CN1503352A - Non-volatile memory cell and fabrication method - Google Patents
Non-volatile memory cell and fabrication method Download PDFInfo
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- CN1503352A CN1503352A CNA031328423A CN03132842A CN1503352A CN 1503352 A CN1503352 A CN 1503352A CN A031328423 A CNA031328423 A CN A031328423A CN 03132842 A CN03132842 A CN 03132842A CN 1503352 A CN1503352 A CN 1503352A
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- 238000000034 method Methods 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 63
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000003860 storage Methods 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims description 37
- 238000009413 insulation Methods 0.000 claims description 23
- 239000004020 conductor Substances 0.000 claims description 11
- 241000209094 Oryza Species 0.000 claims description 10
- 235000007164 Oryza sativa Nutrition 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 10
- 235000009566 rice Nutrition 0.000 claims description 10
- 239000002019 doping agent Substances 0.000 claims description 6
- 230000010415 tropism Effects 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000002800 charge carrier Substances 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 239000007943 implant Substances 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims description 3
- 230000014759 maintenance of location Effects 0.000 claims description 2
- 238000002955 isolation Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 50
- 150000004767 nitrides Chemical class 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
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- 238000007254 oxidation reaction Methods 0.000 description 3
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- 230000002093 peripheral effect Effects 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
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- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Abstract
Memory cell transistors with back-channel isolation are produced without using an SOI substrate. With the word line stack acting as a mask, the semiconductor material is etched on both sides of the world line, first anisotropically and then isotropically to widen the etch hole and form an undercut beneath the gate electrode and at a distance from the ONO storage layer forming the gate dielectric. The undercut is filled, whereby a buried oxide layer of at least 20 nm maximum thickness is formed underneath the channel region. The latter is p-doped at a density of at least 10<17 >cm<-3>.
Description
Technical field
The present invention system can write and can eliminate non-volatile flash memory field about electronics, and it comprises the NROM-form memory cell that is preferably with the arrangement of virtual ground NOR array.
Background technology
Very little non-volatile internal memory cell element is necessary to the very large-scale integration density in multimedia application.Yet although the minimum characteristics size, it is determined by little shadow, continuous decrease, and other parameter can't increase and decrease according to this in proportion.
NROM-form memory cell is described in B.Eitan etc. " NROM: novel local trap, 2-position non-volatile internal memory cell element ", IEEE Electronic Device Letter
21, 543-545 (2000), at present, NROM cell element system is fabricated to the plane MOS transistor of using three layers of oxide-nitride thing-oxide, two oxide layers are all as lock circle electricity body and as internal memory or program layer, and middle nitride layer is used as the storage layer to catch charge carrier, is preferably electronics.Because of the special properties of institute's materials used, in program and eliminate operating period, 4 volts to 5 volts typical source/drain voltage is necessary.
Under these quite high voltages, run through generation, its further size that can hinder transistor channel length is contracted to and is lower than 200 values of rice how.Run through between the n+-joint that is considered to be in the source/drain of passing the semi-conducting material that is lower than channel region and take place.Recent research at the physics of semiconductor device confirms to be limited to down when the buried oxide of channel by a certain distance of distance gate electrode, can obtain the improvement that runs through behavior and short channel character of excellence.
Be described in the book of Jean-Pierre Colinge at the MOSFETs of SOI base material " crystal silicon technology on the insulator: the VLSI material ", the 2nd edition, Kluwer Academic Publi shers, Dordrecht 1997, the 5 chapters: " SOI MOSFET ".The vertical extent of SOI MOSFETs channel region is subject to the insulating barrier of SOI base material.This channel is decided according to the thickness of channel region by part or full consumption system, and it determines also whether the space charge region that reaches adjacent to insulating barrier adjacent to the lock oxide is that separate or adjacent one another are.This SOI MOSFET is complete electric insulation to monolith substrate, unless the through hole that provides by this insulating barrier is arranged, so that monolith substrate can be electrically contacted by the surface, top.
