CN1236109C - 一种铜材料表面形成无机覆盖层的电化学方法 - Google Patents

一种铜材料表面形成无机覆盖层的电化学方法 Download PDF

Info

Publication number
CN1236109C
CN1236109C CNB998169277A CN99816927A CN1236109C CN 1236109 C CN1236109 C CN 1236109C CN B998169277 A CNB998169277 A CN B998169277A CN 99816927 A CN99816927 A CN 99816927A CN 1236109 C CN1236109 C CN 1236109C
Authority
CN
China
Prior art keywords
copper
layer
current density
anodic oxidation
seconds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB998169277A
Other languages
English (en)
Chinese (zh)
Other versions
CN1380914A (zh
Inventor
阿尔贝托·比利
斯特凡·赫费尔林
斯特凡·普里格－迈尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Europa Metalli SpA
Original Assignee
Europa Metalli SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Europa Metalli SpA filed Critical Europa Metalli SpA
Publication of CN1380914A publication Critical patent/CN1380914A/zh
Application granted granted Critical
Publication of CN1236109C publication Critical patent/CN1236109C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Chemically Coating (AREA)
CNB998169277A 1999-09-29 1999-09-29 一种铜材料表面形成无机覆盖层的电化学方法 Expired - Fee Related CN1236109C (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IT1999/000307 WO2001023646A1 (en) 1999-09-29 1999-09-29 An electrochemical method for forming an inorganic covering layer on a surface of a copper material

Publications (2)

Publication Number Publication Date
CN1380914A CN1380914A (zh) 2002-11-20
CN1236109C true CN1236109C (zh) 2006-01-11

Family

ID=11333125

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998169277A Expired - Fee Related CN1236109C (zh) 1999-09-29 1999-09-29 一种铜材料表面形成无机覆盖层的电化学方法

Country Status (16)

Country Link
US (1) US6749738B2 (https=)
EP (1) EP1226289B1 (https=)
JP (1) JP4637428B2 (https=)
KR (1) KR20020074143A (https=)
CN (1) CN1236109C (https=)
AT (1) ATE261006T1 (https=)
AU (1) AU6120999A (https=)
CA (1) CA2386129C (https=)
DE (1) DE69915395D1 (https=)
DK (1) DK1226289T3 (https=)
ES (1) ES2217812T3 (https=)
HU (1) HU224454B1 (https=)
PL (1) PL192904B1 (https=)
PT (1) PT1226289E (https=)
RU (1) RU2232212C2 (https=)
WO (1) WO2001023646A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4870699B2 (ja) * 2008-03-10 2012-02-08 日立ビアメカニクス株式会社 銅の表面処理方法およびプリント配線板の表面処理方法
CN102157592A (zh) * 2011-01-06 2011-08-17 上海晶澳太阳能科技有限公司 一种太阳能电池组件内用导线及其加工工艺
RU2483146C1 (ru) * 2011-10-03 2013-05-27 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг РФ) Способ микродугового оксидирования присадочных прутков из титанового сплава для антифрикционной наплавки
DK2728041T3 (en) * 2012-10-30 2017-03-20 Hydro Aluminium Rolled Prod Coated aluminum strip and method of manufacture
CN103014815B (zh) * 2012-11-28 2016-05-04 常州大学 铜导线辊式快速阳极氧化处理方法
WO2015040998A1 (ja) * 2013-09-20 2015-03-26 三井金属鉱業株式会社 銅箔、キャリア箔付銅箔及び銅張積層板
JP5870148B2 (ja) * 2013-11-27 2016-02-24 Ｊｘ金属株式会社 キャリア付銅箔、プリント回路板の製造方法、銅張積層板、銅張積層板の製造方法、及び、プリント配線板の製造方法
WO2016022903A1 (en) * 2014-08-07 2016-02-11 Henkel Ag & Co. Kgaa Apparatus for electroceramic coating of high tension cable wire
WO2016022957A1 (en) 2014-08-07 2016-02-11 Henkel Ag & Co. Kgaa Continuous coating apparatus for electroceramic coating of cable
CN104233433B (zh) * 2014-10-03 2016-09-14 上海工程技术大学 一种制备氧化亚铜薄膜的方法
US10636924B2 (en) 2014-11-26 2020-04-28 Sunpower Corporation Solar module interconnect
CN106410227B (zh) * 2016-12-12 2019-01-15 珠海格力电器股份有限公司 一种氧化铜及其制备方法
CN106591922B (zh) * 2017-02-05 2018-05-08 桂林理工大学 一种Cu2O纳米薄膜的制备方法
CN107177876A (zh) * 2017-05-11 2017-09-19 云南民族大学 一种电沉积制备氧化亚铜锂电池薄膜材料的方法
JP6985745B2 (ja) * 2018-06-20 2021-12-22 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
EP3847921B1 (en) 2018-09-06 2025-06-04 YKK Corporation Fastener member
JP7409602B2 (ja) * 2019-05-09 2024-01-09 ナミックス株式会社 複合銅部材
CN113649042B (zh) * 2021-07-20 2023-10-10 青岛农业大学 光催化电极制备方法、光催化反应器及污染流体处理方法
JP7095193B1 (ja) 2022-03-29 2022-07-04 セイコーホールディングス株式会社 装飾部品及び装飾部品の製造方法
JP7685553B2 (ja) * 2022-05-31 2025-05-29 コリア インスティテュート オブ マテリアルズ サイエンス 殺菌性銅酸化物の形成方法及び殺菌性銅系物品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1052729A (https=) * 1964-10-06
US3528896A (en) * 1968-04-17 1970-09-15 Olin Corp Process for electrochemically cleaning and brightening copper alloy and brass strip
SU658187A1 (ru) * 1975-09-23 1979-04-25 Предприятие П/Я А-7186 Способ электрохимического оксидировани меди
DD131044B1 (de) * 1977-02-21 1982-11-24 Heinz Fink Verfahren zur elektrolytischen erzeugung eines oxidischen haftbelages auf kupferfolien
JPS558487A (en) * 1978-07-05 1980-01-22 Mitsubishi Electric Corp Surface treating method of copper
JPS55106670U (https=) * 1979-01-23 1980-07-25
IL58214A (en) * 1979-09-10 1982-11-30 Yeda Res & Dev Process for the production of optically selective surfaces
JPS607038B2 (ja) * 1980-03-19 1985-02-21 積水化学工業株式会社 銅もしくは銅合金材の着色方法
JPS607037B2 (ja) * 1980-03-19 1985-02-21 積水化学工業株式会社 銅もしくは銅合金材の着色方法
JPS5831099A (ja) * 1981-08-18 1983-02-23 Furukawa Electric Co Ltd:The 銅線、条体の黒色化法
JPS63250494A (ja) * 1987-04-03 1988-10-18 Kobe Steel Ltd 黒色被膜付き銅
JPH0750566B2 (ja) * 1987-07-27 1995-05-31 古河電気工業株式会社 コイル巻線用耐熱耐酸化性導体
DD264718A1 (de) * 1987-10-22 1989-02-08 Akad Wissenschaften Ddr Verfahren zur in- situ- erzeugung einer sehr duennen korrosionsschutzschicht
JP2866697B2 (ja) * 1990-02-19 1999-03-08 臼井国際産業株式会社 銅材表面における強靭な電気絶縁層の形成方法

