的外表面的一片或其他片是可包括一自粘材料的层体,以将模块粘附在任何支撑件的表面上。 Also, the final composition of the outer surface of the module is a sheet or other member may comprise a layer of self-adhesive material to the surface of any module is adhered to the support member. 在此例中,此一模块是构成,例如,一用以辨识一物件的电子标识。 In this embodiment, this module is constituted, for example, for identifying an electronic identification of an object.

在另一实施例中,所采用的片(4、5、6)是可包括透明区域,以是用以作为一视窗,以使应答器或元件的全部或部分可以被看到。 In another embodiment, the sheet (4,5,6) is employed may include a transparent region, so as for a window, so that the transponder, or all or part of elements can be seen. 在一实施例中,特定的中间片是可包括开口,其整体是由外部片的透明区域或完全透明的片所覆盖。 In one embodiment, a specific intermediate sheet may comprise an opening which is covered by the entire region of the outer sheet of transparent or completely transparent sheet. 这些开口是设置在元件所定位的位置,以便使元件可以完全、部分或散布在模块表面上的部分可以显现出来。 These openings are disposed at a position located element, so that the element can be fully, partially or spread on the surface portion of the module can be revealed. 此一特性使得可分辨出真正的应答器模块与未包括任何元件的仿制品。 This characteristic makes it possible to distinguish a true transponder module does not include any mimetic element.

在制造模块期间使用一充填树脂的实施例中,其可以是透明的,以使电子元件可以被看到。 Use of a resin is filled during manufacture of the module embodiment, which may be transparent, so that the electronic components can be seen. 此一安全性特征是可应用在例如进入许可控制设备中,其中该模块是作为诸如门票、名片卡预付卡。 This is a safety feature may be applied, for example into the admission control device, wherein the module such as tickets, cards prepaid card. 额外的标记、全息视图、商标等等,亦可加以模块来防止被剽窃。 Additional indicia, holographic view, trademarks, etc., may be used to prevent theft module.

图7是显示在热压该基板(1)、应答器(3)及回复片(4)之后的组件。 FIG 7 is a graph showing the assembly after hot pressing the substrate (1), the transponder (3) and the return sheets (4).

如此的产品是一种通过重叠两个将应答器(3)密封于其间的片(1、4)所制成的薄板。 Such a product by overlapping the two transponders (3) sealed therebetween a sheet (1,4) made of a thin plate. 该电子模块接着便可依照预定的轮廓而沿着分隔该隔室的区域(D)来切割成板片。 The electronic module can then be of the region of compartment (D) in accordance with a predetermined profile along the partition plate to cut. 该片是可在加压之后来模制元件,因为其具有很小的厚度。 The film thickness is small in the later pressing of the molding element, because it has. 举例来说,此类实施方式是适用于用以粘附在物体上的标签。 For example, such embodiments are suitable for adhering the label on the object.

图8是显示在热加压数个叠置在每一表面(1、4、5、6、7)上的薄片的后所形成的组件,其中在每一片之间是设置有应答器(3)。 FIG 8 is a graph showing the heat pressing assembly formed after several sheets superposed on each surface (1,4,5,6,7), wherein the transponder (3 between each one is provided with ). 如此所制成的产品是一种具有平坦表面的较厚、较坚硬的板片。 The product thus formed is a flat surface having a thicker, more rigid sheet. 此一实施例是可应用于例如名片卡、钥匙或智能卡。 This embodiment is applicable, for example, business cards, or smart card key.

在模块的制造方法中所采用的所有绝缘片是可包括开口(开孔、凹槽)和/或释放结构(凹沟、槽道、浮凸),以在加压操作期间用以排出困在隔室中的空气。 All insulating sheet module manufacturing method is employed may include an opening (aperture, recess) and / or release configuration (grooves, channels, embossments), during the pressing operation in order to discharge trapped compartment air. 实际上,空气是经由开口和/或者是由于释放结构而横向通过板片边缘而散逸,这可以避免在模块的表面上产生不当的气泡。 In fact, the air via the openings and / or due to the release structure and dissipated through the lateral edge of the plates, which avoids undue generation of bubbles on the surface of the module.

