CN1291270C - Method for preparing semi-transparent and semi-reflective thin-film transistor liquid-crystal displaying device - Google Patents
Method for preparing semi-transparent and semi-reflective thin-film transistor liquid-crystal displaying device Download PDFInfo
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- CN1291270C CN1291270C CN 200410046557 CN200410046557A CN1291270C CN 1291270 C CN1291270 C CN 1291270C CN 200410046557 CN200410046557 CN 200410046557 CN 200410046557 A CN200410046557 A CN 200410046557A CN 1291270 C CN1291270 C CN 1291270C
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Abstract
The present invention relates to a method for preparing an LCD with a semi-transparent and semi-reflective thin-film transistor. Firstly, a baseplate of the LCD with the thin-film transistor is provided, the surface of the baseplate is defined with at least a reflecting region, a transmission region and a joining region of an external circuit, a protective layer and a first light resistive layer are jointed on the surface of the baseplate, a first yellow light sum etching procedure is used for defining patterns of the protective layer and the first light resistive layer, and a remaining film of the first light resistive layer in the reflecting region is higher than the surface of the transmission region. A transparent conducting layer, a reflecting layer and a second light resistive layer are joined on the surface of the baseplate, and the thickness of the second light resistive layer in the transmission region is larger than the thickness in the reflecting region. A second yellow light sum etching procedure is used for defining patterns of the transparent conducting layer, the reflecting layer and the second light resistive layer. The second light resistive layer, the reflecting layer and the surface of transparent conducting layer in the transmission region are removed subsequently.
Description
Technical field
The invention relates to a kind of method of making one semi-transparent half antiferromagnetic thin film transistor liquid crystal display (TFT-LCD), refer to a kind of method of making one semi-transparent half antiferromagnetic thin film transistor liquid crystal display (TFT-LCD) of photomask capable of reducing using especially.
Background technology
Thin Film Transistor-LCD is passive luminous flat-panel screens, therefore need add light source provides picture to show required light, and according to the kenel that adds light source, Thin Film Transistor-LCD generally can be divided into the reflective Thin Film Transistor-LCD of ambient light as light source, utilize the transmission-type Thin Film Transistor-LCD of backlight assembly as light source, and between the semi-transparent semi-reflecting Thin Film Transistor-LCD between the two.
The principal character of semi-transparent semi-reflecting Thin Film Transistor-LCD is to be the pixel segmentation in the conventional thin film transistor LCD one transmitting sub-element that is made of transparent conductive material, and a reflective sub-pixel that constitutes by metal material, and utilize a pixel-driving circuit that is arranged on sweep trace and data line interlaced area to drive transmitting sub-element and reflective sub-pixel simultaneously.When the pixel of the semi-transparent semi-reflecting Thin Film Transistor-LCD of known making is organized more, at least need use seven road photomasks to limit figure on the thin film transistor base plate, for example utilize one first gold-tinted and etching work procedure to limit the control utmost point, one second gold-tinted and etching work procedure limit semiconductor layer (being generally amorphous silicon layer), one the 3rd gold-tinted and etching work procedure limit source electrode, drain electrode, one the 4th gold-tinted and etching work procedure limit the overlap joint hole that is connected to drain electrode, structures such as the projection of one the 5th gold-tinted and the reflective-pixel of etching work procedure qualification and overlap joint hole, one the 6th gold-tinted and etching work procedure limit the pixel electrode (transparency conducting layer) of transmitting sub-element, and one the 7th gold-tinted limits the pixel electrode (metal level) of reflective sub-pixel to etching work procedure.Owing to use the number of photomask number to be reacted directly into complex procedures degree and production cost, and along with using the photomask number the more, the other problem of repeatedly also may be between gold-tinted and etching work procedure deriving because of bit errors, and then influence product percent of pass, therefore how reducing the use photomask effectively is very important for the display manufacturer.
Summary of the invention
Therefore, purpose of the present invention is promptly in the method that a kind of making one semi-transparent half antiferromagnetic thin film transistor liquid crystal display (TFT-LCD) is provided, the use photomask be can reduce, complex procedures degree, production cost reduced, and the problem of avoiding repeatedly the bit errors between gold-tinted and etching work procedure to derive.
