CN121927793A - PCB surface treatment device and method - Google Patents
PCB surface treatment device and methodInfo
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- CN121927793A CN121927793A CN202610085740.2A CN202610085740A CN121927793A CN 121927793 A CN121927793 A CN 121927793A CN 202610085740 A CN202610085740 A CN 202610085740A CN 121927793 A CN121927793 A CN 121927793A
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Abstract
The application relates to a surface treatment device and a surface treatment method for a PCB (printed circuit board), and relates to the technical field of PCB manufacturing, wherein the surface treatment device for the PCB comprises a treatment seat, a conveying mechanism for conveying a substrate is arranged on the treatment seat, a coating roller is rotatably arranged on the treatment seat, a storage cavity is formed in the coating roller, coating is stored in the storage cavity, and a coating port communicated with the storage cavity is formed in the coating roller; the treatment seat is provided with a lower spraying seat opposite to the upper coating roller, the lower spraying seat is provided with a discharging channel, the lower spraying seat is provided with a feeding piece for conveying the coating into the discharging channel, the upper coating roller and the lower spraying seat are both positioned on the conveying track of the substrate, and a coating channel for the substrate to pass through is formed between the upper coating roller and the lower spraying seat. According to the application, the synchronous coating of the upper surface and the lower surface of the substrate is realized through the cooperative matching of the upper coating roller and the lower spraying seat, so that the coating efficiency is greatly improved, the positioning deviation is reduced, and the damage risk of the coating is reduced.
Description
Technical Field
The application relates to the technical field of PCB (printed circuit board) manufacturing, in particular to a PCB surface treatment device and method.
Background
A Printed Circuit Board (PCB) is used as a core interconnection component of electronic equipment, and the refinement and the high efficiency of the manufacturing process directly determine the performance and the production benefit of the electronic equipment. The substrate is used as a core bearing foundation of a PCB circuit substrate, and surface insulation and protection treatment are key procedures in a PCB manufacturing process, wherein insulation, corrosion resistance and subsequent pattern transfer functions of the substrate surface are realized through wet film coverage, and the substrate is one of the main stream surface treatment modes in the current industry.
In the prior art, a roller coating process is generally adopted in the wet film covering treatment of a substrate. The process has the core operation logic that a coating roller is used for dipping a wet film material, and the coating of the wet film is realized through the rolling contact between the roller and the surface of the substrate. However, this coating approach can only perform wet film coating treatment on a single surface of a substrate at a time, limited by the structural design and process principles of existing coating equipment. That is, to complete the complete wet film coverage of the upper and lower surfaces of the substrate, at least two independent coating processes must be performed, namely, a series of processes such as positioning, coating, curing, etc. are performed on the first surface of the substrate, after the first surface is wet-formed, the substrate is turned over, and positioning, coating, curing are performed again to complete the process of the second surface.
The step-by-step processing mode has a plurality of inherent defects, and severely restricts the production efficiency and the manufacturing quality stability of the PCB circuit substrate. On one hand, the processing process is tedious and lengthy, the operations of loading, positioning, unloading and the like of the substrate are required to be repeatedly carried out in two independent coating processes, so that the process circulation time is increased, the equipment occupancy rate and the manual operation cost are greatly improved, and on the other hand, the positioning deviation of the substrate is easily caused by repeated process circulation and turnover operation, and the problems of mismatching of upper and lower surface wet film coating precision, insufficient edge alignment and the like are caused, so that the accuracy of manufacturing subsequent circuit patterns is affected. In addition, in the step-by-step treatment process, the coated first surface wet film can be scratched, polluted and other damages caused by friction, collision or environmental dust adhesion in the process of turning and secondary positioning, so that the product yield is reduced.
Disclosure of Invention
In order to solve the above problems, the present application provides a surface treatment device and method for a PCB.
The application provides a PCB surface treatment device and a method, which adopts the following technical scheme:
A conveying mechanism for conveying a substrate is arranged on a treatment seat, a coating roller is rotatably arranged on the treatment seat, a storage cavity is formed in the coating roller, coating is stored in the storage cavity, a coating opening communicated with the storage cavity is formed in the coating roller, a lower spraying seat opposite to the coating roller is formed in the treatment seat, a discharging channel is formed in the lower spraying seat, a feeding piece for conveying the coating into the discharging channel is arranged on the lower spraying seat, the coating roller and the lower spraying seat are both located on a conveying track of the substrate, and a coating channel for the substrate to pass through is formed between the coating roller and the lower spraying seat.