At the European for the third time work station (ULIS 2002) of the final integration of silicon, Munich2002, Thomas Skotnicki propose the how NANO CMOS of rice lock length of a kind of tool 16.The transistor architecture of this pattern provides a kind of back-channel isolation, its be limited to basically this channel region and by remove about 15 how the thick crystal growth of rice the SiGe layer and replace and form with electrical insulating material.The vertical dimension of the channel that does not mix and mix fully can be compared with this SOI MOSFETs skill.The source electrode of this high doped and drain zone extend to that to be lower than this insulating barrier position accurate and provide as the channel contact with tool LDD (light dope drain) zone, and this channel architecture is called as SON, silicon on nothing.
Summary of the invention
The object of the invention is for providing a kind of SONOS-pattern transistor memory cell, and the minimum sectional area of its tool active channels allows at least partly consuming of this channel region simultaneously, and a kind of method of making this kind memory cell and memory cell array is provided.
The further purpose of the present invention is for disclosing a kind of method that the NROM memory cell need not use the SOI base material of how making.
Further purpose is for providing a kind of insulation of memory cell, and it can be voluntarily in alignment with character circuit and the suitable memory cell array that is used for.
The further purpose of the present invention is for providing a kind of channel transistor memory cell through insulation, and the mode that it can the virtual ground array is placed, and a kind of method of making this kind memory cell and memory cell array.
NROM cell element according to the present invention is placed in the surface of semiconductor body or semiconductor layer, it has and extends straight line about this Surface Vertical and enter these semiconductor bodies between bit line and on corresponding character circuit (be provided for and decide this memory cell of address) both sides or the electric insulation zone of semiconductor layer downwards, this electric insulation zone be placed voluntarily in alignment with this character circuit and also may be voluntarily in alignment with this bit line and extend at least this source region and drain zone than lower boundary position standard.This electric insulation zone is preferably and comprises a kind of undercut area or buried horizon in this channel region (it is positioned at the source region and drain is interregional) below.This is transistorized to run through and is avoided or interrupted by this electric insulation zone at least.
This framework by delimit at the character circuit at least accurate back, the low position that engages to source/drain areas between character circuit and bit line not isotropic etching and produce and be preferably waiting tropism's end eclipse quarter and produce by transistorized channel region, this engraving method takes place from the both sides of character circuit and is performed voluntarily in alignment with the character circuit, and this etching hole and last this undercutting are filled with a kind of electrical insulating material.This gate re-oxidation step can be used with the thermal oxide of growing up around this transistor body and reach to protect this semiconductor surface.In addition, boron dope agent or another p-dopant object can be implanted with the electric insulation of improvement below this electrical insulating material of filling this undercutting.
Preferred embodiment comprises that the dielectric material of the relative dielectric constant value that CVD oxide and tool are little enters the deposition in the space of adjacent character circuit.
This method can be applicable to about tool about 90 other memory device of little shadow generation of rice or character circuit half spacing still less how.
The inventive method of making the non-volatile internal memory cell element comprises the following steps that a kind of layer that stores is supplied in the surface of this semiconductor body or semiconductor layer, and is provided the layer that is used as gate electrode and is applied to this and stores layer.The zone that is used as this bit line is being provided, and perforate is etched and be used to implant dopant and comprise the buried bit lines road of source electrode and drain with formation at this gate electrode layer.The bit line storehouse be applied to through burying bit line with reduce between this bit line resistance and cover with electrical insulating material.The character circuit that crosses this bit line and be electrically connected to this gate electrode be applied to and with this gate electrode by structuring to form character circuit storehouse.Several bit line of parallel placement and the character circuit that crosses these bit line can institute's narrating mode be applied to form the whole cell element array of memory device.
This character circuit storehouse is used as shielding to be etched in the semi-conducting material of these character circuit both sides, earlier with isotropic etching not and, in a kind of preferred embodiment, then form this by undercutting to widen the etching hole and below gate electrode, to reach apart from this storage layer one segment distance for isotropic etching.This undercutting is with electrical insulating material, oxide particularly, filling is to form the insulation buried horizon of maximum ga(u)ge, that is with channel region below this semiconductor body or the full-size of the direction of the surperficial quadrature of semiconductor layer, this size at least 20 is rice how, surpasses 100 rice how at some specific embodiment.