在充填树脂以制造模块的实施例中,绝缘片的开口或释放结构,亦可用以在加压期间将多余的树脂抽取出来。 In order to manufacture the resin filled, the opening or release of the structure of the insulating sheet, can be extracted for excess resin during the pressing of the module embodiment.

Claims (22)

  1. 1.电子模块的制造方法,该电子模块具有:至少一电子元件(3),所述电子元件(3)被送至一托盘上,所述托盘用以处理电子元件且包括隔室(2);及一第二绝缘片;该方法的特征在于以下的步骤:-将构成一第一绝缘片(1)的隔室托盘放置在一工件表面上,所述每一隔室(2)容纳至少一电子元件(3);-将所述第二绝缘片(4)叠置在所述第一绝缘片上,从而封闭容纳所述电子元件(3)的隔室(2);-依照包括所述第一绝缘片(1)的至少一隔室(2)的轮廓来切割所述该模块。 1. A method for producing an electronic module, the electronic module comprising: at least one electronic component (3), said electronic component (3) is supplied on a tray, the tray and the electronic components for processing comprises a compartment (2) ; and a second insulating substrate; the method being characterized by the steps of: - constituting a first insulating sheet (1) compartment tray placed on a surface of the workpiece, each of said compartments (2) receiving at least an electronic component (3); - said second insulating sheet (4) superposed on said first insulation sheet so as to close the accommodating electronic component (3) of the compartment (2); - comprising accordance with the profile of the first insulating sheet (1) at least one compartment (2) to cut the said module.
  2. 2.如权利要求1所述的方法,其特征在于,所述第二绝缘片(4)在用以叠合至所述第一绝缘片(1)的表面上包括自一粘性材料层。 2. The method according to claim 1, wherein said second insulating sheet (4) comprises a layer of adhesive material on the self-laminated to the first surface for insulating sheet (1).
  3. 3.如权利要求1所述的方法,其特征在于,由将所述第二绝缘片(4)叠置在所述第一绝缘片(1)上所构成的组件的热加压步骤是通过一施加在所述第二绝缘片(4)上的加压板来予以实施的。 3. The method according to claim 1, characterized in that the said second insulating sheet (4) superposed on the heat pressing step assembly (1) constituted by the first insulating sheet a second insulating sheet is applied to the pressing plate (4) to be implemented.
  4. 4.如权利要求1所述的方法,其特征在于,在将所述第二绝缘片(4)叠置之前,一充填材料被导入至容纳所述电子元件的隔室中,所述材料封装所述电子元件。 4. The method according to claim 1, characterized in that, prior to the second insulating sheet (4) are stacked, a filler material is introduced into the compartment accommodating the electronic element, the encapsulating material the electronic component.
  5. 5.如权利要求1所述的方法,其特征在于,所述第二绝缘片包括隔室,在将所述第二片叠置至所述第一片(1)时,所述隔室嵌入到所述第一绝缘片(1)的隔室(2)中。 5. The method according to claim 1, wherein said insulating sheet comprises a second compartment, in the second sheet superposed to the first sheet (1), embedded in the compartment to the first insulating sheet (1) of the compartment (2).
  6. 6.如权利要求5所述的方法,其特征在于,所述第二片(5)构成电子元件(3)处理的一第二托盘,而所述第二托盘的隔室并未容纳电子元件。 6. The method according to claim 5, wherein said second sheet (5) constitutes a second tray of electronic components (3) treated, and said second tray is not receiving an electronic component compartment .
  7. 7.如权利要求1至6所述的方法,其特征在于,至少一辅助性片(6、7)被放置在所述第一和/或第二片(4、5)上,所述辅助性片是用作模块的装饰件和/或加强件。 7. The method according to claim 16, characterized in that at least one auxiliary sheet (6, 7) is placed on the first and / or second sheets (4,5), said auxiliary decorative sheet and / or as reinforcement module.
  8. 8.如权利要求1所述的方法,其特征在于,多个容纳有电子元件(3、3′)的隔室托盘(1、1′)被堆叠在一起,一托盘的隔室(2)是可嵌入前一个托盘的隔室中,所述堆叠件被一片(4、5)所覆盖,以密封该堆叠件的最后一托盘的隔室。 8. The method according to claim 1, wherein receiving the plurality of electronic components (3,3 ') of a compartment tray (1, 1') are stacked together, a compartment tray (2) may be embedded in a front compartment of a tray, the stack is a (4,5) is covered to seal the last stack tray compartment.
  9. 9.如权利要求3所述的方法,其特征在于,构成所述组件的片包括开口和/或释放结构,在加压操作期间,所述开口和/或结构确保排出围困在所述隔室(2)中的空气。 9. The method according to claim 3, characterized in that said sheet constituting the assembly comprises an opening and / or release configuration, during the pressing operation, the and / or trapped in the structure of the discharge opening ensures the compartment (2) air.
  10. 10.如权利要求3和9所述的方法,其特征在于,所述开口和/或释放结构确保在加压操作期间将过量的充填材料排出所述隔室(2)。 And 10. The method according to claim 39, characterized in that the opening and / or release configuration ensures that during the pressing operation the excess filler material discharge compartment (2).