In the implementation process of the technical scheme, the synchronous coating treatment of the upper surface and the lower surface of the PCB substrate is realized through the cooperative cooperation of the treatment seat, the conveying mechanism, the coating roller, the lower spraying seat and the feeding piece. Synchronously, the coating in the storage cavity in the upper coating roller seeps out through the coating port, the upper surface coating is completed along with the rolling contact of the rotation of the upper coating roller and the upper surface of the substrate, meanwhile, the feeding piece conveys the coating to the discharging channel of the lower spraying seat, and the discharging channel sprays the coating to the lower surface of the substrate to complete the lower surface coating, so that the one-time completion of the upper surface coating and the lower surface coating of the substrate is finally realized. The method has the advantages of greatly simplifying the processing flow of wet film coverage of the PCB substrate, avoiding the complicated operation that the traditional roller coating process needs two independent working procedures and repeated positioning and turning, obviously improving the coating efficiency, simultaneously reducing the positioning deviation risk caused by multiple working procedure circulation, reducing the probability of scratch and pollution of the coated surface, taking the coating precision and the product yield into consideration, and reducing the equipment occupancy rate and the manual operation cost.
Optionally, the feeding part comprises a jet machine and a storage box, wherein the jet machine and the storage box are arranged on the lower spraying seat, the air outlet of the jet machine is communicated with the discharging channel, a feeding pump is arranged in the storage box, the discharging outlet of the feeding pump is communicated with the discharging channel, the lower spraying seat is provided with a pre-drying channel communicated with the air outlet of the jet machine, and the pre-drying channel is arranged on the downstream of the discharging channel along the conveying track of the substrate.
In the implementation process of the technical scheme, the conveying mechanism drives the substrate to move along a preset track and pass through a coating channel between the upper coating roller and the lower spraying seat, the feeding piece on the lower spraying seat is synchronously started, the storage box provides a stable storage space for the coating, the feeding pump in the storage box pumps the coating out and conveys the coating to the discharging channel, meanwhile, the jet machine is started to generate air flow, the air flow and the coating form a synergistic effect after passing through the discharging channel, the coating is pushed to be uniformly sprayed to the lower surface of the substrate from the discharging channel to finish coating on the lower surface, meanwhile, the upper coating roller rotates, the coating in the storage cavity in the upper coating roller is oozed out through a coating port to finish coating on the upper surface of the substrate by virtue of rolling contact, the substrate after finishing coating is continuously moved to the pre-baking channel at the downstream of the discharging channel along with the conveying mechanism, the air flow of the pre-baking channel plays a role in stabilizing the coating raw material on the lower surface of the substrate, the air flow can rapidly break the surface tension of a wet film surface, promote the surface of the wet film to more uniformly, reduce orange peel or ripple defects, play a role in leveling effect, and the extremely slight volatilization of a film surface solvent, enable the coating viscosity to rapidly drop off the coating after leaving the coating in a short time, and the leveling effect on the substrate can be prevented from being slightly and stable. According to the integrated design, on the premise of not interrupting continuous production, the wet film is subjected to physical stabilization treatment after the substrate is subjected to coating treatment, so that the coating uniformity is remarkably improved, various coating defects caused by the fact that the coating fluidity is too strong are avoided, semi-finished products with more consistent states and more stable quality are provided for the follow-up formal curing process, and therefore the quality and the yield of the final product are further improved while the high efficiency is ensured.
Optionally, the pre-drying channel comprises a main drying channel and a plurality of sub-drying channels, the main drying channel is communicated with the air outlet of the air jet, the plurality of sub-drying channels are all communicated with the main drying channel, and the outlets of the plurality of sub-drying channels are all positioned at the downstream of the outlet of the discharging channel of the lower spraying seat.
In the implementation process of the technical scheme, the fine partition and balanced supply of the air flow in the coating channel are realized through the distributed air flow design of the main drying channel and the plurality of sub-drying channels, so that the uniformity and the controllability of the stabilizing and leveling treatment of the coating on the lower surface of the substrate are improved. The cooperative working process is that the main air flow generated by the jet engine firstly enters the main drying channel to serve as a concentrated air flow distribution main pipe, and then the air flow is split to a plurality of independent outlets through a plurality of sub-drying channels communicated with the main drying channel. The key point is that the baking channels are communicated with the coating channel. When the substrate is running in the coating tunnel, the dispensed air streams from the multiple partial bake tunnels act on different areas of the substrate's lower surface coating at more uniform flow and pressure from different locations. The multi-point multi-path air flow supply mode brought by the total-division structure can effectively solve the problem of uneven distribution of strong air flow centers and weak edges possibly generated by a single air flow outlet, and ensures that the air flow shearing force and the evaporation effect of the coating on the whole board width direction (especially wide PCB) are basically consistent. The method has the technical effects that firstly, a more uniform leveling effect on the coating is realized, the phenomenon that the coating is locally too thick or too thin due to uneven air flow is avoided, and secondly, the synchronicity of strengthening the overall stability of the coating is improved, so that each area of the coating can reach a viscosity threshold value required by resisting gravity almost synchronously, and the phenomenon that the local part is drooping or separated due to insufficient stability is prevented. Finally, the structure ensures that the process effect of 'instant stability and leveling' is improved from 'can be realized' to 'can be stably and uniformly realized', provides a semi-finished product with higher quality consistency for subsequent solidification, and further ensures the reliability of the final product.
