CN1559882A - Fork type micromechanical gyro and its manufacturing method - Google Patents

Fork type micromechanical gyro and its manufacturing method Download PDF

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CN1559882A
CN1559882A CNA2004100169302A CN200410016930A CN1559882A CN 1559882 A CN1559882 A CN 1559882A CN A2004100169302 A CNA2004100169302 A CN A2004100169302A CN 200410016930 A CN200410016930 A CN 200410016930A CN 1559882 A CN1559882 A CN 1559882A
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substrate
electrode
mass
bar shaped
driving
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CN1278922C (en
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车录锋
熊斌
王跃林
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Shanghai Institute of Microsystem and Information Technology of CAS
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Shanghai Institute of Microsystem and Information Technology of CAS
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Abstract

A fork-type micromechanical gyro is composed of the first base plate, 4 groups of fixed strip electrode pairs for driving purpose, a central and two side archor points and the second base plate suspended above the first base plate. Said second base plate has symmetrical two driving mass blocks, the first elastic beam for connecting the central anchor point to the driving mass block, the second elastic beam for connecting two side archor points to the driving mass block, the coupling elastic beam between two driving mass blocks, two detecting mass blocks, and the connecting elastic beams between detecting mass block and driving mass block.

Description

A kind of sonic type micro mechanical scopperil and preparation method thereof
Technical field
The present invention relates to a kind of sonic type micro mechanical scopperil and preparation method thereof, relate to or rather a kind of device size the millimeter magnitude, with sonic type micro mechanical scopperil and preparation method that variable-area capacitive realize to drive and detects, belong to the microelectromechanical systems field.
Background technology
The silicon micromechanical gyroscope that utilizes the micro mechanical technology manufacturing to form is compared with traditional gyro, have that volume is little, in light weight, cost is low, reliability is high, produce in batches and easily and advantage such as electronic circuit is integrated, can be widely used in many fields such as Aeronautics and Astronautics, weapon, automobile, medical science, have huge market potential, become an important directions of inertia gyroscope development at present.The silicon micromechanical gyroscope of various structures emerges in an endless stream in the world now, and their common feature is that mutually perpendicular two direction of vibration, the i.e. responsive direction of vibration that vibrational excitation direction and coriolis force cause are arranged.
The type of drive that micromechanical gyro adopts usually has static to drive and electromagnetic drive mode.The static type of drive normally utilizes the electrostatic attraction between the two arrays of electrodes to realize.And electromagnetic drive mode mainly is to utilize Lorentz force to realize, driving amplitude is bigger, but will adopt bigger drive current, and big power consumption causes device heating easily, thereby influences performance; The manufacture craft more complicated will be made insulating barrier in addition.The detection mode of gyro mainly contains pressure drag and detects and capacitance detecting, and the pressure drag detection has bigger temperature coefficient, thus poor-performing.Wherein static drives, the silicon micromechanical gyroscope of capacitance detecting is because manufacture craft realizes characteristics such as temperature coefficient is little and being widely adopted easily.The detection mode of micromechanical gyro generally adopts the interdigitated capacitance detecting, detect angular velocity signal by the variable in distance between interdigited electrode, its advantage is simple in structure, but exist very big press-filming damping between the interdigital electrode of interdigital capacitor, make its quality factor (Q value) very low (having only 10-20), this has limited the raising of micromechanical gyro sensitivity, generally need work under vacuum state, has increased the difficulty and the cost of encapsulation.
The micromechanical gyro (utility model patent that we once proposed with strip electrode structure, ZL99239775.8) efficiently solve the problem of press-filming damping in the system, though this gyro can be realized encapsulation under the atmosphere, but be subjected to the interference of paraxonic acceleration signal easily, and adopt same mass both as driving mass, as detecting mass, cause mechanical couplings easily again, reduce resolution ratio.Desire of the present invention proposes to be modified into a kind of sonic type micro mechanical scopperil, drive mass and detect mass separately, reduced mechanical couplings, driving direction and detection side to all having higher Q value (greater than 1000), can under atmosphere, work, can realize inhibition that the paraxonic acceleration signal is disturbed from structure, thereby draw purpose of the present invention.