This source/drain areas is preferably n-pattern conductance, yet this channel is a p-pattern conductance.This channel is preferably at least 10
17Centimetre
-3Density mix.When wiping state, the pardoning limit value and can be set in value between 0.5 volt and 2.0 volts of this cell transistor, and can be adjusted to by the suitable selection of device parameter and be typically about 1.5 volts.
Finishing of the inventive method is the non-volatile cell transistor of a kind of tool insulation channel is provided and need use the SOI base material.It provides the purpose of the further reduction means size of device, particularly tool of the efficient channel length that reduces this cell element device.In at this channel side or directly the source region below this channel and the interregional electric insulation of drain hinder running through in this zone.
These and other purpose of the present invention, feature and advantage can be by following graphic simple narrations, be described in detail and appended claim and graphic and more obvious.
Description of drawings
1A and 1B figure shows after first procedure of processing of two alternative specific embodiments of the inventive method the cross section section through this bit line.
The 2nd figure shows the cross section section of this character circuit of process shown in 1A and 1B figure.
3A and 3B figure show the end eclipse of two alternative specific embodiments of this method carve form after through the cross section section of this bit line.
4A and 4B figure show the cross section section that passes this character circuit shown in 3A and 3B figure.
Pass cross section section behind the subsequent step of two alternative specific embodiments of 5A and 5B figure demonstration the inventive method according to this character circuit of 4A and 4B figure.
The 6th figure shows the cross section section that pass this character circuit of further specific embodiment according to 5B figure.
Embodiment
Hereinafter, being described in detail of step about the preferred approach made of preferred embodiment of the present invention is provided, and in any specific embodiment, this manufacture method is to begin according to the known step of the manufacture method of this skill memory cell itself.These steps can comprise the pad oxide that deposition is grown up and/or fill up the surface of nitration case at this semiconductor body or semiconductor layer (particularly p-doped semiconductor wafer).All known steps that form through the shade trench isolations of oxide-fillings can be added, and comprise that groove stipulates using of little shadow, reach complanation.Standard is implanted can be carried out the well that provides the peripheral region that is used as the CMOS control integrated circuit to be formed on.
Then, this stores layer, is preferably a kind of ONO-layer (oxide-nitride-oxide layer), grows up on the surface of this semiconductor body or semiconductor layer.Then can carry out a kind of little shadow step to remove this storage layer around and to replace it with one or more different lock oxides, store layer at this, a kind of electrically-conductive layer is deposited, and it is provided to be used as wants manufactured gate electrode.
1A and 1B figure demonstration are passed and are carried the thin cross section section of being made up of polysilicon that stores this semiconductor body 1 of layer 2 and gate electrode layer 3.A kind of nitride layer is deposited as hard screen, and parallel to each other and form on this gate electrode layer 3 at a distance of the character circuit perforate of a segment distance each other by little shadow step, sept 4 forms in perforate at the sidewall of gate electrode layer 3.This sept 4 in the known mode of general semiconductor technology itself by being left and forming up to sidewall spacer only to wait the tropism to deposit a kind of layer of spacer material and then not wait the tropism to eat-back this layer earlier.This sept 4 can be preferably by nitride by oxide, and particularly silicon nitride forms.Then, the implantation of dopant is performed the n that is narrated specific embodiment to be formed on
+The buried bit lines road 5 of-conductance pattern.
The bit line conductor band 6 that reduces resistance is deposited on the surface of the bit line 5 of burying, and this bit line conductor band 6 can be formed by CoSi and/or polysilicon.When using silicide, this bit line conductor band 6 can partly be incorporated the semi-conducting material of this semiconductor body 1 into, shown in 1B figure.Bit line cover layer 7 is applied to this bit line conductor band 6, these cover layers 7 can be by deposition TEOS (tetraethyl orthosilicate) or by generating silicon dioxide in the top of this bit line conductor band 6 and form, if this bit line conductor band 6 is formed by polysilicon.This cover layer 7 is flattened, and the hard screen of nitride is removed.