Optionally, a ventilation film is arranged in the discharging channel, the ventilation film divides the space in the discharging channel into an air cavity and a liquid cavity, the air cavity is communicated with the air outlet of the jet machine, and the liquid cavity is communicated with the discharging port of the feeding pump.
In the realization process of the technical scheme, when the substrate is conveyed to the paint channel for coating the lower surface, the paint in the material storage box is conveyed to the liquid cavity of the material discharging channel by the material conveying pump, meanwhile, the air flow generated by the jet mill is introduced into the air cavity of the material discharging channel through the flow dividing valve, the air permeable membrane has the characteristic of air permeability and airtight liquid, the air flow in the air cavity cannot enter the liquid cavity but can generate stable air pressure to act on the air permeable membrane, the air pressure is transferred to the paint in the liquid cavity by the air permeable membrane, the paint is pushed to move along the liquid cavity to the outlet of the material discharging channel and is uniformly sprayed to the lower surface of the substrate, the air permeable membrane realizes effective isolation between the air cavity and the liquid cavity, the problem of spraying disorder caused by direct mixing of the air flow and the paint is solved, meanwhile, the spraying of the paint is indirectly driven by the air pressure, the spraying pressure of the paint is more stable, the flow velocity is more uniform, the defects of paint accumulation, missing spraying and the like in the spraying process are effectively reduced, the coating quality of the lower surface is improved, the coating quality is more accurate and synchronous matching with the upper surface coating of an upper surface of a paint roller, the upper surface of a circuit board is further ensured, the coating consistency of the upper surface and lower surface coating of the PCB is well-established for the subsequent pretreatment and the whole production boosting rate is improved.
Optionally, two opposite scraping tables are arranged on the processing seat along the conveying track of the substrate, the two scraping tables are located at the downstream of the upper coating roller and the lower spraying seat, a scraping channel for the substrate to pass through is formed between the two scraping tables, two opposite side plates are arranged between the two scraping tables and can be respectively contacted with two side parts of the substrate, a scraping plate is movably arranged on the processing seat, and a first driving piece for driving the scraping plate to be arranged along the moving direction perpendicular to the substrate is arranged on the processing seat.
In the implementation process of the technical scheme, the substrate with the double-sided coating is firstly fed into a scraping channel formed by an upper scraping table and a lower scraping table, and the two scraping tables are respectively and accurately contacted and scrape excessive paint or dropping matters generated on the upper surface and the lower surface of the substrate in the paint process, so that the thickness uniformity of the main surface is ensured. At the same time, the side plates arranged at the two sides of the channel are in continuous contact with the two side edges of the base plate, and the longitudinal edge flash is scraped off. The front end edge and the rear end edge of the raw material part are processed by a scraping plate. When the front end or the rear end of the base plate moves to a specific station, the first driving piece drives the scraping plate to reciprocate once along the plate width direction (perpendicular to the moving direction of the base plate), and the vertically arranged scraping edge of the scraping plate scrapes against the front end edge or the rear end edge of the base plate in the process, so that the paint attached to the scraping plate is thoroughly removed. The device has the technical effects that after the wet film coating of the PCB substrate is realized, the coating on all six physical edges (up and down, left and right, front and back) can be completely, automatically and accurately cleaned. The device not only eliminates the problem of end material accumulation which cannot be cleaned by the scraping table and the side plates, avoids the problem that the head and tail coating forms bulges, drop marks or pollutes the substrate due to collision stripping after solidification, but also ensures that all boundaries outside the effective pattern area of each substrate are clear and clean before each substrate enters the solidification furnace. The coating quality and the consistency of the product appearance are greatly improved, a reliable basis is laid for the subsequent high-precision pattern transfer and element assembly procedures, and meanwhile, the cost of manual trimming or reworking is reduced.
Optionally, the processing seat is gone up along the conveying track of base plate is provided with the solidification seat, the solidification seat is located two scrape the material platform low reaches, set up the curing chamber in the solidification seat, be provided with the curing lamp in the curing chamber, set up on the solidification seat with scrape the curing mouth of material passageway intercommunication, the curing mouth is used for supplying the base plate gets into the curing intracavity.
In the implementation process of the technical scheme, after the substrate is coated on two sides and the upper surface, the lower surface, the side edges and the end edges of the substrate are thoroughly cleaned by the scraping mechanism, the substrate directly enters the curing cavity through the communicated curing opening without any intermediate transfer or waiting. In the closed cavity, a preset curing lamp (such as a UV LED lamp array or a mercury lamp) irradiates the wet films on the upper surface and the lower surface of the substrate immediately. The core technical effect of this design is that a "zero gap" continuous production from the completion of the coating to the initial curing of the coating is achieved. The overflow removed by the scraping mechanism prevents the overflow from entering the curing cavity to pollute the lamp group or be cured on the inner wall of the cavity, and the close-adjacent layout ensures that the coating immediately receives curing illumination in the optimal leveling state (namely after scraping and before secondary flow does not occur), thereby maximally locking the high-quality coating form. Meanwhile, the physical communication channels reduce or even eliminate the pause, shake or offset of the plate during the transfer between stations, thereby not only obviously shortening the production takt and improving the overall efficiency, but also reducing the risks of pollution, damage or quality fluctuation of the coating caused by human intervention or environmental exposure. Finally, the integrated design enables three key working procedures of coating, edge treatment and curing to be connected in a seamless manner, a highly-automatic, stable and efficient closed loop of a PCB surface treatment terminal is formed, and uniformity of a final coating, edge definition and consistency of curing quality are greatly guaranteed.