  11. 11.电子模块,其包括一组件,所述组件具有一第一绝缘片(1)、至少一电子元件(3)及一第二绝缘片(4、5),所述电子模块特征在于,所述第一绝缘片(1)由一包括隔室(2)的电子元件处理托盘构成,其中,每一隔室容纳至少一电子元件(3)。 11. The electronic module comprising an assembly, said assembly having a first insulating sheet (1), at least one electronic component (3) and a second insulating sheet (4, 5), characterized in that the electronic module, the said first insulation sheet (1) comprising a compartment (2) constituting the electronic component processing tray, wherein each compartment contains at least one electronic component (3).
  12. 12.如权利要求11所述的模块,其特征在于,所述模块在所述第一及第二绝缘片之间包括一充填材料层,所述材料封装所述电子元件(3)。 12. The module of claim 11, wherein said module between the first sheet and the second insulating layer comprises a filler material, said material encapsulating the electronic component (3).
  13. 13.如权利要求11和12所述的模块,其特征在于,至少一辅助性片(5、6、7)被组装于所述模块的一个或其他表面上,所述辅助性片能够包括一装饰件。 Modules 11 and 12 according to claim 13, characterized in that at least one auxiliary sheet (5,6,7) is incorporated in said module on one or other surfaces of the sheet can include an auxiliary Garnish.
  14. 14.如权利要求11至13所述的模块,其特征在于,所述第二绝缘片由电子元件的一第二处理托盘构成,所述第二片的隔室插入所述第一片的隔室中,所述第二片的隔室没有电子元件。 14. The module according to claim 11 13, wherein said second insulating sheet is constituted by a second processing tray electronic component, said second compartment is inserted into the spacer sheet of the first sheet chamber, said second compartment sheet is not an electronic component.
  15. 15.如权利要求11至14所述的模块,其包括一堆绝缘片(1、1′),它们由电子元件的处理托盘构成,所述托盘的隔室互相嵌合,被嵌合的片的每一隔室容纳有一元件(3、3′),所述堆叠件的被嵌合的片被一第二片(4、5)所覆盖。 15. The module according to claim 1114, which comprises a stack of insulating sheets (1, 1 '), they are constituted by the electronic processing tray member, the tray compartments fitted together, the fitted sheet each compartment has a receiving element (3,3 '), said stack being fitted sheet member is covered by a second sheet (4, 5).
  16. 16.如权利要求11所述的模块,其特征在于,所述绝缘片(1、4)中的一个和/或另一个包括一装饰件,所述装饰件用作模块的辨识标记。 16. The module of claim 11, wherein said insulating sheet (1,4) in one and / or other identifying mark comprises a module as trim, the trim.
  17. 17.如权利要求11至16所述的模块,其特征在于,所述绝缘片(1、4、5、6、7)的厚度决定所述模块的最终厚度及刚性。 17. The module according to claims 11 to 16, wherein a thickness of said insulating sheet (1,4,5,6,7) determines the final thickness and rigidity of the module.
  18. 18.如权利要求11至17所述的模块,其特征在于,所述绝缘片(1、4、5、6、7)包括开口和/或释放结构,以便在制造所述模块时的加压操作期间,排出空气和/或过量的充填材料。 18. The pressure module according to claims 11 to 17, wherein said insulating sheet (1,4,5,6,7) including an opening and / or release configuration, so that the production of the module during operation, discharge air and / or excess filler material.
  19. 19.如权利要求11至18所述的模块,其特征在于,所述绝缘片(1、4、5、6、7)包括用作窗口的透明区域,以使所有或部分的电子元件(3)可见,所述元件的可视性可作为鉴识所述模块之用。 19. The module according to claim 1118, wherein said insulating sheet (1,4,5,6,7) comprises a transparent region is used as a window, so that all or part of the electronic components (3 ) visible, the visibility of the element can be used as a module of the forensics.
  20. 20.如权利要求12至19所述的模块,其特征在于,所述充填材料是透明的,以确保所述电子元件的可视性。 Module 12 to claim 20. 19, characterized in that said filling material is transparent, in order to ensure the visibility of the electronic component.
  21. 21.如权利要求11至20所述的模块,其特征在于,所述绝缘片(1、4、5、6、7)在所述电子元件(3)被安置的区域中包括开口,所述开口被所述辅助性片(5、6、7)的透明区域所覆盖,该区域可占据整个或部分辅助性片,并且构成窗口,以使整个或部分电子元件(3)显现出来,所述辅助性片被施加于所述模块的一个和/或另一个表面上。 21. The module of claim 20 to claim 11, wherein said insulating sheet (1,4,5,6,7) are arranged in the region of the electronic component (3) comprises an opening, the the opening is covered by said auxiliary sheet (5,6,7) of the transparent region which may occupy the entire or part of the auxiliary sheet, and constitute the window, so that the entire or part of an electronic element (3) emerge, said the auxiliary sheet is applied to the one module and / or the other surface.
  22. 22.如权利要求11至21所述的模块,其特征在于,构成所述模块的外表面的绝缘片中的一个包括一自粘材料层,用以将所述模块固定在一支撑件的表面上。 22. The module according to claim 1121, wherein an outer surface of an insulating sheet constituting the module comprising a layer of self-adhesive material for fixing the module on a surface of the support member on.
CN 02824806 2001-12-11 2002-12-10 Low-cost electronic module and method for making same CN1602235A (en)