A kind of sequence of layer is deposited, it comprises at least one character line layer that is used as the character circuit that is provided, in the example of 1A and 1B figure, show the first character line layer 8 respectively, polysilicon for example, the second character line layer 9 for example comprises a kind of metal, reaches the hard screen 10 that is formed by a kind of electrical insulating material.Be shown in the 2nd figure at the shown cross section section of 1A and the position of 1B figure between two bit line.
After the 2nd figure is presented at this character circuit storehouse and forms, pass this character circuit at the shown cross section section of 1A and 1B figure, this first character line layer 8, this second character line layer 9, this hard screen 10, and this gate electrode layer 3 by construction to form the band of character circuit storehouse.Position at the shown cross section section of 1A and 1B figure is shown in the 2nd figure by broken string.This little shadow step can be divided into two steps with this character circuit of first etching, and peripheral device is still by this hard screen protection.
Shown in the cross section section of 3A and 3B figure, be used carrying out a kind of etching step forming hole in alignment with the mode of character circuit at least voluntarily in the perforate of gate electrode layer, and in this example also voluntarily in alignment with bit line.In this step, RIE (reactive ion etch) can be used not wait tropism ground via these storages layer 2 etchings and directly enter this semi-conducting material downwards, and this vertical directional arrow with downward finger is shown in 3A schemes.It is accurate that hole is etched down to the position than lower boundary on source/drain areas and buried bit lines road 5 at least, that is to accurate in the position than low pn-joint of source/drain/zone, buried bit lines road and main semiconductor body or interlayer.By this, this semiconductor body or semiconductor layer are adjacent to the regional electric insulation of this transistor channel and extend to this source/drain areas vertically downward.
Not behind the isotropic etching, the sidewall of this bit line storehouse and this character circuit storehouse can cover 11 by thin nitride layer and cover, and perhaps covers 11 and can be the thin oxide layer that derives from character circuit re-oxidation step at this.This covering 11 is removed from the surface of this semiconductor body 1 in the bottom through the etching hole at least.In a preferred embodiment, this engraving method is by using for example SF of dry ecthing agent
6Or in the specific embodiment of 3B figure, use wet etchant, wait tropism ground to continue.In the specific embodiment of 3B figure, this sidewall covers 11 protections by this, so that carving through end eclipse of this etching hole 12 partly is restricted to quite less vertical extent.Carve by the end eclipse of the etching hole 12 that is reached to same sex engraving method and can further be continued to meet and be formed on a continuous perforate of the channel region below of this cell transistor up to these character circuit both sides this etching hole forward certainly.
4A and 4B figure show the cross section section that passes this character circuit shown in 3A and the 3B figure.In the example of 4A figure, this engraving method is continued is being lower than all the other semiconductor channel region 17 places formation up to continuous perforate.In the example shown in the 4B figure, this etching hole that this engraving method produces in this character circuit both sides certainly stops before occupying whole zone below channel region 17.In specific embodiment according to 4B figure, this channel region does not separate with this semiconductor body fully, can be provided at enough separations between this channel region and this semiconductor body in the semi-conducting material of this channel region 17 and all the other connections between this semiconductor body 1 (for example silicon), because of this semi-conducting material consumes charge carrier.Yet, preferred embodiment provides a kind of separation fully below this channel region by the complete etching via the overall width that crosses this character circuit, in this preferred embodiment, only between this channel region and this source/drain areas and in this source/drain/buried bit lines road zone and between the semi-conducting material below these zones and/or towards this channel away from side have pn-to engage, but there do not have pn-to engage to be adjacent with this source/drain areas side ground of the channel direction that is lower than this channel region.