Optionally, the processing seat is gone up along the conveying track of base plate is provided with the detection seat, the detection seat is located solidification seat low reaches, the detection intracavity has been seted up to the detection seat, be provided with the humidity detector in the detection chamber, the humidity detector with solidification lamp electricity is connected, the detection chamber pass through the intercommunication mouth with solidification chamber intercommunication, the intercommunication mouth is used for supplying the base plate gets into in the detection chamber.
In the implementation process of the technical scheme, the substrate which is preliminarily solidified by the solidification cavity directly enters the downstream detection cavity through the communicated communication port. A humidity detector (e.g., a near infrared spectrometer or a capacitive sensor) disposed within the detection chamber immediately performs a non-contact on-line measurement of the humidity (or solvent residual) of the substrate coating. The humidity detector is electrically connected with the upstream curing lamp to form a real-time feedback loop. The humidity data acquired by the detector are converted into electric signals and transmitted to a control system of the curing lamp in real time. When the coating humidity is detected to be too high (insufficient curing), the control system can automatically increase the power of the curing lamp or reduce the conveying speed to prolong the irradiation time, and conversely, when the humidity is too low (over-curing risk exists), the control system can automatically reduce the power or speed. The core technical effect of the closed-loop control is that the dynamic optimization and the accurate control of the curing process parameters are realized. The method solves the problem of inconsistent curing quality caused by factors such as substrate thickness, paint batch, environmental temperature and humidity fluctuation and the like in the traditional curing process, and ensures that each PCB substrate can reach an optimal and consistent curing state. This not only significantly improves the reliability of the product (avoids tackiness due to undercure or brittleness due to uncured) but also saves energy by preventing overcure and prolongs the curing lamp life. Finally, the design converts curing from a fixed process to a self-adaptive and traceable intelligent process, and greatly improves the quality control level and process stability of the whole surface treatment device.
Optionally, two opposite sealing cushions are arranged at the communication port, and opposite ends of the two sealing cushions are mutually attached or partially overlapped to seal the communication port.
In the implementation process of the technical scheme, the two sealing cushions are oppositely arranged at the edge of the communication port, and in a natural state, the end parts of the two sealing cushions are mutually attached or partially overlapped to form a flexible sealing barrier to basically seal the communication port. When the substrate needs to be conveyed from the curing chamber to the detecting chamber, the front end of the substrate contacts and presses the pair of seal cushions under the pushing of the conveying mechanism. Due to the flexible nature of the sealing cushions, they will spring away from the ground to both sides, forming a slit through which only the body of the panel passes. The resilient material of the sealing cushion is always kept in light contact with the upper and lower surfaces of the base plate during passage of the plate body. After the plate body passes through completely, the sealing cushion rebounds rapidly under the action of the elastic restoring force of the sealing cushion, the fitting state is restored again, and the communication port is closed again. The sealing cushion can reduce air exchange between the curing cavity and the detection cavity to the greatest extent, effectively maintain an inert gas atmosphere (such as nitrogen) or a specific temperature environment possibly needed in the curing cavity, prevent the environment from being polluted and disturbed by external air, ensure the stability of the detection environment and the precision of a sensor, provide a better sealing effect compared with a rigid gap or a complex air curtain system when in flexible contact sealing between the sealing cushion and a substrate, hardly cause mechanical damages such as scratches and scratches on a cured or semi-cured coating of the substrate, and adapt to PCB production with extremely high surface quality requirements.
Optionally, the conveying mechanism includes two sets of conveying rollers that rotate set up in on the processing seat, two sets of conveying rollers set up relatively, and every group conveying roller all includes a plurality of conveying rollers that set up along the conveying orbit of base plate, along on the conveying orbit of base plate, adjacent two between the conveying roller or with paint roller is adjacent between the conveying roller the distance is not greater than the length of base plate.
In the implementation process of the technical scheme, the clamping conveying channel formed by the upper conveying roller and the lower conveying roller always exists on the whole conveying track of the substrate from feeding, passing through the coating channel and entering the subsequent processing unit. Since the spacing between adjacent conveyor rolls (or conveyor rolls adjacent to the applicator roll) is no greater than the length of the sheet, this means that at any time along the entire conveyor path, the substrate is at least simultaneously contacted and supported by two (four) or more pairs of conveyor rolls—the front end of the substrate is driven by the front pair of rolls and the middle rear portion of the substrate is stably supported by the rear pair or pairs of rolls, thereby eliminating the "hanging section" or "support dead zone" that may occur during conveyance of the substrate. When passing through the key stations (such as paint gaps), the plate body cannot bend, shake or sink due to dead weight or paint pressure, and the constant and uniform gaps between the substrate and the upper paint roller and the lower paint spraying seat are ensured. Meanwhile, the continuous relay driving of the multiple groups of conveying rollers ensures the absolute stability of the conveying speed and avoids uneven coating caused by speed fluctuation. In summary, the conveying mechanism formed by the two groups of conveying rollers not only completes the basic material conveying function, but also provides an extremely stable and reliable motion reference plane for the whole surface treatment process, ensures the controllability and repeatability of the coating quality, and is a core infrastructure for supporting the whole device to realize high-precision and high-efficiency treatment.
