A kind of orientation silicon steel as thin as a wafer with manufacture method
Technical field
The invention belongs to the sheet metal strip rolling technical field, particularly a kind of grain-oriented silicon-iron as thin as a wafer with manufacture method.
Background technology
Silicon steel is electric power, motor, the indispensable critical function material of electron trade, and grain-oriented silicon-iron mainly is used as the soft magnetic materials of iron cores such as technical machinery, transformer.Along with the development of electronics industry, more and more stricter to the requirement of silicon steel sheet.From energy-conservation viewpoint, always wish to improve magnetic strength, reduce iron loss.Since 1970, the iron loss of orientation silicon steel sheet constantly reduces especially, and output and quality all improve a lot, but the iron loss of silicon steel plate still has the leeway of further attenuating, and the major measure that improve magnetic strength at present, reduces iron loss has:
(1) improves (110) [001] degree of grain alignment;
(2) increase silicon content;
(3) attenuate thickness of slab;
(4) refinement magnetic domain.
At present the high magnetic induction grain-oriented silicon steel on the international market<001〉crystal axis with the degree of orientation of rolling direction 3 spend in, the limit has roughly been arrived in the raising of its degree of orientation.In addition, along with the increase of silicon content, mechanical strength increases, and processes more difficultly, and saturation induction density also more reduces.About also positive practicability of method such as refinement magnetic domain and additional tension film, laser scored, plasma treatment.Focused on attenuate thickness of strips aspect so realize the effort of low iron lossization.With the attenuate of thickness of strips, iron loss then reduces greatly owing to geometric effect.
Oriented silicon steel band is as new just known dawn of low iron loss material as thin as a wafer, and its core loss value is lower than known iron-based non-crystalline material after the refinement magnetic domain.But the manufacture method that adopts original orientation silicon steel secondary recrystallization be can not guarantee 110}<001〉growth fully of crystallization texture, the finished product thickness of producing orientation silicon steel thin belt has a limit, generally is about about 0.15mm.When being lower than this thickness, the secondary recrystallization of finished product is imperfection very, and secondary recrystallization does not perhaps take place, the magnetic extreme difference of finished product.Produce orientation silicon steel as thin as a wafer so must adopt new method.
The manufacture method that silicon steel strip usually adopts is: have the oriented silicon steel band of secondary recrystallization of the goss texture of (110) [001] by making, pickling is cold rolled to below the 0.15mm synchronously, and then recrystallization annealing temperature improves (110) [001] degree of orientation.Though can make silicon steel strip with the method, because silicon steel sheet fragility is big, give the cold rolling very big difficulty of bringing, raw edges, broken belt, curling round the roll accident often take place, influence operating rate and hourly output, also influence cost, magnetic property is not high, and very unstable.
Summary of the invention
In view of the technical problem that above-mentioned production silicon steel strip method exists, the invention provides a kind of grain-oriented silicon-iron as thin as a wafer with manufacture method.
Cold-rolled orientation silicon steel of the present invention as thin as a wafer with manufacture method be to adopt the method for asymmetrical rolling and primary recrystallization annealing.Adopt asynchronous rolling method to replace the rolling synchronously of routine.Asymmetrical rolling is as a new rolling mill practice and technology, rolling incomparable advantage is synchronously arranged, reduce draught pressure significantly, can increase work efficiency, improve production quality and improve the product size precision, improve plate shape, improved the thin ability of rolling of milling train, make minimum rolled thickness break the limit of D/h<1500~2000 in the past, and reached more than 20000, as thin as a wafer the band rolling aspect significant advantage is arranged.
Technical scheme of the present invention is: raw material is the common finished product industry of a 3%Si directional silicon steel, adopt the secondary cold-rolling method, the position, (110) [001] that utilization has formed in the secondary recrystallization high annealing is to texture, raw thickness 0.28~0.35mm, reasonable raw material thickness will guarantee that reasonably cold rolling total reduction ratio is between 50%~80%; The inventive method comprises pickling, asynchronous cold rolling, coating and four processing steps of recrystallization annealing: raw material after pickling, enter asynchronous cold rolling, asynchronous speed ratio: I=1.05~1.3, front and back belt tension force.The size of asynchronous speed ratio decision detrusion influence distortional strain energy, influences recrystallization process, and cold rolling one-tenth 0.06~0.1mm is with as thin as a wafer, at this moment (110) [001] to texture change into 111}<112〉cold rolling texture; Band as thin as a wafer after rolling is coated with the MgO coating, and through having the primary recrystallization annealing of different protective atmospheres, annealing atmosphere of the present invention is: vacuum, pure hydrogen, nitrogen hydrogen compound gases, hydrogen shield add magnetic-field annealing, and annealing atmosphere is the key that forms goss texture; The recrystallization annealing temperature is in 700~980 ℃ of scopes, this temperature can guarantee silicon steel strip generation primary recrystallization, and temperature retention time 10~60min fully grows up the crystal grain of primary recrystallization, the grain size that obtains is 0.5~2mm, the magnetic property of silicon steel strip is reached: B
10Between 1.90~1.98T, P
15/400=11~14W/Kg.