Maximum ga(u)ge 19, that is, generally appear at the extension of the peripheral plane of this character circuit storehouse in undercutting full-size, as shown in each figure with the direction of the surperficial quadrature of this semiconductor body or semiconductor layer.
The area upper limit of this covering 11 in 4B figure shows the position of the upper surface of this bit line storehouse.This covering 11 can etchedly be carried out thermal oxide with exposing surface and grow up so that passivation to be provided.
5A and 5B figure shows respectively according to 4A and 4B figure and covers the cross section section that passes this character circuit after 13 the growth at thermal oxide.A kind of electrical insulating material is deposited as filler 15 accurate to the position of this hard screen 10 to fill this etching hole and the zone between this character circuit.The material of filler 15 is preferably selected with the little relative dielectric constant value of tool.
In the specific embodiment shown in the 5A figure, the insulating barrier of the undercutting below channel region 17 with at least 100 how the maximum ga(u)ge 19 of rice form.In the specific embodiment shown in the 5B figure, this covering 11 (4B figure) has made carving through end eclipse of this etching hole 12 partly be restricted to the how quite less vertical extent of the maximum ga(u)ge 19 of rice of tool at least 20.
5B figure shows the additional features of selecting: well 14 forms to provide p-conductance zone with the separation of improvement below channel region 17 by boron implant or other dopant; A kind of nitride passivation layer 18, the surface, top of base material shown in it is applied to; And in the case, by of the fully separation of thermal oxidation (oxide covers 13) this channel region 17 that formed dielectric material carried out with this semiconductor body 1.
The 6th figure shows the cross section section according to the further specific embodiment of 5B figure, in this further specific embodiment, wherein the growth of thermal oxide covering is restricted to the surface of this etching hole, yet this nitride layer 16 is applied to all surface of this character circuit storehouse.This nitride layer 16 is corresponding to nitride passivation layer 18 above 5B figure, and this kind nitride layer can be used with this character circuit of package, and so, the aligning voluntarily of this bit line contact mechanism can be applied.
The example specific embodiment of institute's revealing method is positioned at the scope of the invention because of the deviation of the specific (special) requirements through making memory device.
Claims (14)
1. method of making the non-volatile internal memory cell element of tool semiconductor body or semiconductor layer,
Place reaching of this semiconductor body or semiconductor layer surface being applied to this surperficial conductor band of this bit line through the buried bit lines road,
An one source pole zone and a drain zone, each is connected by one of this bit line,
Be applied at least in this source region and the lock dielectric on this surface that this drain is interregional,
One gate electrode is placed on this lock dielectric, and
One character circuit is electrically connected to this gate electrode, and this character circuit crosses this bit line and reaches and this bit line electric insulation,
It comprises the following steps:
Provide the semiconductor body or the base material of at least one semiconductor layer of a tool at first step,
Comprise the lock dielectric that provides in order to the storage layer of catching charge carrier in second step deposition one,
Provide the layer that is used as this gate electrode in third step deposition one,
Be formed on the perforate of this layer and be formed on the sept of the sidewall in this perforate in the 4th step,
Implant dopant forming this in the 5th step via this perforate through the buried bit lines road,
The 6th step use this conductor band in this on the buried bit lines road, and use the electric insulation cover layer on this conductor band,
Use at least one character line layer that is electrically connected to this gate electrode in the 7th step, and use a hard screen in the top of this at least one character line layer, this hard screen is used with this gate electrode of framework and reaches this at least one character line layer to form character circuit storehouse
Do not wait the etching downwards of tropism ground to enter this semiconductor body or semiconductor layer in the both sides of the 8th step this character circuit storehouse between this bit line accurate forming voluntarily the etching hole in alignment with this character circuit storehouse to the position that is lower than this source region and this drain zone, and
Fill this etching hole in the 9th step with electrical insulating material.
2. according to the method for the 1st of claim, comprise in addition:
With after forming this etching hole, then enter this etching hole below this gate electrode, to extend and at isotropic etching not apart from this gate electrode one segment distance formation undercutting for isotropic etching.