The PCB surface treatment method, which is applied to the PCB surface treatment device, comprises the following steps:
placing a PCB substrate to be processed on the conveying mechanism;
driving the conveying mechanism to convey the substrate to continuously pass through a coating channel formed between the upper coating roller and the lower spraying seat;
During the process of the substrate passing through the paint channel, the following operations are synchronously performed:
the coating roller rotates, and the coating in the storage cavity of the coating roller is coated on the upper surface of the substrate through the coating opening;
And the coating is conveyed to the discharging channel through the feeding piece, so that the coating acts on the lower surface of the substrate from the discharging channel.
In summary, the present application includes at least one of the following beneficial technical effects:
1. The synchronous coating of the upper surface and the lower surface is realized, namely, the complicated operation of step-by-step coating in the traditional process is avoided through the relative layout and the cooperative work of the upper coating roller and the lower spraying seat, the coating efficiency is greatly improved, and the process circulation time is reduced;
2. the coating precision and stability are ensured, namely, the deviation risk caused by multiple positioning is reduced by synchronous coating, and the uniformity and regularity of the coating layer are effectively improved by matching with the airflow stabilizing effect of the pre-drying channel and the trimming function of the scraping mechanism;
3. the solidification quality is intelligently controlled, wherein solidification parameters are adjusted in real time through closed-loop control of a humidity detector and a solidification lamp, so that the problems of undercure or overcure are avoided, and the reliability of products is improved;
4. the production continuity and stability are improved, each process unit is in seamless connection, the reasonable layout of the conveying mechanism ensures the stable conveying of the substrate, the sealed cushion design maintains the stable environment of the chamber, and the quality fluctuation caused by the environment interference is reduced;
5. The production cost is reduced, the process flow is simplified, the equipment occupancy rate is reduced, the manual operation and the rework cost are reduced, and the production benefit is improved.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a surface treatment device for a PCB in embodiment 1 of the present application;
FIG. 2 is a cut-away side view of example 1 of the present application;
Fig. 3 is an enlarged view of a portion a in fig. 2.
The reference numerals are 1, a processing seat, 2, a conveying mechanism, 201, a conveying roller, 202, a synchronous belt, 203, a roller motor, 3, an upper coating roller, 4, a storage cavity, 5, a coating port, 6, a lower spraying seat, 7, a discharging channel, 8, a feeding part, 801, a jet engine, 802, a storage box, 9, a coating channel, 10, a pre-drying channel, 1001, a main drying channel, 1002, a sub-drying channel, 11, a ventilation film, 12, an air cavity, 13, a liquid cavity, 14, a scraping table, 15, a scraping channel, 16, a side plate, 17, a scraping plate, 18, a first driving part, 1801, a telescopic rod, 19, a curing seat, 20, a curing cavity, 21, a curing port, 22, a detecting seat, 23, a detecting cavity, 24, a humidity detector, 25, a curing lamp, 26, a sealing cushion, 27, a coating cloth layer, 28, a substrate, 29, a communication port, 30, a driving motor, 31 and a storage box.
Detailed Description
The present application will be described in further detail with reference to fig. 1 to 3.
The embodiment 1 of the application discloses a surface treatment device for a PCB. Referring to fig. 1-3, the surface treatment device for the PCB comprises a treatment seat 1, wherein a conveying mechanism 2 for conveying a substrate 28 is arranged on the treatment seat 1, a coating roller 3 is rotatably arranged on the treatment seat 1, a storage cavity 4 is formed in the coating roller 3, coating is stored in the storage cavity 4, a coating opening 5 communicated with the storage cavity 4 is formed in the coating roller 3, a coating cloth layer 27 used for being in contact with the substrate 28 is coated on the outer wall of the coating roller 3, a lower spraying seat 6 opposite to the coating roller 3 is formed in the treatment seat 1, a discharging channel 7 is formed in the lower spraying seat 6, a feeding piece 8 for conveying the coating into the discharging channel 7 is arranged on the lower spraying seat 6, the coating roller 3 and the lower spraying seat 6 are both positioned on a conveying track of the substrate 28, and a coating channel 9 for the substrate 28 to pass through is formed between the coating roller 3 and the lower spraying seat 6.