Summary of the invention
The object of the present invention is to provide a kind of sonic type micro mechanical scopperil and preparation method thereof, is a kind of simple, highly sensitive micromechanical gyro of manufacture craft that has.
Micromechanical gyro provided by the invention be characterised in that by first substrate and on four groups drive with bar shaped fixing to electrode and two groups detect with bar shaped fixing to electrode, be fixed on middle anchor point and both sides anchor point on first substrate, second substrate that is suspended in above first substrate forms; Second substrate mainly comprise be suspended in first substrate top can be along the identical and symmetrical driving mass of two structures of driving direction vibration, first spring beam that middle anchor point is connected with the driving mass, second spring beam that the both sides anchor point is connected with the driving mass, connect two coupling spring beams that drive mass, what be suspended in first substrate top can detect masses to two that vibrate along the detection side perpendicular to driving direction, detecting mass forms with the spring beam that is connected that drives between the mass.
Described each driving mass all is anchored together by four spring beams and first substrate, and each detects mass and all is connected with the driving mass by four spring beams.
Described driving mass is made up of with the frame that is connected movable bar shaped drive electrode movable bar shaped drive electrode.
Described detection mass is made up of with the frame that is connected movable bar shaped detecting electrode movable bar shaped detecting electrode.
Driving on the described movable bar shaped drive electrode and first substrate is fixing to gaps between electrodes with bar shaped, and is fixing identical to gaps between electrodes with bar shaped with the detection on the movable bar shaped detecting electrode and first substrate, all is not less than 1 micron.
On described first substrate two groups detect with bar shaped fixing to electrode respectively preceding two groups drive with bar shaped fixing to electrode between and two groups of backs drive with bar shaped fixing to electrode between.
Each strip electrode of described movable bar shaped drive electrode be positioned at every group drive with fixing to electrode pair answer strip electrode right directly over, each strip electrode of movable bar shaped detecting electrode be positioned at every group detect with fixing to electrode pair answer strip electrode right directly over.
Between the described driving mass and first substrate, detect between the mass and first substrate and be slide-film damping; Drive mass and detect mass separately, adopt variable-area capacitive to realize driving and detecting.
The objective of the invention is to adopt micro-electronic mechanical system technique to make, concrete steps are:
(1) uses the insulating materials glass substrate as first substrate, but be not limited to glass substrate, also can select for use the surface that the silicon chip substrate of thermal oxide layer is arranged.Upper surface at first substrate is fixing to electrode with bar shaped by four groups of drivings that evaporation or sputter form aluminum, and two groups are detected with bar shaped fixing to electrode;
(2) select the conductive material silicon chip for use, as second substrate.Utilize alkaline aqueous solution to form the gap in the lower surface corrosion of silicon chip;
(3) lower surface of the upper surface of described first substrate and described second substrate bonding in opposite directions;
(4) etching second substrate, form can be along two structures of driving direction the vibration identical and symmetrical driving mass be suspended in first substrate top, be suspended in first substrate top can along perpendicular to the detection side of driving direction to two of vibration detect masses, be fixed on middle anchor point on first substrate and both sides anchor point, middle anchor point with drive first spring beam, the both sides anchor point that mass is connected and drive the spring beam that is connected between second spring beam, the coupling spring beam that is connected two driving masses, detection mass and the driving mass that mass is connected.
In sum, can realize according to the present invention by first substrate and on four groups drive with bar shaped fixing to electrode and two groups detect with bar shaped fixing to electrode, be fixed on middle anchor point and both sides anchor point on first substrate, be suspended in the micromechanical gyro that second substrate above first substrate is formed; Second substrate mainly comprise be suspended in first substrate top can be along the identical and symmetrical driving mass of two structures of driving direction vibration, first spring beam that middle anchor point is connected with the driving mass, second spring beam that the both sides anchor point is connected with the driving mass, connect two coupling spring beams that drive mass, what be suspended in first substrate top can detect masses to two that vibrate along the detection side perpendicular to driving direction, detect mass and the spring beam that is connected that drives between the mass.