In preferred embodiment of the present invention, this method provides a substrate earlier, this substrate surface limits at least one echo area, a transmission area and an external circuit bonding land, and the echo area comprises a thin film transistor (TFT), and the external circuit bonding land comprises an external circuit bonding electrodes.Form a protective seam and one first photoresist layer at substrate surface afterwards; and utilize one first gold-tinted and etching work procedure to limit the figure of the protective seam and first photoresist layer; pass to this film crystal tube-surface in the echo area, to form one first opening; externally form one second opening in the circuit bonding land and pass to this external circuit bonding electrodes surface, and make the residual film of this first photoresist layer in the echo area be higher than the surface of this transmission area.Be engaged in substrate surface and form a transparency conducting layer, a reflection horizon and one second photoresist layer, and the thickness of second photoresist layer in transmission area is greater than the thickness of second photoresist layer in the echo area.Then utilize one second gold-tinted and etching work procedure to limit the figure of transparency conducting layer, reflection horizon and second photoresist layer again, in the echo area, to form one the 3rd opening.Remove second photoresist layer, reflection horizon in the transmission area then, until layer at transparent layer.
Because the present invention is when utilizing first gold-tinted and etching work procedure to limit second opening of first opening of echo area and external circuit bonding land; form different surface elevations in the echo area with transmission area more simultaneously; therefore utilize this height fall can make second photoresist layer of follow-up formation have bigger thickness at transmission area; and then can be in the process of carrying out second gold-tinted and etching work procedure; keep the suitable residual film of second photoresist layer at transmission area, be used for protecting the reflection horizon and the transparency conducting layer of transmission area and avoid it in the etching process of the 3rd opening that limits the echo area, to be damaged.The present invention simultaneously is when the residual film of second photoresist layer of follow-up removal transmission area, and second photoresist layer that still can keep suitable thickness in the echo area is surrounded on the 3rd around openings, is damaged when removing the reflection horizon of transmission area with the reflection horizon of avoiding the echo area.Thus, the figure that the present invention only needs to utilize one photomask can finish reflective sub-pixel and transmitting sub-element limits, therefore the problem that can avoid known technology to utilize the pixel electrode that the twice photomask limits reflective sub-pixel respectively and the pixel electrode of transmitting sub-element to derive, and reduction complex procedures degree and production cost.
Description of drawings
Fig. 1 to Figure 11 makes the method synoptic diagram of semi-transparent half an antiferromagnetic thin film transistor liquid crystal display (TFT-LCD) for the present invention.
The reference numeral explanation:
10 substrates, the 12 control utmost points
14 external circuit bonding electrodes, 16 dielectric layers
18,20 semiconductor layers, 21 passages
24 drain electrodes of 22 source electrodes
26 thin film transistor (TFT)s, 28 protective seams
30,50 photoresist layers 32,32 ', 34, potential figure
36、36’、52、
54
32 ", 36 ", 38, opening 42 projections
40、52’、56
44 transparency conducting layers, 46 cushions
A echo area, 48 reflection horizon
B transmission area C external circuit bonding land
The residual film height of H photoresist layer
Embodiment
Referring to figs. 1 to Figure 11, Fig. 1 to Figure 11 makes the method synoptic diagram of semi-transparent half an antiferromagnetic thin film transistor liquid crystal display (TFT-LCD) for the present invention.As shown in Figure 1, the inventive method provides a substrate 10 earlier, glass substrate for example, and substrate 10 surfaces limit an echo area A, a transmission area B and an external circuit bonding land C, wherein echo area A and transmission area B are a pixel region of semi-transparent semi-reflecting Thin Film Transistor-LCD, external circuit bonding land C then is used for welding drive circuit chip, so that sweep trace and the data line of drive signal to semi-transparent semi-reflecting Thin Film Transistor-LCD to be provided.Be engaged in substrate 10 surfaces and form one first conductive layer, the metal level that constitutes by aluminium, molybdenum, tantalum or aluminium alloy etc. for example, and utilize one first gold-tinted and etching work procedure to limit the figure of first conductive layer, forming control utmost points 12 that are arranged among the A of echo area, and form external circuit bonding electrodes 14 that are arranged among the C of external circuit bonding land on substrate 10 surfaces on substrate 10 surface.
Then form a dielectric layer 16 and semiconductor layer 18,20 on substrate 10 surfaces in regular turn, and utilize one second gold-tinted and etching work procedure to limit the figure of semiconductor layer 18,20, wherein dielectric layer 16 can be silicon oxide layer or silicon nitride layer, semiconductor layer 18 can be an amorphous silicon layer, and semiconductor layer 20 can be once the doped amorphous silicon layer.Next again in substrate 10 surface coverage one second conductive layer, the metal level that constitutes by aluminium, molybdenum or tantalum etc. for example, and utilize one the 3rd gold-tinted and etching work procedure to limit the figure of second conductive layer, to form one source pole 22, a drain electrode 24 above the control utmost point 12 in the A of echo area, open and between source electrode 22 and drain electrode 24, form a raceway groove 21, finish the making of thin film transistor (TFT) 26.