Referring to fig. 1 to 3, the conveying mechanism 2 includes two sets of conveying rollers 201 rotatably provided on the processing base 1, the conveying rollers 201 are driven to rotate by a roller motor 203 and a timing belt 202, the two sets of conveying rollers 201 are disposed opposite to each other, each set of conveying rollers 201 includes a plurality of conveying rollers 201 disposed along a conveying track of the substrate 28, and a distance between adjacent conveying rollers 201 or between conveying rollers 201 adjacent to the upper coating roller 3 is not greater than a length of the substrate 28 along the conveying track of the substrate 28.
Referring to fig. 1-3, the feeding member 8 includes a jet 801 and a storage tank 802 disposed on the lower jet seat 6 (corresponding accommodating spaces are formed in the lower jet seat 6 and are used for accommodating the jet 801 and the storage tank 802, respectively), an air outlet of the jet 801 is communicated with the discharge channel 7, a feeding pump (not shown in the drawings) is disposed in the storage tank 802, a discharge outlet of the feeding pump is communicated with the discharge channel 7 through a pipeline, a pre-baking channel 10 communicated with the air outlet of the jet 801 is formed in the lower jet seat 6, and the pre-baking channel 10 is formed downstream of the discharge channel 7 along a conveying track of the substrate 28.
Referring to fig. 1-3, a ventilation membrane 11 is arranged in the discharge channel 7, the ventilation membrane 11 divides the space in the discharge channel 7 into an air cavity 12 and a liquid cavity 13, the air cavity 12 is communicated with an air outlet of the jet 801, and the liquid cavity 13 is communicated with a discharge port of the feed pump through a pipeline. The pre-drying channel 10 comprises a main drying channel 1001 and a plurality of sub-drying channels 1002, wherein the main drying channel 1001 is communicated with an air outlet of the air jet 801, the plurality of sub-drying channels 1002 are communicated with the main drying channel 1001, and outlets of the plurality of sub-drying channels 1002 are positioned at the downstream of an outlet of the discharging channel 7 of the lower spraying seat 6.
Referring to fig. 1-3, two opposite scraping tables 14 are arranged on the processing seat 1 along the conveying track of the substrate 28, the two scraping tables 14 are located at the downstream of the upper coating roller 3 and the lower spraying seat 6, a scraping channel 15 for the substrate 28 to pass through is formed between the two scraping tables 14, two opposite side plates 16 are arranged between the two scraping tables 14, the two side plates 16 can be respectively contacted with two side parts of the substrate 28, a scraping plate 17 is movably arranged on the processing seat 1, and a first driving piece 18 for driving the scraping plate 17 to be arranged along the conveying direction perpendicular to the substrate 28 is arranged on the processing seat 1.
The first driving piece 18 comprises an electric control telescopic rod 1801 which is vertically arranged, the fixed end of the telescopic rod 1801 is fixedly connected with the processing seat 1, the movable end of the telescopic rod 1801 is fixedly connected with the bottom of the scraping plate 17, and the telescopic movement of the telescopic rod 1801 drives the scraping plate 17 to move according to a preset track.
Referring to fig. 1-3, a curing seat 19 is disposed on the processing seat 1 along a conveying track of the substrate 28, the curing seat 19 is located at the downstream of the two scraping tables 14, a curing cavity 20 is disposed in the curing seat 19, a curing lamp 25 is disposed in the curing cavity 20, a curing opening 21 communicated with the scraping channel 15 is disposed on the curing seat 19, and the curing opening 21 is used for the substrate 28 to enter the curing cavity 20.
Referring to fig. 1-3, a detection seat 22 is disposed on the processing seat 1 along a conveying track of a substrate 28, the detection seat 22 is located at a downstream of the curing seat 19, a detection cavity 23 is formed in the detection seat 22, a humidity detector 24 is disposed in the detection cavity 23, the humidity detector 24 is electrically connected with a curing lamp 25, the detection cavity 23 is communicated with the curing cavity 20 through a communication port 29, and the communication port 29 is used for allowing the substrate 28 to enter the detection cavity 23. Two opposite sealing cushions 26 are arranged at the communication port 29, and opposite ends of the two sealing cushions 26 are mutually attached to seal the communication port 29.
In the embodiment of the present application, the diameters of the plurality of conveying rollers 201 included in each group of conveying rollers 201 are different, and the design is to adapt to the sizes of the components on the processing seat 1, for example, the conveying rollers 201 are rotatably arranged in the curing seat 19 and the detecting seat 22, and the diameters of the conveying rollers 201 at corresponding positions are smaller than the diameters of the conveying rollers 201 at the inlet position of the processing seat 1 in order to adapt to the sizes of the internal spaces of the curing chamber 20 and the detecting chamber 23.
In the embodiment of the application, the coating roller 3 is driven to rotate by a driving motor 30, the driving motor 30 and a roller motor 203 are arranged on the outer wall of the processing seat 1 together, an output shaft of the driving motor 30 is coaxial with a rotating shaft of the coating roller 3, the driving motor 30 drives the coating roller 3 to rotate by a bearing, in order to facilitate the replenishment of the coating in the storage cavity 4, one side of the processing seat 1 is provided with a storage box 31, a delivery pump (not shown in the figure) is arranged in the storage box 31, and a discharge port of the delivery pump is communicated with a pipeline which is communicated with the storage cavity 4 by a bearing.