The micromechanical gyro of tuning-fork type structure provided by the invention is realized driving and detecting with variable-area capacitive, have two and detect mass, thereby can eliminate the interference that extraneous acceleration signal that the detection side makes progress causes, improved the anti-interference of system, and angular velocity signal is a difference mode signal, and sensitivity doubles.Drive mass and detect mass separately, help reducing to drive the coupling between mode and the responsive mode, improved resolution ratio.The present invention utilizes variable-area capacitive to realize to the driving of movable mass with to the detection of angular velocity signal, make the damping that drives mode and detect mode be slide-film damping, much smaller than press-filming damping, improved the quality factor that drives mode and detect mode greatly, thus the sensitivity that can improve device effectively.In fixing electrode with bar shaped, driving applies the combined-voltage of certain frequency, each strip electrode of movable bar shaped drive electrode and the driving under it are fixing to producing the static driving force of alternation between the electrode with bar shaped, under the effect of this electrostatic force, drive two identical and symmetrical driving masses of structure and make anti-phase harmonic moving, when when external angular velocity being arranged perpendicular to the device plane direction, two detect mass be subjected to the effect of Coriolis (complementation) acceleration along perpendicular to the detection side of driving direction to making anti-phase motion.When movable bar shaped detecting electrode had displacement, movable bar shaped detecting electrode and the detection under it changed with the fixing Differential Detection electric capacity overlapping area that electrode is constituted, thereby caused that detecting electric capacity changes.Therefore Differential Detection capacitance variations and the proportional relation of extraneous angular speed by measuring the Differential Detection capacitance variations, just can obtain the size of extraneous angular speed.Gyro novel structure of the present invention, manufacture craft is simple, helps reducing cost and improving yield rate, and is highly sensitive, is a kind of micromechanical gyro that can practical application.
Further illustrate substantive distinguishing features of the present invention and marked improvement below by description of drawings and embodiment, but the present invention only limits to the embodiment that introduced by no means.
Description of drawings
Fig. 1 drives on first substrate and detects with bar shaped and fix the electrode schematic diagram.
Fig. 2 is the vertical view of micromechanical gyro structure.
Fig. 3 is a micromechanical gyro manufacture craft flow chart.
(a) first upper surface of base plate forms four groups and drives and skewer is surveyed with bar shaped fixing to the electrode and the schematic diagram that goes between among the figure
(b) the gap schematic diagram that corrosion forms on second substrate
(c) first upper surface of base plate and second base lower surface bonding schematic diagram in opposite directions
(d) on second substrate, finish whole micromechanics behind the bonding and make schematic diagram
The specific embodiment
Following examples are set forth the substantial characteristics and the marked improvement of the sonic type micro mechanical scopperil that the present invention relates to and preparation method thereof, but the present invention only is confined to the embodiment that introduces by no means.
Embodiments of the invention relate to a kind of micromechanical gyro, in conjunction with the accompanying drawings 1 and Fig. 2 describe.As shown in Figure 1, being formed with four groups on first substrate 1 drives with bar shaped fixing to electrode 1a, 1b, drive fixed electrode lead-in wire 3a, 3b, two groups are detected with bar shaped fixing to electrode 2a, 2b, detect fixed electrode lead-in wire 4a, 4b, middle anchor point contact conductor 14, both sides anchor point contact conductor 13, and two groups detect with bar shaped fixing to electrode 2a, 2b respectively preceding two groups drive with bar shaped fixing to electrode 1a, 1b between and two groups of backs drive with bar shaped fixing to electrode 1a, 1b between.As shown in Figure 2, the middle anchor point 4 and the both sides anchor point 5 that link to each other with second substrate 12 are fixed on first substrate 1, and second substrate 12 that is suspended in first substrate, 1 top drives masses 2, two by identical and symmetrical two of structure and drives coupling spring beam 3 between the mass, drives first spring beam 6 between mass 2 and the middle anchor point 4, drives second spring beam 7 between mass 2 and the both sides anchor point 5, is suspended in two of first substrate, 1 top and detects masses 8, detection mass 8 and constitute with the spring beam 9 that is connected between the driving mass 2.Drive mass 2 and comprise movable bar shaped drive electrode 10, detect mass 8 and comprise movable bar shaped detecting electrode 11.Each strip electrode of movable bar shaped drive electrode 10 be positioned at every group drive with fixing to the corresponding strip electrode of electrode 1a, 1b right directly over.Each strip electrode of movable bar shaped detecting electrode 11 be positioned at every group detect with fixing to the corresponding strip electrode of electrode 2a, 2b right directly over.Driving on the movable bar shaped drive electrode 10 and first substrate 1 is with fixing the gap between electrode 1a, the 1b, and is identical to the gap between electrode 2a, the 2b with fixing with the detection on the movable bar shaped detecting electrode 11 and first substrate 1, all is not less than 1 micron.