3. according to the method for the 2nd of claim, comprise in addition:
Carry out isotropic etching and cross the continuous perforate that this character circuit extends so that this undercutting forms.
4. according to claim the 2nd or 3 s' method, comprise in addition:
With after forming this etching hole, use side and this etching hole that covers to this character circuit storehouse at isotropic etching not, to protect this sidewall when the isotropic etching.
5. according to each method in the 1st to 4 of the claim, wherein this storage layer is applied with three layers of oxide-nitride-oxide layer.
6. method of making the non-volatile internal memory cell element, it comprises step:
Semiconductor body or semiconductor layer are provided,
The storage layer of using a dielectric material is in the surface of this semiconductor body or semiconductor layer,
Use one and be provided the layer that is used as gate electrode in this storages layer,
Form perforate in this floor and via this perforate implant dopant with formation be provided be used as through the buried bit lines road and be used as source electrode and drain through doped region,
Use bit line and be stacked over this through the buried bit lines road, this bit line storehouse respectively comprises at least one conductor band,
Form one and cross the character circuit of this bit line, this character circuit is electrically connected to this gate electrode and reaches and this bit line electric insulation, and this gate electrode of structuring,
By using this character circuit is shielding, carry out one not the isotropic etching method enter this semiconductor body or semiconductor layer between this bit line of these character circuit both sides, the etching hole forms thus, and
Deposit the filler of an electrical insulating material as this etching hole.
7. according to the method for the 6th of claim, comprise in addition:
, carry out follow-up isotropic etching method and enter this etching hole not after the isotropic etching method at this, a undercutting to be providing the mode of extending below the semiconductor regions that is used as channel region to be formed thus, and
Deposit the filler of an electrical insulating material as this undercutting and this etching hole.
8. according to claim the 6th or 7 s' method, comprise wherein one feature of the 3rd to 5 of claim in addition.
9. non-volatile internal memory cell element, it comprises:
Semiconductor body or semiconductor layer,
Place reaching of this semiconductor body or semiconductor layer surface being applied to this surperficial conductor band of this bit line through the buried bit lines road,
An one source pole zone and a drain zone, each is connected by one of this bit line,
One at least in this source region and the lock dielectric on interregional this surface of this drain, and this gate electrode comprises and being provided in order to catching the storage layer of charge carrier,
One gate electrode is placed on this lock dielectric, and
One character circuit is electrically connected to this gate electrode, and this character circuit crosses this bit line and reaches and this bit line electric insulation, and
Between this bit line and the both sides of this character circuit extend into the electric insulation zone of this semiconductor body or semiconductor layer, this electric insulation zone voluntarily in alignment with this character circuit and extend at least this source region and this drain zone than lower boundary position standard.
10. non-volatile internal memory cell element according to the 9th of claim comprises in addition:
This electric insulation zone comprise one apart from this lock dielectric one segment distance in the undercut area below this character circuit and below this source region and interregional this channel region that is provided of this drain,
This electric insulation undercut area to the semi-conducting material of this channel region of major general and this channel region below partly separate and at least part separate this source region and this drain zone.
11. the non-volatile internal memory cell element according to the 10th of claim comprises in addition:
This electric insulation undercut area is crossed this character circuit and is extended continuously.
12. the non-volatile internal memory cell element according to claim the 10th or 11 comprises in addition:
This electric insulation undercut area with the tool at least 20 of the direction of this semiconductor body or the semiconductor layer surface quadrature maximum ga(u)ge of rice how.
13. the non-volatile internal memory cell element according to claim the 10th or 11 comprises in addition:
This electric insulation undercut area with the direction tool at least 100 of this surface quadrature of this semiconductor body or the semiconductor layer maximum ga(u)ge of rice how.