The implementation principle of the PCB surface treatment device in the embodiment 1 of the application is that the synchronous coating treatment of the upper surface and the lower surface of the PCB substrate 28 is realized through the cooperative cooperation of the treatment seat 1, the conveying mechanism 2, the upper coating roller 3, the lower spraying seat 6 and the feeding piece 8. The processing seat 1 provides a mounting bearing foundation for each component, the conveying mechanism 2 drives the substrate 28 to move along a preset track and pass through a coating channel 9 between the upper coating roller 3 and the lower spraying seat 6, synchronously, coating in the storage cavity 4 in the upper coating roller 3 seeps out through the coating port 5, the upper surface coating is completed by rolling contact with the upper surface of the substrate 28 along with the rotation of the upper coating roller 3, meanwhile, the feeding piece 8 conveys the coating to the discharging channel 7 of the lower spraying seat 6, the discharging channel 7 sprays the coating to the lower surface of the substrate 28 to complete the lower surface coating, and finally, the one-time completion of the upper surface coating and the lower surface coating of the substrate 28 is realized. The whole technical effect can be summarized as that the processing flow of wet film coverage of the PCB substrate 28 is greatly simplified, the complicated operations of two independent procedures and repeated positioning and turning are avoided in the traditional roller coating process, the coating efficiency is remarkably improved, the positioning deviation risk caused by multiple procedure circulation is reduced, the probability of scratch and pollution of the coated surface is reduced, the coating precision and the product yield are both considered, and the equipment occupancy rate and the manual operation cost are also reduced.
Example 2
The embodiment 2 of the application discloses a surface treatment method of a PCB, which is applied to the surface treatment device of the PCB in the embodiment 1 of the application and comprises the following steps:
s1, feeding and conveying. The PCB substrate 28 to be processed is placed at the feed end of the conveyor mechanism 2, and both the upper and lower surfaces of the substrate 28 are supported in contact with the conveyor rollers 201. The transport mechanism 2 is started to transport the substrate 28 at a constant speed.
S2, synchronous double-sided coating. When the substrate 28 enters the paint passage 9, the paint roller 3 is driven to rotate by the driving motor 30, the jet 801 and the feed pump in the storage tank 802 operate together to feed out paint, the paint roller 3 applies paint onto the upper surface of the substrate 28, and simultaneously, the paint in the storage tank 80 applies paint uniformly to the lower surface of the substrate 28 through the discharge passage 7.
S3, online stabilizing treatment. Immediately after coating, the substrate 28 passes through the position of the partial drying channel 1002, and uniform air flow is delivered from the partial drying channel 1002 to blow the lower surface of the substrate 28, so that the leveling property and the initial stability of the coating on the lower surface of the substrate 28 are improved.
S4, cleaning the edge paint. The substrate 28 enters the scraping channel 15, and the upper and lower scraping tables 14, the side plates 16 and the movable scraping plates 17 work cooperatively to scrape the excessive paint on the substrate 28.
S5, closed-loop control curing. The substrate 28 enters the sequential curing chamber 20 and the detection chamber 23, and the moisture detector 24 monitors the coating curing status in real time and feeds data back to the control system. The control system fine-tunes the irradiation power and/or the conveying speed of the curing lamps 25 in real time according to a preset target value of the curing degree, so as to ensure that each substrate 28 is completely and consistently cured.
S6, blanking. After cooling, the solidified substrate 28 is collected by a material receiving device in a subsequent process.
The above embodiments are not intended to limit the scope of the application, so that the equivalent changes of the structure, shape and principle of the application are covered by the scope of the application.
Claims (10)
1. A PCB surface treatment device is characterized by comprising a treatment seat (1), wherein a conveying mechanism (2) for conveying a substrate (28) is arranged on the treatment seat (1), an upper coating roller (3) is rotatably arranged on the treatment seat (1), a storage cavity (4) is formed in the upper coating roller (3), coating is stored in the storage cavity (4), a coating opening (5) communicated with the storage cavity (4) is formed in the upper coating roller (3), a lower spraying seat (6) opposite to the upper coating roller (3) is formed in the treatment seat (1), a discharging channel (7) is formed in the lower spraying seat (6), a feeding piece (8) for conveying coating into the discharging channel (7) is arranged on the lower spraying seat (6), the upper coating roller (3) and the lower spraying seat (6) are both positioned on a conveying track of the substrate (28), and the upper coating roller (3) and the lower spraying seat (6) form a coating supplying channel (9) through the substrate (28).