As shown in Figure 2; after the making of finishing thin film transistor (TFT) 26; according to the inventive method, next form the photoresist layer 30 that a protective seam 28 that is formed by silicon nitride and is formed by organic material, and make substrate 10 have a rough smooth surface on substrate 10 surface.
Then promptly utilize one the 4th gold-tinted and etching work procedure to limit the figure of protective seam 28 and photoresist layer 30; pass to thin film transistor (TFT) 26 surfaces in the A of echo area, to limit pixel overlap joint hole; externally form an opening in the C of circuit bonding land and pass to external circuit bonding electrodes 14 surfaces, and make A interior residual photoresistor layer 30 in echo area be higher than the surface of transmission area B.Wherein the detailed step of the 4th gold-tinted and etching work procedure is described below.
As shown in Figure 3, utilize a photomask, for example semi-transparent printing opacity mask (halftone mask), in echo area A, transmission area B and external circuit bonding land C, carry out simultaneously the exposure first time, be located among the A of echo area in photoresist layer 30, to form a potential figure 32 respectively, form a potential figure 34 and be located among the transmission area B, and form a potential figure 36 and be located among the C of external circuit bonding land.Wherein potential figure 32,34,36 can utilize factors such as time shutter, exposure intensity and photomask void density to control its exposure depth, makes the thickness of the exposure depth of potential figure 32,34,36 after exposure for the first time less than photoresist layer 30.
As shown in Figure 4, next in echo area A and external circuit bonding pad C, carry out second time exposure again, be located among the A of echo area, and form a potential figure 36 ' and be located among the C of external circuit bonding land in photoresist layer 30, to form a potential figure 32 ' respectively.Position that it should be noted that exposure for the second time should overlap mutually with the exposure position first time of part, so that potential figure 32 ' and potential figure 36 ' all can run through photoresist layer 30 and pass to protective seam 28 surfaces.In preferred embodiment of the present invention, potential figure 32 ' is to be used for limiting a pixel that is connected to drain electrode 24 to overlap hole pattern, potential figure 36 ' then is to be used for limiting an opening figure that is connected to external circuit bonding electrodes 14, and the potential figure 36 ' that external circuit bonding land C forms in exposure for the second time is arranged at potential figure 36 inside that exposure for the first time forms.
As shown in Figure 5, carry out a developing procedure subsequently,, the potential figure 32 ', 34,36 ' in the photoresist layer 30 can be displayed to remove the photoresist layer 30 of exposure area.At this moment, echo area A residual photoresistor layer 30 has maximum height, the height of transmission area B and external circuit bonding land C residual photoresistor layer 30 time, become then noresidue photoresist layer of the predetermined zone that forms opening of the zone in pixel overlap joint hole and external circuit bonding land C as for echo area A preboarding.Then utilize photoresist layer 30 as an etching mask; carry out a dry ecthing and remove protective seam 28 and dielectric layer 16; to form an opening 32 at echo area A respectively " pass to drain electrode 24 surfaces, and externally circuit bonding land C forms an opening 36 " pass to external circuits connection electrode 14 surfaces.
Afterwards as shown in Figure 6, utilize an oxygen plasma ashing operation to remove the photoresist layer 30 of transmission area B and external circuit bonding land C,, finish the making of the opening 40 of the opening 38 of echo area A and external circuit bonding land C to expose protective seam 28 surfaces.Because echo area A is residual higher photoresist layer 30 is arranged simultaneously, so after oxygen plasma ashing operation, still can keep the residual film of the photoresist layer 30 of suitable height, be used for making a plurality of projections, to increase the reflectivity of light at echo area A.Because the projection operation be those skilled in the art's known technology, and it is not technical characterictic of the present invention place, so does not repeat them here.
The inventive method makes substrate 10 have two kinds of different surface elevations (dual gap) at echo area A and transmission area B after finishing the 4th gold-tinted and etching work procedure, be beneficial to this height fall of later use and make the pixel electrode of echo area A and transmission area B, reach and reduce the purpose of using photomask.For the clear characteristics of describing subsequent handling, Fig. 7 to Figure 11 only shows the diagrammatic cross-section of echo area A and transmission area B.