The preparation method of the micromechanical gyro that present embodiment relates to describes with reference to process chart shown in Figure 3, mainly comprises following processing step:
(a) select for use the insulating materials glass substrate as first substrate 1, but be not limited to glass substrate, also can select for use the surface that the silicon chip substrate of thermal oxide layer is arranged.Upper surface at first substrate 1 is fixing to electrode 1a, 1b with bar shaped by four groups of drivings that evaporation or sputter form aluminum, and two groups are detected with bar shaped fixing to electrode 2a, 2b.(Fig. 3 (a))
(b) select the conductive material silicon chip for use, as second substrate 12.Utilize alkaline aqueous solution to form the gap in the lower surface corrosion of silicon chip 12.(Fig. 3 (b))
(c) with the lower surface of the upper surface of first substrate 1 and second substrate 12 bonding in opposite directions; (Fig. 3 (c))
(d) utilize silicon deep etching technology (DRIE) etching second substrate 12, form identical and symmetrical two of the structure be suspended in first substrate, 1 top and drive masses 2, two and drive coupling spring beam 3 between the mass, be fixed on middle anchor point 4 and both sides anchor point 5 on first substrate, drive first spring beam 6 between mass 2 and the middle anchor point 4, drive second spring beam 7 between mass 2 and the both sides anchor point 5, be suspended in and be connected spring beam 9 between two detection masses 8, detection masses 8 and the driving mass 2 of first substrate, 1 top.
By above processing step, produce the micromechanical gyro that the present invention relates to.In conjunction with Fig. 1 and Fig. 2 the working sensor principle is described.In driving fixed electrode lead-in wire 3a, 3b, apply the combined-voltage of certain frequency, each strip electrode of movable bar shaped drive electrode 10 and the driving under it are fixing to producing the static driving force of alternation between electrode 1a, the 1b with bar shaped, under the effect of this electrostatic force, drive two identical and symmetrical driving masses 2 of structure and make anti-phase harmonic moving along the direction of arrow (X-direction), when there is external angular velocity on the edge perpendicular to the device plane direction, produce the Coriolis acceleration in Y direction.Two are detected mass 8 and are subjected to the effect of Coriolis acceleration to make anti-phase motion along the direction of arrow (Y direction).Arbitrary strip electrode of movable bar shaped detecting electrode 11 with under corresponding a pair of detection fixing with bar shaped to electrode 2a, 2b formation detection capacitor C 1, C2, when movable bar shaped detecting electrode 11 has displacement, movable bar shaped detecting electrode 11 with its under corresponding detection with bar shaped is fixing overlapping area between electrode 2a, the 2b is changed, thereby cause detection capacitor C 1, C2 variation.Therefore Differential Detection capacitance variations (C1-C2) and the proportional relation of extraneous angular speed by measuring Differential Detection capacitance variations (C1-C2), just can obtain the size of extraneous angular speed.Total capacitance variations can obtain by middle anchor point contact conductor 14 or both sides anchor point contact conductor 13 and the capacitance variations that detects between fixed electrode lead-in wire 4a, the 4b.Because this gyro adopts the tuning-fork type structure, have two and detect masses, thereby can eliminate the interference that extraneous acceleration signal that the detection side makes progress causes, improved the anti-interference of system, and angular velocity signal is a difference mode signal, sensitivity can double.
As mentioned above, driving between the mass 2 and first substrate 1, detecting the damping that plays a major role between the mass 8 and first substrate 1 is slide-film damping, and slide-film damping is more much smaller than press mold damping, thereby can make driving direction and detection side to quality factor (Q value) can increase substantially (greater than 1000), detection sensitivity also correspondingly increases substantially, thereby has avoided Vacuum Package; The present invention simultaneously adopts micro-electronic mechanical system technique technology to make, and technology is simple, helps improving yield rate and reduces manufacturing cost.