2. The PCB surface treatment device according to claim 1, wherein the feeding piece (8) comprises a jet machine (801) and a storage box (802) which are arranged on the lower jet material seat (6), an air outlet of the jet machine (801) is communicated with the discharging channel (7), a feeding pump is arranged in the storage box (802), an air outlet of the feeding pump is communicated with the discharging channel (7), a pre-drying channel (10) communicated with the air outlet of the jet machine (801) is arranged on the lower jet material seat (6), and the pre-drying channel (10) is arranged on the downstream of the discharging channel (7) along the conveying track of the substrate (28).
3. The surface treatment device for the PCB, as set forth in claim 2, characterized in that the pre-drying channel (10) comprises a main drying channel (1001) and a plurality of sub-drying channels (1002), the main drying channel (1001) is communicated with the air outlet of the air jet machine (801), the plurality of sub-drying channels (1002) are communicated with the main drying channel (1001), and the outlets of the plurality of sub-drying channels (1002) are located downstream of the outlet of the discharging channel (7) of the lower spraying seat (6).
4. The surface treatment device for the PCB circuit board according to claim 2, wherein a breathable film (11) is arranged in the discharging channel (7), the breathable film (11) divides the space in the discharging channel (7) into an air cavity (12) and a liquid cavity (13), the air cavity (12) is communicated with an air outlet of the air jet machine (801), and the liquid cavity (13) is communicated with a discharging hole of the feeding pump.
5. The surface treatment device for the PCB, as set forth in claim 1, is characterized in that two opposite scraping tables (14) are arranged on the treatment base (1) along the conveying track of the substrate (28), the two scraping tables (14) are located at the downstream of the upper coating roller (3) and the lower spraying base (6), a scraping channel (15) for the substrate (28) to pass through is formed between the two scraping tables (14), two opposite side plates (16) are arranged between the two scraping tables (14), the two side plates (16) can be respectively contacted with two side parts of the substrate (28), a scraping plate (17) is movably arranged on the treatment base (1), and a first driving piece (18) for driving the scraping plate (17) to be arranged along the moving direction perpendicular to the substrate (28) is arranged on the treatment base (1).
6. The PCB surface treatment device according to claim 5, wherein a curing seat (19) is arranged on the treatment seat (1) along the conveying track of the substrate (28), the curing seat (19) is positioned at the downstream of the two scraping tables (14), a curing cavity (20) is formed in the curing seat (19), a curing lamp (25) is arranged in the curing cavity (20), a curing opening (21) communicated with the scraping channel (15) is formed in the curing seat (19), and the curing opening (21) is used for the substrate (28) to enter the curing cavity (20).
7. The PCB surface treatment device according to claim 6, wherein a detection seat (22) is arranged on the treatment seat (1) along the conveying track of the substrate (28), the detection seat (22) is positioned at the downstream of the curing seat (19), a detection cavity (23) is formed in the detection seat (22), a humidity detector (24) is arranged in the detection cavity (23), the humidity detector (24) is electrically connected with the curing lamp (25), the detection cavity (23) is communicated with the curing cavity (20) through a communication port (29), and the communication port (29) is used for allowing the substrate (28) to enter the detection cavity (23).
8. A surface treatment device for a PCB according to claim 7, wherein two opposite sealing cushions (26) are arranged at the communication opening (29), and opposite ends of the two sealing cushions (26) are mutually attached or partially overlapped to seal the communication opening (29).
9. A surface treatment device for a PCB according to claim 1, wherein the conveying mechanism (2) comprises two groups of conveying rollers (201) rotatably arranged on the treatment base (1), the two groups of conveying rollers (201) are oppositely arranged, each group of conveying rollers (201) comprises a plurality of conveying rollers (201) arranged along a conveying track of the substrate (28), and a distance between two adjacent conveying rollers (201) or between the conveying rollers (201) adjacent to the coating roller (3) along the conveying track of the substrate (28) is not larger than the length of the substrate (28).
10. A surface treatment method for a PCB circuit board, applying the surface treatment device for a PCB circuit board according to any one of claims 1 to 9, comprising the steps of:
Placing a PCB substrate (28) to be processed on the transport mechanism (2);
Driving the conveying mechanism (2) to convey the substrate (28) continuously through a coating channel (9) formed between the upper coating roller (3) and the lower spraying seat (6);
During the passage of the substrate (28) through the paint channel (9), the following operations are performed simultaneously:
The coating roller (3) is rotated, and the coating in the storage cavity (4) is coated on the upper surface of the substrate (28) through the coating opening (5);
And the paint is conveyed to the discharging channel (7) through the feeding piece (8), so that the paint acts on the lower surface of the substrate (28) from the discharging channel (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202610085740.2A CN121927793A (en) | 2026-01-22 | 2026-01-22 | PCB surface treatment device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202610085740.2A CN121927793A (en) | 2026-01-22 | 2026-01-22 | PCB surface treatment device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN121927793A true CN121927793A (en) | 2026-04-28 |
Family
ID=99520115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202610085740.2A Pending CN121927793A (en) | 2026-01-22 | 2026-01-22 | PCB surface treatment device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN121927793A (en) |
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2026
- 2026-01-22 CN CN202610085740.2A patent/CN121927793A/en active Pending
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