As shown in Figure 7, the inventive method is after echo area A forms a plurality of projections 42, then again in substrate 10 surperficial successive sedimentation one transparency conducting layers 44, a cushion 46 and a reflection horizon 48.The wherein composition of transparency conducting layer 44 optional autoxidation indium tin or indium zinc oxide, the composition of cushion 46 can be selected from molybdenum, titanium or chromium, and the composition in reflection horizon 48 can be selected from aluminum or aluminum alloy.Because the oxidation-reduction potential that the reflection horizon that transparency conducting layer 44 that tin indium oxide forms and aluminum metal form is 48 differs bigger, make and the too high and difficult driving of contact resistance of the two therefore must form cushion 46 at transparency conducting layer 44 and 48 in reflection horizon in addition.In order to improve the contact resistance in 48 in transparency conducting layer 44 and reflection horizon, in other embodiments of the invention, also can use other material to replace aluminum metal and make reflection horizon 48, for example use silver/palladium/aldary to make reflection horizon 48, can not need between transparency conducting layer 44 and reflection horizon 48, to make again cushion 46.
Be engaged in substrate 10 surface and form photoresist layers 50, and along with the height fall on substrate 10 surfaces, the thickness of photoresist layer 50 in transmission area B is greater than the thickness of photoresist layer 50 in the A of echo area.Carry out one the 5th gold-tinted and etching work procedure then and limit the figure of photoresist layer 50, reflection horizon 48, cushion 46 and transparency conducting layer 44,, expose structures such as the sweep trace of Thin Film Transistor-LCD and data line in the A of echo area, to form opening.Wherein the detailed step of the 5th gold-tinted and etching work procedure is described below.
As shown in Figure 8, carry out an exposure process, be located at echo area A in photoresist layer 50, to form a potential figure 52, and formation one potential figure 54 is located at transmission area B in photoresist layer 50.Wherein potential figure 52 is used for limiting a plurality of opening figure that pass to the data line and the sweep trace of Thin Film Transistor-LCD, and 54 in potential figure is used for limiting the position and the figure of the pixel electrode of transmitting sub-element.Under the condition of identical exposure and since photoresist layer 50 at the thickness of transmission area B greater than the thickness of photoresist layer 50 at echo area A, therefore potential figure 52 can run through photoresist layer 50 until 48 surfaces, reflection horizon, potential figure 54 then fails to run through photoresist layer 50.In preferred embodiment of the present invention, the residual film height of unexposed photoresist layer should also be that the residual film height of the unexposed photoresist layer in potential figure 54 belows should be less than the residual film height of unexposed photoresist layer around the potential figure 52 less than the residual film height of unexposed photoresist layer in the A of echo area in the transmission area B.
As shown in Figure 9; carry out a developing procedure subsequently; to remove the photoresist layer 50 of exposure area; potential figure 52,54 in the photoresist layer 50 can be displayed; and the residual film that makes the photoresist layer 50 of potential figure 54 belows has a residual film height H, is used for protecting reflection horizon 48, cushion 46 and the transparency conducting layer 44 of transmission area B and avoids it to be damaged in the etching process of the opening that limits echo area A.In preferred embodiment of the present invention, the residual film height H of the photoresist layer of transmission area B is approximately between 3000-8000 .
Then utilize photoresist layer 50 as an etching mask, carry out reflection horizon 48, cushion 46 and transparency conducting layer 44 that an etching work procedure is removed echo area A, be positioned on data line or the sweep trace to form an opening 52 ' at echo area A.The etching work procedure of above-mentioned removal reflection horizon 48, cushion 46 and transparency conducting layer 44 can be the wet etching operation, for example uses aluminic acid to remove reflection horizon 48 and cushion 46, and uses oxalic acid to remove transparency conducting layer 44.In addition, the etching work procedure of above-mentioned removal reflection horizon 48, cushion 46 and transparency conducting layer 44 also can be the dry ecthing operation, and for example the etching gas in reflection horizon 48 can be selected from the combination (Cl of chlorine and boron chloride
2/ BCl
3), the etching gas of cushion 46 can be selected from the combination (SF of sulfur hexafluoride, helium and hydrogen chloride
6/ He/HCl), and the etching gas of transparency conducting layer 44 can be selected from the combination (Cl of chlorine and hydrogen chloride
2/ HCl).