When 3490 microns of driving mass length, 5700 microns of width, 5 pairs of driving strip electrodes are wide 80 microns, 80 microns of spacings.Detect 1850 microns of mass length, 4700 microns of width, 50 pairs of detection strip electrodes are wide 20 microns, 20 microns of spacings.10 pairs drive 64 microns of fixed electrode width, and spacing is 16 microns.100 pairs are detected 16 microns of fixed electrode width, 4 microns of spacings.Drive folded beam and middle 1500 microns of the folding beam lengths that connect, wide 40 microns, detect 650 microns of folding beam lengths, wide 16 microns, 300 microns of structural thicknesses.This Gyroscope Design drives model frequency and detects model frequency and is respectively 3106Hz, 3175Hz, and the Q value that drives and detect mode can reach 1721 and 1450 respectively.Driving voltage 10V direct current, 5V exchanges, and drives to drive model frequency, when input angular velocity is 1 °/s, detects capacitance change and is about 400aF.The minimum resolution of circuit can reach 20aF, and the minimum resolution of device can reach 0.05 °/s.

Claims (9)

1. sonic type micro mechanical scopperil is characterized in that:
(A) it by first substrate (1) and on four groups drive with bar shaped fixing to electrode (1a, 1b) and two groups detect with bar shaped fixing to electrode (2a, 2b), be fixed on middle anchor point (4) and both sides anchor point (5) on first substrate, second substrate (12) that is suspended in above first substrate (1) forms;
(B) second substrate comprises that mainly can be along two structures of driving direction vibration identical and symmetrical two drive masses (2), first spring beam (6) that middle anchor point (4) is connected with the driving mass, second spring beam (7) that both sides anchor point (4) is connected with driving mass (2), connect two coupling spring beams (3) that drive mass, can detect masses (8) to two that vibrate along detection side perpendicular to driving direction, detecting mass (8) forms with the spring beam (9) that is connected that drives between the mass (2);
(C) two groups on first substrate detect with bar shaped fixing to electrode (2a, 2b) respectively preceding two groups drive with bar shaped fixing to electrode (1a, 1b) between and the back drive for two groups fix electrode (1a, 1b) with bar shaped between;
2. sonic type micro mechanical scopperil according to claim 1, it is characterized in that each driving mass (2) is anchored together by four spring beams (9) and first substrate (1), each detects mass and all is connected with driving mass (2) by four spring beams (9).
3. sonic type micro mechanical scopperil according to claim 1 is characterized in that described driving mass (2) is made up of with the frame that is connected movable bar shaped drive electrode movable bar shaped drive electrode.
4. sonic type micro mechanical scopperil according to claim 1 is characterized in that described detection mass is made up of with the frame that is connected movable bar shaped detecting electrode movable bar shaped detecting electrode.
5. sonic type micro mechanical scopperil according to claim 1, it is characterized in that the driving on the movable bar shaped drive electrode and first substrate is fixing to gaps between electrodes with bar shaped, fixing identical with the detection on the movable bar shaped detecting electrode and first substrate to gaps between electrodes with bar shaped, all be not less than 1 micron.
6. sonic type micro mechanical scopperil according to claim 3, each strip electrode that it is characterized in that movable bar shaped drive electrode (10) be positioned at every group drive with fixing to the corresponding strip electrode of electrode (1a, 1b) right directly over, each strip electrode of movable bar shaped detecting electrode (11) be positioned at every group detect with fixing to the corresponding strip electrode of electrode (2a, 2b) right directly over.
7. the preparation method of sonic type micro mechanical scopperil according to claim 1 and 2, it is characterized in that driving between mass (2) and first substrate (1), detecting between mass (8) and first substrate (1) is slide-film damping; Drive mass and detect mass separately, the employing variable-area capacitive is realized driving and skewer is surveyed.