Manufacture method of the present invention has not only solved the problem that silicon steel strip is difficult to produce, and the silicon steel strip magnetic property of producing is high and stable simultaneously, and the lumber recovery height is saved cost, is to produce orientation silicon steel to be with practicable approach as thin as a wafer.
The present invention compared with prior art has following advantage and characteristics:
(1) produces orientation silicon steel as thin as a wafer with the attenuate that not only helps silicon steel plate thickness with asynchronous rolling method, and required rolling pass is few, and reduction ratio is big, and draught pressure is low, reduce the generation of broken limit and belt phenomenon for crisp and hard silicon steel plate, improved lumber recovery.
(2) with synchronous rolling comparing, with obtaining to be orientated concentrated (110) [001] texture, magnetic property generally is better than synchronously rolling the orientation silicon steel of asymmetrical rolling production as thin as a wafer, and magnetic property is stable.
(3) produce simply, save cost, economical and efficient, be fit to the silicon steel strip production status of China.
The specific embodiment
Embodiment 1:
Adopt the thick secondary recrystallization finished product orientation silicon steel of 0.3mm as raw material, its chemical composition be (mass fraction, %): C0.02, Si3.12, Mn0.12, S0.02, Cu0.01, N0.01, P0.02, surplus Fe.Pickling on the asynchronous cold-rolling mill 90mm/200mm * 200mm of four rollers, adopts asynchronous speed ratio 1.05 rolling modes to be cold rolled to 0.06mm respectively, at N after removing surface insulation layer
2+ H
2Carry out 950 ℃ in (1: 3) mixed atmosphere annealing furnace, 10 minutes annealing.Adopt ring-shaped sample to measure the magnetic property of annealing back strip.B
10At 1.93T, P
15/400=13W/Kg.
Embodiment 2:
Adopt the thick secondary recrystallization finished product orientation silicon steel of 0.3mm as raw material, its chemical composition be (mass fraction, %): C0.01, Si3.10, Mn0.085, S0.03, Cu0.01, N0.001, P0.009, surplus Fe.Pickling on the asynchronous cold-rolling mill 90mm/200mm * 200mm of four rollers, adopts asynchronous speed ratio 1.17 rolling modes to be cold rolled to 0.08mm respectively after removing surface insulation layer, carries out 850 ℃ in pure hydrogen annealing stove, 20 minutes annealing.Adopt ring-shaped sample to measure the magnetic property of annealing back strip.B
10At 1.98T, P
15/400=14W/Kg.
Embodiment 3:
Adopt the thick secondary recrystallization finished product orientation silicon steel of 0.3mm as raw material, its chemical composition be (mass fraction, %): C0.02, Si3.13, Mn0.06, S0.002, Cu0.01, N0.004, P0.01, surplus Fe.Pickling on the asynchronous cold-rolling mill 90mm/200mm * 200mm of four rollers, adopts asynchronous speed ratio 1.28 rolling modes to be cold rolled to 0.10mm respectively after removing surface insulation layer, carries out 750 ℃, 30 minutes annealing in pure hydrogen externally-applied magnetic field annealing furnace.Adopt ring-shaped sample to measure the magnetic property of annealing back strip.B
10At 1.94T, P
15/400=11W/Kg.
Embodiment 4:
Adopt the thick secondary recrystallization finished product orientation silicon steel of 0.35mm as raw material, its chemical composition be (mass fraction, %): C0.02, Si3.13, Mn0.06, S0.002, Cu0.01, N0.004, P0.01, surplus Fe.Pickling on the asynchronous cold-rolling mill 90mm/200mm * 200mm of four rollers, adopts asynchronous speed ratio 1.12 rolling modes to be cold rolled to 0.10mm respectively, in vacuum annealing furnace (vacuum 1 * 10 after removing surface insulation layer
-3) in carry out 900 ℃, 10 minutes annealing.Adopt ring-shaped sample to measure the magnetic property of annealing back strip.B
10At 1.92T, P
15/400=13W/Kg.