As shown in figure 10, next utilize an oxygen plasma ashing operation to remove the photoresist layer 50 of echo area A and transmission area B, with 48 surfaces, reflection horizon that expose transmission area B, and the residual zona that the unexposed area in the A of echo area keeps the suitable photoresist layer 50 of height around opening 52 ' on every side, the etching mask when being used as the pixel electrode of follow-up qualification transmission area B.Carry out a wet etching operation or dry ecthing operation subsequently, remove reflection horizon 48 and the cushion 46 of transmission area B, until transparency conducting layer 44 surfaces, with the making of the pixel electrode of finishing transmitting sub-element.At last, as shown in figure 11, remove the residual film 50 of photoresist layer of echo area A fully, with the making of the opening 56 of finishing echo area A, and carry out an annealing thermal treatment, to reduce the resistance of transparency conducting layer 44.
Principal character of the present invention is combined into one with the 4th and the 5th gold-tinted and the etching work procedure in the method for the semi-transparent semi-reflecting Thin Film Transistor-LCD of known making, in same gold-tinted and etching work procedure, to finish the isostructural figure qualification of pixel overlap joint hole and projection, also the 6th in the known method and the 7th gold-tinted and etching work procedure are combined into one in addition, limit with the figure of in same gold-tinted and etching work procedure, finishing transmitting sub-element and reflective sub-pixel.Structural design as for thin film transistor (TFT), external circuit bonding electrodes, and make thin film transistor (TFT), the isostructural method of external circuit bonding electrodes is not characteristics of the present invention, is that the present invention does not only limit and can make structures such as thin film transistor (TFT) and external circuit bonding electrodes according to aforementioned first to the 3rd gold-tinted and etching work procedure yet.
Method compared to the semi-transparent semi-reflecting Thin Film Transistor-LCD of known making, the present invention can reduce the use photomask, reduce complex procedures degree and production cost, and avoid repeatedly the other problem that possibility is derived because of bit errors between gold-tinted and etching work procedure, and then improve product percent of pass.
The above only is preferred embodiment of the present invention, and all equalizations of being done according to the present patent application claim change and modify, and all should belong to the covering scope of patent of the present invention.
Claims (10)
1. method of making semi-transparent half an antiferromagnetic thin film transistor liquid crystal display (TFT-LCD), this display comprises a substrate, this substrate surface limits at least one echo area, a transmission area and an external circuit bonding land, this echo area comprises a thin film transistor (TFT), this external circuit bonding land comprises an external circuit bonding electrodes, and this method comprises the following steps:
Form a protective seam and one first photoresist layer at this substrate surface, and utilize one first gold-tinted and etching work procedure to limit the figure of this protective seam and this first photoresist layer, pass to this film crystal tube-surface in this echo area, to form one first opening, in this external circuit bonding land, form one second opening and pass to this external circuit bonding electrodes surface, and make the residual film of this first photoresist layer in this echo area be higher than the surface of this transmission area;
Form a transparency conducting layer, a reflection horizon and one second photoresist layer at this substrate surface, and the thickness of this second photoresist layer in this transmission area is greater than the thickness of this second photoresist layer in this echo area;
Utilize one second gold-tinted and etching work procedure to limit the figure of this transparency conducting layer, this reflection horizon and this second photoresist layer, in this echo area, to form one the 3rd opening; And
Remove this second photoresist layer, this reflection horizon in this transmission area, until this layer at transparent layer.
2. method as claimed in claim 1 is characterized in that: this first gold-tinted and etching work procedure comprise the following steps:
In this echo area, this transmission area and this external circuit bonding land, carry out the exposure first time, in this first photoresist layer, to form one first figure;
In this echo area and this external circuit bonding land, carry out the exposure second time, with formation one second graph in this first photoresist layer, and this second graph and the mutual storehouse of this first figure partly;
Carry out a developing procedure;
Utilize this first photoresist layer as etching mask, remove this protective seam, to form this first opening and this second opening; And
Remove this first photoresist layer of part.
3. method as claimed in claim 2 is characterized in that: expose this protective seam surface after removing this first photoresist layer partly in this transmission area and this external circuit bonding land.
4. method as claimed in claim 1 is characterized in that: comprise that also the residual film of this first photoresist layer that utilizes in this echo area forms a plurality of projections.
5. method as claimed in claim 1 is characterized in that: also be included in and form a cushion between this transparency conducting layer and this reflection horizon.