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US8316535B2 (en) * 2002-10-11 2012-11-27 Nagraid Sa Electronic device comprising a visible electronic element connected to an internal module and manufacturing process of such a device
CN100481121C (en) * 2002-10-11 2009-04-22 纳格雷德股份有限公司 Electronic module comprising an element exposed on one surface and method for making the same
US20080105751A1 (en) * 2006-10-31 2008-05-08 Steven Landau Powered Authenticating Cards
WO2008054715A3 (en) * 2006-10-31 2009-05-07 Solicore Inc Powered print advertisements, product packaging, and trading cards
US7967214B2 (en) * 2006-12-29 2011-06-28 Solicore, Inc. Card configured to receive separate battery
US8181879B2 (en) * 2006-12-29 2012-05-22 Solicore, Inc. Mailing apparatus for powered cards
WO2010070964A1 (en) * 2008-12-16 2010-06-24 株式会社村田製作所 Circuit module and method for managing same
JP2012160216A (en) * 2012-05-30 2012-08-23 Toshiba Corp Non-contact type reader/writer

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US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
US5631447A (en) * 1988-02-05 1997-05-20 Raychem Limited Uses of uniaxially electrically conductive articles
DE19516250C1 (en) * 1995-04-26 1996-07-04 Mannesmann Ag Method for joining silicon glass micro-mechanical pressure sensor to connecting piece for pipelines
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US20050085005A1 (en) 2005-04-21 application

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