8. according to the preparation method of claim 1,2,3,4,5 or 6 described sonic type micro mechanical scopperils, it is characterized in that may further comprise the steps:
A) forming described four groups at the upper surface of first substrate by evaporation or sputtered aluminum drives with fixing electrode (1a, 1b) and two groups are detected with bar shaped of bar shaped and fixes electrode (2a, 2b);
B) utilize alkaline aqueous solution to form the gap at the lower surface of second substrate;
C) with the lower surface of the upper surface of described first substrate (1) and second substrate (12) bonding in opposite directions;
D) utilize silicon deep etching technology etching second substrate (12), form be suspended in first substrate (1) top can be along the identical and symmetrical driving mass (2) of two structures of driving direction vibration, what be suspended in first substrate top can detect masses (8) to two that vibrate along the detection side perpendicular to driving direction, be fixed on middle anchor point (4) and both sides anchor point (5) on first substrate, first spring beam that middle anchor point is connected with the driving mass, second spring beam that the both sides anchor point is connected with the driving mass, connect two coupling spring beams that drive mass, detect mass and the spring beam that is connected that drives between the mass.
9. the preparation method of sonic type micro mechanical scopperil according to claim 1 is characterized in that as first substrate (1) or is the insulating glass substrate, or there is the silicon chip substrate of thermal oxide layer on the surface; As second substrate (12) is conductive silicon chip.
CN 200410016930 2004-03-12 2004-03-12 Fork type micromechanical gyro and its manufacturing method Expired - Lifetime CN1278922C (en)

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CN1766528B (en) * 2005-11-11 2010-09-15 中北大学 Differential micro-mechanical gyro with higher sensitivity and band width
CN101319899B (en) * 2008-07-24 2010-11-10 北京大学 Capacitor type horizontal shaft micro-mechanical tuning fork gyroscope
CN101067555B (en) * 2007-06-08 2010-11-10 北京航空航天大学 Force balancing resonance micro-mechanical gyro
CN102009945A (en) * 2010-11-11 2011-04-13 北京自动化控制设备研究所 Method for machining micro-mechanical quartz tuning fork gyro sensitive structure
CN101368826B (en) * 2008-09-25 2011-04-27 中国人民解放军国防科学技术大学 Vibration isolation frame work decoupled silicon micro-gyroscope
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CN101443629B (en) * 2006-03-10 2015-12-02 大陆-特韦斯贸易合伙股份公司及两合公司 There is the speed probe of articulated beam
CN101067555B (en) * 2007-06-08 2010-11-10 北京航空航天大学 Force balancing resonance micro-mechanical gyro
CN101319899B (en) * 2008-07-24 2010-11-10 北京大学 Capacitor type horizontal shaft micro-mechanical tuning fork gyroscope
CN101368826B (en) * 2008-09-25 2011-04-27 中国人民解放军国防科学技术大学 Vibration isolation frame work decoupled silicon micro-gyroscope
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CN102009945A (en) * 2010-11-11 2011-04-13 北京自动化控制设备研究所 Method for machining micro-mechanical quartz tuning fork gyro sensitive structure
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CN105084302A (en) * 2014-05-19 2015-11-25 无锡华润上华半导体有限公司 Manufacturing method of MEMS mass block
CN105444748A (en) * 2014-08-21 2016-03-30 上海矽睿科技有限公司 Anti-interference gyroscope
CN105444748B (en) * 2014-08-21 2018-08-31 上海矽睿科技有限公司 Jamproof gyroscope
CN106153026A (en) * 2015-03-30 2016-11-23 北京自动化控制设备研究所 A kind of tuning-fork-type microelectromechanicgyroscope gyroscope
CN106153026B (en) * 2015-03-30 2019-09-17 北京自动化控制设备研究所 A kind of tuning-fork-type microelectromechanicgyroscope gyroscope
CN105953781A (en) * 2016-06-03 2016-09-21 哈尔滨工业大学 Tuning-fork micromechanical gyroscope sensor applied to wireless sensor network
CN106525017A (en) * 2016-11-09 2017-03-22 刘亚婷 Micromechanical gyroscope resisting environmental vibration influence
CN108204806A (en) * 2016-12-19 2018-06-26 美国亚德诺半导体公司 Synchronizing quality block gyroscope
CN108204806B (en) * 2016-12-19 2021-10-08 美国亚德诺半导体公司 Synchronous mass block gyroscope
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