6. method of making semi-transparent half an antiferromagnetic thin film transistor liquid crystal display (TFT-LCD), this method comprises the following steps:
Provide a substrate, and this substrate surface limits at least one echo area, a transmission area and an external circuit bonding land;
Form one first conductive layer at this substrate surface, and utilize one first gold-tinted and etching work procedure to limit the figure of this first conductive layer, control the utmost point and form an external circuit bonding electrodes in this external circuit bonding land to form one in this echo area;
Form a dielectric layer and semi-conductor layer at this substrate surface, and utilize one second gold-tinted and etching work procedure to limit the figure of this semiconductor layer;
Form one second conductive layer at this substrate surface, and utilize one the 3rd gold-tinted and etching work procedure to limit the figure of this second conductive layer, drain to form one source pole and in this echo area;
Form a protective seam and one first photoresist layer at this substrate surface, and utilize one the 4th gold-tinted and etching work procedure to limit the figure of this protective seam and this first photoresist layer, pass to this drain surface in this echo area, to form one first opening, and formation one second opening passes to this bonding land electrode surface in this external circuit bonding land, so that the residual film height of this first photoresist layer in this echo area is greater than the residual film height of this first photoresist layer in this transmission area;
Form a transparency conducting layer, a reflection horizon and one second photoresist layer at this substrate surface, and the thickness of this second photoresist layer in this transmission area is greater than the thickness of this second photoresist layer in this echo area;
Utilize one the 5th gold-tinted and etching work procedure to limit the figure of this transparency conducting layer, this reflection horizon and this second photoresist layer, in this echo area, to form one the 3rd opening; And
Remove this second photoresist layer, this reflection horizon in this transmission area, until this layer at transparent layer.
7. method as claimed in claim 6 is characterized in that: the 4th gold-tinted and etching work procedure comprise the following steps:
In this echo area, this transmission area and this external circuit bonding land, carry out the exposure first time, in this first photoresist layer, to form one first figure;
In this echo area and this external circuit bonding land, carry out the exposure second time, with formation one second graph in this first photoresist layer, and this second graph and the mutual storehouse of this first figure partly;
Carry out a developing procedure;
Utilize this first photoresist layer as etching mask, remove this protective seam, to form this first opening and this second opening; And
Remove this first photoresist layer of part.
8. method as claimed in claim 7 is characterized in that: expose this protective seam surface behind this first photoresist layer of removing part in this transmission area and this external circuit bonding land.
9. method as claimed in claim 6 is characterized in that: comprise that also the residual film of this first photoresist layer that utilizes in this echo area forms a plurality of projections.
10. method as claimed in claim 6 is characterized in that: also be included in and form a cushion between this transparency conducting layer and this reflection horizon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410046557 CN1291270C (en) | 2004-06-02 | 2004-06-02 | Method for preparing semi-transparent and semi-reflective thin-film transistor liquid-crystal displaying device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410046557 CN1291270C (en) | 2004-06-02 | 2004-06-02 | Method for preparing semi-transparent and semi-reflective thin-film transistor liquid-crystal displaying device |
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| CN1584714A CN1584714A (en) | 2005-02-23 |
| CN1291270C true CN1291270C (en) | 2006-12-20 |
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| CN 200410046557 Expired - Fee Related CN1291270C (en) | 2004-06-02 | 2004-06-02 | Method for preparing semi-transparent and semi-reflective thin-film transistor liquid-crystal displaying device |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100371817C (en) * | 2005-11-29 | 2008-02-27 | 友达光电股份有限公司 | Semi-penetration, semi-reflective pixel structure and its manufacturing method |
| US8059236B2 (en) * | 2007-02-15 | 2011-11-15 | Au Optronics Corporation | Method for producing reflective layers in LCD display |
| CN101807552B (en) * | 2010-03-16 | 2013-09-25 | 信利半导体有限公司 | Production method of semi-transmission type TFT array substrate |
| JP2013083758A (en) * | 2011-10-07 | 2013-05-09 | Sony Corp | Display device, method of manufacturing the same, and electronic unit |
| CN102707349B (en) * | 2012-03-31 | 2015-07-29 | 深圳市华星光电技术有限公司 | The manufacture method in the reflection horizon of reflection LCD |
| CN104199213A (en) * | 2014-08-18 | 2014-12-10 | 京东方科技集团股份有限公司 | Transflective liquid crystal display panel and liquid crystal display |
| CN107643657B (en) * | 2017-10-31 | 2019-10-11 | 武汉华星光电技术有限公司 | A kind of remaining method of improvement panel periphery TITO and light shield |
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