14., comprise in addition according to each non-volatile internal memory cell element of the 9th to 13 of claim:
One channel region is in this source region and this drain is interregional is provided its tool at least 10
17Centimetre
-3Doping density.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/200,423 US6734063B2 (en) | 2002-07-22 | 2002-07-22 | Non-volatile memory cell and fabrication method |
| US10/200423 | 2002-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100068940A Division CN101197326A (en) | 2002-07-22 | 2003-07-22 | Non-volatile memory cell and fabrication method |
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| CN1503352A true CN1503352A (en) | 2004-06-09 |
| CN1249808C CN1249808C (en) | 2006-04-05 |
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| CNB031328423A Expired - Lifetime CN1249808C (en) | 2002-07-22 | 2003-07-22 | Non-volatile memory cell and fabrication method |
| CNA2006100068940A Pending CN101197326A (en) | 2002-07-22 | 2003-07-22 | Non-volatile memory cell and fabrication method |
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| CNA2006100068940A Pending CN101197326A (en) | 2002-07-22 | 2003-07-22 | Non-volatile memory cell and fabrication method |
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| US (2) | US6734063B2 (en) |
| CN (2) | CN1249808C (en) |
| DE (1) | DE10328577B4 (en) |
| TW (1) | TWI255509B (en) |
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| CN102856375B (en) * | 2011-06-27 | 2015-05-20 | 中国科学院微电子研究所 | Semiconductor structure and manufacturing method thereof |
| CN102856360B (en) * | 2011-06-27 | 2015-09-16 | 中国科学院微电子研究所 | A kind of semiconductor structure and manufacture method thereof |
| CN102856376B (en) * | 2011-06-30 | 2016-08-03 | 中国科学院微电子研究所 | A kind of semiconductor structure and manufacture method thereof |
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| US5051796A (en) * | 1988-11-10 | 1991-09-24 | Texas Instruments Incorporated | Cross-point contact-free array with a high-density floating-gate structure |
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| DE59814170D1 (en) * | 1997-12-17 | 2008-04-03 | Qimonda Ag | Memory cell arrangement and method for its production |
| US6255167B1 (en) * | 1998-06-03 | 2001-07-03 | Texas Instruments - Acer Incorporated | Method of forming high density buried bit line flash EEPROM memory cell with a shallow trench floating gate |
| EP1043769A1 (en) * | 1999-04-07 | 2000-10-11 | STMicroelectronics S.r.l. | Process for manufacturing a semiconductor material wafer comprising single-crystal regions separated by insulating material regions, in particular for manufacturing intergrated power devices, and wafer thus obtained |
| WO2001043186A1 (en) * | 1999-12-13 | 2001-06-14 | Infineon Technologies North America Corp. | Body contacted silicon-on-insulator (soi) structure and method of fabrication |
| AU2001286432A1 (en) * | 2000-08-14 | 2002-02-25 | Matrix Semiconductor, Inc. | Dense arrays and charge storage devices, and methods for making same |
| JP3967193B2 (en) * | 2002-05-21 | 2007-08-29 | スパンション エルエルシー | Nonvolatile semiconductor memory device and manufacturing method thereof |
-
2002
- 2002-07-22 US US10/200,423 patent/US6734063B2/en not_active Ceased
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2003
- 2003-06-25 TW TW092117339A patent/TWI255509B/en not_active IP Right Cessation
- 2003-06-25 DE DE10328577A patent/DE10328577B4/en not_active Expired - Lifetime
- 2003-07-22 CN CNB031328423A patent/CN1249808C/en not_active Expired - Lifetime
- 2003-07-22 CN CNA2006100068940A patent/CN101197326A/en active Pending
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2005
- 2005-01-11 US US11/034,444 patent/USRE40532E1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| TWI255509B (en) | 2006-05-21 |
| DE10328577A1 (en) | 2004-03-11 |
| TW200403770A (en) | 2004-03-01 |
| US20040014280A1 (en) | 2004-01-22 |
| USRE40532E1 (en) | 2008-10-07 |
| US6734063B2 (en) | 2004-05-11 |
| DE10328577B4 (en) | 2006-01-19 |
| CN1249808C (en) | 2006-04-05 |
| CN101197326A (en) | 2008-06-11 |
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