Also Published As

Publication number Publication date
RU2232212C2 (ru) 2004-07-10
CA2386129A1 (en) 2001-04-05
JP2003510466A (ja) 2003-03-18
CN1380914A (zh) 2002-11-20
KR20020074143A (ko) 2002-09-28
HU224454B1 (hu) 2005-09-28
EP1226289B1 (en) 2004-03-03
ATE261006T1 (de) 2004-03-15
PL192904B1 (pl) 2006-12-29
CA2386129C (en) 2010-03-16
RU2002111346A (ru) 2004-02-27
DK1226289T3 (da) 2004-07-12
WO2001023646A1 (en) 2001-04-05
HUP0203533A2 (en) 2003-05-28
US20030102227A1 (en) 2003-06-05
EP1226289A1 (en) 2002-07-31
JP4637428B2 (ja) 2011-02-23
AU6120999A (en) 2001-04-30
US6749738B2 (en) 2004-06-15
PL354489A1 (en) 2004-01-26
PT1226289E (pt) 2004-07-30
DE69915395D1 (de) 2004-04-08
ES2217812T3 (es) 2004-11-01

Similar Documents

Publication Publication Date Title
CN1236109C (zh) 一种铜材料表面形成无机覆盖层的电化学方法
TW317575B (https=)
DE69408189T2 (de) Kupferfolie für Leiterplatten und Verfahren zu ihrer Herstellung
US4789437A (en) Pulse electroplating process
Chen et al. Influence of F-doped β-PbO2 conductive ceramic layer on the anodic behavior of 3D Al/Sn Rod Pb− 0.75% Ag for zinc electrowinning
CN101660188B (zh) 在铝及其合金阳极氧化膜孔内和表面镶嵌纳米金属的方法
KR20050044602A (ko) 금속 산화물 및/또는 금속 수산화물 피복 금속재료와 그제조방법
US5322975A (en) Universal carrier supported thin copper line
JP7456578B2 (ja) 銅表面の加工装置
US20040108211A1 (en) Surface treatment for a wrought copper foil for use on a flexible printed circuit board (FPCB)
JPH08120499A (ja) 液中集電法によるプリント回路用銅箔表面処理方法
TW202221169A (zh) 粗糙化處理銅箔、覆銅積層板及印刷線路板
JPH052744B2 (https=)
KR100227581B1 (ko) 구리재 표면에 강인한 전기 절연층의 형성방법
KR100297348B1 (ko) 구리재의표면상에의강인한전기절연층의형성방법
JP5520151B2 (ja) 銅材料の表面上に無機被覆層を形成するための電気化学的方法
KR101096638B1 (ko) 구리 라미네이트의 박리 강도 강화
JPH11217693A (ja) グレー発色アルミニウム材とその着色体の製造方法
EP1445352A1 (en) A method for forming a passivation layer on an article having at least one tin-plated surface
KR100777176B1 (ko) 마그네슘을 주성분으로 하는 금속체의 표면 처리 방법
US4579633A (en) Method of producing tin-free steel sheets
US4389459A (en) Conductive coatings for metal substrates
JP2000355795A (ja) アルミニウムおよびアルミニウム合金の表面処理方法
Homhual et al. Microstructural and mechanical property evaluation of zinc oxide coated solar collectors
KR102350114B1 (ko) 친환경 알루미늄 전해 크로메이트 처리방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060111

Termination date: 20180929